CN205319143U - Be packaged with a plurality of audio power amplifier chip's circuit structure - Google Patents
Be packaged with a plurality of audio power amplifier chip's circuit structure Download PDFInfo
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- CN205319143U CN205319143U CN201521123711.4U CN201521123711U CN205319143U CN 205319143 U CN205319143 U CN 205319143U CN 201521123711 U CN201521123711 U CN 201521123711U CN 205319143 U CN205319143 U CN 205319143U
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Abstract
The utility model relates to a circuit packaging structure, specifically be a be packaged with a plurality of audio power amplifier chip's circuit structure, based on QFN or QFP's encapsulation mode, including plastic -sealed body and a plurality of audio power amplifier chip, a plurality of audio power amplifier chip are integrated in an integrated package, the integrated package divides a plurality of paster districts that wait the area into, the optional subsides of every audio power amplifier chip are in a paster district, the plastic -sealed body cladding is in on the integrated package, be equipped with a plurality of function pins on the plastic -sealed body, every function pin all is connected with the audio power amplifier chip who corresponds. The utility model has the advantages of simple structure, reasonable in design has reduced the encapsulation cost of circuit, has simplified the design of complete machine PCB board, improves production efficiency.
Description
Technical field
The utility model relates to the encapsulation structure of a kind of circuit, is specifically related to a kind of circuit structure with multiple Audio power amplifier chip.
Background technology
As shown in Figure 1, being the electrical block diagram encapsulating single Audio power amplifier chip in prior art, the encapsulation structure of this kind of single Audio power amplifier chip generally adopts the packing forms of HTSSOP28-EP. The package pins of single Audio power amplifier chip has 28, and these 28 pin functions are such as following table:
This table definition package pins function of existing single Audio power amplifier chip, the packing forms of existing this kind of HTSSOP28-EP can not only simplify design and the peripheral solder of PCB version, and improve packaging efficiency, but the range of application of this single Audio power amplifier chip is but restricted, particularly for some specific ranges of application, such as: 4 sound channel power amplifier application, 2 sound channel High-power amplifier application, 2.1 sound channel power amplifier application, the circuit structure of existing encapsulation single Audio power amplifier chip all can not realize the application of these specific functions.
At present, in order to realize above-mentioned several specific application, many complete machine producers adopt the audio power amplifying circuit of two pieces of encapsulation separately (adopting separately the packaged type of HTSSOP28-EP) to form this several specific application, concrete building form is as follows: (1) 4 sound channel power amplifier application, two audio power amplifying circuits all adopt stereo output pattern, add up to 4 sound channels to export; (2) 2 sound channel High-power amplifier application, two audio power amplifying circuits all adopt monophonic to export pattern, add up to 2 sound channels to export; (3) 2.1 sound channel power amplifier application, one of them audio power amplifying circuit adopts stereo output pattern, and another adopts monophonic to export pattern. These 3 kinds application need two audio power amplifying circuits, the area that two pieces of circuit take in the pcb board of complete machine design is big, the periphery design of circuit and welding are complicated, the encapsulation overhead of two pieces of HTSSOP28-EP, thus cause power amplifier circuit cost higher, the cost height of circuit complete machine producer buying circuit.
Summary of the invention
The purpose of this utility model is exactly the problem solving prior art, thus provides a kind of circuit structure being packaged with multiple Audio power amplifier chip, and this encapsulation structure can realize multiple application, it is possible to reduce the area occupied of PCB, reduces encapsulation overhead.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of circuit structure being packaged with multiple Audio power amplifier chip, based on the packaged type of QFN or QFP, this encapsulation structure comprises plastic packaging body and multiple Audio power amplifier chip, it is characterized in that, described multiple Audio power amplifier integrated chip is in one integrated piece, described integrated piece is divided into multiple Chip Area waiting area, each Audio power amplifier chip described is attached on a Chip Area arbitrarily, described plastic packaging body is coated on described integrated piece, described plastic packaging body is provided with multiple functional pin, each functional pin connects with corresponding Audio power amplifier chip.
Preferred: described integrated piece is provided with the Chip Area that 4 are waited area, described 4 Chip Areas are the form arrangement that 2 row 2 arrange.
Preferred further: described Audio power amplifier chip has 2, and one of them is attached to a Chip Area in the upper right corner of 4 Chip Areas, and another is attached to a Chip Area in the lower left corner.
Another is preferred: described plastic packaging body is provided with 64 functional pins, is distributed on the surrounding of plastic packaging body respectively, and each limit is distributed with 16 functional pins.
The beneficial effects of the utility model are: encapsulation structure of the present utility model is passed through multiple Audio power amplifier integrated chip on one integrated piece, and the packing forms that can specifically adopt QFN64L can by two Audio power amplifier Chip Packaging in a plastic packaging body, achieve multiple application mode, effectively reduce the system cost of multiple application scheme.
Compared with encapsulation structure of the present utility model encapsulates structure with the HTSSOP28-EP of the two of prior art Audio power amplifier chips, greatly save encapsulation overhead, the pcb board of complete machine design decreases the area occupied of two chips, decrease the periphery design of circuit and the complexity of welding, it is to increase packaging efficiency.
Accompanying drawing explanation
Fig. 1, encapsulates the electrical block diagram of single Audio power amplifier chip in prior art;
Fig. 2, a kind of structure composition schematic diagram of the present utility model.
Embodiment
Below in conjunction with accompanying drawing and preferred scheme, embodiment of the present utility model is described in further detail.
As shown in Figure 2, structural representation of the present utility model can be described, the composition of a kind of circuit structure being packaged with multiple Audio power amplifier chip specifically can be described, this structure is based on the packaged type of QFN64L, this encapsulation structure comprises plastic packaging body 101 and multiple Audio power amplifier chip 102, described multiple Audio power amplifier chip 102 is integrated in one integrated piece 103, described integrated piece 103 is divided into multiple Chip Area 104 waiting area, each Audio power amplifier chip 102 described is attached on a Chip Area 104 arbitrarily, described plastic packaging body 101 is coated on described integrated piece 103, described plastic packaging body 101 is provided with multiple functional pin 105, each functional pin 105 connects with corresponding Audio power amplifier chip 102.
Embodiment: the present embodiment is the preferred scheme of one of the present utility model, described in the present embodiment, integrated piece 103 is provided with the Chip Area 104 that 4 are waited area, and described 4 Chip Areas are the form arrangement that 2 row 2 arrange;Described Audio power amplifier chip 102 has 2, and one of them is attached to a Chip Area 104 in the upper right corner of 4 Chip Areas 104, and another is attached to a Chip Area 104 in the lower left corner; Described plastic packaging body 101 is provided with 64 functional pins, is distributed on the surrounding of plastic packaging body 101 respectively, and each limit is distributed with 16 functional pins, presses No. 1-64 counterclockwise branch successively from the lower right corner.
Adopt the pin function of QFN64L encapsulation such as following table.
Encapsulation structure in the present embodiment can realize 4 sound channel power amplifier application, 2 sound channel power amplifier application, 2.1 sound channel power amplifier application simultaneously. Compared with the scheme (calling in the following text " former scheme ") that the scheme (calling in the following text " existing scheme ") that the present embodiment is applied in 2.1 sound channel power amplifiers is applied in 2.1 sound channel power amplifiers with prior art, there is following difference: (1) packing forms, former scheme adopts HTSSOP28-EP × 2, and existing scheme adopts QFN64L; (2) packaging cost, the packaging cost of former scheme two pieces of HTSSOP28, the packaging cost of existing scheme only one piece of QFN64L, reduces packaging cost; (3) 2.1 sound channel complete machines use circuit quantity, two pieces, the circuit that former scheme HTSSOP28 encapsulates, one piece, the circuit of existing scheme QFN64L encapsulation; (4) taking complete machine pcb board, it is big that former scheme takies pcb board area, takies the area of two pieces of circuit, and needs spacing between circuit and other device during typesetting, and it is little that existing scheme takies pcb board area, accounts for the 50% of two pieces of HTSSOP28-EP schemes.
Structure of the present utility model is simple, reasonable in design, it is to increase packaging efficiency, reduces the packaging cost of circuit; Can being suitable for multiple application scheme, it may also be useful to convenient, circuit consumption reduces, and simplifies the design of complete machine pcb board, it is to increase production efficiency.
Claims (4)
1. one kind is packaged with the circuit structure of multiple Audio power amplifier chip, based on the packaged type of QFN or QFP, this encapsulation structure comprises plastic packaging body (101) and multiple Audio power amplifier chip (102), it is characterized in that: described multiple Audio power amplifier integrated chip is in one integrated piece (103), described integrated piece is divided into multiple Chip Area (104) waiting area, each Audio power amplifier chip described is attached on a Chip Area arbitrarily, described plastic packaging body is coated on described integrated piece, described plastic packaging body is provided with multiple functional pin (105), each functional pin connects with corresponding Audio power amplifier chip.
2. the circuit structure being packaged with multiple Audio power amplifier chip according to claim 1, is characterized in that: described integrated piece (103) are provided with the Chip Area (104) that 4 are waited area, the form arrangement that described 4 Chip Areas (104) arrange in 2 row 2.
3. the circuit structure being packaged with multiple Audio power amplifier chip according to claim 2, it is characterized in that: described Audio power amplifier chip (102) has 2, one of them is attached to a Chip Area (104) in the upper right corner of 4 Chip Areas (104), and another is attached to a Chip Area (104) in the lower left corner.
4. the circuit structure being packaged with multiple Audio power amplifier chip according to claim 3, it is characterized in that: described plastic packaging body (101) is provided with 64 functional pins (105), 64 pins are distributed on the surrounding of plastic packaging body (101) respectively, and each limit is distributed with 16 functional pins (105).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521123711.4U CN205319143U (en) | 2015-12-31 | 2015-12-31 | Be packaged with a plurality of audio power amplifier chip's circuit structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521123711.4U CN205319143U (en) | 2015-12-31 | 2015-12-31 | Be packaged with a plurality of audio power amplifier chip's circuit structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205319143U true CN205319143U (en) | 2016-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521123711.4U Active CN205319143U (en) | 2015-12-31 | 2015-12-31 | Be packaged with a plurality of audio power amplifier chip's circuit structure |
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| CN (1) | CN205319143U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022036547A1 (en) * | 2020-08-18 | 2022-02-24 | 华为技术有限公司 | Power amplifier chip and communication device |
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2015
- 2015-12-31 CN CN201521123711.4U patent/CN205319143U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022036547A1 (en) * | 2020-08-18 | 2022-02-24 | 华为技术有限公司 | Power amplifier chip and communication device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 214135 -6, Linghu Avenue, Wuxi Taihu international science and Technology Park, Wuxi, Jiangsu, China, 180 Patentee after: China Resources micro integrated circuit (Wuxi) Co., Ltd Address before: No.180-22, Linghu Avenue, Taihu International Science and Technology Park, Wuxi, Jiangsu, 214135 Patentee before: WUXI CHINA RESOURCES SEMICO Co.,Ltd. |