CN203553141U - Interactive lead frame unit and interactive lead frame - Google Patents
Interactive lead frame unit and interactive lead frame Download PDFInfo
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- CN203553141U CN203553141U CN201320513366.XU CN201320513366U CN203553141U CN 203553141 U CN203553141 U CN 203553141U CN 201320513366 U CN201320513366 U CN 201320513366U CN 203553141 U CN203553141 U CN 203553141U
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- pin
- lead frame
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- interactive
- tube foot
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Abstract
The utility model relates to an interactive lead frame unit. The interactive lead frame unit comprises triode units, wherein each of the triode units comprises a chip part, an external pin part, an internal pin part and pin connection bars; the external pin part comprises an emitter pin, a collector pin and a base pin, the collector pin is directly connected with the chip part, and the emitter pin and the base pin are located at the both side of the collector pin; the pins of the internal pin part are in one-to-one correspondence with to the pins of the external pin part, and the central axes thereof are coaxially arranged; the pin connection bars are located between the internal pin part and the external pin part; and the pin connection bars, the pins of the internal pin part, and the pins of the external pin part are communicated. The interactive lead frame unit comprises two triode units with heads and tails which are reversely arranged, wherein the pins of the internal pin parts of the two triode units are crosswise arranged; and because the internal pin parts are the common parts of the two triode units, the material utilization rate is high. In addition, the utility model further provides an interactive lead frame composed of the interactive lead frame unit abovementioned.
Description
Technical field
The utility model relates to semiconductor die package technical field, particularly relates to a kind of interactive lead frame unit and interactive lead frame.
Background technology
Along with the development of national economy, cost of labor constantly rises, and Discrete device packaging industry competition is more and more fierce.Each manufacturer all wishes to set about reducing production costs from raw material, production technology each side, strengthens the competitiveness of enterprise.Wherein, from raw material, reducing production costs is a kind of simple effective method.
For Discrete device packaging industry, lead frame is wherein extremely important.The Main Function of lead frame is supporting chip, lost work calories, by bonding material (spun gold, aluminium wire, copper wire), realizes the electrical connection of chip internal circuit exit and outer lead etc.
And lead frame is accounting for ratio greatly on the cost of Discrete device packaging industry, but there is raw-material waste problem in the lead frame of some conventional models, as being stamped to form TO-92, TO-251, TO-126, TO-220, TO-3P and derivative packing forms thereof by copper strips, the availability of the copper of the lead frame of these models is lower.Take TO-220 lead frame as example, its length is 228.1mm, and wide is 29.67mm, has arranged altogether 20 triode unit above, and under existing technique, its availability is about 72.20%.Therefore, need to design new lead frame and improve the availability of blaster fuse frame material, thereby reach the object reducing production costs.
Utility model content
Based on this, be necessary to provide interactive lead frame unit and the interactive lead frame that a kind of stock utilization is higher.
A kind of interactive lead frame unit, comprises triode unit, and described triode unit comprises chip section, outer tube foot, inner tube foot and pin dowel;
Described outer tube foot comprises emitter pin, collector electrode pin and base stage pin, and described collector electrode pin is directly connected with described chip section, and described emitter pin and base stage pin lay respectively at the both sides of described collector electrode pin;
The pin of the pin of described inner tube foot and described outer tube foot one by one corresponding and axis conllinear arranges;
Described pin dowel is between described inner tube foot and described outer tube foot, and the pin of described pin dowel, described inner tube foot is communicated with the pin of described outer tube foot;
Described interactive lead frame unit comprises the described triode unit of two head and the tail reversed arrangement, the pin cross arrangement of the inner tube foot of two triode unit.
In an embodiment, also comprise location division therein, described location division is connected with described chip section, and one-body molded with described chip section, on described location division, is provided with location hole.
In an embodiment, the length of described interactive lead frame unit is 11.405mm therein, and wide is 47.14mm.
Therein in an embodiment, the pin of described outer tube foot wide identical, is 1.27mm; The pin of described inner tube foot wide identical is 0.81mm.
In an embodiment, the length of described internal pin is 10.94mm therein.
In an embodiment, the centre distance between adjacent internal pin is 1.27mm therein.
In an embodiment, the wide of described pin dowel is 0.63mm therein.
Above-mentioned interactive lead frame unit is oppositely formed inserting by two triode unit head and the tail, the pin of inner tube foot is in the cross arrangement of inner tube foot, inner tube foot becomes the common sparing of two triode unit, the material that has rationally utilized former inner tube foot to be wasted.Compare with traditional lead frame unit, produce same number of triode unit, the material that above-mentioned interactive lead frame unit has rationally utilized former inner tube foot to be wasted, stock utilization is higher, thereby has reduced production cost.Therefore, the production cost of above-mentioned interactive lead frame unit is relatively cheap.And above-mentioned interactive lead frame unit can be applied in the various interactive lead frames that are stamped to form by copper strips, as the lead frame of TO-92, TO-251, TO-126, TO-220, TO-3P or its derivative model.
A kind of interactive lead frame, comprises multiple above-mentioned interactive lead frames unit, and multiple described interactive lead frames unit is set up in parallel.
The stock utilization of above-mentioned interactive lead frame is higher.Take the TO-220 lead frame with 20 triode unit as example, its length is 228.1mm, wide is 29.67mm, and the length of above-mentioned interactive lead frame is with to have 20 triode unit TO-220 lead frames identical, width is 47.14mm, but the interactive lead frame of above-mentioned size has 40 triode unit.Produce 40 triode unit, needing the area of traditional lead frame is 228.1*29.67*2mm
2, needing the area of above-mentioned interactive lead frame is 228.1*47.14mm
2, above-mentioned interactive lead frame is than the material of traditional lead frame saving (29.67*2*228.1-47.14*228.1)/29.67*2*228.1=20.56%.And traditional TO-220 type lead frame availability with 20 triode unit is about 72.20%, and the availability of above-mentioned interactive lead frame is about 81.25%.
Accompanying drawing explanation
Fig. 1 is the structural representation of the interactive lead frame of an execution mode;
Fig. 2 is the interactive lead frame unit of an execution mode and the structural representation of pin dowel;
Fig. 3 is the triode unit of an execution mode and the structural representation of pin dowel.
Embodiment
Below in conjunction with drawings and the specific embodiments, interactive lead frame unit and interactive lead frame are further detailed.
As shown in Figure 1, the interactive lead frame of an execution mode, comprises multiple interactive lead frames unit 10.Multiple interactive lead frames unit 10 is connected to form interactive lead frame by pin dowel 20.
As shown in Figure 2, the interactive lead frame unit 10 of present embodiment comprises the triode unit 100 of two head and the tail reversed arrangement.
As shown in Figure 3, the triode unit 100 of present embodiment comprises location division 110, chip section 120, outer tube foot 130 and inner tube foot 140.
The pin of inner tube foot 140 is corresponding one by one with the pin of outer tube foot 130, and arrangement is in line.Also be
In inner tube foot 140, three pin ones 42,144,146 arrange with the axis conllinear of emitter pin one 32, collector electrode pin one 34 and base stage pin one 36 respectively.
Incorporated by reference to Fig. 2 and Fig. 3, the pin cross arrangement of the inner tube foot 140 of two triode unit 100 in present embodiment, also the internal pin 142 of a triode unit between the internal pin 144 and pin one 46 of another triode unit, other down pass successively.In other embodiments, the pin one 42 of a triode unit in two triode unit between the pin one 42 and pin one 44 of another triode unit, other successively down pass.
In the present embodiment, the length of interactive lead frame unit 10 is 11.405mm, and wide is 47.14mm.Three pins of outer tube foot 130 wide identical is 1.27mm.Three pins of inner tube foot 140 wide identical is 0.81mm; The length of the pin of inner tube foot 140 is 10.94mm; The centre distance of adjacent two pins of inner tube foot 140 is 1.27mm; The wide of pin dowel 20 is 0.63mm.In interactive lead frame X, the location hole distance between adjacent positioned hole 112 is 11.405mm.
Above-mentioned interactive lead frame unit is oppositely formed inserting by two triode unit head and the tail, the pin of inner tube foot is in the cross arrangement of inner tube foot, inner tube foot becomes the common sparing of two triode unit, the material that has rationally utilized former inner tube foot to be wasted.Compare with traditional lead frame unit, produce same number of triode unit, the material that above-mentioned interactive lead frame unit has rationally utilized former inner tube foot to be wasted, stock utilization is higher, thereby has reduced production cost.Therefore, the production cost of above-mentioned interactive lead frame unit is relatively cheap.And above-mentioned interactive lead frame unit can be applied in the various interactive lead frames that are stamped to form by copper strips, as the lead frame of TO-92, TO-251, TO-126, TO-220, TO-3P or its derivative model.
The stock utilization of above-mentioned interactive lead frame is higher.Take the TO-220 lead frame with 20 triode unit as example, its length is 228.1mm, wide is 29.67mm, and the length of above-mentioned interactive lead frame is with to have 20 triode unit TO-220 lead frames identical, width is 47.14mm, but the interactive lead frame of above-mentioned size has 40 triode unit.Produce 40 triode unit, needing the area of traditional lead frame is 228.1*29.67*2mm
2, needing the area of above-mentioned interactive lead frame is 228.1*47.14mm
2, above-mentioned interactive lead frame is than the material of traditional lead frame saving (29.67*2*228.1-47.14*228.1)/29.67*2*228.1=20.56%.
And traditional TO-220 type lead frame availability with 20 triode unit is about 72.20%, and the availability of above-mentioned interactive lead frame is about 81.25%.
Wherein, availability computational methods are as follows:
The lead frame being stamped to form by copper strips, frame part is as copper strips reserve part, and the part that the part of other hollow outs need to cut copper strips exactly supposes that copper strips is even thickness, the ratio of the area of frame area and whole copper strips is availability so.In uneven thickness when copper material, in order to simplify calculating, we can be using being cut into the ratio of the shell frame products quality of type and the quality of former copper strips as the availability of this product.Therefore the efficient calculating formula of certain product is: ρ
availability=S
frame area/ S
consume copper strips area, or ρ
availability=M
framework quality/ M
consume copper strips quality.
In the present embodiment, availability is to pass through formula: ρ
availability=M
framework quality/ M
consume copper strips quality, calculate.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (8)
1. an interactive lead frame unit, is characterized in that, comprises triode unit, and described triode unit comprises chip section, outer tube foot, inner tube foot and pin dowel;
Described outer tube foot comprises emitter pin, collector electrode pin and base stage pin, and described collector electrode pin is directly connected with described chip section, and described emitter pin and base stage pin lay respectively at the both sides of described collector electrode pin;
The pin of the pin of described inner tube foot and described outer tube foot one by one corresponding and axis conllinear arranges;
Described pin dowel is between described inner tube foot and described outer tube foot, and the pin of described pin dowel, described inner tube foot is communicated with the pin of described outer tube foot;
Described interactive lead frame unit comprises the described triode unit of two head and the tail reversed arrangement, the pin cross arrangement of the inner tube foot of two triode unit.
2. interactive lead frame as claimed in claim 1 unit, is characterized in that, also comprises location division, and described location division is connected with described chip section, and one-body molded with described chip section, on described location division, is provided with location hole.
3. interactive lead frame as claimed in claim 1 unit, is characterized in that, the length of described interactive lead frame unit is 11.405mm, and wide is 47.14mm.
4. interactive lead frame as claimed in claim 1 unit, is characterized in that, the pin of described outer tube foot wide identical is 1.27mm; The pin of described inner tube foot wide identical is 0.81mm.
5. interactive lead frame as claimed in claim 1 unit, is characterized in that, the length of described internal pin is 10.94mm.
6. interactive lead frame as claimed in claim 1 unit, is characterized in that, the centre distance between adjacent internal pin is 1.27mm.
7. interactive lead frame as claimed in claim 1 unit, is characterized in that, the wide of described pin dowel is 0.63mm.
8. an interactive lead frame, is characterized in that, comprises multiple interactive lead frame unit as described in any one in claim 1-7, and multiple described interactive lead frames unit is set up in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320513366.XU CN203553141U (en) | 2013-08-21 | 2013-08-21 | Interactive lead frame unit and interactive lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320513366.XU CN203553141U (en) | 2013-08-21 | 2013-08-21 | Interactive lead frame unit and interactive lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553141U true CN203553141U (en) | 2014-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320513366.XU Expired - Lifetime CN203553141U (en) | 2013-08-21 | 2013-08-21 | Interactive lead frame unit and interactive lead frame |
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| CN (1) | CN203553141U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600048A (en) * | 2014-12-30 | 2015-05-06 | 杰群电子科技（东莞）有限公司 | Semiconductor packaging structure and method |
-
2013
- 2013-08-21 CN CN201320513366.XU patent/CN203553141U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600048A (en) * | 2014-12-30 | 2015-05-06 | 杰群电子科技（东莞）有限公司 | Semiconductor packaging structure and method |
| CN104600048B (en) * | 2014-12-30 | 2018-12-18 | 杰群电子科技（东莞）有限公司 | A kind of semiconductor package and method |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140416 |