CN201859874U - 7P lead wire framework - Google Patents

7P lead wire framework Download PDF

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Publication number
CN201859874U
CN201859874U CN 201020579845 CN201020579845U CN201859874U CN 201859874 U CN201859874 U CN 201859874U CN 201020579845 CN201020579845 CN 201020579845 CN 201020579845 U CN201020579845 U CN 201020579845U CN 201859874 U CN201859874 U CN 201859874U
Authority
CN
China
Prior art keywords
outer pin
pin
external pin
dao
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201020579845
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Chinese (zh)
Inventor
李军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUJIANG JUFENG ELECTRONIC CO Ltd
Original Assignee
WUJIANG JUFENG ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUJIANG JUFENG ELECTRONIC CO Ltd filed Critical WUJIANG JUFENG ELECTRONIC CO Ltd
Priority to CN 201020579845 priority Critical patent/CN201859874U/en
Application granted granted Critical
Publication of CN201859874U publication Critical patent/CN201859874U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The utility model discloses a 7P lead wire framework, which comprises a plurality of framework units with pads and external pins around the pads. The external pins comprise a first external pin, a second external pin, a third external pin, a fourth external pin, a fifth external pin, a sixth external pin, and an eighth external pin. The pads comprise an upper pad and a lower pad, which are independent mutually. The lower pad extends towards one side to form the fifth external pin and the sixth external pad. The upper pad extends towards the same side to form the eighth external pin. The sixth external pin is connected with the eighth external pin through a third connecting rib. A seventh external pin, which has the same extension direction with the eighth external pin and is parallel to the eighth external pin, is arranged on the third connecting rib. The fifth external pin and the fourth external pin, the sixth external pin and the third external pin, the eighth external pin and the first external pin, and the seventh external pin and the second external pin are respectively distributed oppositely. When the lead wire framework is used, the seventh external pin is cut off so that a short circuit does not happen on the sixth external pin and the eighth external pin. The lead wire framework has a simple structure, is easy to implement, and is applicable to popularization and use.

Description

A kind of 7P lead frame
Technical field
The utility model relates to a kind of lead frame, more particularly, relates to a kind of 7P lead frame that is converted by the 8P lead frame.
Background technology
The demand that occurs the 7P Chip Packaging in the Chip Packaging industry, will there be the lead frame of a kind of 7P to satisfy the various performance requirements that encapsulate, as shown in Figure 1, owing between the 6th outer pin and the 8th outer pin electrical potential difference is arranged, if the 7th outer pin exists, then can cause between the 6th outer pin and the 8th outer pin and open circuit, even the meeting defective chip, cause damage to the user.
The utility model content
The purpose of this utility model provides a kind of 7P lead frame that is formed through improvement by 8P.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of 7P lead frame, comprise several frame units, each described frame unit comprises Ji Dao and is arranged on described Ji Dao a plurality of outer pin on every side, a plurality of described outer pins are included as the first outer pin, the second outer pin, the 3rd outer pin, pin all round, the 5th outer pin, the 6th outer pin and the 8th outer pin, the side of described Ji Dao is provided with 4 lead district, the described first outer pin, the second outer pin, the 3rd outer pin and all round pin equally spacedly around corresponding successively in the counterclockwise direction 4 the described lead district of described Ji Dao, described Ji Dao comprises separate last Ji Dao and following Ji Dao, described down Ji Dao extends to a side that deviates from described lead district and forms outside the described the 5th pin outside the pin and the described the 6th respectively, the described the 5th outer pin is with described pin is relative all round distributes, the described the 6th outer pin is with the described the 3rd outer pin is relative distributes, the described Ji Dao that goes up extends to form pin outside the described the 8th to a side that deviates from described lead district, and the described the 8th outer pin is with described first outer pin is relative distributes.
Preferably, be connected by the 3rd dowel between the described the 6th outer pin and the described the 8th outer pin, the 7th outer pin that described the 3rd dowel is provided with is identical with the described the 8th outer pin bearing of trend, be parallel to each other with the described the 8th outer pin, the described the 7th outer pin is with described second outer pin is relative distributes.
Preferably, the described first outer pin, the described second outer pin, the described the 3rd outer pin and described are provided with first dowel all round between the pin, be provided with second dowel between the described the 5th outer pin and the described the 6th outer pin.
The beneficial effects of the utility model are: with the 5th outer pin in the 8P lead frame of the prior art, the 6th outer pin, the 7th outer pin and the 8th outer pin redesign, for avoiding being short-circuited between the former the 8th outer pin and the 6th outer pin, during application the former the 7th outer pin is excised, at this moment, the former the 8th outer pin becomes the 7th new outer pin, satisfies the user's request of 7P Chip Packaging with this, and, simple, the easily enforcement of this lead frame structure is adapted at promoting the use of in the industry.
Description of drawings
Accompanying drawing 1 is the structural representation of the single frame unit of 8P lead frame of the prior art;
Accompanying drawing 2 is the structural representation of the single frame unit of 7P lead frame of the present utility model;
Accompanying drawing 3 is the structural representation of 7P lead frame of the present utility model.
In the accompanying drawing: 1, the first outer pin; 2, the second outer pin; 3, the 3rd outer pin; 4, pin all round; 5, the 5th outer pin; 6, the 6th outer pin; 7, the 7th outer pin; 8, the 8th outer pin; 9, go up Ji Dao; 10, following Ji Dao; 11, lead district; 12, first dowel; 13, second dowel; 14, the 3rd dowel.
Embodiment
Below in conjunction with embodiment shown in the drawings the technical solution of the utility model is done following detailed description the in detail:
Shown in accompanying drawing 2 and accompanying drawing 3,7P lead frame of the present utility model comprises several frame units, each frame unit comprises Ji Dao and is arranged on the outer pin on every side of Ji Dao, outer pin comprises the first outer pin 1, the second outer pin 2, the 3rd outer pin 3, pin 4 all round, the 5th outer pin 5, the 6th outer pin 6 and the 8th outer pin 8, the side of Ji Dao is provided with four lead district 11, these four lead district around Ji Dao in the counterclockwise direction one by one with first outside pin 1, the second outer pin 2, the 3rd outer pin 3 and pin 4 is corresponding all round, the 5th outer pin 5 with opposite side, the 6th outer pin 6 and the 8th outer pin 8, the side of Ji Dao be provided with along counterclockwise respectively with first outside pin 1, the second outer pin 2, the 3rd outer pin 3 and is pin 4 corresponding four lead district all round, Ji Dao comprises separate last basic island 9 and following basic island 10, down basic island 9 extends to form outside the 5th pin 6 outside the pin 5 and the 6th to opposite side, go up basic island 9 and extend to form pin 8 outside the 8th to opposite side, the 5th outer pin 5 and pin 4 relative distributions all round, the 6th outer pin 6 and the 3rd outer pin 3 relative distributions, the 8th outer pin 8 and the first outer pin 1 relative distribution, the first outer pin 1, the second outer pin 2, the 3rd outer pin 3 is connected by first dowel 12 between the pin 4 all round with, be connected by second dowel 13 between the 5th outer pin 5 and the 6th outer pin 6, the 6th outer pin 6 and the 8th outer pin 8 are provided with the 3rd dowel 14, it is identical with the 8th outer pin 8 bearing of trends that the 3rd dowel 14 is provided with, the 7th outer pin 7, the seven outer pins 7 and the second outer pin 2 relative distributions that are parallel to each other with the 8th outer pin 8.
During encapsulation, the 7th outer pin 7 with above-mentioned lead frame cuts away earlier, guarantee can not conduct between the 6th outer pin 6 and the 8th outer pin 8, with the 1-4 pin of 7P chip the first outer pin 1 corresponding to this lead frame, the second outer pin 2, the 3rd outer the pin 3 and lead district 11 usefulness leads of pin 4 correspondences all round connects, with this die bonding on Ji Dao, make this chip the 5-7 pin respectively with the 5th outer pin 5 of lead frame of the present utility model, the 6th outer pin 6 and the 8th outer pin 8 corresponding conductings, finally make the 7P chip each pin one by one with the first outer pin 1 of this lead frame, the second outer pin 2, the 3rd outer pin 3, pin 4 all round, the 5th outer pin 5, the 6th outer pin 6 and the 8th outer pin 8 corresponding conductings.
Enforcement simple in structure, easy of the present utility model can be satisfied the demand of user's 7P, is adapted at promoting the use of in this area.
The foregoing description only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present utility model and enforcement according to this, can not limit protection range of the present utility model with this.All equivalences of being done according to the utility model spirit change or modify, and all should be encompassed within the protection range of the present utility model.

Claims (3)

1. 7P lead frame, comprise several frame units, each described frame unit comprises Ji Dao and is arranged on described Ji Dao a plurality of outer pin on every side, a plurality of described outer pins are included as the first outer pin, the second outer pin, the 3rd outer pin, pin all round, the 5th outer pin, the 6th outer pin and the 8th outer pin, it is characterized in that: the side of described Ji Dao is provided with 4 lead district, the described first outer pin, the second outer pin, the 3rd outer pin and all round pin equally spacedly around corresponding successively in the counterclockwise direction 4 the described lead district of described Ji Dao, described Ji Dao comprises separate last Ji Dao and following Ji Dao, described down Ji Dao extends to a side that deviates from described lead district and forms outside the described the 5th pin outside the pin and the described the 6th respectively, the described the 5th outer pin is with described pin is relative all round distributes, the described the 6th outer pin is with the described the 3rd outer pin is relative distributes, the described Ji Dao that goes up extends to form pin outside the described the 8th to a side that deviates from described lead district, and the described the 8th outer pin is with described first outer pin is relative distributes.
2. a kind of 7P lead frame according to claim 1, it is characterized in that: be connected by the 3rd dowel between the described the 6th outer pin and the described the 8th outer pin, the 7th outer pin that described the 3rd dowel is provided with is identical with the described the 8th outer pin bearing of trend, be parallel to each other with the described the 8th outer pin, the described the 7th outer pin is with described second outer pin is relative distributes.
3. a kind of 7P lead frame according to claim 1, it is characterized in that: the described first outer pin, the described second outer pin, the described the 3rd outer pin and described are provided with first dowel all round between the pin, be provided with second dowel between the described the 5th outer pin and the described the 6th outer pin.
CN 201020579845 2010-10-28 2010-10-28 7P lead wire framework Expired - Lifetime CN201859874U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201020579845 CN201859874U (en) 2010-10-28 2010-10-28 7P lead wire framework

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201020579845 CN201859874U (en) 2010-10-28 2010-10-28 7P lead wire framework

Publications (1)

Publication Number Publication Date
CN201859874U true CN201859874U (en) 2011-06-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201020579845 Expired - Lifetime CN201859874U (en) 2010-10-28 2010-10-28 7P lead wire framework

Country Status (1)

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CN (1) CN201859874U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102034783A (en) * 2010-10-28 2011-04-27 吴江巨丰电子有限公司 Seven-pin lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102034783A (en) * 2010-10-28 2011-04-27 吴江巨丰电子有限公司 Seven-pin lead frame
CN102034783B (en) * 2010-10-28 2012-03-28 吴江巨丰电子有限公司 Seven-pin lead frame

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C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20110608

Effective date of abandoning: 20120328