CN204029816U - A kind of chip diode - Google Patents
A kind of chip diode Download PDFInfo
- Publication number
- CN204029816U CN204029816U CN201420461640.8U CN201420461640U CN204029816U CN 204029816 U CN204029816 U CN 204029816U CN 201420461640 U CN201420461640 U CN 201420461640U CN 204029816 U CN204029816 U CN 204029816U
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- CN
- China
- Prior art keywords
- paster
- lead
- wire
- dao
- backlight unit
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- Expired - Lifetime
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- 238000005452 bending Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 230000002000 scavenging effect Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model relates to a kind of chip diode, comprise the first lead-in wire, the second lead-in wire, diode chip for backlight unit and plastic-sealed body, the first lead-in wire and second goes between and has respectively separately and its first paster Ji Dao and the second paster Ji Dao of one each other, the back side of diode chip for backlight unit and the first lead-in wire paster base island load, the front of diode chip for backlight unit and the second paster base island load, described the first paster Ji Dao, the second paster Ji Dao and diode chip for backlight unit are all encapsulated in plastic-sealed body; Described the first lead-in wire have one with its first terminal pin of one each other, and the first terminal pin is exposed at outside plastic-sealed body; There is the first groove on the second free-ended end, paster base island, and there is the second groove the second free-ended both sides, paster base island; The second lead-in wire have two with its second terminal pin of one each other, and two the second terminal pins are all exposed at outside plastic-sealed body.The utlity model has and reduce the empty area of welding, can discharge the suffered stress of diode chip for backlight unit, and thermal diffusivity is good, and improve the advantages such as product reliability.
Description
Technical field
The utility model is specifically related to a kind of chip diode, is applicable to the chip diode on electrical equipment, equipment and parts, belongs to semiconductor microelectronics device technology field.
Background technology
In existing chip diode, the front and back of diode chip for backlight unit is equipped mutually with the first paster Ji Dao of the first lead-in wire and the second paster Ji Dao of the second lead-in wire respectively, and the second paster Ji Dao of the second lead-in wire is the encapsulating products that belongs to larger comparatively speaking, like this, in diode chip for backlight unit and paster base island welding process, very easily produce larger cavity, and can produce larger thermal stress, mechanical stress iso-stress, also can cause diode chip for backlight unit and therefore can impairedly break or crack, and to product fine rate and the larger hidden danger of mass formation, reduce the reliability of product, all have a terminal pin because the first lead-in wire and second in prior art goes between again, therefore, this product is under operating mode, and thermal diffusivity is relatively poor.
Summary of the invention
The purpose of this utility model is: a kind of empty area of welding that reduces is provided, can discharge the suffered stress of diode chip for backlight unit, and thermal diffusivity is good, and improves the chip diode of product reliability, to overcome the deficiencies in the prior art.
In order to achieve the above object, the technical solution of the utility model: a kind of chip diode, comprise the first lead-in wire, the second lead-in wire, diode chip for backlight unit and plastic-sealed body, described the first lead-in wire and second goes between and has respectively separately and its first paster Ji Dao and the second paster Ji Dao of one each other, the back side of described diode chip for backlight unit and the first lead-in wire paster base island load, the front of diode chip for backlight unit and the second paster base island load, described the first paster Ji Dao, the second paster Ji Dao and diode chip for backlight unit are all encapsulated in plastic-sealed body; Described the first lead-in wire have one with its first terminal pin of one each other, and the first terminal pin is exposed at outside plastic-sealed body; Its innovative point is:
There is the first groove a, described the second free-ended end, paster base island, and there is the second groove the second free-ended both sides, paster base island;
B, described the second lead-in wire have two with its second terminal pin of one each other, and two the second terminal pins are all exposed at outside plastic-sealed body.
In technique scheme, the second paster Ji Dao of described the second lead-in wire is connected transition position with two the second terminal pins bending section, and bending section is near the side edge of plastic-sealed body.
In technique scheme, all there is gap the first paster Ji Dao of described the first lead-in wire and the both sides at the first adjacent position of terminal pin, and gap is near the first terminal pin place.
In technique scheme, the back side of described diode chip for backlight unit and front all by conducting resinl or soldering paste or weld tabs respectively with the first paster Ji Dao and the second paster base island load.
The good effect that the utility model has is: adopt after above-mentioned chip diode, because there is the first groove described the second free-ended end, paster base island, and there is the second groove on the second free-ended both sides, paster base island, like this, the groove that the second paster base island is set up can play scavenging action, can effectively reduce the empty area of welding, can not produce larger thermal stress, mechanical stress iso-stress yet, can not cause diode chip for backlight unit and therefore can impairedly break or crack, improve the reliability of product yet; Again due to described the second lead-in wire have two with its second terminal pin of one each other, and two the second terminal pins are all exposed at outside plastic-sealed body, can improve like this thermal diffusivity of product under operating mode, have realized the purpose of this utility model.
Brief description of the drawings
Fig. 1 is the structural representation of a kind of embodiment of the utility model;
Fig. 2 is the A-A cross-sectional schematic of Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and the embodiment that provides, the utility model is further described, but is not limited to this.
As shown in Figure 1, 2, a kind of chip diode, comprise the first lead-in wire 1, the second lead-in wire 2, diode chip for backlight unit 3 and plastic-sealed body 4, described the first lead-in wire 1 and the second lead-in wire 2 have respectively and its first paster base island 1-1 and the second paster base island 2-1 of one each other separately, the back side of described diode chip for backlight unit 3 and the first lead-in wire paster base island 1-1 load, the front of diode chip for backlight unit 3 and the second paster base island 2-1 load, described the first paster base island 1-1, the second paster base island 2-1 and diode chip for backlight unit 3 are all encapsulated in plastic-sealed body 4; Described the first lead-in wire 1 have one with its first terminal pin 1-2 of one each other, and the first terminal pin 1-2 is exposed at outside plastic-sealed body 4; And its:
There is the first groove 2-2 a, described the second free-ended end of paster base island 2-1, and there is the second groove 2-3 the second free-ended both sides of paster base island 2-1;
B, described the second lead-in wire 2 have two with its second terminal pin 2-4 of one each other, and two the second terminal pin 2-4 are all exposed at outside plastic-sealed body 4.
As shown in Figure 1, 2, in order to strengthen the adhesion between lead-in wire and plastic-sealed body, the second paster base island 2-1 of described the second lead-in wire 2 is connected transition position with two the second terminal pin 2-4 bending section 2-5, and bending section 2-5 is near the side edge of plastic-sealed body 4.
As shown in Figure 1, in order further to improve the adhesion between paster Ji Dao and plastic-sealed body, all there is gap 1-3 the first paster base island 1-1 of described the first lead-in wire 1 and the both sides at the first adjacent position of terminal pin 1-2, and gap 1-3 is near the first terminal pin 1-2 place.
The back side of diode chip for backlight unit 3 described in the utility model and front all by conducting resinl or soldering paste or weld tabs respectively with the first paster base island 1-1 and the second paster base island 2-1 load.
When the utility model uses, described the first terminal pin 1-2 and the second terminal pin 2-4 are welded on electronic circuit board, and the second terminal pin 2-4 has 2, can improve like this thermal diffusivity of product under operating mode; And there is the first groove 2-2 described the second free-ended end of paster base island 2-1, and there is the second groove 2-3 the second free-ended both sides of paster base island 2-1, and groove 2-3 can play scavenging action like this, can effectively reduce empty area, has strengthened the reliability of product.
The demonstration of the utility model lab scale effect, its effect is well-content.
Claims (4)
1. a chip diode, comprise the first lead-in wire (1), the second lead-in wire (2), diode chip for backlight unit (3) and plastic-sealed body (4), described the first lead-in wire (1) and second go between (2) have respectively separately and its first paster Ji Dao (1-1) and the second paster Ji Dao (2-1) of one each other, the back side of described diode chip for backlight unit (3) and the first lead-in wire paster Ji Dao (1-1) load, the front of diode chip for backlight unit (3) and the second paster Ji Dao (2-1) load, described the first paster Ji Dao (1-1), the second paster Ji Dao (2-1) and diode chip for backlight unit (3) are all encapsulated in plastic-sealed body (4), described the first lead-in wire (1) have one with its first terminal pin (1-2) of one each other, and the first terminal pin (1-2) is exposed at outside plastic-sealed body (4), it is characterized in that:
There is the first groove (2-2) a, described the second free-ended end of paster Ji Dao (2-1), and there is the second groove (2-3) the second free-ended both sides of paster Ji Dao (2-1);
B, described the second lead-in wire (2) have two with its second terminal pin (2-4) of one each other, and two the second terminal pins (2-4) are all exposed at outside plastic-sealed body (4).
2. chip diode according to claim 1, it is characterized in that: the second paster Ji Dao (2-1) of described the second lead-in wire (2) is connected transition position with two the second terminal pins (2-4) bending section (2-5), and bending section (2-5) is near the side edge of plastic-sealed body (4).
3. chip diode according to claim 1, it is characterized in that: all there is gap (1-3) described the first lead-in wire first paster Ji Dao (1-1) of (1) and the both sides at the adjacent position of the first terminal pin (1-2), and gap (1-3) is located near the first terminal pin (1-2).
4. chip diode according to claim 1, is characterized in that: the back side of described diode chip for backlight unit (3) and front all by conducting resinl or soldering paste or weld tabs respectively with the first paster Ji Dao (1-1) and the second paster Ji Dao (2-1) load.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420461640.8U CN204029816U (en) | 2014-08-15 | 2014-08-15 | A kind of chip diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420461640.8U CN204029816U (en) | 2014-08-15 | 2014-08-15 | A kind of chip diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204029816U true CN204029816U (en) | 2014-12-17 |
Family
ID=52069647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420461640.8U Expired - Lifetime CN204029816U (en) | 2014-08-15 | 2014-08-15 | A kind of chip diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204029816U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110400755A (en) * | 2018-04-24 | 2019-11-01 | 财团法人工业技术研究院 | Semiconductor package |
-
2014
- 2014-08-15 CN CN201420461640.8U patent/CN204029816U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110400755A (en) * | 2018-04-24 | 2019-11-01 | 财团法人工业技术研究院 | Semiconductor package |
| CN110400755B (en) * | 2018-04-24 | 2022-02-01 | 财团法人工业技术研究院 | Semiconductor packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee after: CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO.,LTD. Address before: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee before: CHANGZHOU GALAXY CENTURY MICRO-ELECTRONICS Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20141217 |
|
| CX01 | Expiry of patent term |