CN204230400U - A kind of for increasing the bond-wire inductor link model in microwave device match circuit - Google Patents
A kind of for increasing the bond-wire inductor link model in microwave device match circuit Download PDFInfo
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- CN204230400U CN204230400U CN201420762204.4U CN201420762204U CN204230400U CN 204230400 U CN204230400 U CN 204230400U CN 201420762204 U CN201420762204 U CN 201420762204U CN 204230400 U CN204230400 U CN 204230400U
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- Prior art keywords
- bonding line
- model
- bond
- match circuit
- increasing
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Abstract
The utility model discloses a kind of for increasing the bond-wire inductor link model in microwave device match circuit, for connecting two bodies to be connected, it is characterized in that, comprise pad and two bonding lines; Described pad is provided with metal parts; Bonding line described in every bar connects described metal parts and a body to be connected.The beneficial effect that the utility model reaches: between individual layer electric capacity (or chip or device pin), insert a pad, and according to the requirement keystroke zygonema of figure below.Like this, when realizing same inductance value, the length of two bonding lines is all short than the bonding line length in original scheme.Thus in the microwave Matching Network design needing long bonding line, reduce bonding line technology difficulty, add reliability of technology, improve bonding line.
Description
Technical field
The utility model relates to a kind of for increasing the bond-wire inductor link model in microwave device match circuit, belongs to microwave power device design field.
Background technology
In the match circuit of microwave device, bonding line has the effect of inductance, forms microwave matching circuit with individual layer electric capacity or other forms of electric capacity.Usual inductance is directly proportional to the length of bonding line.Need in the matching network of larger inductance at some, bonding line must be very long.But bonding line exceedes the difficulty that certain length can increase technique, reduce the reliability of bonding line and the bearing capacity of electric current.
Utility model content
For solving the deficiencies in the prior art, the purpose of this utility model is to provide a kind of bonding line link model being applicable to large inductance value microwave device match circuit, can reduce technology difficulty, improve the reliability of bonding line and the bearing capacity of electric current.
In order to realize above-mentioned target, the utility model adopts following technical scheme:
For increasing the bond-wire inductor link model in microwave device match circuit, for connecting two bodies to be connected, it is characterized in that, comprising pad and two bonding lines; Described pad is provided with metal parts; Bonding line described in every bar connects described metal parts and a body to be connected.
Aforesaidly a kind ofly to it is characterized in that for increasing the bond-wire inductor link model in microwave device match circuit, described body to be connected is individual layer electric capacity or chip or device pin.
Aforesaidly a kind ofly to it is characterized in that for increasing the bond-wire inductor link model in microwave device match circuit, described pad is pottery.
The beneficial effect that the utility model reaches: between individual layer electric capacity (or chip or device pin), insert a pad, and according to the requirement keystroke zygonema of figure below.Like this, when realizing same inductance value, the length of two bonding lines is all short than the bonding line length in original scheme.Thus in the microwave Matching Network design needing long bonding line, reduce bonding line technology difficulty, add reliability of technology, improve bonding line.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the end view of Fig. 1.
The implication of Reference numeral in figure:
1-body to be connected, 2-bonding line, 3-pad, 4-metal parts.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection range of the present utility model with this.
It is a kind of for increasing the bond-wire inductor link model in microwave device match circuit that the utility model relates to.In prior art, in the match circuit of microwave device, bonding line has the effect of inductance, forms microwave matching circuit with individual layer electric capacity or other forms of electric capacity.Usual inductance is directly proportional to the length of bonding line.Need in the matching network of larger inductance at some, bonding line must be very long.But bonding line exceedes the difficulty that certain length can increase technique, reduce the reliability of bonding line and the bearing capacity of electric current.
This device is provided with pad between two bodies 1 to be connected, and is connected respectively by two bonding lines.Body 1 to be connected is individual layer electric capacity or chip or device pin.As Fig. 1, pad is provided with metal parts, two ends connection metal parts and a body 1 to be connected respectively of every bar bonding line.Like this, when realizing same inductance value, the length of two bonding lines is all short than the bonding line length in original scheme.Thus in the microwave Matching Network design needing long bonding line, reduce bonding line technology difficulty, add reliability of technology, improve bonding line.
Preferentially, pad can select ceramic gasket.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvement and distortion, these improve and distortion also should be considered as protection range of the present utility model.
Claims (3)
1. for increasing the bond-wire inductor link model in microwave device match circuit, for connecting two bodies to be connected, it is characterized in that, comprising pad and two bonding lines; Described pad is provided with metal parts; Bonding line described in every bar connects described metal parts and a body to be connected.
2. according to claim 1ly a kind ofly to it is characterized in that for increasing the bond-wire inductor link model in microwave device match circuit, described body to be connected is individual layer electric capacity or chip or device pin.
3. according to claim 1ly a kind ofly to it is characterized in that for increasing the bond-wire inductor link model in microwave device match circuit, described pad is pottery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420762204.4U CN204230400U (en) | 2014-12-08 | 2014-12-08 | A kind of for increasing the bond-wire inductor link model in microwave device match circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420762204.4U CN204230400U (en) | 2014-12-08 | 2014-12-08 | A kind of for increasing the bond-wire inductor link model in microwave device match circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204230400U true CN204230400U (en) | 2015-03-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420762204.4U Expired - Fee Related CN204230400U (en) | 2014-12-08 | 2014-12-08 | A kind of for increasing the bond-wire inductor link model in microwave device match circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204230400U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409820A (en) * | 2014-12-08 | 2015-03-11 | 江苏博普电子科技有限责任公司 | Bond-wire inductor connection model for improved microwave device matching circuit |
-
2014
- 2014-12-08 CN CN201420762204.4U patent/CN204230400U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409820A (en) * | 2014-12-08 | 2015-03-11 | 江苏博普电子科技有限责任公司 | Bond-wire inductor connection model for improved microwave device matching circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150325 Termination date: 20211208 |