CN103617965B - A kind of external form has the flat integrated circuit package structure of lead - Google Patents
A kind of external form has the flat integrated circuit package structure of lead Download PDFInfo
- Publication number
- CN103617965B CN103617965B CN201310590157.XA CN201310590157A CN103617965B CN 103617965 B CN103617965 B CN 103617965B CN 201310590157 A CN201310590157 A CN 201310590157A CN 103617965 B CN103617965 B CN 103617965B
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- Prior art keywords
- integrated circuit
- pin
- lead
- external form
- draw pin
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- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 238000003780 insertion Methods 0.000 claims abstract description 4
- 230000037431 insertion Effects 0.000 claims abstract description 4
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention relates to the flat integrated circuit package structures that a kind of external form has lead, including the circuit board being sequentially stacked, substrate, integrated circuit and adhesive material, jack is offered on integrated circuit side wall, jack interpolation is connected to the draw pin of Z-shaped structure in succession, the insertion end of draw pin and the two sides of output end are equipped with arc positioning side, the main function on arc positioning side is after draw pin is inserted into jack, arc positioning side is structure as a whole with draw pin, several pins are laterally placed on circuit board, one end of pin is equipped with the pin bores that connection is plugged with draw pin output end, the other end of pin stretches out outside circuit board.A kind of external form has the flat integrated circuit package structure of lead can in use using the integrated circuit package structure of such design, and integrated circuit and circuit board contacts area are big, and using effect is good and replaces conveniently.
Description
Technical field
The present invention relates to the field of integrated antenna package, especially a kind of external form has the flat integrated antenna package of lead
Structure.
Background technique
Various electronic products include the chip of different function, these chips with integrated circuit are by various semiconductors
Fabrication process goes out, and in the technical field of semiconductors manufacture, the integrated antenna package technology for belonging to back-end manufacturing is occupied
Very important status.
It is in integrated circuit package structure at present, integrated circuit and circuit board is mutually connected, is all to use
Conducting wire is connected, since conducting wire and pin are connected with each other, phenomena such as be easy to causeing rosin joint, solder joint that can not weld, to cause
Occur breaking phenomena in use, to influence to use, and if integrated circuit damages in use, just needs
First conducting wire weld by being welded iron, if misoperation, be easy to cause the damage of circuit board.
Summary of the invention
The technical problem to be solved by the present invention is above-mentioned in order to solve the problems, such as, providing a kind of external form has
The flat integrated circuit package structure of lead, design structure is reasonable and contact area is big, and using effect is good.
The technical solution adopted by the present invention to solve the technical problems is: a kind of external form has the flat integrated circuit of lead
Encapsulating structure, including be sequentially stacked circuit board, set substrate on circuit boards, be placed on substrate and be electrically connected to each other with substrate
Integrated circuit and covering be sealed in the adhesive material on substrate, the integrated electricity on the integrated and by integrated circuit
Jack is offered on trackside wall, jack interpolation is connected to the draw pin of Z-shaped structure, the insertion end of draw pin and the two sides of output end in succession
When being equipped with arc positioning, the main function on arc positioning side is after draw pin is inserted into jack, to can be realized a tensioner,
To realize the purpose of locking, arc positioning side is structure as a whole with draw pin, is laterally placed with several on the circuit board
Pin, one end of pin are equipped with the pin bores that connection is plugged with draw pin output end, and the other end of pin stretches out outside circuit board, draws
Needle realizes contact of the face with face with pin bores, to have the big advantage of contact area, can be convenient for changing integrated circuit.
In order to realize that high powered, the material of the draw pin are magnesium alloy.
The adhesive material is epoxy resin.
In order to keep its contact area bigger, the pin bores are flat taper hole.
The beneficial effects of the present invention are: a kind of external form has the flat integrated circuit package structure of lead, use
The integrated circuit package structure of such design, can in use, and integrated circuit and circuit board contacts area are big, uses
Effect is good and replaces conveniently.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the overall structure signal for the flat integrated circuit package structure that a kind of external form of the present invention has lead
Figure；
Fig. 2 is the structural schematic diagram of draw pin in Fig. 1.
Attached drawing acceptance of the bid note is described below: 1, circuit board, 2, substrate, 3, integrated circuit, 4, jack, 5, draw pin, 6, arc it is fixed
Position side, 7, pin, 8, pin bores.
Specific embodiment
In conjunction with the accompanying drawings, the present invention is further explained in detail.These attached drawings are simplified schematic diagram, only with
Illustration illustrates basic structure of the invention, therefore it only shows the composition relevant to the invention.
A kind of external form as depicted in figs. 1 and 2 has the flat integrated circuit package structure of lead, including what is be sequentially stacked
It circuit board 1, the integrated circuit 3 for setting substrate 2 on the circuit card 1, being placed on substrate 2 and being electrically connected to each other with substrate 2 and covers
The adhesive material on integrated circuit 3 and by the sealing of integrated circuit 3 on a substrate 2 is covered, adhesive material is epoxy resin, integrates electricity
Jack 4 is offered on 3 side wall of road, 4 interpolation of jack is connected to the draw pin 5 of Z-shaped structure in succession, and the material of draw pin 5 is magnesium alloy,
The insertion end of draw pin 5 and the two sides of output end are equipped with arc positioning side 6, and arc positioning side 6 is structure as a whole with draw pin 5,
Several pins 7 are laterally placed on circuit board 1, one end of pin 7 is equipped with the pin bores that connection is plugged with 5 output end of draw pin
8, pin bores 8 are flat taper hole, and the other end of pin 7 stretches out outside circuit board 1.
A kind of external form of the invention has the flat integrated circuit package structure of lead, successively by circuit board 1, substrate 2, collection
It is packaged at circuit 3 by adhesive material, keeps integrated circuit 3 and pin 7 mutual using the draw pin 5 with arc positioning side 6
Electrical connection, realizes good connecting effect, and be less prone to broken string phenomenon, long service life.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (4)
1. a kind of external form have lead flat integrated circuit package structure, including be sequentially stacked circuit board (1), be located at circuit
Substrate (2) on plate (1), the integrated circuit (3) for being placed on substrate (2) and being electrically connected to each other with substrate (2) and it is covered on collection
It is sealed in the adhesive material on substrate (2) on circuit (3) and by integrated circuit (3), it is characterized in that: the integrated circuit
(3) it is offered on side wall jack (4), jack (4) interpolation is connected to the draw pin (5) of Z-shaped structure, the insertion end of draw pin (5) in succession
It is equipped with arc positioning side (6) with the two sides of output end, arc positioning side (6) is structure as a whole with draw pin (5), the electricity
Several pins (7) are laterally placed on road plate (1), one end of pin (7), which is equipped with, plugs connection with draw pin (5) output end
The other end of pin bores (8), pin (7) stretches out circuit board (1) outside.
2. a kind of external form according to claim 1 has the flat integrated circuit package structure of lead, it is characterized in that: described
Draw pin (5) material be magnesium alloy.
3. a kind of external form according to claim 1 has the flat integrated circuit package structure of lead, it is characterized in that: described
Adhesive material be epoxy resin.
4. a kind of external form according to claim 1 has the flat integrated circuit package structure of lead, it is characterized in that: described
Pin bores (8) be flat taper hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310590157.XA CN103617965B (en) | 2013-11-20 | 2013-11-20 | A kind of external form has the flat integrated circuit package structure of lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310590157.XA CN103617965B (en) | 2013-11-20 | 2013-11-20 | A kind of external form has the flat integrated circuit package structure of lead |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103617965A CN103617965A (en) | 2014-03-05 |
| CN103617965B true CN103617965B (en) | 2019-02-22 |
Family
ID=50168668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310590157.XA Active CN103617965B (en) | 2013-11-20 | 2013-11-20 | A kind of external form has the flat integrated circuit package structure of lead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103617965B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10553523B2 (en) * | 2015-11-20 | 2020-02-04 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device |
| CN107906378A (en) * | 2017-11-16 | 2018-04-13 | 江门市江海区康欣电子科技有限公司 | A kind of four light source lamp beads |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6413796B1 (en) * | 2000-08-31 | 2002-07-02 | Kil Seob Noh | Tape for semiconductor package, method of manufacturing the same, and method of manufacturing the package using the tape |
| CN203553131U (en) * | 2013-11-20 | 2014-04-16 | 常州唐龙电子有限公司 | Flat integrated circuit packaging structure with lead in appearance |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60257533A (en) * | 1984-06-05 | 1985-12-19 | Nec Corp | Semiconductor device |
| US5018005A (en) * | 1989-12-27 | 1991-05-21 | Motorola Inc. | Thin, molded, surface mount electronic device |
-
2013
- 2013-11-20 CN CN201310590157.XA patent/CN103617965B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6413796B1 (en) * | 2000-08-31 | 2002-07-02 | Kil Seob Noh | Tape for semiconductor package, method of manufacturing the same, and method of manufacturing the package using the tape |
| CN203553131U (en) * | 2013-11-20 | 2014-04-16 | 常州唐龙电子有限公司 | Flat integrated circuit packaging structure with lead in appearance |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103617965A (en) | 2014-03-05 |
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Address after: 213200, Huafeng Road, Jintan Economic Development Zone, Changzhou, Jiangsu, Jintan 188, China Patentee after: Changzhou Tanglong Electronic Co.,Ltd. Address before: 213200, Huafeng Road, Jintan Economic Development Zone, Changzhou, Jiangsu, Jintan 188, China Patentee before: CHANGZHOU TANGLONG ELECTRONICS Co.,Ltd. |
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Effective date of registration: 20240103 Address after: Floors 3-4, Building 8, Semiconductor Phase I, No.1 Jinshan Road, Juegang Street, Rudong County, Nantong City, Jiangsu Province, 226000 Patentee after: Jiangsu Tanglong Electronic Technology Co.,Ltd. Address before: No. 188 Huafeng Road, Jintan Economic Development Zone, Jintan City, Changzhou City, Jiangsu Province, 213200 Patentee before: Changzhou Tanglong Electronic Co.,Ltd. |
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| TR01 | Transfer of patent right |