CN207651047U - A kind of patch chip experiment bread board - Google Patents
A kind of patch chip experiment bread board Download PDFInfo
- Publication number
- CN207651047U CN207651047U CN201721073005.2U CN201721073005U CN207651047U CN 207651047 U CN207651047 U CN 207651047U CN 201721073005 U CN201721073005 U CN 201721073005U CN 207651047 U CN207651047 U CN 207651047U
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- pad
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- bread board
- patch
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Abstract
A kind of patch chip experiment bread board, including rectangular substrate：Pad group is uniformly provided on substrate, the pad group includes the pad of three connections arranged in a straight line；The top and bottom position of the bread board is equipped with big pad arranged in a straight line along the edge of bread board respectively；The big pad of top left is connected to the big pad of bottom left end by left heavy gauge wire, and the big pad of top right end is connected to the big pad of bottom right end by right heavy gauge wire, is connected to by central conductor between the big pad in the centre position of top and bottom；The both sides of central conductor are equipped with chip patch package interface, and the upper side and lower side of chip patch package interface is equipped with decoupling capacitor soldering opening.
Description
Technical field
The utility model is related to electricity fields, and in particular to a kind of patch chip experiment bread board.
Background technology
Bread board is due to having many small jacks to hence obtain one's name like the aperture in bread on plank, aiming at electronic circuit
Experimental design manufacture.Existing bread board includes solderless bread board, reusable.But dedicated pin is needed to build electricity
Road.It builds that rear circuit is messy, and reliability is not high, may be only available for direct inserting device.The also welded type bread board of PCB forms leads to
It crosses welding and builds circuit.It cannot reuse, it is difficult to realize that surface mount elements circuit is built.Patch encapsulates extensive use at present, because
This, it is necessary to design a kind of bread board being conducive to the experiment of patch encapsulated circuit.
Utility model content
The utility model provides a kind of patch chip experiment bread board in order to solve the above problem
The utility model is achieved by the following technical solution：
A kind of patch chip experiment bread board, including rectangular substrate：Pad group, the pad are uniformly provided on substrate
Group includes the pad of three connections arranged in a straight line；The top and bottom position of the bread board is set along the edge of bread board respectively
There is big pad arranged in a straight line, the external interface that can be used as experimental plate uses；The big pad of top left and bottom left end it is big
Pad is connected to by left heavy gauge wire, and the big pad of top right end is connected to the big pad of bottom right end by right heavy gauge wire, top
It is connected to by central conductor between the big pad in the centre position of bottom；The both sides of central conductor are equipped with the encapsulation of chip patch and connect
Mouthful, the upper side and lower side of chip patch package interface is equipped with decoupling capacitor soldering opening.
Further to improve, the pad in the pad group is rounded square, and adjacent pad is diagonally arranged using angle.
Further to improve, the obverse and reverse of experiment bread board is equipped with the identical pad group of layout, big pad, thick
Conducting wire and chip patch package interface.
Further to improve, the front chip patch package interface pad spacing of experiment bread board is 1.27mm,
Back side chip patch package interface pad spacing is 0.65mm, and patch pad uses elongate in shape, wide with the chip for adapting to different
Degree.
Further to improve, distance is 5.08mm between adjacent two big pad.
Further to improve, bread board central conductor both sides are equipped with 6 chip patch package interfaces.
Compared with prior art, the utility model has the following advantages：
The bread board of the utility model interconnects part pad in advance, reduces the welding capacity that circuit is built, convenient for circuit point
It cuts and connects, edge uses the big pads of spacing 5.08mm, and connector welding, left and right side edge and centre is convenient for connect using heavy gauge wire
It connects, can be used as power cord use, and this thick line is connect with 6, edge pad, be convenient for plant-grid connection.Positive and negative uses two kinds of spacing
Patch encapsulates.Front patch chip spacing 1.27mm.Back side patch chip spacing 0.65mm, chip bonding pad use elongate in shape,
Applicable different Chip-wide.It is debugged convenient for patch chip.And there are decoupling capacitor welding positions for chip upper and lower position.Using
This bread board, which can shorten, builds circuit time, improves the working efficiency for building circuit.
Description of the drawings
Fig. 1 is experiment bread board front elevation；
Fig. 2 is pad group enlarged drawing；
Fig. 3 is the big pad enlarged drawing in edge；
Fig. 4 is heavy gauge wire connection diagram；
Fig. 5 is front chip patch package interface；
Fig. 6 is reverse side chip patch package interface.
Specific implementation mode
Embodiment 1
A kind of patch chip experiment bread board as shown in Figure 1, including rectangular substrate：Pad is uniformly provided on substrate
Group, the pad group include the pad of three connections arranged in a straight line, and the pad in the pad group is rounded square, adjacent
Pad be diagonally arranged using angle（As shown in Figure 2）, such shape and set-up mode are convenient for having connected the segmentation of pad, be convenient for
The connection of not connected pad.The top and bottom position of the bread board is equipped with along the edge of bread board arranged in a straight line respectively
Big pad（As shown in Figure 3）, distance is 5.08mm between adjacent two big pad, and can be used as the external interface of experimental plate makes
With convenient for connector welding.The big pad of top left is connected to the big pad of bottom left end by left heavy gauge wire, top right end
Big pad be connected to by right heavy gauge wire with the big pad of bottom right end, between the big pad in the centre position of top and bottom lead to
Cross central conductor connection（As shown in Figure 4）, this three unicom conducting wires can be as the power cord of experimental plate, and this thick line and edge
6 pad connections, are convenient for plant-grid connection.The both sides of central conductor are equipped with 6 chip patch package interfaces, and the encapsulation of chip patch connects
The upper side and lower side of mouth is equipped with decoupling capacitor soldering opening.The obverse and reverse of experiment bread board is equipped with the identical weldering of layout
Disk group, big pad, heavy gauge wire and chip patch package interface.The front chip patch package interface spacing of experiment bread board is
1.27mm, back side chip patch package interface spacing are 0.65mm（As shown in Figure 5 and Figure 6）.A variety of patch encapsulation can be welded
Component, convenient for patch chip debug, and patch pad use elongate in shape, to adapt to different Chip-wides.
Claims (6)
1. a kind of patch chip experiment bread board, which is characterized in that including rectangular substrate：Pad is uniformly provided on substrate
Group, the pad group include the pad of three connections arranged in a straight line；The top and bottom position of the bread board is respectively along face
The edge of wrapper sheet is equipped with big pad arranged in a straight line；The big pad of top left and the big pad of bottom left end pass through left heavy gauge wire
Connection, the big pad of top right end are connected to the big pad of bottom right end by right heavy gauge wire, the centre position of top and bottom
Big pad between be connected to by central conductor；The both sides of central conductor are equipped with chip patch package interface, the encapsulation of chip patch
The upper side and lower side of interface is equipped with decoupling capacitor soldering opening.
2. a kind of patch chip experiment bread board as described in claim 1, which is characterized in that the pad in the pad group
For rounded square, adjacent pad is diagonally arranged using angle.
3. a kind of patch chip experiment bread board as described in claim 1, which is characterized in that the front of experiment bread board
It is equipped with the identical pad group of layout, big pad, heavy gauge wire, decoupling capacitor interface and chip patch package interface with reverse side.
4. a kind of patch chip experiment bread board as claimed in claim 2, which is characterized in that the experiment bread board
Front chip patch package interface pad spacing is 1.27mm, and back side chip patch package interface pad spacing is 0.65mm.
5. a kind of patch chip experiment bread board as described in claim 1, which is characterized in that the big pad of adjacent two it
Between distance be 5.08mm.
6. a kind of patch chip experiment bread board as described in claim 1, which is characterized in that the bread board central conductor
Both sides are equipped with 6 chip patch package interfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721073005.2U CN207651047U (en) | 2017-08-25 | 2017-08-25 | A kind of patch chip experiment bread board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721073005.2U CN207651047U (en) | 2017-08-25 | 2017-08-25 | A kind of patch chip experiment bread board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207651047U true CN207651047U (en) | 2018-07-24 |
Family
ID=62885897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721073005.2U Active CN207651047U (en) | 2017-08-25 | 2017-08-25 | A kind of patch chip experiment bread board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207651047U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035608A (en) * | 2019-05-23 | 2019-07-19 | 上海健康医学院 | A kind of common printed circuit board |
-
2017
- 2017-08-25 CN CN201721073005.2U patent/CN207651047U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110035608A (en) * | 2019-05-23 | 2019-07-19 | 上海健康医学院 | A kind of common printed circuit board |
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