CN110035608A - A kind of common printed circuit board - Google Patents
A kind of common printed circuit board Download PDFInfo
- Publication number
- CN110035608A CN110035608A CN201910433805.8A CN201910433805A CN110035608A CN 110035608 A CN110035608 A CN 110035608A CN 201910433805 A CN201910433805 A CN 201910433805A CN 110035608 A CN110035608 A CN 110035608A
- Authority
- CN
- China
- Prior art keywords
- welding
- power supply
- supply line
- circuit substrate
- mounting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
Abstract
The present invention provides a kind of common printed circuit boards, for to direct insertion electronic component and connecting the connecting wire of the direct insertion electronic component and carrying out installation to forming electronic loop, it is characterized in that, it include: circuit substrate, one surface is element mounting surface, another surface is welding surface, comprising: multiple element mounting portion, for installing direct insertion electronic component；At least one power supply line, is printed on the welding surface of circuit substrate；And at least one ground line, it is printed on the welding surface of circuit substrate, it is arranged in parallel with corresponding power supply line, wherein, each element mounting portion all has multiple welding islands, each welding island includes multiple welding jacks and jack conducting wire, and welding jack is uniformly arranged along the width direction of circuit substrate, for allow direct insertion electronic component pin and the end of a thread of connecting wire enable a user to direct insertion electronic component and connecting wire being welded on welding surface from the insertion of element mounting surface.
Description
Technical field
The invention belongs to electronic technology fields, and in particular to a kind of common printed circuit board.
Background technique
In order to analyze and study the performance an of electronic circuit and carry out electronics practice of innovation activity, general printing is used
Circuit board making experimental circuit is a kind of common method, especially suitable for electric with the non-electronics of production in bulk of direct insertion electronic component
Road.
Common common printed circuit board, which passes through, uniformly prints many identical welderings for being used to install electronic component and conducting wire
Disk, but still have apparent inconvenience when making circuit.It needs to spend when making circuit using common general-purpose circuit board first
The expense plenty of time removes the conducting wire being welded to connect between each electronic component, especially power supply line and ground line, secondly using common
General-purpose circuit board when, the connection between element pin and conducting wire needs to realize by the method for transverse lap, if using leading
Line is directly contacted with pin and is overlapped, solder joint be not easy it is regular, maintenance sealing-off it is also relatively difficult；If using scolding tin traction is used
It is welded, the scolding tin of traction, which is easy to shrink, when welding causes dockingundocking, and reliability is poor.
In addition, common common printed circuit board also without design circuit necessary power supply and ground wire access socket, with
And input/output signal access socket, installation site of circuit board level decoupling capacitance etc., it is conveniently also lacking in functionality.
Summary of the invention
To solve the above problems, present invention employs following technical solutions:
The present invention provides a kind of common printed circuit board, for direct insertion electronic component and connecting the direct insertion electricity
The connecting wire of subcomponent is installed, to form electronic loop characterized by comprising circuit substrate, the circuit base
One surface of plate is element mounting surface, another surface parallel with element mounting surface is welding surface, comprising: multiple element
Mounting portion, the width direction along circuit substrate extends, for installing direct insertion electronic component；At least one is used for and input power
The power supply line being connected, is printed on the welding surface of circuit substrate, and is located near corresponding element mounting portion；And
Ground line of at least one for ground connection, is printed on the welding surface of circuit substrate, is arranged in parallel with corresponding power supply line, and
And it is located near corresponding power supply line, wherein each element mounting portion all has multiple length directions along circuit substrate
Evenly arranged welding island, each welding island include that multiple welding jacks and the connection that is used for being printed on circuit substrate are welded
The jack conducting wire of jointing holes, welding jack is uniformly arranged along the width direction of circuit substrate, for allowing direct insertion electronic component
Pin and the end of a thread of connecting wire enable a user to lead in direct insertion electronic component and connection from the insertion of element mounting surface
Wire bonding is on welding surface.
The present invention provides common printed circuit boards, can also have the feature that, wherein have on power supply line multiple
Along the evenly arranged power lead jack of the length direction of power supply line, for allowing connection power supply line and direct insertion electronic component
The end of a thread of power lead is inserted into, the evenly arranged earth lead jacks of length direction with multiple edge ground lines on ground line,
For allowing connection ground line and the end of a thread of the earth lead of direct insertion electronic component to be inserted into.
The present invention provides common printed circuit boards, can also have the feature that, wherein the weldering in each welding island
The quantity of jointing holes is 3.
The present invention provides common printed circuit boards, can also have the feature that, wherein every two adjacent welding
Island is 0.1 inch along the distance between length direction of circuit substrate, and every two welds the corresponding welding jack in position in island
The distance between width direction along circuit substrate is 0.3 inch or 0.6 inch.
The present invention provides common printed circuit boards, can also have the feature that, wherein power supply line with it is corresponding
The distance between ground line is 0.1 inch~0.3 inch.
The present invention provides common printed circuit boards, can also have the feature that, wherein circuit substrate also has use
It is inserted in installation power insert or the plug-in unit mounting portion of input/output signal plug-in unit, including single connector mounting portion and single-double dual-purpose
There are multiple plug-in units being connected respectively with power supply line and ground line to install jack for part mounting portion, each plug-in unit mounting portion.
The present invention provides common printed circuit boards, can also have the feature that, wherein circuit substrate also has use
In the decoupling capacitance mounting portion of installation decoupling capacitance, it is arranged at the corner location of circuit substrate, each decoupling capacitance mounting portion
Jack is installed at least a pair of capacitor being connected respectively with power supply line and ground line.
The present invention provides common printed circuit boards, can also have the feature that, wherein power supply line includes+V power supply
Line ,-V power supply line and+5V power supply line, ground line include AG analogue ground line and DG digital grounding wire ,+V power supply line and-V
Power supply line and AG analogue ground line correspondingly parallel arrangement ,+5V power supply line and DG digital grounding wire correspondingly parallel arrangement.
The present invention provides common printed circuit boards, can also have the feature that, wherein circuit substrate also have to
A few backup power source line for being connected with input power, is printed on the welding surface of circuit substrate, at least one is used for
The service ground line of ground connection, is printed on the welding surface of circuit substrate, is arranged in parallel with corresponding backup power source line.
Invention action and effect
Common printed circuit board according to the present invention, since power supply line and ground line has been pre-printed on circuit substrate, because
This when making circuit, user only need by electronic component weld be mounted on circuit substrate, and by connecting wire with it is corresponding
Power supply line be connected with ground line can complete in circuit production connect power supply line and ground line work, greatly reduce
The time of circuit production improves the convenience of circuit production.Since element mounting portion has multiple welding islands, island is welded by more
A welding jack being connected by the jack conducting wire being pre-printed is constituted, therefore needs to carry out laterally in element pin and conducting wire
It, can be complete in remaining welding jack as long as being respectively welded at conducting wire both ends on the welding island being connected with element pin when overlap joint
At transverse lap, the repetition welding of the same pad is avoided, the difficulty of welding is reduced, also improves the reliability of welding.
Detailed description of the invention
Fig. 1 is the schematic layout pattern of the element mounting surface of the common printed circuit board of the embodiment of the present invention；
Fig. 2 is the schematic layout pattern of the welding surface of the common printed circuit board of the embodiment of the present invention；
Fig. 3 is the partial enlargement diagram on the welding island of the embodiment of the present invention；
Fig. 4 is the use state diagram of the common printed circuit board of the embodiment of the present invention.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Attached drawing is closed to be specifically addressed common printed circuit board of the invention.
Fig. 1 is the schematic layout pattern of the element mounting surface of the common printed circuit board of the embodiment of the present invention, and Fig. 2 is the present invention
The schematic layout pattern of the welding surface of the common printed circuit board of embodiment, Fig. 3 are that the part on the welding island of the embodiment of the present invention is put
Big schematic diagram.
As shown in FIG. 1 to 3, the common printed circuit board 100 of the present embodiment includes circuit substrate 10, circuit substrate 10
One surface is element mounting surface 10a, another surface parallel with element mounting surface 10a is welding surface 10b, circuit substrate
10 include multiple element mounting portion 101, power supply line 102, ground line 103, plug-in unit mounting portion 107 and decoupling capacitance mounting portion
108。
The index line and element sign, index line that white is printed on element mounting surface 10a are used to indicate welding surface
The wiring trend of power supply line 102 on 10b and ground line 103, element sign be used to indicate specific electronic component (such as
Decoupling capacitance etc.) installation site.
Power supply line 102 and ground line 103 has been pre-printed in welding surface 10b, around each jack on welding surface 10b
Be coated with metallic tin helps layer, so that the pad of welding is formed, and remaining part is then to have applied green oil on welding surface 10b
Solder mask cause accidentally to weld, wrong weldering to prevent scolding tin from adhering on these parts.
Element mounting portion 101 extends along the width direction of circuit substrate 10, for installing direct insertion electronic component, including it is more
A welding island 104.The quantity of element mounting portion 101 in the present embodiment is 4, is respectively made of a column welding island 104
The first element mounting portion 101a and second element mounting portion 101b being made of two column welding islands 104.In other embodiments,
The quantity and composition of element mounting portion 101 can arbitrarily arrange according to the actual use demand of user, such as by three column or more
Line up to weld the composition of island 104, to adapt to the use demand of different direct insertion electronic components.
Island 104 is welded, the length direction along circuit substrate 10 is uniformly arranged, including multiple welding jacks 105, jack conducting wire
106 and decoupling capacitance mounting portion 108.In the present embodiment, the quantity on welding island 104 is a column 24, every two adjacent weldering
It is 0.1 inch that island, which is connect, along the distance between length direction of circuit substrate 10.
Welding jack 105 is uniformly arranged along the width direction of circuit substrate 10, for allowing the pin of direct insertion electronic component
It is enabled a user to from element mounting surface 10a insertion by direct insertion electronic component and connecting wire with the end of a thread of connecting wire
It is welded on welding surface 10b.In the present embodiment, immediate two welding holes 105 are along circuit substrate 10 in every two welding island
The distance between width direction be 0.3 inch or 0.6 inch.With the first welding jack 105a, the second welding jack in Fig. 1
For 105b, third welding jack 105c, the 4th welding jack 105d and the 5th welding jack 105e, the first welding jack
The spacing of the welding of 105a and second jack 105b is 0.3 inch, for installing narrow electronic component (such as the narrow body core in Fig. 4
Piece NE555, key switch K1, microswitch S1 and diode D1 and D2 etc.), third is welded the welding of jack 105c and the 5th and is inserted
The spacing of hole 105e is 0.6 inch, for installing wide type electronic component (such as wide cake core HM6116 in Fig. 4 etc.).4th
The spacing for welding the welding of jack 105d and the 5th jack 105e is also 0.3 inch, can be used for installation narrow electronic component.
Jack conducting wire 106, for corresponding welding jack 105, the welding surface being printed on circuit substrate to be connected in series
Upper 10b.
The quantity of power supply line 102 is 3, for being connected with input power, is printed on the welding surface 10b of circuit substrate
On, and be located near corresponding element mounting portion 101.There are multiple length sides along power supply line 102 on power supply line 102
To evenly arranged power lead jack, the power lead jack be used for allow connection power supply line and direct insertion electronic component it is defeated
Enter the end of a thread insertion of the power lead between power supply leading-in end.
The quantity of ground line 103 is 2, for being grounded, is printed on the welding surface 10b of circuit substrate, and corresponding
Power supply line 102 is arranged in parallel, and is located near corresponding power supply line 102, power supply line 102 and corresponding ground line
The distance between 103 be 0.1 inch.With multiple evenly arranged ground connection of length direction along ground line 103 on ground line 103
Wire jack, the earth lead jack are used to that connection to be allowed to be grounded the earth lead between direct insertion electronic component ground terminal
The end of a thread insertion.
In the present embodiment, power supply line 102 includes+V power supply line ,-V power supply line and+5V power supply line, and ground line 103 includes
AG analogue ground line and DG digital grounding wire ,+V power supply line and-V power supply line and AG analogue ground line correspondingly parallel
Spacing between cloth ,+V power supply line and-V power supply line and AG analogue ground line is 0.1 inch ,+5V power supply line and DG digital grounding
Correspondingly parallel arrangement, the spacing between+5V power supply line and DG digital grounding wire are 0.1 inch to line.In other embodiments,
Power supply line 102 can also select+3V power supply line ,+15V power supply line ,+12V power supply line, -15V and -12V power supply line.
Plug-in unit mounting portion 107 is used to install the power insert or input/output signal plug-in unit of different size, including single connects
Plug-in unit mounting portion 107a and single-double dual-purpose plug-in unit mounting portion 107b, plug-in unit mounting portion 107 have one respectively with power supply line and connect
The plug-in unit that ground wire is connected installs jack 107c.
Decoupling capacitance mounting portion 108 is used for the decoupling capacitance of mounting circuit boards grade, and the corner location of circuit substrate is arranged in
There is at least a pair of capacitor being connected respectively with power supply line and ground line to install jack for place, each decoupling capacitance mounting portion
108a。
Fig. 4 is the use state diagram of the common printed circuit board of the embodiment of the present invention.
Common printed circuit board 100 in the present embodiment is adapted to the direct insertion electronic component of various sizes model, directly
The pin for inserting formula electronic component is inserted into welding jack from element mounting surface 10a and is mounted on welding surface by scolding tin welding
On the upper corresponding pad of 10b, including bipod electronic component and three foot electronic components, for example, single connector, double connector,
Electrolytic capacitor, narrow body chip, expanded letter chip, diode, resistance, triode, three foot potentiometers, key switch, microswitch with
And contact pin etc..
It is illustrated below in conjunction with use state of the attached drawing to the common printed circuit board in the present embodiment, this implementation
Common printed circuit board in example can be used for installing following direct insertion electronic component, specifically:
Single connector J1 and single connector J2 welding is mounted on the single connector on 100 top of common printed circuit board
At mounting portion 107a.
Double connector J3 welding is mounted on the single-double dual-purpose plug-in unit mounting portion 107b of 100 lower part of common printed circuit board
Place.
Four electrolytic capacitor C1, which are respectively welded, is mounted on 100 4 jiaos of common printed circuit board of decoupling capacitance mounting portion 108
Place, electrolytic capacitor C2 welding are mounted at the decoupling capacitance mounting portion 108 in 100 middle position of common printed circuit board.
Six non-electrolytic capacitor C3, two contact pin P1 welding are mounted on the power lead jack of corresponding power supply line 102
In ground line 103 and earth lead jack.Wherein, the non-electrolytic capacitor C3 for tilting installation is the chip being mounted near chip
Grade decoupling capacitance, i.e. power supply line 102 are grounded in power lead jack and earth lead jack nearest above 103 with corresponding
Can also be inserted into and weld two pins of a decoupling capacitance respectively, this capacitor can near the electronic chip of needs,
As chip-scale decoupling capacitance.
Narrow body chip NE555, key switch K1, microswitch S1, three diode D1 are mounted on two adjacent first
On element mounting portion 101a.
Expanded letter chip HM6116, two non-electrolytic capacitor C3, two resistance R1 be mounted on first element mounting portion 101a and
On second element mounting portion 101b.
Triode T1, three foot potentiometer W1 (i.e. three foot electronic components) are mounted in a first element mounting portion 101a not
On same welding island 104.
In conclusion the common printed circuit board in the present embodiment can be suitable for different direct insertion electronic components, it is right
In the specific installation for making electronic component necessary to circuit (such as external power supply, input and output plug-in unit and decoupling capacitance etc.)
Position has carried out reasonable arrangement, so that circuit production is more convenient time saving, operability is stronger.
Above it is that the use state of the common printed circuit board in the present embodiment is illustrated, is not comprised in
In the common printed circuit board of the present embodiment, the common printed circuit board of the present embodiment can also be suitable for more different straight cuttings
The installation of formula electronic component.
Embodiment action and effect
According to the common printed circuit board of the present embodiment, since power supply line and ground line has been pre-printed on circuit substrate,
Therefore when make circuit, user only need by electronic component weld be mounted on circuit substrate, and pass through connecting wire with it is right
The power supply line answered is connected with ground line can complete to connect the work of power supply line and ground line in circuit production, greatly reduce
Production Time of circuit improves the convenience of circuit manufacture.Due to element mounting portion have multiple welding islands, welding island by
Multiple welding jacks being connected by the jack conducting wire being pre-printed are constituted, therefore need to carry out cross in element pin and conducting wire
When to overlap joint, as long as conducting wire both ends, which are respectively welded on the welding island being connected with element pin remaining, welds jack,
The repetition welding for avoiding the same pad, reduces the difficulty of welding, also improves the reliability of welding.
Due to all having evenly arranged power lead jack and earth lead jack on power supply line and ground line, make
The pin of electronic component and power supply line and ground line more convenient can be welded to connect by user when making circuit.Due to
Power supply line and ground line are disposed in parallel relation to one another, and can be connected nearby with electronic component, therefore, more micro- in some signals
In the weak system for needing to prevent high-frequency signal from interfering, power supply line, ground line and electronic component can be minimized and be formed by
Surround the area, to reduce high-frequency electromagnetic interference, so that the working performance of circuit is more stable.Further, for this resistance
High-frequency Interference has the circuit of particular/special requirement, can also install many chip-scale decoupling capacitances, due on power supply line and ground line
With many welding jacks, therefore in chip grade decoupling capacitance, can directly by decoupling capacitance be mounted on power supply line and
Between ground line, no longer need to carry out additional make contact.In addition, since the decoupling capacitance installation position of circuit board level is in circuit substrate
Four corners, therefore decoupling capacitance will not impact the layout of other electronic components and conducting wire when making circuit, simplify
The process of circuit production, has saved the time of circuit production.
Since the fore-and-aft distance between every two adjacent welding island is 0.1 inch, every two welds lateral position in island
The distance between corresponding welding jack is 0.3 inch or 0.6 inch, the pin with the direct insertion electronic component of different size
The distance between be adapted, therefore, the circuit board of the present embodiment can install various direct insertion electronic components, and (such as biserial is straight
Insert four foot of formula, octal, 14 feet, 16 feet, 20 feet, 24 feet, 32 feet, 40 feet or two single-row feet, three
Foot etc.), use scope is wider, and versatility is stronger.
Due to plug-in unit mounting portion, for installing power insert or input/output signal plug-in unit, therefore in circuit production
After the completion, it can be connected by plug-in unit mounting portion with external power supply or signal input/output unit, save circuit system
The time made and difficulty.
Due to encountering power supply line and ground line quantity when making circuit with backup power source line and service ground line
Not enough, position it is unreasonable or damage situations such as, can by backup power source line and service ground line connecting electronic component, thus
The production for completing circuit, improves stability and flexibility.
The preferred embodiment of the present invention has been described in detail above.It should be appreciated that the ordinary skill of this field is without wound
The property made labour, which according to the present invention can conceive, makes many modifications and variations.Therefore, all technician in the art
Pass through the available technology of logical analysis, reasoning, or a limited experiment on the basis of existing technology under this invention's idea
Scheme, all should be within the scope of protection determined by the claims.
Claims (9)
1. a kind of common printed circuit board, for direct insertion electronic component and connecting the connection of the direct insertion electronic component
Conducting wire is installed, to form electronic loop characterized by comprising
One surface of circuit substrate, the circuit substrate is element mounting surface, another is parallel with the element mounting surface
Surface is welding surface, comprising:
Multiple element mounting portion, the width direction along the circuit substrate extends, for installing the direct insertion electronic component；
At least one is used for the power supply line being connected with input power, is printed on the welding surface of the circuit substrate, and position
Near the corresponding element mounting portion；And
Ground line of at least one for ground connection, is printed on the welding surface of the circuit substrate, with the corresponding power supply
Line is arranged in parallel, and is located near the corresponding power supply line,
Wherein, each element mounting portion all has multiple evenly arranged welding of the length direction along the circuit substrate
Island,
Each welding island include multiple welding jacks and be printed on the circuit substrate for connecting the weldering
The jack conducting wire of jointing holes,
The welding jack is uniformly arranged along the width direction of the circuit substrate, for allowing the pipe of the direct insertion electronic component
Foot and the end of a thread of the connecting wire are enabled a user to from element mounting surface insertion by the direct insertion electronics member
Part and the connecting wire are welded on the welding surface.
2. common printed circuit board according to claim 1, it is characterised in that:
Wherein, there is the evenly arranged power lead jack of multiple length directions along the power supply line on the power supply line, use
In allowing the end of a thread insertion for connecting the power lead of the power supply line and the direct insertion electronic component,
There is the evenly arranged earth lead jack of multiple length directions along the ground line, for the company of allowing on the ground line
Connect the end of a thread insertion of the earth lead of the ground line and the direct insertion electronic component.
3. common printed circuit board according to claim 1, it is characterised in that:
Wherein, the quantity of the welding jack in each welding island is 3.
4. common printed circuit board according to claim 1, it is characterised in that:
Wherein, the every two adjacent welding island is 0.1 inch along the distance between length direction of the circuit substrate,
The corresponding welding jack in position is between the width direction of the circuit substrate in welding island described in every two
Distance is 0.3 inch or 0.6 inch.
5. common printed circuit board according to claim 1, it is characterised in that:
Wherein, the power supply line with it is corresponding it is described ground line the distance between be 0.1 inch.
6. common printed circuit board according to claim 1, it is characterised in that:
Wherein, the circuit substrate also has the plug-in unit mounting portion for installing power insert or input/output signal plug-in unit, packet
Single connector mounting portion and single-double dual-purpose plug-in unit mounting portion are included,
There are each plug-in unit mounting portion multiple plug-in unit installations being connected respectively with the power supply line and the ground line to insert
Hole.
7. common printed circuit board according to claim 1, it is characterised in that:
Wherein, the circuit substrate also has the decoupling capacitance mounting portion for mounting circuit boards grade decoupling capacitance, is arranged in institute
It states at the corner location of circuit substrate,
Each decoupling capacitance mounting portion has at least a pair of electricity being connected respectively with the power supply line and the ground line
Hold installation jack.
8. common printed circuit board according to claim 1, it is characterised in that:
Wherein, the power supply line includes+V power supply line ,-V power supply line and+5V power supply line, and the ground line includes that AG simulation connects
Ground wire and DG digital grounding wire,
+ V the power supply line and the-V power supply line and the AG analogue ground line correspondingly the parallel arrangement ,+5V power supply
Line and the DG digital grounding wire correspondingly parallel arrangement.
9. common printed circuit board according to claim 1, it is characterised in that:
Wherein, the circuit substrate also has backup power source line of at least one for being connected with input power, is printed on institute
It states on the welding surface of circuit substrate,
Service ground line of at least one for ground connection, is printed on the welding surface of the circuit substrate, and corresponding described
Backup power source line is arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910433805.8A CN110035608A (en) | 2019-05-23 | 2019-05-23 | A kind of common printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910433805.8A CN110035608A (en) | 2019-05-23 | 2019-05-23 | A kind of common printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110035608A true CN110035608A (en) | 2019-07-19 |
Family
ID=67243089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910433805.8A Pending CN110035608A (en) | 2019-05-23 | 2019-05-23 | A kind of common printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110035608A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2531482Y (en) * | 2002-01-11 | 2003-01-15 | 马宏文 | Convenient circuit experiment board |
| US7425684B2 (en) * | 2005-02-03 | 2008-09-16 | Sang Henry Ta | Universal systems printed circuit board for interconnections |
| CN201341270Y (en) * | 2009-01-16 | 2009-11-04 | 湖北师范学院 | Breadboard with center ground wire |
| WO2018045167A1 (en) * | 2016-09-02 | 2018-03-08 | Octavo Systems Llc | Substrate for use in system in a package (sip) devices |
| CN207651047U (en) * | 2017-08-25 | 2018-07-24 | 盐城市贵清电气厂 | A kind of patch chip experiment bread board |
-
2019
- 2019-05-23 CN CN201910433805.8A patent/CN110035608A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2531482Y (en) * | 2002-01-11 | 2003-01-15 | 马宏文 | Convenient circuit experiment board |
| US7425684B2 (en) * | 2005-02-03 | 2008-09-16 | Sang Henry Ta | Universal systems printed circuit board for interconnections |
| CN201341270Y (en) * | 2009-01-16 | 2009-11-04 | 湖北师范学院 | Breadboard with center ground wire |
| WO2018045167A1 (en) * | 2016-09-02 | 2018-03-08 | Octavo Systems Llc | Substrate for use in system in a package (sip) devices |
| CN207651047U (en) * | 2017-08-25 | 2018-07-24 | 盐城市贵清电气厂 | A kind of patch chip experiment bread board |
Non-Patent Citations (1)
| Title |
|---|
| E_JEVON: "万用板", 《百度文库：HTTPS://WENKU.BAIDU.COM/VIEW/C4D40167DE80D4D8D15A4FEC.HTML?FR=SEARCH-4-INCOME4-PSREC3&FIXFR=VCTKDZOKFD%2BYJSNWTQS5WG%3D%3D》 * |
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Application publication date: 20190719 |
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| WD01 | Invention patent application deemed withdrawn after publication |