CN106211570B - Radio frequency PCB connection structure and connection method - Google Patents
Radio frequency PCB connection structure and connection method Download PDFInfo
- Publication number
- CN106211570B CN106211570B CN201610843464.8A CN201610843464A CN106211570B CN 106211570 B CN106211570 B CN 106211570B CN 201610843464 A CN201610843464 A CN 201610843464A CN 106211570 B CN106211570 B CN 106211570B
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- pcb board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
Abstract
The invention discloses a kind of radio frequency PCB connection structure and connection methods, radio frequency PCB connection structure includes the first pcb board and the second pcb board, first pcb board is set to the top of second pcb board, the top layer of first pcb board is equipped with the first radio circuit, the bottom of first pcb board is equipped with the first signal pad, first radio circuit and first signal pad are electrically connected by signal via, the top layer of second pcb board is equipped with the second radio circuit, second radio circuit is equipped with second signal pad corresponding with first signal pad, first signal pad is mutually welded with the second signal pad.First radio circuit is connected to by the present invention by signal via with the first signal pad, the first signal pad is together with the second signal pad solder being located on the second radio circuit later, to realize the signal communication between the first radio circuit and the second radio circuit.
Description
Technical field
The present invention relates to PCB interconnection technique fields, more particularly, to a kind of radio frequency PCB connection structure and connection method.
Background technique
With the fast development of mobile communication, the development of especially 4G communication, so that the demand of product seriation, hardware and software platform
It is more and more, in tandem product, by the circuit modular of same function, the development cycle will be effectively reduced, reduce cost.It should
Design concept is equally applicable to radio circuit, and radio circuit can be more conducive to reduce cost, obtain better property using scoreboard design
Energy and seriation hardware and software platform.However, how by two pieces of radio frequency PCB (Printed Circuit Board, printed circuit board) into
Row connection, and realize that good RF impedance controls and lower cost is the pass of radio circuit seriation modular platform
Key.
Currently, the method for existing PCB connection mainly has following a few classes: 1, being connect between pcb board using dew copper and electroconductive elastic sheet
Touching connection, this mode are difficult to meet the requirement of the impedance control in radio frequency PCB connection；2, it is carried out between pcb board using connector
Connection, connection and digital signal of this connector for digiboard are transmission, low in cost, but are unable to satisfy rf board radio frequency
The requirement of signal cannot achieve 50ohm impedance control；3, radio frequency PCB is attached using radio-frequency joint and coaxial cable,
This mode can obtain good impedance control, but with high costs, and can introduce cable waste；4, RF blind insertion connector is utilized
It is to realize that two pieces of radio frequency pcb boards connect face-to-face, preferable performance equally may be implemented in which, and saves space, but cost
It is very high.From the foregoing, it will be observed that the prior art also cannot achieve low cost and the radio frequency PCB connection with good resistance control.
Summary of the invention
Based on this, the invention reside in overcoming the deficiencies of existing technologies, provide that a kind of cost is relatively low, impedance control is good penetrates
Frequency PCB connection structure and connection method.
Its technical solution is as follows:
A kind of radio frequency PCB connection structure, including the first pcb board and the second pcb board, first pcb board are set to described the
The top of two pcb boards, the top layer of first pcb board are equipped with the first radio circuit, and the bottom of first pcb board is equipped with first
Signal pad, first radio circuit and first signal pad are electrically connected by signal via, second pcb board
Top layer be equipped with the second radio circuit, second radio circuit be equipped with it is corresponding with first signal pad second letter
Number pad, first signal pad are mutually welded with the second signal pad.
First radio circuit is microstrip line in one of the embodiments, and the top layer of first pcb board is additionally provided with
Two the first top layers positioned at the two sides of first radio circuit, first top layer between first radio circuit
Every setting.
In one of the embodiments, the bottom of first pcb board with being additionally provided with the first bottom, first top layer
Pass through ground Kong Liantong with first bottom.
Hole is arranged close to the signal via in one of the embodiments, describedly.
First bottom is equipped at least one first ground pad, the 2nd PCB on the ground in one of the embodiments,
Equipped with the second top layer, second top layer is equipped on the ground to be welded the top layer of plate with one-to-one second ground of first ground pad
Disk mutually welds between first ground pad and corresponding second ground pad.
In one of the embodiments, first bottom be set to first signal pad periphery, described first
Guard band is equipped with to bottom between first signal pad.
Green oil is coated in the guard band in one of the embodiments,.
There are two being all provided with to first ground pad and second top layer in one of the embodiments, described in two
Second top layer it is respectively arranged on the two sides of second radio circuit, each second top layer is equipped with one described the on the ground
Two ground pads.
First pcb board partly overlaps with second pcb board in one of the embodiments, first signal
Via hole is set to first radio circuit close to one end of second pcb board, and the second signal pad is also set to described the
Two radio circuits are close to one end of the first PCB.
The technical program additionally provides a kind of radio frequency PCB connection method, comprising the following steps:
The first signal pad is made on the bottom of the first pcb board；
Signal via is made on the first pcb board, to connect the first radio circuit of its top layer and the first letter of bottom
Number pad；
Second signal pad is made on the second radio circuit on the second pcb board；
First signal pad and second signal pad solder, so that the first pcb board links together with the second pcb board.
The advantages of below to preceding solution or principle are illustrated:
First radio circuit is connected to by signal via by the present invention with the first signal pad, later the first signal pad and
Second signal pad solder on the second radio circuit together, to realize the first radio circuit and the second radio circuit
Between signal communication.The configuration of the present invention is simple, it is easy to implement, it does not need to increase additional radio-frequency joint, cable etc., only pass through
Circuit on two pieces of pcb boards that needs connect, which is welded together, can be realized, and cost is very cheap, and impedance control and connect
Ground is good, and standing wave is preferable, and Insertion Loss is very small, can meet most of radio frequency design.
The top layer of first pcb board is equipped with two the first top layers positioned at microstrip line two sides, so that the first pcb board
Top layer upper conductor band and ground level are in together in approximately the same plane, and then form coplanar waveguide structure, and the structure is convenient in parallel outer
Connect element, be readily configured hydrid integrated circuit, at the same its also have connect with active device, passive device it is very convenient etc. excellent
Point.
The bottom of first pcb board with being additionally provided with the first bottom, the first top layer is connected to by ground hole and the first bottom
Layer ground, to form complete signal circuit, while but also the first pcb board has good heat sinking function and shield effectiveness.
Described ground hole is arranged close to the signal via, corresponding with reference to ground to provide for signal via.
First bottom is equipped with the first ground pad on the ground, and the second top layer is equipped with and first on the ground on second pcb board
The corresponding second ground pad of ground pad, pad mutually welds the first ground pad with the second, to realize the first pcb board and second
Ground connection between pcb board, while also further enhancing the bonding strength between the first pcb board and the second pcb board.
Second pcb board top layer also is provided with being located at two the second top layers of the second radio circuit two sides, each second top layer
On the ground by the first ground pad solder on a second ground pad and the first pcb board, to realizing each second top layer
With the connection between the first bottom ground.
First bottom be set to first signal pad periphery, first bottom with first signal
Guard band is equipped between pad, it is short-circuit in welding procedure to prevent.Further, green oil is coated in guard band, it is green
Oil, to further prevent solder shorts, extends pcb board service life as solder resist.
First pcb board partly overlaps with second pcb board, and first signal via is set to described first and penetrates
The end of frequency circuit, the second signal pad are also set to the end of second radio circuit so that first pcb board with
Only end is overlapped second pcb board, to provide more accommodating spaces for component on circuit board.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of radio frequency PCB connection structure described in the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of the top layer of the first pcb board described in the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of the bottom of the first pcb board described in the embodiment of the present invention；
Fig. 4 is the structural schematic diagram of the top layer of the second pcb board described in the embodiment of the present invention；
Fig. 5 is the flow chart of radio frequency PCB connection method described in the embodiment of the present invention.
Description of symbols:
100, the first pcb board, the top layer of the 110, first pcb board, the 111, first radio circuit, the 112, first top layer,
120, the bottom of the first pcb board, the 121, first signal pad, the 122, first bottom, the 1221, first ground pad, 123, protection
Spacing, 130, signal via, 140, hole, the 200, second pcb board, the top layer of the 210, second pcb board, the 211, second radio frequency electrical
Road, 2111, second signal pad, the 212, second top layer, the 2121, second ground pad.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with attached drawing and specific embodiment party
Formula, the present invention is further described in detail.It should be understood that the specific embodiments described herein are only to solve
The present invention is released, and the scope of protection of the present invention is not limited.
As shown in Figures 1 to 4, radio frequency PCB connection structure of the present invention, including the first pcb board 100 and the 2nd PCB
Plate 200, first pcb board 100 be set to second pcb board 200 top, the bottom 120 of first pcb board 100 with
The top layer 210 of second pcb board 200 is connected.The top layer 110 of first pcb board 100 is equipped with the first radio circuit 111,
The bottom 120 of first pcb board 100 is equipped with the first signal pad 121, first radio circuit 111 and first letter
Number pad 121 passes through signal via 130 (plated-through hole) and is electrically connected.The top layer 210 of second pcb board 200 is equipped with the
Two radio circuits 211, second radio circuit 211 are equipped with the second letter being oppositely arranged with first signal pad 121
Number pad 2111, first signal pad 121 are welded with 2111 phase of second signal pad.First radio circuit
111 and the impedance of second radio circuit 211 be 50ohm (ohm), to minimize the loss of skin effect.This paper institute
The term " on " that uses, "lower", " top layer ", " bottom " and similar statement embodiment party of the invention solely for the purpose of illustration
Formula, it is not intended that being unique embodiment.The present invention passes through signal via 130 for the first radio circuit 111 of top layer 110
It is connected to the first signal pad 121 of bottom 120, the first signal pad 121 is again and on the second radio circuit 211 later
Second signal pad 2111 welds together, to realize the signal between the first radio circuit 111 and the second radio circuit 211
Connection.The configuration of the present invention is simple, it is easy to implement, it does not need to increase additional radio-frequency joint, cable etc., only by needing to connect
Two pieces of pcb boards on circuit weld together and can be realized, cost is very cheap, and impedance control and ground connection are good, stay
Wave is preferable, and Insertion Loss is very small, can meet most of radio frequency design.
In the present embodiment, first radio circuit 111 and second radio circuit 211 are microstrip line, this hair
Bright can also be according to actual needs other radio circuits by the microstrip line replacement.
As shown in Fig. 2, the top layer 110 of first pcb board 100 is additionally provided with two positioned at first radio circuit 111
Two the first top layers of side 112, first top layer 112 with first radio circuit interval be arranged so that the first PCB
The top layer upper conductor band and ground level of plate 100 are in together in approximately the same plane, and then form coplanar waveguide structure, which is convenient for
Outward element in parallel, is readily configured hydrid integrated circuit, at the same its also have connect with active device, passive device it is very convenient
The advantages that.
As shown in figure 3, the bottom 120 of first pcb board 100 with being additionally provided with the first bottom 122, first top layer
112 with first bottom 122 are connected to by ground hole 140 (through-hole), to form complete signal circuit, while but also
First pcb board 100 has good heat sinking function and shield effectiveness.Specifically, each first top layer on 112 by several
122 it is electrically connected to a ground hole 140 and the first bottom.In the present embodiment, described ground hole 140 is close to the signal via
130 settings, it is corresponding with reference to ground to be provided for signal via 130.
As shown in figure 4, the top layer 210 of second pcb board 200 is additionally provided with positioned at 211 two sides of the second radio circuit
Two the second top layers 212, also to form coplanar waveguide structure in the top layer 210 of the second pcb board 200.
Preferably, it referring to Fig. 3, on the bottom 120 of the first pcb board 100, is additionally provided on 122 to the first bottom and is located at
Two the first ground pads 1221 of 121 two sides of the first signal pad, correspondingly, referring to Fig. 4, in the top layer of the second pcb board 200
On 210, be also equipped on 212 to each second top layer one with the first the corresponding second ground pad of pad 1221
2121, the first ground pad 1221 corresponding welding of pad 2121 with the second, to realize the first pcb board 100 and the second pcb board
Ground connection between 200, while also further enhancing the bonding strength between the first pcb board 100 and the second pcb board 200.Ability
Field technique personnel are it should be understood that the present invention can also design more than two second ground pad 2121 and respective counts according to actual needs
First ground pad 1221 of amount is welded to each other；Or second top layer can also be designed according to actual needs 212,
One the second ground pad 2121 is only set simultaneously to welding corresponding with a first ground pad 1221.
Further, please continue to refer to Fig. 3, short-circuit first bottom occurs in welding procedure 122 it is set to the in order to prevent
The periphery of one signal pad 121, and in first bottom formed between protection between 122 and first signal pad 121
Away from 123.Preferably, the present invention coats green oil in guard band 123, and green oil is short to further prevent welding as solder resist
Road extends pcb board service life.The present invention can also be according to actual needs in the first signal pad 121 and the first ground pad 1221
Position in addition is coated with green oil.
In the present embodiment, first pcb board 100 partly overlaps with second pcb board 200, first signal
Via hole 130 is set to first radio circuit 111 close to one end of second pcb board 200, meanwhile, the second signal weldering
Disk 2111 is set to second radio circuit 211 close to one end of second pcb board 200, so that first pcb board 100
Only end is Chong Die with second pcb board 200, to provide more accommodating spaces for component on circuit board.The present invention
The first pcb board 100 can be all placed on the second pcb board 200 according to actual needs.
As shown in figure 5, the radio frequency PCB connection method of the present embodiment includes the following steps:
S10, the first signal pad 121 is made on the bottom 120 of the first pcb board 100；
S20, signal via 130 is made on the first pcb board 100, to connect the first radio circuit of its top layer 110
111 and bottom 120 the first signal pad 121；
Second signal pad 2111 is made on S30, the second radio circuit 211 on the second pcb board 200；
S40, the first signal pad 121 are welded with second signal pad 2111, so that the first pcb board 100 and the second pcb board
200 link together.
Further, further comprising the steps of between step S30 and S40:
S31, the first pcb board 100 the first bottom on 122 production be set to two of 121 two sides of the first signal pad
First ground pad 1221；
S32, the second pcb board 200 the second top layer on 212 production be set to two of 2111 two sides of second signal pad
Second ground pad 2121, the first ground pad 1221 and the second ground pad 2121 correspond, in the first signal pad 121 and second
When signal pad 2111 welds, guarantee that the first ground pad 1221 and about 2121 face of the second ground pad are arranged, Jin Erbao
Demonstrate,proving the first ground pad 1221, pad 2121 can dock with the second.
In step 40 then specifically: by the first signal pad 121 and second signal pad 2111 and the first ground pad
1221 pad 2121 is corresponding with the second welds together, and so far, completes the connection of the first pcb board 100 and the second pcb board 200
Work.
It is to be appreciated that above-mentioned steps S30 and S31 are not necessarily the relationships successively executed, it is also possible to first carry out S31
After execute S30, i.e., first make the first signal pad 121, signal via 130 and the first ground pad 1221 in the first pcb board 100,
Second signal pad 2111 and the second ground pad 2121 are made on the second pcb board 200 afterwards, finally by the first pcb board 100 and the
The welding of two pcb boards 200.Further, step S31 can also be executed directly between step S10 and step S20.
When using the present invention, for the radio frequency pcb board of small volume, using SMT (Surface Mount
Technology, electronic circuit surface installation technique) can be realized, pcb board biggish for area, then using spot welding mode into
Row welding.SMT can be realized with spot welding by automation equipment.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.
Claims (11)
1. a kind of radio frequency PCB connection structure, which is characterized in that including the first pcb board and the second pcb board, first pcb board is set
In the top of second pcb board, the top layer of first pcb board is equipped with the first radio circuit, the bottom of first pcb board
Equipped with the first signal pad, first radio circuit and first signal pad are electrically connected by signal via, described
The top layer of second pcb board is equipped with the second radio circuit, and second radio circuit is equipped with opposite with first signal pad
The second signal pad answered, first signal pad are mutually welded with the second signal pad；First pcb board with it is described
Second pcb board partly overlaps.
2. radio frequency PCB connection structure according to claim 1, which is characterized in that first radio circuit is microstrip line,
The top layer of first pcb board is additionally provided with two the first top layers positioned at the two sides of first radio circuit, and described first
It is arranged with first radio circuit interval to top layer.
3. radio frequency PCB connection structure according to claim 2, which is characterized in that the bottom of first pcb board is additionally provided with
First bottom, pass through ground Kong Liantong with first bottom to first top layer.
4. radio frequency PCB connection structure according to claim 3, which is characterized in that described ground hole is close to the signal mistake
Hole setting.
5. radio frequency PCB connection structure according to claim 3, which is characterized in that first bottom is equipped at least on the ground
One the first ground pad, equipped with the second top layer, second top layer is equipped with and described the top layer of second pcb board on the ground
The one-to-one second ground pad of one ground pad mutually welds between first ground pad and corresponding second ground pad
It connects.
6. radio frequency PCB connection structure according to claim 5, which is characterized in that be set to described the to first bottom
The periphery of one signal pad is equipped with guard band to first bottom between first signal pad.
7. radio frequency PCB connection structure according to claim 6, which is characterized in that be coated with green oil in the guard band.
8. radio frequency PCB connection structure according to claim 5, which is characterized in that first ground pad and described second
There are two being all provided with to top layer, it is respectively arranged on to two second top layers the two sides of second radio circuit, each described
Two top layers are equipped with second ground pad on the ground.
9. radio frequency PCB connection structure according to any one of claim 1 to 8, which is characterized in that the first signal mistake
Hole is set to first radio circuit close to one end of second pcb board.
10. radio frequency PCB connection structure according to any one of claim 1 to 8, which is characterized in that the second signal
Pad is also set to second radio circuit close to one end of the first PCB.
11. a kind of radio frequency PCB connection method, which comprises the following steps:
The first signal pad is made on the bottom of the first pcb board；
Signal via is made on the first pcb board, the first signal weldering of the first radio circuit and bottom to connect its top layer
Disk；
Second signal pad is made on the second radio circuit on the second pcb board；
First signal pad and second signal pad solder, so that the first pcb board links together with the second pcb board；Described
One pcb board partly overlaps with second pcb board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610843464.8A CN106211570B (en) | 2016-09-22 | 2016-09-22 | Radio frequency PCB connection structure and connection method |
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|---|---|---|---|
| CN201610843464.8A CN106211570B (en) | 2016-09-22 | 2016-09-22 | Radio frequency PCB connection structure and connection method |
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| CN106211570A CN106211570A (en) | 2016-12-07 |
| CN106211570B true CN106211570B (en) | 2019-06-11 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107624004A (en) * | 2017-08-22 | 2018-01-23 | 努比亚技术有限公司 | A kind of applying method of printed circuit board (PCB) and a kind of printed circuit board (PCB) |
| CN107949154A (en) * | 2017-12-15 | 2018-04-20 | 京信通信系统（中国）有限公司 | The connection method of radio frequency PCB a kind of and connection structure |
| CN110313881B (en) * | 2018-03-30 | 2021-10-26 | 上海微创医疗机器人（集团）股份有限公司 | Pad switching structure and electronic endoscope head structure |
| CN110167261A (en) * | 2019-06-26 | 2019-08-23 | 京信通信技术(广州)有限公司 | Interconnection structure between millimeter wave active antenna element and pcb board |
| CN111942153B (en) * | 2020-08-21 | 2021-05-11 | 黑龙江天有为电子有限责任公司 | Automobile central control system and instrument panel display system thereof |
| CN114641151B (en) * | 2022-05-19 | 2022-08-02 | 广东省新一代通信与网络创新研究院 | Manufacturing method of base station radio frequency circuit based on PCB castle plate |
| CN115279020B (en) * | 2022-08-01 | 2023-06-02 | 苏州源数芯通信科技有限公司 | Connection structure of chip with small pad spacing and PCB and processing method thereof |
| CN115455886B (en) * | 2022-08-05 | 2023-04-11 | 上海移柯通信技术股份有限公司 | PCB design method, PCB, electronic device, storage medium and terminal |
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| JPH03123096A (en) * | 1989-10-05 | 1991-05-24 | Fujitsu Ten Ltd | Manufacture and structure of hybrid ic |
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| CN201238299Y (en) * | 2008-08-14 | 2009-05-13 | 陈伦洪 | Novel frequency-division duplexing energy-saving repeater |
| CN101998763A (en) * | 2010-09-02 | 2011-03-30 | 华为技术有限公司 | Connection structure of bare chip and printed circuit board, printed circuit board and communication equipment |
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| CN106211570A (en) | 2016-12-07 |
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