CN106211570A - Radio frequency PCB attachment structure and method of attachment - Google Patents
Radio frequency PCB attachment structure and method of attachment Download PDFInfo
- Publication number
- CN106211570A CN106211570A CN201610843464.8A CN201610843464A CN106211570A CN 106211570 A CN106211570 A CN 106211570A CN 201610843464 A CN201610843464 A CN 201610843464A CN 106211570 A CN106211570 A CN 106211570A
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- pcb board
- ground
- pad
- pcb
- top layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a kind of radio frequency PCB attachment structure and method of attachment, this radio frequency PCB attachment structure includes the first pcb board and the second pcb board, described first pcb board is located at the top of described second pcb board, the top layer of described first pcb board is provided with the first radio circuit, the bottom of described first pcb board is provided with the first signal pad, described first radio circuit and described first signal pad are electrically connected with by signal via, the top layer of described second pcb board is provided with the second radio circuit, described second radio circuit is provided with the secondary signal pad corresponding with described first signal pad, described first signal pad welds mutually with described secondary signal pad.First radio circuit and the first signal pad are connected by the present invention by signal via, first signal pad is together with the secondary signal pad solder being positioned on the second radio circuit afterwards, in order to realize the signal communication between the first radio circuit and the second radio circuit.
Description
Technical field
The present invention relates to PCB interconnection technique field, especially relate to a kind of radio frequency PCB attachment structure and method of attachment.
Background technology
Along with the fast development of mobile communication, the development of especially 4G communication so that product seriation, the demand of hardware and software platform
More and more, in tandem product, by the circuit modular of same function, will effectively reduce the construction cycle, reduce cost.Should
Design concept is equally applicable to radio circuit, and radio circuit uses a point plate design can more conducively reduce cost, obtain more preferable property
Energy and seriation hardware and software platform.But, how two pieces of radio frequency PCB (Printed Circuit Board, printed circuit board) are entered
Row connects, and realizes good RF impedance and control and relatively low cost is the pass of radio circuit seriation modular platform
Key.
At present, the method that existing PCB connects mainly has following a few class: 1, use dew copper to connect with electroconductive elastic sheet between pcb board
Touching and connect, this mode is difficult to meet the impedance control requirement during radio frequency PCB connects；2, connector is used to carry out between pcb board
Connecting, this connector is transmission for connection and the digital signal of digiboard, with low cost, but cannot meet rf board radio frequency
The requirement of signal, it is impossible to realize 50ohm impedance control；3, utilize radio-frequency joint and coaxial cable that radio frequency PCB is attached,
This mode can obtain good impedance control, but with high costs, and can introduce cable waste；4, RF blind insertion joint is utilized
Being to realize two pieces of radio frequency pcb boards to connect face-to-face, which equally realizes preferable performance, and saves space, but cost
The highest.From the foregoing, it will be observed that prior art also cannot realize low cost and have the radio frequency PCB connection that good resistance controls.
Summary of the invention
Based on this, the invention reside in the defect overcoming prior art, it is provided that a kind of cost is relatively low, impedance control is good penetrates
Frequently PCB attachment structure and method of attachment.
Its technical scheme is as follows:
A kind of radio frequency PCB attachment structure, including the first pcb board and the second pcb board, described first pcb board is located at described the
The top of two pcb boards, the top layer of described first pcb board is provided with the first radio circuit, and the bottom of described first pcb board is provided with first
Signal pad, described first radio circuit and described first signal pad are electrically connected with by signal via, described second pcb board
Top layer be provided with the second radio circuit, described second radio circuit is provided with corresponding with described first signal pad the second letter
Number pad, described first signal pad welds mutually with described secondary signal pad.
Wherein in an embodiment, described first radio circuit is microstrip line, and the top layer of described first pcb board is additionally provided with
It is positioned at two the first top layer ground of the both sides of described first radio circuit, between described first top layer ground and described first radio circuit
Every setting.
Wherein in an embodiment, the bottom of described first pcb board is additionally provided with the first bottom ground, described first top layer ground
With described first bottom by ground hole connect.
Wherein in an embodiment, hole, described ground is arranged close to described signal via.
Wherein in an embodiment, described first bottom is provided with at least one first ground pad, described 2nd PCB on the ground
The top layer of plate is provided with the second top layer ground, and described second top layer is provided with and the second ground weldering one to one of described first ground pad on the ground
Dish, welds between described first ground pad and corresponding described second ground pad mutually.
Wherein in an embodiment, it is located at the periphery of described first signal pad described first bottom, described first
It is provided with guard band between bottom ground and described first signal pad.
Wherein in an embodiment, in described guard band, it is coated with green oil.
Wherein in an embodiment, it is equipped with two, described in two described first ground pad and described second top layer
Being respectively arranged on the both sides of described second radio circuit, each described second top layer is equipped with one described the on the ground second top layer
Two ground pads.
Wherein in an embodiment, described first pcb board partly overlaps with described second pcb board, described first signal
Via is located at described first radio circuit one end near described second pcb board, and described secondary signal pad is also located at described
Two radio circuits are near one end of a described PCB.
The technical program additionally provides a kind of radio frequency PCB method of attachment, comprises the following steps:
The bottom of the first pcb board makes the first signal pad；
First pcb board makes signal via, the first letter of the first radio circuit and bottom in order to connect its top layer
Number pad；
Secondary signal pad is made on the second radio circuit on the second pcb board；
First signal pad and secondary signal pad solder so that the first pcb board and the second pcb board link together.
Advantage or principle to preceding solution illustrate below:
First radio circuit and the first signal pad are connected by the present invention by signal via, afterwards the first signal pad and
The secondary signal pad solder being positioned on the second radio circuit together, in order to realize the first radio circuit and the second radio circuit
Between signal communication.Present configuration is simple, it is easy to implement, it is not necessary to increase extra radio-frequency joint, cable etc., only pass through
Needing the circuit on the two pieces of pcb boards connected to weld together and can realize, its cost is the cheapest, and impedance control and connecing
Ground is good, and standing wave is preferable, and Insertion Loss is the least, can meet major part radio frequency design.
The top layer of described first pcb board is provided with two the first top layer ground being positioned at microstrip line both sides so that the first pcb board
Top layer upper conductor band and ground level are in together in approximately the same plane, and then form coplanar waveguide structure, and this structure is easy to outside parallel connection
Connect element, it is easy to constitute hydrid integrated circuit, simultaneously its also have be connected with active device, passive device very convenient etc. excellent
Point.
The bottom of described first pcb board is additionally provided with the first bottom ground, by hole, ground with connecting the first top layer and first end
Layer ground, in order to form complete signal circuit, also makes the first pcb board have good heat sinking function and shield effectiveness simultaneously.
Hole, described ground is arranged close to described signal via, with thinking that signal via provides corresponding with reference to ground.
Described first bottom is provided with the first ground pad on the ground, and on described second pcb board, the second top layer is provided with and first on the ground
The second ground pad that ground pad is corresponding, the first ground pad and the second ground pad weld mutually, in order to realize the first pcb board and second
Ground between pcb board connects, and also further enhances the bonding strength between the first pcb board and the second pcb board simultaneously.
Second pcb board top layer also is provided with being positioned at two the second top layer ground of the second radio circuit both sides, each second top layer
The most all by the first ground pad solder on a second ground pad and the first pcb board, in order to realize each second top layer ground
And the connection between the first bottom ground.
It is located at the periphery of described first signal pad, described first bottom ground and described first signal described first bottom
Guard band it is provided with, in order to prevent short circuit in welding procedure between pad.Further, in guard band, coat green oil, green
Oil in order to prevent solder shorts further, extends pcb board service life as solder resist.
Described first pcb board partly overlaps with described second pcb board, and described first signal via is located at described first and is penetrated
The end of frequency circuit, described secondary signal pad is also located at the end of described second radio circuit so that described first pcb board with
Described second pcb board only end is overlapping, with thinking that on circuit board, components and parts provide more accommodation space.
Accompanying drawing explanation
Fig. 1 is the structural representation of the radio frequency PCB attachment structure described in the embodiment of the present invention；
Fig. 2 is the structural representation of the top layer of the first pcb board described in the embodiment of the present invention；
Fig. 3 is the structural representation of the bottom of the first pcb board described in the embodiment of the present invention；
Fig. 4 is the structural representation of the top layer of the second pcb board described in the embodiment of the present invention；
Fig. 5 is the flow chart of the radio frequency PCB method of attachment described in the embodiment of the present invention.
Description of reference numerals:
100, the first pcb board, the top layer of the 110, first pcb board, the 111, first radio circuit, the 112, first top layer ground,
120, the bottom of the first pcb board, the 121, first signal pad, 122, first bottom ground, the 1221, first ground pad, 123, protection
Spacing, 130, signal via, 140, hole, the 200, second pcb board, the top layer of the 210, second pcb board, the 211, second radio frequency electrical
Road, the 2111, secondary signal pad, 212, second top layer ground, the 2121, second ground pad.
Detailed description of the invention
For making the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and specific embodiment party
Formula, is described in further detail the present invention.It should be appreciated that detailed description of the invention described herein is only in order to solve
Release the present invention, do not limit protection scope of the present invention.
As shown in Figures 1 to 4, radio frequency PCB attachment structure of the present invention, including the first pcb board 100 and the 2nd PCB
Plate 200, described first pcb board 100 is located at the top of described second pcb board 200, the bottom 120 of described first pcb board 100 with
The top layer 210 of described second pcb board 200 is connected.The top layer 110 of described first pcb board 100 is provided with the first radio circuit 111,
The bottom 120 of described first pcb board 100 is provided with the first signal pad 121, described first radio circuit 111 and described first letter
Number pad 121 is electrically connected with by signal via 130 (plated-through hole).The top layer 210 of described second pcb board 200 is provided with
Two radio circuits 211, described second radio circuit 211 is provided with the second letter being oppositely arranged with described first signal pad 121
Number pad 2111, described first signal pad 121 welds with described secondary signal pad 2111 phase.Described first radio circuit
111 and the impedance of described second radio circuit 211 be 50ohm (ohm), in order to minimize the loss of Kelvin effect.Institute herein
The term that uses " on ", D score, " top layer ", " bottom " and the embodiment party of the similar statement present invention solely for the purpose of illustration
Formula, it is not intended that be unique embodiment.The present invention passes through signal via 130 by the first radio circuit 111 of top layer 110
Connect with the first signal pad 121 of bottom 120, afterwards the first signal pad 121 again be positioned on the second radio circuit 211
Secondary signal pad 2111 welds together, in order to realize the signal between the first radio circuit 111 and the second radio circuit 211
Connection.Present configuration is simple, it is easy to implement, it is not necessary to increasing extra radio-frequency joint, cable etc., only by needs are connected
Two pieces of pcb boards on circuit weld together and can realize, its cost is the cheapest, and impedance control and ground connection are good, stay
Ripple is preferable, and Insertion Loss is the least, can meet major part radio frequency design.
In the present embodiment, described first radio circuit 111 and described second radio circuit 211 are microstrip line, this
Bright also dependent on being actually needed, described microstrip line is replaced with other radio circuits.
As in figure 2 it is shown, the top layer 110 of described first pcb board 100 is additionally provided with is positioned at the two of described first radio circuit 111
Two the first top layer ground 112 of side, described first top layer ground 112 and described first radio circuit interval are arranged so that a PCB
The top layer upper conductor band of plate 100 and ground level are in together in approximately the same plane, and then form coplanar waveguide structure, and this structure is easy to
Outward element in parallel, it is easy to constitute hydrid integrated circuit, it also has and is connected very convenient with active device, passive device simultaneously
Etc. advantage.
As it is shown on figure 3, the bottom 120 of described first pcb board 100 is additionally provided with the first bottom ground 122, described first top layer ground
112 are connected by hole 140, ground (through hole) with described first bottom ground 122, in order to form complete signal circuit, also make simultaneously
First pcb board 100 has good heat sinking function and shield effectiveness.Specifically, by some on each first top layer ground 112
Hole, individual ground 140 and the first bottom ground 122 are electrically connected with.In the present embodiment, hole, described ground 140 is close to described signal via
130 are arranged, with thinking that signal via 130 provides corresponding with reference to ground.
As shown in Figure 4, the top layer 210 of described second pcb board 200 is additionally provided with and is positioned at described second radio circuit 211 both sides
Two second top layers ground 212, in order to also to form coplanar waveguide structure at the top layer 210 of the second pcb board 200.
Preferably, refer to Fig. 3, on the bottom 120 of the first pcb board 100, the first bottom ground 122 is additionally provided with and is positioned at
Two the first ground pads 1221 of the first signal pad 121 both sides, correspondingly, refer to Fig. 4, at the top layer of the second pcb board 200
On 210, each described second top layer ground 212 is also equipped with a second ground pad corresponding with the first ground pad 1221
2121, the welding corresponding with the second ground pad 2121 of the first ground pad 1221, in order to realize the first pcb board 100 and the second pcb board
Ground between 200 connects, and also further enhances the bonding strength between the first pcb board 100 and the second pcb board 200 simultaneously.Ability
Field technique personnel are it should be understood that the present invention is also dependent on being actually needed plural second ground pad 2121 and the respective counts of design
First ground pad 1221 of amount is welded to each other；Or also dependent on being actually needed the described second top layer ground 212 of design one,
Only arrange a second ground pad 2121 to weld in order to corresponding with first ground pad 1221 simultaneously.
Further, please continue to refer to Fig. 3, in order to the first bottom ground 122 that prevents from being short-circuited in welding procedure is located at the
The periphery of one signal pad 121, and formed between protection between described first bottom ground 122 and described first signal pad 121
Away from 123.Preferably, the present invention coats green oil in guard band 123, and green oil is short in order to prevent from further welding as solder resist
Road, extends pcb board service life.The present invention is also dependent on being actually needed at the first signal pad 121 and the first ground pad 1221
Position in addition is coated with green oil.
In the present embodiment, described first pcb board 100 partly overlaps with described second pcb board 200, described first signal
Via 130 is located at described first radio circuit 111 one end near described second pcb board 200, and meanwhile, described secondary signal is welded
Described second radio circuit 211 one end near described second pcb board 200 is located at by dish 2111 so that described first pcb board 100
Overlapping with described second pcb board 200 only end, with thinking that on circuit board, components and parts provide more accommodation space.The present invention is also
According to actual needs the first pcb board 100 all can be positioned on the second pcb board 200.
As it is shown in figure 5, the radio frequency PCB method of attachment of the present embodiment comprises the steps:
S10, on the bottom 120 of the first pcb board 100, make the first signal pad 121；
S20, on the first pcb board 100 make signal via 130, in order to connect the first radio circuit of its top layer 110
111 and the first signal pad 121 of bottom 120；
Secondary signal pad 2111 is made on S30, the second radio circuit 211 on the second pcb board 200；
S40, the first signal pad 121 weld with secondary signal pad 2111 so that the first pcb board 100 and the second pcb board
200 link together.
Further, further comprising the steps of between step S30 and S40:
S31, the first bottom ground 122 of the first pcb board 100 makes and is located at two of the first signal pad 121 both sides
First ground pad 1221；
S32, the second top layer ground 212 of the second pcb board 200 makes and is located at two of secondary signal pad 2111 both sides
Second ground pad 2121, the first ground pad 1221 and the second ground pad 2121 one_to_one corresponding, at the first signal pad 121 and second
The when that signal pad 2111 welding, it is ensured that the first ground pad 1221 and the second ground pad about 2121 are just to setting, Jin Erbao
Demonstrate,prove the first ground pad 1221 can dock with the second ground pad 2121.
Then particularly as follows: by the first signal pad 121 and secondary signal pad 2111 and the first ground pad in step 40
1221 corresponding with the second ground pad 2121 weld together, and so far, complete the first pcb board 100 and connection of the second pcb board 200
Work.
It is to be appreciated that above-mentioned steps S30 and S31 are not necessarily the relations successively performed, it is also possible to be to first carry out S31
Rear execution S30, i.e. first makes the first signal pad 121, signal via 130 and the first ground pad 1221 at the first pcb board 100,
After on the second pcb board 200, make secondary signal pad 2111 and the second ground pad 2121, finally by the first pcb board 100 and the
Two pcb boards 200 weld.Further, step S31 can also directly perform between step S10 and step S20.
When using the present invention, for the radio frequency pcb board of small volume, use SMT (Surface Mount
Technology, electronic circuit surface installation technique) can realize, for the pcb board that area is bigger, then use spot welding mode to enter
Row welding.SMT and spot welding all can be realized by automation equipment.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic executed in example is all described, but, as long as the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but also
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that, come for those of ordinary skill in the art
Saying, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into the protection of the present invention
Scope.
Claims (10)
1. a radio frequency PCB attachment structure, it is characterised in that include that the first pcb board and the second pcb board, described first pcb board set
In the top of described second pcb board, the top layer of described first pcb board is provided with the first radio circuit, the bottom of described first pcb board
It is provided with the first signal pad, described first radio circuit and described first signal pad to be electrically connected with by signal via, described
The top layer of the second pcb board is provided with the second radio circuit, and described second radio circuit is provided with relative with described first signal pad
The secondary signal pad answered, described first signal pad welds mutually with described secondary signal pad.
Radio frequency PCB attachment structure the most according to claim 1, it is characterised in that described first radio circuit is microstrip line,
The top layer of described first pcb board be additionally provided with the both sides being positioned at described first radio circuit two first top layers ground, described first
Top layer ground and described first radio circuit interval are arranged.
Radio frequency PCB attachment structure the most according to claim 2, it is characterised in that the bottom of described first pcb board is additionally provided with
First bottom ground, described first top layer ground is connected by hole, ground with described first bottom ground.
Radio frequency PCB attachment structure the most according to claim 3, it is characterised in that hole, described ground is close to described signal mistake
Hole is arranged.
Radio frequency PCB attachment structure the most according to claim 3, it is characterised in that described first bottom is provided with at least on the ground
One the first ground pad, the top layer of described second pcb board is provided with the second top layer ground, and described second top layer is provided with on the ground and described the
One ground pad the second ground pad one to one, welds between described first ground pad and corresponding described second ground pad mutually
Connect.
Radio frequency PCB attachment structure the most according to claim 5, it is characterised in that be located at described described first bottom
The periphery of one signal pad, is provided with guard band between described first bottom ground and described first signal pad.
Radio frequency PCB attachment structure the most according to claim 6, it is characterised in that be coated with green oil in described guard band.
Radio frequency PCB attachment structure the most according to claim 5, it is characterised in that described first ground pad and described second
It is equipped with two top layer, is respectively arranged on the both sides of described second radio circuit two described second top layers, each described
Two top layers are equipped with a described second ground pad on the ground.
Radio frequency PCB attachment structure the most according to any one of claim 1 to 8, it is characterised in that described first pcb board
Partly overlapping with described second pcb board, described first signal via is located at described first radio circuit near described second pcb board
One end, described secondary signal pad is also located at described second radio circuit one end near a described PCB.
10. a radio frequency PCB method of attachment, it is characterised in that comprise the following steps:
The bottom of the first pcb board makes the first signal pad；
First pcb board makes signal via, the first signal weldering of the first radio circuit and bottom in order to connect its top layer
Dish；
Secondary signal pad is made on the second radio circuit on the second pcb board；
First signal pad and secondary signal pad solder so that the first pcb board and the second pcb board link together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610843464.8A CN106211570B (en) | 2016-09-22 | 2016-09-22 | Radio frequency PCB connection structure and connection method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610843464.8A CN106211570B (en) | 2016-09-22 | 2016-09-22 | Radio frequency PCB connection structure and connection method |
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| CN106211570A true CN106211570A (en) | 2016-12-07 |
| CN106211570B CN106211570B (en) | 2019-06-11 |
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Cited By (8)
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| CN107624004A (en) * | 2017-08-22 | 2018-01-23 | 努比亚技术有限公司 | A kind of applying method of printed circuit board (PCB) and a kind of printed circuit board (PCB) |
| CN107949154A (en) * | 2017-12-15 | 2018-04-20 | 京信通信系统（中国）有限公司 | The connection method of radio frequency PCB a kind of and connection structure |
| CN110167261A (en) * | 2019-06-26 | 2019-08-23 | 京信通信技术(广州)有限公司 | Interconnection structure between millimeter wave active antenna element and pcb board |
| CN110313881A (en) * | 2018-03-30 | 2019-10-11 | 微创（上海）医疗机器人有限公司 | Pad exchanging structure and fujinon electronic video endoscope head end structure |
| CN111942153A (en) * | 2020-08-21 | 2020-11-17 | 黑龙江天有为电子有限责任公司 | Automobile central control system and instrument panel display system thereof |
| CN114641151A (en) * | 2022-05-19 | 2022-06-17 | 广东省新一代通信与网络创新研究院 | Manufacturing method of base station radio frequency circuit based on PCB castle board |
| CN115279020A (en) * | 2022-08-01 | 2022-11-01 | 苏州源数芯通信科技有限公司 | Connecting structure of small pad pitch chip and PCB and processing method thereof |
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| CN110167261A (en) * | 2019-06-26 | 2019-08-23 | 京信通信技术(广州)有限公司 | Interconnection structure between millimeter wave active antenna element and pcb board |
| CN111942153A (en) * | 2020-08-21 | 2020-11-17 | 黑龙江天有为电子有限责任公司 | Automobile central control system and instrument panel display system thereof |
| CN111942153B (en) * | 2020-08-21 | 2021-05-11 | 黑龙江天有为电子有限责任公司 | Automobile central control system and instrument panel display system thereof |
| CN114641151A (en) * | 2022-05-19 | 2022-06-17 | 广东省新一代通信与网络创新研究院 | Manufacturing method of base station radio frequency circuit based on PCB castle board |
| CN114641151B (en) * | 2022-05-19 | 2022-08-02 | 广东省新一代通信与网络创新研究院 | Manufacturing method of base station radio frequency circuit based on PCB castle plate |
| CN115279020A (en) * | 2022-08-01 | 2022-11-01 | 苏州源数芯通信科技有限公司 | Connecting structure of small pad pitch chip and PCB and processing method thereof |
| CN115455886A (en) * | 2022-08-05 | 2022-12-09 | 上海移柯通信技术股份有限公司 | PCB design method, PCB, electronic device, storage medium and terminal |
| CN115455886B (en) * | 2022-08-05 | 2023-04-11 | 上海移柯通信技术股份有限公司 | PCB design method, PCB, electronic device, storage medium and terminal |
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