JPH03123096A - Manufacture and structure of hybrid ic - Google Patents

Abstract

PURPOSE:To simplify a hybrid IC in manufacturing process and to miniaturize an electronic equipment by a method wherein the width of a slit is made two times as large as the required length of a terminal, the opposed holes where the terminals are inserted are bored in the terminal lands of the hybrid IC substrate opposed to each other interposing the slit between them, electronic parts and the IC are fixed to a component land, and lead wires are fixed to the opposed holes. CONSTITUTION:The width of a slit 6' is made nearly two times as large as the required length of a terminal, opposed holes 8 where the terminals are inserted are board in terminal lands 4' of an IC substrate 2 opposed to each other interposing the slit 6' between them. An electronic part and an IC are mounted on a component land 3, and a lead wire 7' is inserted into the opposed holes 8, which are fixed together at the same time by soldering through a reflow soldering method. A hybrid IC manufacturing as above can be small in height as the lead wire 7' which does not require a terminal of bifurcated structure is used, and when the hybrid IC concerned is built in an electronic equipment, it can be conductive to the miniaturization of the equipment.

Description

[Detailed Description of the Invention] [Summary] The present invention involves making the slit width the desired length of the terminal, and further drilling an opposing hole into which the terminal is inserted into the terminal land of the hybrid IC board facing across the slit. A method for manufacturing a hybrid IC in which electronic components and ICs are fixed to a component land and conductive wires are fixed to the opposing hole, which reduces the terminal price, simplifies the manufacturing process, and reduces the height of the hybrid IC. can.

[Industrial application field]

The present invention applies to all electronic components (semiconductors, resistors, capacitors,
The present invention relates to a hybrid IC, which is a type of IC that combines a coil, etc.) and an IC.

(1) (2) Hybrid ICs are used in communication devices, computers, etc. that use a large number of components to form complex electronic circuits, and make these devices smaller, more stable, higher quality, and lower priced. Especially needed.

The present invention particularly refers to the structure of a hybrid IC.

[Conventional technology]

FIG. 7 is a plan view showing a conventional printed circuit board made up of a plurality of hybrid IC boards. The configuration of this figure will be explained below. Note that similar components are represented by the same reference numbers or symbols throughout the drawings. In this figure, a printed circuit board 1 is a printed wiring board made of a glass epoxy resin base material.

For example, the printed circuit board 1 has wiring (not shown)
, a component land 3 on which an electronic component is mounted and a terminal land 4 located on one side in the elongated direction are printed;
Eight hybrid IC boards 2 are arranged in two rows, and the hybrid IC boards 2 are connected to each other and side edge plates (17, 1
8) and cut off the four slits 6 provided in the longitudinal direction of each hybrid IC board 2, the upper edge plate (15), and the lower edge plate (16) to facilitate separation from the printed circuit board 1. In order to separate the upper and lower hybrid IC boards from the printed circuit board 1, three parting lines having V-shaped grooves (for example, V
(Explained using a cut line or a V cut line below the perforation hole) 5. FIG. 8 is a plan view showing the hybrid IC in the shaded area in FIG. 7. In this figure, the hybrid IC 2 includes a hybrid IC board 2, an ICl0 mounted on the hybrid board 2, a transistor 11, and a resistor 1.
2. Electronic components such as capacitor 13, and terminal land 4
It includes a terminal 7 fixed to. FIG. 9 is a side view of FIG. 8. In this figure, one end of the terminal 7 of the hybrid IC 2' has a bifurcated structure, and the terminal land 4 of the hybrid IC board 2 is sandwiched between the terminals 7 of the hybrid IC 2'. In FIG. 8, the length a of the terminal 7 is about 5 embryos, and the shoulder part from the shoulder of the forked structure at the tip of the terminal 7 to the edge of the vibrator (3) (4) lid IC board 2 at the time of insertion. Height b is 1.3+n+
n~1.7 +n+n.

Next, the process of manufacturing the hybrid IC 2' will be explained.

FIG. 10 is a manufacturing flowchart of a conventional hybrid IC. In this figure, wiring (not shown), component lands 3, and terminal lands 4 are printed on a hybrid IC board 2 of a printed circuit board 1 to form a circuit pattern (Sl). V-cut lines 5 and slit lines 6 are processed on the printed circuit board 1 (S2). Solder cream is applied to the component lands 3 of the hybrid IC board 2 by, for example, screen printing or a dispenser (S3). Electronic components such as the ICl0, transistor 11, resistor 12, and capacitor 13 are mounted on the component land 3 of the hybrid IC board 2 (S4). These electronic components are fixed by heating and melting using a reflow soldering method (S5). Next V
Cut the printed circuit board 1 along the cut line 5 into each hybrid I.
Divide into C substrates 2 (S6). The terminals 7 are inserted into the terminal lands 4 of each divided hybrid IC board 2 and soldered to complete the hybrid IC 2' (S7).
. Thereafter, cleaning of flux residue caused by soldering and surface coating for moisture proofing are performed, but these are not directly related to the present invention. Thus these hybrid I
C2' has been incorporated into electronic equipment (S8) and has contributed to the miniaturization and high quality of electronic equipment.

[Problem to be solved by the invention]

However, the first problem is that special equipment is required for inserting and soldering the terminals 7 into the hybrid IC board 2, and the manufacturing process is complicated because the terminals are soldered separately from the soldering of electronic components such as ICl0. There's a problem.

Further, since the terminal 7 itself needs to be processed into a bifurcated structure, there is a problem that it becomes expensive. 0.5 yen to 1 per terminal
．． A fee of 5 yen is required.

Furthermore, since the terminal 7 has a bifurcated tip as shown in Fig. 8, its shoulder height b (1.3 mm to 1.7 m +
Due to n), there is a third problem in that mounting the hybrid IC 2' to the electronic equipment (5) (6) increases the height h'. In the case of an in-vehicle deck, the height is approximately 10+
Since it is limited to nm, the shoulder height b at the tip of terminal 7
is too large to be ignored.

Therefore, in view of the above-mentioned problems, it is an object of the present invention to provide a hybrid IC that can simplify the manufacturing process, is inexpensive, and allows electronic equipment to be miniaturized.

[Means to solve the problem]

FIG. 1 is a diagram showing the basic configuration of the present invention. In the present invention, in order to solve the above-mentioned problems, the width of the slit 60 is made approximately twice the desired length of the terminal, and furthermore, the width of the slit 60 is made approximately twice as large as the desired length of the terminal, and the terminal land 4' of the hybrid IC board 2 facing the slit 6' is
A facing hole 8 into which a terminal is inserted was bored in the hole. Then, the electronic components and IC are mounted on the component land 3, and the conductive wire 7' is inserted into the opposing hole 8, and these are simultaneously soldered and fixed using the reflow soldering method.

The hybrid IC 2 manufactured in this manner includes a conductive wire 7' fixed to a hole 8 formed in a terminal land 4' to which a terminal is attached.

[For production]

In FIG. 1, since a conductive wire 7', for example, a jumper wire, is used as a terminal, the price of the hybrid IC 2' can be lowered compared to the conventional one. Since the hole 8 facing the slit 6 is provided, the conductor 7' can be fixed to the printed circuit board at the same time as the electronic components and IC, which simplifies the manufacturing process compared to the conventional method. For charging, commonly used equipment can be used, eliminating the need for conventional dedicated equipment.

The structure of the hybrid IC manufactured in this way is
Conductor 7' that does not require the conventional two-pronged terminal structure
Since the height of the device can be reduced, it contributes to the miniaturization of the device when it is incorporated into an electronic device.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail (7) and (8) with reference to the drawings. FIG. 2 shows a first embodiment of the present invention, and is a plan view of a printed circuit board made up of a plurality of hybrid IC boards. The components in this figure that are different from those in FIG.
the second slit 6' and the second slit 6' provided between the first and second rows and between the third and fourth rows from the left side of the hybrid IC board 2 (for example, approximately 5 mm x 2). The hybrid IC facing the slit 6' of
A terminal land 4' is disposed on the side of the substrate 2 and has a hole 8 formed therein for the terminal to pass through. FIG. 3 is a plan view showing how the terminals are attached in the section A of FIG. 2. The configuration shown in this figure includes opposing hybrid IC boards 2, terminal lands 4' located on the sides of each hybrid IC board 2, each having a hole 8 formed therein, and a terminal land 4' sandwiched between each hybrid IC board 2. A conductive wire 7', for example, a jumper wire, is inserted as a terminal into the second slit 6' and the hole 8 of each opposing terminal land 4' so as to straddle the second slit 6'. FIG. 4 is a side view of FIG. 3. The conductor wire 7' is inserted into the opposing holes 8 and its both ends are bent, using a printed circuit board jumper wire insertion machine used for boat fishing. This conductive wire 7' will be soldered as will be described later and will be cut along the dotted line in the center as shown in FIG. This jumper wire used as the conductor 7' has a cost of almost zero per piece, and is cheaper than the conventional terminal 7. Note that terminal land 4
The hole ' is easily drilled because the base material of the printed circuit board is made of a resin board type.

Next, a manufacturing process of a hybrid IC according to an embodiment of the present invention will be explained. FIG. 5 is a manufacturing flowchart of a hybrid IC according to an embodiment of the present invention. In this figure, wiring (not shown), component lands 3, and terminal lands 4' are printed on a hybrid board 2 of a printed circuit board 1 to form a circuit pattern (Sl). Printed circuit board 1
A slit 6.6' is provided with a V-cut line 5, and a hole 8 is bored in the terminal land 4' (S2). Hybrid (9) (10) Terminal land 4' along with component land 3 of IC board 2
A solder cream is applied, for example by screen printing or a dispenser (S3). ICl0, transistor, resistor 1 on component land 3 of hybrid IC board 2
2. Attach electronic components such as the capacitor 13, and insert the conducting wire 7' into the hole 8 of the opposing terminal land 4' (S4). The printed circuit board 1 on which the electronic components are mounted and the conductive wire 7' is inserted is heated to melt the solder and are fixed to the printed circuit board 1 by reflow soldering (S5). Next, by cutting the conductor 7' at its center and further dividing the printed circuit board 1 along the V-cut line 5, each SIL hybrid IC 2' whose height is lower than the conventional one is completed (S6).
. The above manufacturing process eliminates the process of soldering the terminals after dividing the hybrid IC board 2 as in the prior art. These hybrid ICs 2' are incorporated into electronic equipment (S7), and the electronic equipment can be further downsized.

FIG. 6 is a plan view of a printed circuit board comprising a plurality of hybrid IC boards, which is a second embodiment of the present invention. In this diagram, the components that differ from those in Figure 2 are each hybrid I.
The terminal land 4' has holes 8 formed on both sides in the longitudinal direction of the C board 2', and the width is twice the desired length of the terminal (for example, about 5+nm x 2). A second slit 6 provided between the rows and the second row, between the second row and the third row, and between the third row and the fourth row.
', the width is the desired length of the terminal (for example, about 5 mm),
A third slit 61 provided between the first row and the left side edge plate 18 and between the fourth row and the right side edge plate 18,
Also, holes 8' are formed in the side edge plates 17 and 18 to correspond to the holes 8 of the terminal lands 4' of the hybrid IC board 2'. By configuring the printed circuit board 1 in this way, a DIL hybrid IC 2' can be obtained. The manufacturing process is the same as described above, so the explanation will be omitted.

(11) (12) [Effects of the Invention] As explained above, according to the present invention, the width of the slit is made twice the desired length of the terminal, and furthermore, the width of the slit is made twice as large as the desired length of the terminal, and the terminal land of the hybrid IC board facing the slit is Opposed holes are drilled into which terminals are inserted, electronic components and ICs are fixed to the component land, and conductors are fixed in the opposed holes, which reduces terminal costs and replaces conventionally used terminals. This eliminates the need for specialized installation equipment, simplifies the manufacturing process, and lowers the height of the hybrid IC, allowing electronic devices to be made smaller.

[Brief explanation of drawings]

Fig. 1 is a diagram showing the principle configuration of the present invention, Fig. 2 is a plan view showing the first embodiment of the invention, and shows a printed circuit board consisting of a plurality of hybrid IC boards, and Fig. 3 is the same as Fig. 2. FIG. 4 is a side view of FIG. 3, FIG. 5 is a manufacturing flowchart of a hybrid IC according to the present invention, and FIG. 6 is a second embodiment of the present invention. , a plan view of a printed circuit board made up of a plurality of hybrid IC boards, FIG. 7 is a plan view showing a printed board made up of a plurality of conventional hybrid IC boards, and FIG. 8 is a plan view showing the hybrid IC shown in the shaded area in FIG. 7. 9 is a side view of FIG. 8, and FIG. 10 is a manufacturing flowchart of a conventional hybrid IC. In the figure, 1...Printed circuit board, 2...Hybrid IC board, 2'...Hybrid IC, 3...Component land,
4...terminal land, 5...dividing line, 6
...Slit, 7'...Conductor, 8.
··hole. (13) (14) JP-A-3 123096 (7) Planar diagram showing the hybrid IC shown in the shaded area in Fig. 7

Claims (2)

[Claims] 1. A plurality of hybrid IC boards (2) having component lands (3) on which electronic components and ICs are mounted and terminal lands (4') on which terminals (7) are mounted are separated by a dividing line (5) for easy division and facing In the printed circuit board (1) arranged with slits (6') between the hybrid IC boards (2), the width of the slits (6') is approximately twice the desired length of the terminal, and Hybrid I facing across 6')
A hole (8) for inserting a terminal is drilled in the terminal land (4') of the C board (2), and an electronic component and an IC are fixed to the component land (3), and at the same time, the opposing holes (8) are connected to each other. Conductor (7') between
A method for manufacturing a hybrid IC, characterized by fixing. 2. Hybrid IC equipped with electronic components and IC (
2'), the terminal land (4') where the terminal is attached.
The conducting wire (7') is fixed by passing through the hole (8) drilled in the
) A structure of a hybrid IC characterized by comprising: