JPH05259372A - Hibrid ic - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] To provide a hybrid IC that requires a small number of work steps and is compatible with high-density mounting. [Structure] A printed wiring board 10 in which a plurality of chip components 11 are mounted on front and back wiring patterns 12 and a frame-shaped substrate attached to the back surface of the printed wiring board 10 and provided with lead electrodes 21b on the lower surface. It consists of a frame type substrate 20
Is formed at least higher than the mounting height h of the chip component 11 mounted on the back surface of the printed wiring board 10, and the wiring pattern 12 and the lead electrode 21b are provided on the frame-shaped substrate 20 in a conductive manner. It connects through the sex pattern 21. Moreover, the lead electrode 2 is formed on the outer surface of the frame-shaped substrate 20.
A side electrode is provided in a state of being raised from 1b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC having a plurality of chip parts mounted on a printed wiring board.

[0002]

2. Description of the Related Art A hybrid IC is one in which chip parts such as resistors, capacitors, transistors and semiconductor elements are connected to a printed wiring board to give various electrical characteristics. When this hybrid IC is mounted on a mother board, a printed wiring board on which this chip component or the like is mounted is mounted on a lead frame, this lead frame and the wiring pattern of the printed wiring board are connected by soldering, and this lead frame is mounted. It is used to connect the hybrid IC and the motherboard.

[0003]

However, such a hybrid IC has the following problems. That is, by using the lead frame, a step of connecting the printed wiring board and the lead frame is required, and the positioning accuracy when the hybrid IC is mounted on the motherboard due to variations in the lead frame such as floating and deviation. Will decrease. Furthermore, since it is necessary to set the interval (pitch) between the lead frames to be wider, so-called fine pitch hybrid IC
Are difficult to form. Such a hybrid I
C is not enough to deal with a high-density mounting type motherboard. Therefore, it is an object of the present invention to provide a hybrid IC that requires a small number of work steps and is compatible with high-density mounting.

[0004]

The present invention is a hybrid IC made to solve the above problems.
That is, a printed wiring board having a plurality of chip components mounted on each of the wiring patterns provided on the front and back surfaces and a portion of the back surface of the printed wiring board where no chip components are mounted, and the lead electrodes are provided on the lower surface. And a back face of the printed wiring board, wherein the back of the frame substrate is formed at least higher than the mounting height of the chip component mounted on the back surface of the printed wiring board. The wiring pattern provided on the substrate and the lead electrode are connected via the conductive pattern provided on the frame-shaped substrate. Further, a side surface electrode is provided on the outer side surface of the frame-type substrate in a state of being raised from the lead electrode.

[0005]

Operation: The printed wiring board is mounted on the mother board while being supported by the frame type substrate attached to the back surface of the printed wiring board. On the lower surface of the frame-shaped substrate, a lead electrode connected to a wiring pattern via a conductive pattern formed on the frame-shaped substrate is formed.
The connection with the motherboard can be obtained without using a lead frame. Further, since the lead electrodes are formed in close contact with the lower surface of the frame-shaped substrate, there is no floating or deviation of each lead electrode, and the hybrid IC can be accurately positioned on the motherboard. Further, by soldering the side surface electrode provided upright from the lead electrode and the upper surface of the motherboard, the soldered state of the motherboard and the hybrid IC can be easily visually checked.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A hybrid IC of the present invention will be described below with reference to the drawings. FIG. 1 shows the hybrid I of the present invention.
FIG. 2 is a schematic sectional view illustrating C, and FIG. 2 is a schematic bottom view of the hybrid IC of the present invention. That is, the hybrid IC 1 of the present invention is mainly composed of a plurality of chip components 11 on the front and back surfaces.
And a frame type substrate 20 attached to the back surface of the printed wiring board 10. The printed wiring board 10 is made of an organic substrate, ceramics, or the like, has wiring patterns 12 of a predetermined shape formed on the front and back surfaces, and chip components 11 are mounted on the wiring patterns 12, respectively. The chip component 11 is a resistor, a capacitor, and a bare chip 11a of a semiconductor element,
A bonding wire 13 is used to connect the bare chip 11a and the wiring pattern 12.

On the back surface of the printed wiring board 10 where the chip component 11 is not mounted, at least the mounting height h of the chip component 11 is higher than the frame height of the frame type substrate 20.
Are mounted and mounted on the mother board 2 in a state in which the printed wiring board 10 is supported by the frame type substrate 20. A plurality of lead electrodes 21b as shown in FIG. 2 are formed at predetermined intervals on the lower surface of the frame-shaped substrate 20, and the conductive pattern 21 formed of through holes 21a is formed.
It is connected to the wiring pattern 12 provided on the front and back surfaces of the printed wiring board 10 via. The printed wiring board 1 is connected to the lead electrode 21b through the conductive pattern 21.
Some are connected to the wiring pattern 12 provided on the front surface of the printed wiring board 0, and some are connected to the wiring pattern 12 provided on the back surface of the printed wiring board 10. Hybrid IC
1 is mounted on the motherboard 2, this lead electrode 2
By using 1b as a reference, the positioning can be performed with high accuracy, and the electrical connection between the wiring pattern 12 and the mother board 2 can be obtained.

Next, the side surface electrode 2 is formed on the outer surface of the frame-shaped substrate 20.
The hybrid IC 1 provided with 2 will be described with reference to FIGS. 3 and 4. That is, as shown in the schematic cross-sectional view of FIG. 3, the hybrid IC 1 includes a printed wiring board 10 on which a chip component 11 is mounted, a frame-shaped substrate 20 attached to the lower surface of the printed wiring board 10, and a frame. The side surface electrode 22 is provided on the outer side surface of the mold substrate 20 so as to stand up from the lead electrode 21b.

The side electrode 22 is formed by adhering a copper foil or the like to the outer surface of the frame-shaped substrate 20 and removing unnecessary portions by etching or the like, or a metal plate or the like on the outer surface of the frame-shaped substrate 20. Is attached and soldered to the lead electrode 21b so that the lead electrode 21b is electrically connected. FIG. 4 shows a state in which the hybrid IC 1 is connected to the mother board 2. In this way, the hybrid IC
1 is mounted on the mother board 2 and connected by soldering. During this soldering, the side electrode 22 and the mother board 2
Solder 23 is attached to the upper surface. As a result, the solder 23
Also flows between the lead electrode 21b and the upper surface of the mother board 2. (Not shown) Also, when the creamy solder 23 is used, the solder 23 is in a state of being attached between the lead electrode 21b and the upper surface of the mother board 2 and between the side surface electrode 22 and the upper surface of the mother board 2. ..

As described above, since the solder 23 is attached between the side surface electrode 22 and the upper surface of the mother board 2, the connection state of the solder 23 can be easily seen from the side and the top of the hybrid IC 1 and the frame-type substrate is also provided. Since the connection (soldering) surface formed by the lower surface and the side surface of 20 can be made large, more reliable connection can be obtained.

Next, the steps of manufacturing the hybrid IC substrate of the present invention will be described in the order of steps. 5A to 5C are cross-sectional views for explaining the manufacturing process of the substrate of the hybrid IC 1 in process order. First, as a first step, as shown in FIG. 5A, a copper foil or the like is adhered to the front and back surfaces of the printed wiring board 10 to form a wiring pattern 12 for forming a predetermined circuit by a printing method, a photographic method, or the like. Formed by. In addition, the frame-shaped frame-shaped substrate 20 is formed by punching out the substantially central portion of the organic substrate or the like to be the frame-shaped substrate 20. Then, the back surface of the printed wiring board 10 and the top surface of the frame-type substrate 20 are connected by thermocompression bonding or the like.

Next, as a second step, as shown in FIG. 5B, a copper foil or the like is adhered to the lower surface of the frame-type substrate 20 and a lead electrode 21b having a predetermined shape is formed by using a printing method or a photographic method. To form. Thereby, the lead electrode 21b can be formed on the lower surface of the frame-shaped substrate 20 with high positional accuracy.

Finally, as a third step, as shown in FIG. 5C, the wiring pattern 12 is formed from each lead electrode 21b.
To form a hole in the frame substrate 20 with a drill,
The through hole 21a is formed by plating the inside of the hole. As a result, the lead electrode 21b and the wiring pattern 12 provided on the printed wiring board 10 are electrically connected. Through the above steps, the substrate of the hybrid IC 1 can be manufactured. Chip parts 11
The hybrid IC 1 can be easily formed by connecting the bare chip 11a and wiring with the bonding wire 13 or the like. In the first step described above, the chip component 1 is formed on the wiring pattern 12 provided on the printed wiring board 10 in advance.
Alternatively, the frame-shaped substrate 20 may be attached to the back surface of the printed wiring board 10 after connecting 1 or the bare chip 11a.

Next, another embodiment of the present invention will be described with reference to the schematic bottom view of FIG. That is, as shown in FIG. 6A as the first of the other embodiments, the printed wiring board 10 is
The internal substrate 30 is attached to the portion of the back surface of the substrate where the frame-type substrate 20 is not attached, and the lead electrode 2
1b is formed. This allows the hybrid IC
Since it is possible to connect to the mother board 2 from a portion other than the outer peripheral portion of the bottom surface of 1 as well, the degree of freedom in designing the electric circuit is increased and the number of lead electrodes 21b can be increased.

FIG. 6 shows a second example of another embodiment.
As shown in (b), the internal substrate 30 is provided so as to surround the corner of the frame-shaped substrate 20, and the bare chip 11a and the like are connected to the back surface of the printed wiring board 10 in the enclosed portion. And
If the enclosed portion is filled with a potting resin for protection, the internal substrate 30 also has a function of preventing the potting resin from flowing. The shape and the mounting position of the internal substrate 30 are not limited to this, and the internal substrate 30 can be freely provided in a necessary place. By attaching such an internal substrate 30, the mechanical strength of the hybrid IC 1 is increased, which is effective for mounting on the mother board 2 by an automatic machine.

In each of the above-described embodiments, the wiring pattern 12 provided on the printed wiring board 10 and the frame-shaped substrate 2 are provided.
Although the through hole 21a is used as the conductive pattern 21 for connecting to the lead electrode 21b provided on the lower surface of 0, the present invention is not limited to this. That is, when ceramic is used as the frame-shaped substrate 20, it is difficult to process the holes formed in forming the through holes 21a. Therefore, instead of the through holes 21b, LC is formed on the side surface of the frame-shaped substrate 20.
A metallized electrode such as used in C (Leadless Chip Carrier) may be used. Further, the manufacturing cost of the hybrid IC 1 can be reduced by standardizing the size of the frame of the frame-shaped substrate 20, the pitch and the number of the lead electrodes 21b, and the like into several types and combining these to obtain a required size. ..

[0017]

As described above, the hybrid IC of the present invention has the following effects. That is, the lead electrode formed on the lower surface of the frame-type substrate can connect the hybrid IC and the mother board without using a lead frame, so that the number of working steps can be reduced. Furthermore, since the lead electrodes can be accurately positioned by printing or photography and the interval between the lead electrodes can be narrowed, it is possible to form a fine pitch hybrid IC. Therefore, a hybrid IC that can also be used for high-density mounted motherboards
Becomes Moreover, the soldering state of the hybrid IC and the mother board can be easily visually checked by the side surface electrodes provided on the outer side surface of the frame-shaped substrate. As a result, the connection inspection between the hybrid IC and the mother board can be accurately performed, so that the productivity can be improved.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view illustrating a hybrid IC of the present invention.

FIG. 2 is a schematic bottom view of the hybrid IC of the present invention.

FIG. 3 is a schematic cross-sectional view illustrating a side electrode.

FIG. 4 is a sectional view illustrating a connection state between a hybrid IC and a motherboard.

5A and 5B are cross-sectional views for explaining a manufacturing process of a substrate of a hybrid IC of the present invention in the order of processes, in which (a) is a first process and (b) is a process.
Is the second step, and (c) is the third step.

FIG. 6 is a schematic bottom view illustrating another embodiment of the present invention,
(A) is No. 1 of the other embodiment, and (b) is No. 2 of the other embodiment.

[Explanation of symbols]

 1 Hybrid IC 2 Motherboard 10 Printed Wiring Board 11 Chip Component 11a Bare Chip 12 Wiring Pattern 13 Bonding Wire 20 Frame-type Substrate 21 Conductive Pattern 21a Through Hole 21b Lead Electrode 22 Side Electrode 30 Internal Substrate

Claims (2)

[Claims] 1. A printed wiring board having a plurality of chip components mounted on wiring patterns provided on the front and back surfaces, respectively.
A hybrid IC comprising a frame-shaped substrate mounted on a portion of the back surface where the chip component is not mounted and having a lead electrode provided on a lower surface thereof, wherein at least the printed wiring is provided at the back of the frame-shaped substrate. The wiring pattern, which is formed higher than the mounting height of the chip component mounted on the back surface of the board, and is provided on the front and back surfaces of the printed wiring board, is a conductive pattern provided on the frame-shaped substrate. A hybrid IC characterized by being connected to a lead electrode. 2. The hybrid IC according to claim 1, wherein a side surface electrode is provided on an outer surface of the frame-shaped substrate in a state of being raised from the lead electrode.