CN201700085U

CN201700085U - Circuit board structure

Info

Publication number: CN201700085U
Application number: CN2010201861077U
Authority: CN
Inventors: 吴仲扬
Original assignee: Inventec Corp
Current assignee: Inventec Corp
Priority date: 2010-05-04
Filing date: 2010-05-04
Publication date: 2011-01-05
Anticipated expiration: 2020-05-04

Abstract

The utility model relates to a circuit board structure, which comprises a board body, a welding pad and at least one threshold, wherein a plurality of conduction through holes are arranged on the side surface of the board body, and the welding pad is also arranged on the side surface thereof; and the threshold is convexly arranged on the welding pad and is positioned between the two adjacent conduction through holes. A circuit board is coated at the welding pad by soldering tin when in reflow and then is welded with an electronic assembly. As the soldering tin is not attached on the threshold, a certain altitude difference is left between the threshold and the electronic assembly, and the gas generated by soldering flux in the soldering tin can be emitted by virtue of the altitude difference.

Description

Board structure of circuit

Technical field

The utility model relates to a kind of board structure of circuit, convexes with the board structure of circuit of rank sill on particularly a kind of weld pad.

Background technology

Along with day by day improving of electronics technology, various electronic product has been applied in modern's the daily life, for example in large quantities: household electrical appliances, consumption-orientation and the commercial communications electronics product etc. of using.In the exploitation of this electronic product, when technology was made final products, the designer can install integrated circuit, transistor, diode, passive component (as resistance, electric capacity, connector etc.) or other various electronic components on circuit board at present.Be communicated with by the lead on the circuit board, can form electronic signal and connect, to reach the target that realizes its expection function.

The general method that related electronic components is set on circuit board, comprise: plated-through-hole (Plated Through Hole) on can double-sided printed-circuit board, wherein each through hole provides the two relative side in circuit board, and copper facing on the internal face of through hole, to form the through hole (via hole) of tool conductive characteristic.Thereafter, utilize the mode of reflow that electronic building brick is fixed on the circuit board again, to reach the purpose that electronic building brick is fixedly arranged on circuit board and electrically conducts.

This kind reflow technology comprises on technology in regular turn: scaling powder coating, preheating, scolding tin apply, unnecessary scolding tin blows down, detect maintenance and cleaning step such as finishes.In this technology, mainly be with circuit board by in the tin stove with molten condition tin ripple so that liquid tin finishes into the hole in the through hole of circuit board, forms solder joint after filling out tin, and then reach electronic building brick be fixed in purpose on the circuit board.

When circuit board enters the tin stove and carries out reflow process, because the difference of Temperature Distribution on the circuit board will make scolding tin to be coated on the weld pad equably.In addition,, cause through hole in reflow process, can be filled earlier all around because liquid tin when entering the hole, also has the character of easily seeking connections with earlier around through hole, and the non-uniform phenomenon that through hole central authorities fill not yet.In addition, the bulk temperature in reflow process, owing to reached the temperature range that scaling powder can act on, so these scaling powders can produce gas thereupon volatilizing.If these gases can't be discharged circuit board effectively, then can residue in scolding tin inside.In this, the inside of scolding tin can have a plurality of bubbles, and then causes the defective of follow-up electronic building brick when welding.

Have under the uniform temperature based on scaling powder and can produce reaction, and cause the residual problem that air is arranged in the scolding tin, when being easy to follow-up electronic building brick welding, form the phenomenon of empty weldering.Therefore, in the manufacturing of circuit board, must exist the circuit board of weld defect to carry out the operation of heavy industry to these, so that obtain good circuit board finished product.This heavy industry step not only makes operating personnel's load increase, and also causes the rising of board production cost simultaneously.

The utility model content

Based on the problem of above existence, the utility model proposes a kind of board structure of circuit, in order to solving circuit board in reflow process, because of scaling powder can be in scolding tin residual bubble, and then cause the problem of electronic building brick weld defect.

The utility model proposes a kind of board structure of circuit, in order to welding an electronic building brick, and electronic building brick electrically conducts with board structure of circuit by a scolding tin.Board structure of circuit includes a plate body, a weld pad reaches single order sill at least.Wherein, a side of plate body has provided a plurality of conductive through holes.Weld pad is arranged on this side.The rank sill are convexly set on the weld pad, and between two adjacent conductive through holes.Scolding tin is coated on the position that weld pad is not provided with the rank sill, and electronic building brick is arranged on the scolding tin, and has a difference in height between electronic building brick and the rank sill.

The board structure of circuit that the utility model proposes, the material of its scala media sill can be anti-welding material.Circuit board also can have a plurality of rank sill, and wherein the second order sill can interconnect at least, or has a spacing between each rank sill, or has an angle between the adjacent second order sill.

Effect of the present utility model is, because this kind board structure of circuit, after reflow process applies scolding tin, scolding tin not invest on the sill of rank, in this, be welded between electronic building brick on the circuit board and the rank sill and have a difference in height, can make the air that in reflow process, in scolding tin, forms in the scaling powder effectively, be discharged from circuit board by this difference in height, and then solve because of forming the problem that bubble may cause follow-up empty weldering in the scolding tin.

Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to qualification of the present utility model.

Description of drawings

Figure 1A is the board structure of circuit according to the utility model one embodiment;

Figure 1B is the end view of board structure of circuit behind the welding electronic building brick according to the utility model one embodiment;

Fig. 2 A is the board structure of circuit according to another embodiment of the present utility model;

Fig. 2 B is the board structure of circuit according to another embodiment of the present utility model;

Fig. 2 C is the board structure of circuit according to another embodiment of the present utility model;

Fig. 2 D is the board structure of circuit according to another embodiment of the present utility model;

Fig. 3 A is the board structure of circuit according to another embodiment of the present utility model;

Fig. 3 B is the board structure of circuit according to another embodiment of the present utility model;

Fig. 3 C is the board structure of circuit according to another embodiment of the present utility model; And

Fig. 3 D is the board structure of circuit according to another embodiment of the present utility model.

Wherein, Reference numeral

10 plate bodys

12 sides

14 conductive through holes

16 electronic building bricks

18 pins

20 weld pads

22 metallic contacts

30 rank sill

32 scolding tin

100 circuit boards

The H1 difference in height

Embodiment

Below in conjunction with accompanying drawing structural principle of the present utility model and operation principle are done concrete description:

See also Figure 1A and Figure 1B, be board structure of circuit according to the utility model one embodiment.Circuit board 100 comprises that a plate body 10, one weld pads 20 reach single order sill 30 at least.Wherein, weld pad 20 is arranged on the side 12 of plate body 10, and plate body 10 12 has provided a plurality of conductive through holes (via hole) 14 in the side.The pin 18 of electronic building brick 16 can be connected in metallic contact 22, to reach electrically conducting of electronic building brick 16 and circuit board 100.Rank sill 30 are convexly set on the weld pad 20, and rank sill 30 are between two adjacent conductive through holes 14.

When circuit board 100 carried out the reflow operation, circuit board 100 can be by the liquid tin of molten condition under the driving of motor-mount pump, and is coated on the weld pad 20 with a scolding tin 32, and enters the conductive through hole 14 of circuit board 100, forms solder joint.

In this, shown in Figure 1B, because scolding tin 32 and being not attached on the rank sill 30, therefore, when electronic building brick 16 was welded in circuit board 100, electronic building brick 16 was because of constituting a height difference H 1 between the relation that contacts with scolding tin 32 and the rank sill 30.Therefore, in reflow process, the bubble that scolding tin inside forms because of flux reaction can be discharged by height difference H 1.In this, formed height fall similar similarly is the gutter between rank sill 30 and the electronic building brick 16, and bubble can utilize this height difference H 1 to be guided out outside the scolding tin with the orientation of rank sill 30, and then loss is fallen on circuit board 100.

According to an embodiment of the present utility model, the material of the rank sill 30 on the circuit board 100 can be an anti-welding material, and when preventing that circuit board 100 from carrying out the reflow operation, scolding tin is attached to the situation on the rank sill 30.Wherein anti-welding material is the most typical and what be widely used most is to be anti-welding green lacquer (solder mask).In this, rank sill 30 can with part beyond the conductive through hole on the circuit board 100 14, form in the mode of green lacquer once or in the gradation.In addition; the material of rank sill 30 is not limited to anti-welding green lacquer (solder mask); can also other material form; so long as can form a barrier layer; in order to the material that prevents that scolding tin from adhering to; and provide according to this between rank sill 30 and the electronic building brick 16 to be formed with difference in height person, also belong to protection range of the present utility model.

For example, the structure of circuit board 100 can be shown in Fig. 2 A to Fig. 3 D, and the quantity that is provided with of its conductive through hole 14 does not limit, and those skilled in the art can correspondence be offered conductive through hole 14 according to the actual design demand.

Shown in Fig. 2 B to Fig. 2 D, the circuit board 100 of present embodiment comprises a weld pad 20 and three conductive through holes 14, and weld pad 20 is to be positioned on the side of circuit board 100, and conductive through hole 14 is the sides that provide in circuit board 100.Circuit board 100 respectively has single order sill 30 between two adjacent conductive through holes 14, and at least one end of rank sill 30 is connected in the edge of weld pad 20.Shown in Fig. 2 B, each rank sill 30 can not link to each other mutually and possess a spacing.According to embodiment of the present utility model, circuit board 100 also can be shown in Fig. 2 C and Fig. 2 D, and wherein second order sill 30 can interconnect at least.

The structure of circuit board 100 can also be shown in Fig. 3 A to Fig. 3 D, and circuit board 100 comprises a weld pad 20 and four conductive through holes 14, and wherein weld pad 20 is to be positioned on the side of circuit board 100, and conductive through hole 14 is the sides that provide in circuit board 100.Circuit board 100 comprise single order sill 30 at least, and at least one end of rank sill 30 is connected in the edge of weld pad 20 between its two adjacent conductive through hole 14.The circuit board structure can comprise single order sill 30 as shown in Figure 3A, also can comprise two to four rank sill 30 shown in Fig. 3 B, Fig. 3 C, Fig. 3 D.Wherein, shown in Fig. 2 A, Fig. 2 B and Fig. 3 D, rank sill 30 can be convexly set on the weld pad 20 with a radial arrangement, more particularly, have an angle between the adjacent second order sill 30 on the circuit board 100.

According to embodiment of the present utility model; the needs that the number of rank sill can be looked in the technology are selected to set up; the utility model does not exceed with the number or the spread geometry of rank sill; visual actual demand changes; only the rank sill can be convexly set on the weld pad; can form difference in height to cause between subsequent stages sill and the electronic building brick,, be all protection range of the present utility model so as to guiding out the bubble person in the scolding tin in the reflow operation.

Except the structure that is convexly equipped with the rank sill, also can select on weld pad, to dig during the design circuit plate to set out a concave surface, in this, equally also can form a difference in height on the weld pad, to guide out the bubble in the scolding tin in the reflow process.

For this reason,, can effectively utilize rank sill 30 structures that are convexly equipped with, cause between rank sill 30 and the electronic building brick 16 and can form a difference in height according to the board structure of circuit of embodiment of the present utility model.So the scaling powder in the reflow process because of reaching reaction temperature formed bubble in scolding tin 32, can utilize this difference in height, and be guided out outside the scolding tin 32, and then loss on circuit board 100.

Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.

Claims

1. board structure of circuit, in order to welding an electronic building brick, and this electronic building brick electrically conducts with this board structure of circuit by a scolding tin, it is characterized in that this board structure of circuit comprises:

One plate body, a side of this plate body has provided a plurality of conductive through holes;

One weld pad is arranged on this side of this plate body; And

At least single order sill, be convexly set on this weld pad, these rank sill are between two adjacent conductive through holes of those conductive through holes, and this scolding tin system is coated on the position that this weld pad is not provided with these rank sill, this electronic building brick system is arranged on this scolding tin, and has a difference in height between this electronic building brick and this rank sill.

2. board structure of circuit according to claim 1 is characterized in that, these rank sill are anti-welding material pieces.

3. board structure of circuit according to claim 1 is characterized in that, this circuit board has a plurality of these rank sill, and at least two these rank sill are for interconnecting.

4. board structure of circuit according to claim 1 is characterized in that, this circuit board has a plurality of these rank sill, and respectively has a spacing between these rank sill.

5. board structure of circuit according to claim 1 is characterized in that, this circuit board has a plurality of these rank sill, and has an angle between two adjacent these rank sill.