CN201315702Y - Pad structure and printing circuit board - Google Patents
Pad structure and printing circuit board Download PDFInfo
- Publication number
- CN201315702Y CN201315702Y CNU2008201796846U CN200820179684U CN201315702Y CN 201315702 Y CN201315702 Y CN 201315702Y CN U2008201796846 U CNU2008201796846 U CN U2008201796846U CN 200820179684 U CN200820179684 U CN 200820179684U CN 201315702 Y CN201315702 Y CN 201315702Y
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- pad
- circuit board
- base material
- pad structure
- lead
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Abstract
The embodiment of the utility model discloses a pad structure and a printing circuit board, which belong to the technical field of electron, and solve the technical problems of unsure reliability and easy invalidation of an electronic product provided with a printing circuit board when in use caused by that a bonding pad in the pad structure on the existing printing circuit board is easy to fall off from the substrate. The pad structure comprises a bonding pad arranged on the surface of the substrate and at least one lead connected with the welding pad; the lead is a non-conducted outlet. The printing circuit board comprises at least one layer of substrate; and at least one pad structure disclosed by the embodiment of the utility model is arranged on the substrate. The utility model is applied to enhance the reliability of the pad structure on the printing circuit board.
Description
Technical field
The utility model belongs to electronic technology field, relates to the printed circuit board (PCB) manufacturing technology, the printed circuit board (PCB) that is specifically related to a kind of pad structure and is provided with this pad structure.
Background technology
Along with the develop rapidly of electronic technology, (Print Circuit Board, application PCB) more and more widely for printed circuit board.
As depicted in figs. 1 and 2, existing printed circuit board comprises one deck base material 3 at least, and base material 3 is provided with a plurality of pad structures, and this pad structure comprises the pad 1 of being located at base material 3 surfaces, links to each other with pad 1 and be located at the lead 20 on the base material 3.Pad 1 is used for being electrically connected with electronic devices such as electric capacity, resistance, and lead 20 is used for conduction current.Link to each other with pad 1 and all adopt the made lead of etch process 20 to be called outlet, of the outlet of above-mentioned lead 20 for being used to switch on pad 1.The pad 1 that links to each other with the outlet of conduction current has participated in that circuit is connected on the printed circuit board, so be called practical pad 10.Base material 3 surfaces also are provided with some usually and do not link to each other with lead 20, do not participate in the pad 1 that circuit connects on the printed circuit board, and this pad 1 is called sky pad 11.Empty pad 11 is used for fixing electronic devices such as electric capacity, resistance, strengthens the adhesion of electronic device and printed circuit board (PCB), makes the electronic device symmetric arrays on printed circuit board (PCB).
Set circuit structure more complicated on the printed circuit board, so that pad structure usually is provided with is many, and arranges with the array way of rule as shown in Figure 1, so be called ball grid array (Ball Grid Array, BGA).
The inventor finds that in realizing process of the present utility model though existing pad structure can be used in the adhesion of electronic device being installed or strengthening printed circuit board (PCB) electronic device and base material to a certain extent, there are the following problems at least:
For practical pad 10 as shown in Figure 1, though it links to each other with outlet, outlet has strengthened the adhesion of practical pad 10 and base material 3 to a certain extent, but because outlet is set is the needs that connect for circuit, so a common pad 1 only is connected with one or two outlets, adhesion is still smaller between practical pad 10 and the base material 3, reliability can not get guaranteeing in pad 1 use, especially in the printed circuit board maintenance process, the phenomenon that pad 1 is heated and comes off often appears, cause and reprocess difficulty, even cause printed circuit board to be scrapped;
For the empty pad 11 that does not connect outlet, the adhesion of itself and base material 3 is poorer, so that the phenomenon that pad 1 comes off appears in empty pad 11 is even more serious;
Because existing pad structure is insecure, the electronic product that causes being provided with printed circuit board (PCB) in use reliability also can not get guaranteeing, losing efficacy easily.
The utility model content
The utility model embodiment provides a kind of pad structure, solved that pad comes off from base material easily in the pad structure on the existing printed circuit board (PCB), so the electronic product that causes being provided with printed circuit board (PCB) in use reliability can not get the technical problem that guarantees, lost efficacy easily.
For achieving the above object, embodiment of the present utility model adopts following technical scheme:
This pad structure comprises the pad of being located at substrate surface, at least one lead that links to each other with described pad, and described lead is cold outlet.
The utility model embodiment provides a kind of printed circuit board (PCB), solved that pad comes off from base material easily in the pad structure on the existing printed circuit board (PCB), so the electronic product that causes being provided with printed circuit board (PCB) in use reliability can not get the technical problem that guarantees, lost efficacy easily.
For achieving the above object, embodiment of the present utility model adopts following technical scheme:
This printed circuit board (PCB) comprises one deck base material at least, and described base material is provided with at least one pad structure, and described pad structure comprises the pad of being located at substrate surface, at least one lead that links to each other with described pad, and described lead is cold outlet.
Compared with prior art, because pad is connected with at least one cold outlet among the utility model embodiment, outlet is connected reliable with pad, and outlet is attached to the adhesion that has strengthened on the base material between pad and the base material, in addition, outlet no power in the utility model, and it not is the needs that connect for circuit that outlet is set, the bar number of outlet and position only are subjected to the restriction of pad surrounding space, outlet can be arranged at practical pad also can be arranged at the sky pad, so it is smaller to have solved in the pad structure on the existing printed circuit board (PCB) adhesion between the pad and base material, pad comes off from base material easily, so the electronic product that causes being provided with printed circuit board (PCB) in use reliability can not get guaranteeing, the easy technical problem that lost efficacy.
Description of drawings
Fig. 1 is for being provided with the partial schematic diagram of the printed circuit board (PCB) of pad structure in the prior art;
Fig. 2 is the cross-sectional schematic of pad structure shown in Figure 1;
The partial schematic diagram of the printed circuit board (PCB) that is provided with pad structure that Fig. 3 is provided for the utility model embodiment;
The schematic diagram of a kind of execution mode of pad structure that Fig. 4 is provided for the utility model embodiment;
The schematic diagram of another execution mode of pad structure that Fig. 5 is provided for the utility model embodiment.
Embodiment
Below in conjunction with accompanying drawing the utility model embodiment is described in detail.
The utility model embodiment provides that the adhesion of a kind of pad and base material is bigger, pad is difficult for the pad structure that comes off from base material.
As Fig. 3, Fig. 4 and shown in Figure 5, a kind of pad structure that the utility model embodiment is provided comprises the pad 1 of being located at base material 3 surfaces, at least one lead 2 that links to each other with pad 1, and lead 2 is cold outlet.
Because pad 1 is connected with at least one cold outlet, outlet and pad 1 all adopt etch process made, and it not only is connected reliable with pad 1, and it is attached to the adhesion that has strengthened on the base material 3 between pad 1 and the base material 3.Practical pad 10 also is connected with cold lead 2 among the utility model embodiment except that the lead 20 that is connected with energising, because lead 2 is cold outlet, and it not is the needs that connect for circuit that outlet is set, the bar number of outlet and position only are subjected to the restriction of pad 1 surrounding space, practical pad 10 can be arranged at and also sky pad 11 can be arranged at, so it is smaller to have solved in the pad structure on the existing printed circuit board (PCB) as depicted in figs. 1 and 2 the adhesion between the pad 1 and base material 3, pad 1 comes off from base material 3 easily, so the electronic product that causes being provided with printed circuit board (PCB) in use reliability can not get guaranteeing, the easy technical problem that lost efficacy.
As shown in Figure 4, as the further improvement of the utility model embodiment, offer through hole on pad 1 and the base material 3, the hole wall of through hole is attached with the articulamentum 4 that links to each other with pad 1.The articulamentum 4 that is attached to the hole wall of through hole has further increased the adhesion of pad 1 with base material 3.
Articulamentum 4 is identical with the material of pad 1.The articulamentum 4 that material is identical is connected power with pad 1 and is better than material inequality usually.The material of pad 1 is generally copper, so the material of articulamentum 4 is preferably copper in the present embodiment.
Articulamentum 4 extends through hole away from the part of pad 1, and fits with the surface of base material 3 away from a side of pad 1.The part that articulamentum 4 extends through hole fits with surface away from a side of pad 1, make that the fitting area between articulamentum 4 and the base material 3 is bigger, the bigger adhesion each other of fitting area is also bigger, and then the pad 1 that links to each other with articulamentum 4 is also just big more with the adhesion of base material 3.
Articulamentum 4 forms for electroplating.Electroplating technology is a kind of metal level manufacture craft of comparative maturity, is suitable for adhesion metal layer on base material 3.
Be filled with in 4 area surrounded of articulamentum and support spacer 5.Support the effect that spacer 5 plays support and connection layer 4 and pad 1 on the one hand, avoid articulamentum 4 to peel off from the hole wall of through hole, when having avoided on the other hand on practical pad 10 electronic device being set, solder(ing) paste is fallen into through hole.
Supporting spacer 5 makes for resin material.Resin material has plasticity preferably, and has certain degree of hardness, can play supporting role preferably, and simultaneously, resin material also is reliable insulating material, is suitable for the isolate conductive device.
The utility model embodiment also provides a kind of printed circuit board (PCB), and the adhesion of pad and base material is bigger in the pad structure on this printed circuit board (PCB), pad is difficult comes off from base material.
As Fig. 3, Fig. 4 and shown in Figure 5, a kind of printed circuit board (PCB) that the utility model embodiment is provided, comprise one deck base material 3 at least, base material 3 is provided with at least one pad structure, pad structure comprises the pad 1 of being located at base material 3 surfaces, at least one lead 2 that links to each other with pad 1, and lead 2 is cold outlet.
As shown in Figure 5, printed circuit board (PCB) in the present embodiment comprises the three stacked base materials that lump together 3, and base material 3 is provided with the pad structure that a plurality of evenly distributed above-mentioned the utility model embodiment are provided.Through hole passes pad 1 and the three stacked base materials that lump together 3.Certainly, printed circuit board (PCB) also can comprise two-layer or multi-layer substrate 3 in the present embodiment
With above-mentioned the utility model embodiment in like manner, pad 1, pad bigger with the adhesion of base material 31 is difficult in the printed circuit board (PCB) that the utility model embodiment is provided comes off from base material 3, it is smaller to have solved in the pad structure as depicted in figs. 1 and 2 on the existing printed circuit board (PCB) adhesion between the pad 1 and base material 3, pad 1 comes off from base material 3 easily, so the electronic product that causes being provided with printed circuit board (PCB) in use reliability can not get the technical problem that guarantees, lost efficacy easily.
The above; it only is embodiment of the present utility model; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; can expect easily changing or replacing, all should be encompassed within the protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range of claim.
Claims (10)
1, a kind of pad structure is characterized in that: comprise the pad of being located at substrate surface, at least one lead that links to each other with described pad, described lead is cold outlet.
2, pad structure according to claim 1 is characterized in that: described lead is uniformly distributed in described pad periphery.
3, pad structure according to claim 1 is characterized in that: offer through hole on described pad and the described base material, the hole wall of described through hole is attached with the articulamentum that links to each other with described pad.
4, pad structure according to claim 3 is characterized in that: described articulamentum is identical with the material of described pad.
5, pad structure according to claim 3 is characterized in that: described articulamentum extends described through hole away from the part of described pad, and fits with the surface of described base material away from a side of described pad.
6, pad structure according to claim 3 is characterized in that: described articulamentum forms for electroplating.
7, pad structure according to claim 3 is characterized in that: be filled with the support spacer in the described articulamentum institute area surrounded.
8, pad structure according to claim 7 is characterized in that: described support spacer is that resin material is made.
9, a kind of printed circuit board (PCB), it is characterized in that: comprise one deck base material at least, described base material is provided with at least one pad structure, and described pad structure comprises the pad of being located at substrate surface, at least one lead that links to each other with described pad, and described lead is cold outlet.
10, printed circuit board (PCB) according to claim 9 is characterized in that: offer through hole on described pad and the described base material, the hole wall of described through hole is attached with the articulamentum that links to each other with described pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201796846U CN201315702Y (en) | 2008-12-19 | 2008-12-19 | Pad structure and printing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201796846U CN201315702Y (en) | 2008-12-19 | 2008-12-19 | Pad structure and printing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201315702Y true CN201315702Y (en) | 2009-09-23 |
Family
ID=41127506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201796846U Expired - Lifetime CN201315702Y (en) | 2008-12-19 | 2008-12-19 | Pad structure and printing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201315702Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103402309A (en) * | 2013-07-31 | 2013-11-20 | 无锡市伟丰印刷机械厂 | Printed circuit board elastic bonding pad having vertical supporting structure |
| CN103857181A (en) * | 2012-12-06 | 2014-06-11 | 华为终端有限公司 | PCB and electronic equipment with PCB |
| CN105636348A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN109285822A (en) * | 2017-07-21 | 2019-01-29 | 中芯国际集成电路制造(北京)有限公司 | A kind of pad, semiconductor devices and preparation method thereof, electronic device |
| WO2023070580A1 (en) * | 2021-10-29 | 2023-05-04 | 京东方科技集团股份有限公司 | Printed circuit board, maintenance method therefor, and display apparatus |
-
2008
- 2008-12-19 CN CNU2008201796846U patent/CN201315702Y/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103857181A (en) * | 2012-12-06 | 2014-06-11 | 华为终端有限公司 | PCB and electronic equipment with PCB |
| CN103402309A (en) * | 2013-07-31 | 2013-11-20 | 无锡市伟丰印刷机械厂 | Printed circuit board elastic bonding pad having vertical supporting structure |
| CN103402309B (en) * | 2013-07-31 | 2016-05-04 | 无锡市伟丰印刷机械厂 | A kind of printed circuit board (PCB) elastomeric pad with vertical support structure |
| CN105636348A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN109285822A (en) * | 2017-07-21 | 2019-01-29 | 中芯国际集成电路制造(北京)有限公司 | A kind of pad, semiconductor devices and preparation method thereof, electronic device |
| CN109285822B (en) * | 2017-07-21 | 2021-02-26 | 中芯国际集成电路制造(北京)有限公司 | Bonding pad, semiconductor device, manufacturing method of semiconductor device and electronic device |
| WO2023070580A1 (en) * | 2021-10-29 | 2023-05-04 | 京东方科技集团股份有限公司 | Printed circuit board, maintenance method therefor, and display apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: HUAWEI DEVICE CO., LTD. Free format text: FORMER NAME: SHENZHEN HUAWEI TECHNOLOGY CO. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: Huawei Device Co.,Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20180207 Address after: California, USA Patentee after: Global innovation polymerization LLC Address before: California, USA Patentee before: Tanous Co. Effective date of registration: 20180207 Address after: California, USA Patentee after: Tanous Co. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: HUAWEI DEVICE Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090923 |
|
| CX01 | Expiry of patent term |