CN103402309B - A kind of printed circuit board (PCB) elastomeric pad with vertical support structure - Google Patents
A kind of printed circuit board (PCB) elastomeric pad with vertical support structure Download PDFInfo
- Publication number
- CN103402309B CN103402309B CN201310327822.6A CN201310327822A CN103402309B CN 103402309 B CN103402309 B CN 103402309B CN 201310327822 A CN201310327822 A CN 201310327822A CN 103402309 B CN103402309 B CN 103402309B
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- Prior art keywords
- pad
- insulating barrier
- vertical support
- printed circuit
- circuit board
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- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present invention discloses a kind of printed circuit board (PCB) elastomeric pad with vertical support structure, comprise insulating barrier, base, described insulating barrier is arranged on base top, be positioned at insulating barrier center position top pad is set, the insulating barrier that is positioned at pad below arranges through hole and is positioned at the inner both sides of this through hole a triangle reinforcement is set respectively, each triangle reinforcement inboard arranges conductive layer, the bottom that is positioned at the sealing chamber that conductive layer surrounds arranges firm banking, between this firm banking top and pad, the three vertical support plates in road is set. Beneficial effect of the present invention is: can make pad processing comparatively reliable, avoid occurring because of pad out-of-flatness, the rosin joint that subsides and bring, thereby improve the electric connection reliability of described printed circuit board (PCB); By setting up triangle reinforcement, reinforce pad structure; Can give for a long time the support force of top pad from below.
Description
Technical field
The present invention relates to printing technology, relate in particular to a kind of printed circuit board (PCB) elastomeric pad with vertical support structure.
Background technology
Printed circuit board develops into dual platen, multi-layer sheet and flex plate from individual layer, and constantly to high accuracy, high density and high reliability future development, constantly reduced volume, minimizing cost, raising performance. Printed circuit board manufacturing technology development trend is to high density, high accuracy, fine pore, thin wire, little spacing, highly reliable, multiple stratification, high-speed transfer, light weight, slim future development in performance. The wire of single sided board wherein only appears at wherein one side, and dual platen is the extension of single sided board, can carry out the circuit of conducting between two-layer by via hole, makes it to form needed network and connects. At present, in common multilayer board, conventionally be followed successively by from top to bottom pad, line layer and insulating barrier, wherein pad is positioned at the upper surface of line layer, and insulating barrier is formed with through hole, sometimes, the position of pad can be corresponding to the position of through hole, partly or entirely drops in through hole, can make in this case pad processing unreliable, easily occur, because of pad out-of-flatness, the rosin joint that subsides and bring, causing the electric connection reliability of printed circuit board (PCB) bad; The supporting construction that it is important to point out that pad below causes glue, China ink, dust etc. to enter in it because sealing is not enough sometimes, and is not easy to cleaning. Therefore,, for above aspect, need to make rational improvement.
Summary of the invention
The object of this invention is to provide a kind of processing comparatively reliable, be conducive to weld smooth, can to improve printed circuit board (PCB) electric connection reliability, be conducive to improve the printed circuit board (PCB) elastomeric pad with vertical support structure of wiring board printing efficiency, to solve many deficiencies of prior art.
Object of the present invention is carried out specific implementation by the following technical programs:
A kind of printed circuit board (PCB) elastomeric pad with vertical support structure, comprise insulating barrier, base, described insulating barrier is arranged on base top, be positioned at insulating barrier center position top pad is set, the insulating barrier that is positioned at pad below arranges through hole and is positioned at the inner both sides of this through hole a triangle reinforcement is set respectively, each triangle reinforcement inboard arranges conductive layer, the bottom that is positioned at the sealing chamber that conductive layer surrounds arranges firm banking, between this firm banking top and pad, the three vertical support plates in road is set.
Between every two adjacent vertical support plates, a fixture block is set, sets up a circle sealing ring at pressing plate outer edge and between pad and conductive layer.
The beneficial effect of the printed circuit board (PCB) elastomeric pad with vertical support structure of the present invention is:
(1) can make pad processing comparatively reliable, avoid occurring because of pad out-of-flatness, the rosin joint that subsides and bring, thereby improve the electric connection reliability of described printed circuit board (PCB);
(2) by setting up triangle reinforcement, reinforced pad structure;
(3) by vertical support plate and sealing ring are set, can give for a long time the support force of top pad from below, thisly below pad, set up firm supporting construction, also can prevent that China ink, glue, dust etc. from entering simultaneously.
Brief description of the drawings
According to drawings and embodiments the present invention is described in further detail below.
Fig. 1 is the structure chart described in the embodiment of the present invention with the printed circuit board (PCB) elastomeric pad of vertical support structure.
In figure: 1, insulating barrier; 2, base; 3, pad; 4, triangle reinforcement; 5, conductive layer; 6, firm banking; 7, vertical support plate; 8, sealing ring; 9, fixture block.
Detailed description of the invention
As shown in Figure 1, described in the embodiment of the present invention, there is the printed circuit board (PCB) elastomeric pad of vertical support structure, comprise insulating barrier 1, base 2, described insulating barrier 1 is arranged on base 2 tops, be positioned at insulating barrier 1 center position top pad 3 is set, the insulating barrier 1 that is positioned at pad 3 belows arranges through hole and is positioned at the inner both sides of this through hole a triangle reinforcement 4 is set respectively, and each triangle reinforcement 4 inboard arranges conductive layer 5;
The bottom that is positioned at the sealing chamber that conductive layer 5 surrounds arranges firm banking 6, between these firm banking 6 tops and pad 3, arrange between the three vertical support plates 7 in road and every two adjacent vertical support plates 7 fixture block 9 is set, set up a circle sealing ring 8 at pressing plate 7 outer edges and between pad 3 and conductive layer 5.
Claims (1)
1. a printed circuit board (PCB) elastomeric pad with vertical support structure, comprises insulating barrier, base, and described insulating barrier is arranged on base top, it is characterized in that:
Be positioned at insulating barrier center position top pad is set, the insulating barrier that is positioned at pad below arranges through hole and is positioned at the inner both sides of this through hole a triangle reinforcement is set respectively, each triangle reinforcement inboard arranges conductive layer, the bottom that is positioned at the sealing chamber that conductive layer surrounds arranges firm banking, above this firm banking with between pad, the three vertical support plates in road are set, between every two adjacent vertical support plates, a fixture block is set, sets up a circle sealing ring at pressing plate outer edge and between pad and conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310327822.6A CN103402309B (en) | 2013-07-31 | 2013-07-31 | A kind of printed circuit board (PCB) elastomeric pad with vertical support structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310327822.6A CN103402309B (en) | 2013-07-31 | 2013-07-31 | A kind of printed circuit board (PCB) elastomeric pad with vertical support structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103402309A CN103402309A (en) | 2013-11-20 |
| CN103402309B true CN103402309B (en) | 2016-05-04 |
Family
ID=49565794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310327822.6A Expired - Fee Related CN103402309B (en) | 2013-07-31 | 2013-07-31 | A kind of printed circuit board (PCB) elastomeric pad with vertical support structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103402309B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364123B (en) * | 2022-03-15 | 2022-06-07 | 潍坊学院 | Printing pad supporting framework |
| CN115604914B (en) * | 2022-11-25 | 2023-03-21 | 山东科技职业学院 | Printed circuit board pad structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0368262A2 (en) * | 1988-11-09 | 1990-05-16 | Nitto Denko Corporation | Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device |
| CN201315702Y (en) * | 2008-12-19 | 2009-09-23 | 深圳华为通信技术有限公司 | Pad structure and printing circuit board |
| CN102933031A (en) * | 2012-11-14 | 2013-02-13 | 东莞市五株电子科技有限公司 | Printed circuit board and fabrication process of printed circuit board |
| CN203352948U (en) * | 2013-07-31 | 2013-12-18 | 无锡市伟丰印刷机械厂 | Printed circuit board flexible pad with vertical supporting structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5581519B2 (en) * | 2009-12-04 | 2014-09-03 | 新光電気工業株式会社 | Semiconductor package and manufacturing method thereof |
-
2013
- 2013-07-31 CN CN201310327822.6A patent/CN103402309B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0368262A2 (en) * | 1988-11-09 | 1990-05-16 | Nitto Denko Corporation | Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device |
| CN201315702Y (en) * | 2008-12-19 | 2009-09-23 | 深圳华为通信技术有限公司 | Pad structure and printing circuit board |
| CN102933031A (en) * | 2012-11-14 | 2013-02-13 | 东莞市五株电子科技有限公司 | Printed circuit board and fabrication process of printed circuit board |
| CN203352948U (en) * | 2013-07-31 | 2013-12-18 | 无锡市伟丰印刷机械厂 | Printed circuit board flexible pad with vertical supporting structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103402309A (en) | 2013-11-20 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Chen Mingbin Inventor before: Wu Weiping |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170621 Address after: Baiyun District of Guangzhou City, Guangdong province 510550 Zhongluotan Guangcong Road No. 28 seven 7 3 floor Patentee after: Guangzhou Guowei Electronics Co., Ltd. Address before: New area, the new Industrial Park Road 214000 Jiangsu city of Wuxi province No. 22 Patentee before: Wuxi Jiangsu Weifeng Printing Machine Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160504 Termination date: 20170731 |