CN103889167A - Method for forming via holes and embedded holes in multilayer circuit board - Google Patents
Method for forming via holes and embedded holes in multilayer circuit board Download PDFInfo
- Publication number
- CN103889167A CN103889167A CN201410070638.2A CN201410070638A CN103889167A CN 103889167 A CN103889167 A CN 103889167A CN 201410070638 A CN201410070638 A CN 201410070638A CN 103889167 A CN103889167 A CN 103889167A
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- circuit board
- via hole
- copper post
- hollow copper
- wiring board
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a copper cylinder used in the manufacturing process of a circuit board. The copper cylinder is a hollow copper cylinder. Through holes are vertically formed in the side wall of the hollow copper cylinder. Based on the hollow copper cylinder, environment-friendly forming of via holes and embedded holes in a multilayer circuit board can be achieved. According to the forming method of the embedded holes, the hollow copper cylinder is arranged in the circuit board, one end or two ends of the hollow copper cylinder are welded to the circuit board, and accordingly circuits on the two sides of the circuit board can be communicated. Single-layer circuit boards and double-layer circuit boards are laminated to form the multilayer circuit board, and the through holes in the inner-layer circuit board form the embedded holes. When the embedded holes need to be connected with one certain layer of circuit board, the hollow copper cylinder is used, the hollow copper cylinder is inserted into the corresponding positions of the embedded holes from the circuit board at the uppermost layer, tin soldering is performed, and soldering tin is led in through the through holes of the hollow copper cylinder so that soldering tin and the embedded holes of the inner-layer circuit board can be welded. A brand new method for forming via holes and embedded holes in the circuit board is provided, it is hopeful that the etching technology of the circuit board can be overall improved, an electroless plating copper electroplating technology is eliminated, and energy saving and environmental protection are achieved.
Description
Technical field
The present invention relates to wiring board technical field, be specifically related to the manufacture method of a kind of multilayer circuit board via hole and buried via hole.
Background technology
The pollution existing in the manufacture craft of existing multilayer circuit board is on record, and pollution problem is a general character difficult problem for whole industry.Each wiring board producer all will spend the control of a large amount of manpower and financial resources for polluting, and Optimization Technology pollutes to reduce as much as possible.But these process optimizations are all the solutions of curing the symptoms, not the disease.Therefore must fundamentally change its processing technology.Occurred at present adopting laser engraving circuit technique thereof, although cost is higher, circuit making precision is high, and production board quality is good, and pollution-free.But for double sided board or multilayer circuit board, the making of via hole or buried via hole etc. still cannot realize, and has limited the application of laser engraving circuit technique thereof at circuit board industry.
Summary of the invention
For the problems referred to above, the invention provides a kind of copper post and utilize this copper post to realize the making of multilayer circuit board via hole and buried via hole.
First the present invention provides a kind of wiring board processing procedure copper post, and described copper post is hollow copper post, on the sidewall of the vertical direction of hollow copper post, is evenly provided with through hole taking wiring board thickness as interval.
Preferably, described through hole is uniformly distributed on hollow copper post circumferencial direction.
Preferred, described through hole point three rows on hollow copper post circumferencial direction be equally spaced.
Preferably, described hollow copper post is T-shaped.
Based on above-mentioned hollow copper post, the present invention also provides the manufacture method of a kind of multilayer circuit board via hole and buried via hole, comprises the processing that is connected of the making of via hole and buried via hole and via hole and buried via hole.The making of described buried via hole comprises: by design document, wiring board is punched, carry out circuit making; In circuit plate hole, install the hollow copper post of correspondingly-sized, by designing requirement, hollow copper post one or both ends are welded on wiring board, realize the connection of wiring board both sides circuit; The individual layer of making and double-layered circuit board lamination form multilayer circuit board, and the through hole on internal layer circuit plate forms buried via hole.The connection processing of described buried via hole comprises: when buried via hole need to be when certain sandwich circuit board be connected, adopt above-mentioned hollow copper post, insert the correspondence position of buried via hole from the superiors' wiring board, multilayer circuit board one or both sides after lamination carried out tin welding, and scolding tin imports the welding of the buried via hole of realization and internal layer circuit plate by the through hole of hollow copper post.
Preferably, the welding described in when described buried via hole is made adopts laser welding, and at pad to be welded place, solder(ing) paste is set in advance.
The invention provides the mode that a kind of brand-new wiring board via hole and buried via hole are made, be expected to make circuit board etching technique overall improvement, cancel heavy copper electroplating technology, energy-conserving and environment-protective.
Brief description of the drawings
Fig. 1 is described hollow copper rod structure schematic diagram;
Fig. 2 is that described wiring board buried via hole is made schematic flow sheet;
Fig. 3 is that described wiring board buried via hole is made schematic flow sheet.
Embodiment
Below in conjunction with drawings and the specific embodiments, the present invention is described in further detail.
As shown in Figure 1, the processing procedure of wiring board described in the present invention is T hollow copper post 10 with copper post, on the sidewall of the vertical direction of hollow copper post, is evenly provided with through hole in a row 11 taking wiring board thickness as interval.Through hole 11 is uniformly distributed on hollow copper post circumferencial direction, is preferably on hollow copper post circumferencial direction point three rows and is equally spaced, and on circumferencial direction, interval 120 degree arrange a through hole, so enough support welding, and through hole is unlikely to too little and tin only.The shape of through hole 11 can be that circle can be also square etc., for the ease of crossing tin, preferably oval.
As Fig. 2, generally wiring board comprises base material 1 and covers the Copper Foil 2 on base material, and double-layered circuit board is that base material two sides all covers copper foil layer 2.While making wiring board, first by design document, copper-clad plate is punched, carry out circuit making, then via hole is processed to the conducting that realizes levels circuit.Processing procedure is coated with Laser Welding tin cream 12 on the via hole both sides pad connecting at need, wears hollow copper post 10 in via hole, then adopts the mode of laser welding by copper post and wiring board welding.Copper post is set to T-shaped, is beneficial to the welding of one end, and the other end wears out after via hole, can punching press flange, then carry out welding fabrication.
After above-mentioned single or multiple lift wiring board is made, the pressing of multilayer circuit board lamination is formed to multilayer circuit board, the via hole of internal layer circuit plate becomes buried via hole.Shown in Fig. 2, Fig. 3, when buried via hole 3 need to be when certain sandwich circuit board be connected, adopt above-mentioned hollow copper post, the diameter of this copper post is less than the diameter of the hollow copper post in buried via hole, insert the correspondence position of buried via hole from the superiors' wiring board, multilayer circuit board one or both sides after lamination carried out tin welding, and scolding tin imports the welding of the buried via hole of realization and internal layer circuit plate by the through hole of hollow copper post.
Above-described embodiment is only wherein a kind of implementation of the present invention, and it describes comparatively concrete and detailed, can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (6)
1. a wiring board processing procedure copper post, is characterized in that, described copper post is hollow copper post, on the sidewall of the vertical direction of hollow copper post, is evenly provided with through hole taking wiring board thickness as interval.
2. wiring board processing procedure copper post according to claim 1, is characterized in that, described through hole is uniformly distributed on hollow copper post circumferencial direction.
3. wiring board processing procedure copper post according to claim 2, is characterized in that, described through hole point three rows on hollow copper post circumferencial direction be equally spaced.
4. wiring board processing procedure copper post according to claim 1, is characterized in that, described hollow copper post is T-shaped.
5. a manufacture method for multilayer circuit board via hole and buried via hole, comprises the processing that is connected of the making of via hole and buried via hole and via hole and buried via hole; It is characterized in that,
The making of described buried via hole comprises: by design document, wiring board is punched, carry out circuit making;
In circuit plate hole, install the hollow copper post of correspondingly-sized, by designing requirement, hollow copper post one or both ends are welded on wiring board, realize the connection of wiring board both sides circuit;
The individual layer of making and double-layered circuit board lamination form multilayer circuit board, and the through hole on internal layer circuit plate forms buried via hole;
The connection processing of described buried via hole comprises: when buried via hole need to be when certain sandwich circuit board be connected, adopt the hollow copper post described in claim 1-3, insert the correspondence position of buried via hole from the superiors' wiring board, multilayer circuit board one or both sides after lamination carried out tin welding, and scolding tin imports the welding of the buried via hole of realization and internal layer circuit plate by the through hole of hollow copper post.
6. the manufacture method of multilayer circuit board via hole according to claim 4 and buried via hole, is characterized in that: described in when buried via hole is made, welding adopts laser welding, and at pad to be welded place, solder(ing) paste is set in advance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410070638.2A CN103889167A (en) | 2014-02-28 | 2014-02-28 | Method for forming via holes and embedded holes in multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410070638.2A CN103889167A (en) | 2014-02-28 | 2014-02-28 | Method for forming via holes and embedded holes in multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103889167A true CN103889167A (en) | 2014-06-25 |
Family
ID=50957825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410070638.2A Withdrawn CN103889167A (en) | 2014-02-28 | 2014-02-28 | Method for forming via holes and embedded holes in multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103889167A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188280A (en) * | 2015-07-31 | 2015-12-23 | 惠州绿草电子科技有限公司 | Mechanical through hole forming method of printed circuit board and printed circuit board with mechanical through holes |
| CN106604569A (en) * | 2017-02-14 | 2017-04-26 | 杨小荣 | Preparation technology of environmental protection circuit board |
| CN113301716A (en) * | 2021-06-01 | 2021-08-24 | 深圳市利迪亚电子有限公司 | Multilayer PCB with special-shaped holes and processing method |
| CN114364130A (en) * | 2021-12-22 | 2022-04-15 | 鹤山市中富兴业电路有限公司 | Manufacturing method of copper-embedded column PCB |
| CN117715291A (en) * | 2023-12-20 | 2024-03-15 | 皆利士多层线路版(中山)有限公司 | Circuit board and electronic equipment |
-
2014
- 2014-02-28 CN CN201410070638.2A patent/CN103889167A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188280A (en) * | 2015-07-31 | 2015-12-23 | 惠州绿草电子科技有限公司 | Mechanical through hole forming method of printed circuit board and printed circuit board with mechanical through holes |
| CN106604569A (en) * | 2017-02-14 | 2017-04-26 | 杨小荣 | Preparation technology of environmental protection circuit board |
| CN113301716A (en) * | 2021-06-01 | 2021-08-24 | 深圳市利迪亚电子有限公司 | Multilayer PCB with special-shaped holes and processing method |
| CN113301716B (en) * | 2021-06-01 | 2022-03-29 | 深圳市利迪亚电子有限公司 | Multilayer PCB with special-shaped holes and processing method |
| CN114364130A (en) * | 2021-12-22 | 2022-04-15 | 鹤山市中富兴业电路有限公司 | Manufacturing method of copper-embedded column PCB |
| CN117715291A (en) * | 2023-12-20 | 2024-03-15 | 皆利士多层线路版(中山)有限公司 | Circuit board and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C04 | Withdrawal of patent application after publication (patent law 2001) | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20140625 |