CN203691754U - Combined and jointed board based on various kinds of samples - Google Patents
Combined and jointed board based on various kinds of samples Download PDFInfo
- Publication number
- CN203691754U CN203691754U CN201420064918.8U CN201420064918U CN203691754U CN 203691754 U CN203691754 U CN 203691754U CN 201420064918 U CN201420064918 U CN 201420064918U CN 203691754 U CN203691754 U CN 203691754U
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- China
- Prior art keywords
- splicing
- plate
- combined
- model
- jointed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000039 congener Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 21
- 239000000463 material Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Abstract
The utility model discloses a combined and jointed board based on various kinds of samples. The combined and jointed board comprises at least two splicing units (1) of different kinds of sample plates, wherein the splicing units are spliced on the same combined and jointed board. The splicing units (1) keep an interval. Each splicing unit (1) is formed by at least two splicing subunits (11). Each splicing subunit (11) is formed by at least one sample plate with a same kind. An interval is arranged between the splicing subunits (11). The splicing units (1) are spliced in a line area. A non-conductive area (2) is an area which does not comprise any conductive lines. A surface of the non-conductive area (2) is covered by printing ink. According to the combined and jointed board, the same kind of plates with a same plate material and a same structure are spliced into a large plate and production is performed so as to satisfy a requirement of PCB production equipment and a tool; production cost of a PCB sample plate is reduced; a production rate is increased and a production progress is shortened.
Description
Technical field
The utility model relates to pcb board and makes field, particularly relates to a kind of plate that is merged based on several samples.
Background technology
Printed circuit board is called for short pcb board, adopt and on insulating material, make printed wiring, printed component or both conductive patterns combining by schematic diagram design in advance and be called printed circuit, and on insulating substrate, provide the conductive pattern of the electrical connection between components and parts, be called printed wiring, above-mentioned printed circuit or printed wiring are made into production board and are called printed wiring board, or be called printed board or printed circuit board.It is mainly by circuit and drawing, dielectric layer and can make two-layer above circuit form in the hole of conducting each other, in addition, also can print the isolated copper face of one deck and eat the material of tin for some printed circuit boards, avoid the anti-solder ink of short circuit between the non-circuit of eating tin and some are for identifying title, the position frame of each part, so that the silk-screen that postorder assembling and maintenance identification are used.
Drop in batches and make before processing at pcb board, need carry out sample process to the pcb board of every kind, when just carrying out production, the test and on probation of small lot after the product success of sample, after the standard that all meets businessman's defined until the sample of small lot in process on probation, just produce in batches.Along with the development of electronic technology, the continuous upgrading of electronic product, continually developing, manufacturing experimently of new product, more and more to the demand of PCB model.In order to adapt to the demand of electronic product trial-production, pcb board manufacturer adopts jigsaw mode to carry out model production to PCB model, thereby improves the throughput rate of PCB model.At present, the board joint method that PCB manufacturing factory adopts is: produce on normal production line every a model as an independent item number, as shown in Figure 1, produced rear ability and divided plate by sample.Adopt above-mentioned board joint method model need be combined into large plate, to meet the requirement of pcb board production equipment and instrument, every a model is combined into large plate to meet the requirement of pcb board production equipment and instrument, will increases like this processing cost of PCB model and reduce production efficiency.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, providing a kind of is combined into a large plate by the same class plate identical sheet material, structure is identical and produces, to meet the requirement of pcb board production equipment and instrument, thereby reduce the production cost of PCB model, improve the plate that is merged based on Multi-example of throughput rate, shortening manufacturing schedule.
The purpose of this utility model is achieved through the following technical solutions: based on the plate that is merged of several samples, it comprises that at least two splicings are at the same concatenation unit that is merged the variety classes model on plate, and concatenation unit remains with interval.
Preferably, described concatenation unit is made up of at least two splicing subelements, and splicing subelement is made up of at least one congener model, between splicing subelement, is provided with interval.
Preferably, the described plate that is merged is provided with line areas and non-conductive district, and described concatenation unit splices in line areas, and described non-conductive district is the region that does not comprise any conducting wire.
Preferably, the surface in described non-conductive district is covered with ink.
Compared with traditional jigsaw, the beneficial effects of the utility model are:
1) the same class plate identical sheet material, structure is the same is combined into a large plate and produces, to meet the requirement of pcb board production equipment and instrument, thereby reduced the production cost of PCB model, improved throughput rate, shortened manufacturing schedule;
2) the non-conductive district that is covered with ink is set between concatenation unit, therefore, does not need it to electroplate, thereby lowered gold-plated area, further reduced processing cost.
Accompanying drawing explanation
Fig. 1 is existing PCB jigsaw structural representation;
Fig. 2 is structural representation of the present utility model;
Fig. 3 is concatenation unit structural representation of the present utility model;
In figure, 1-concatenation unit, 11-splices subelement, the non-conductive district of 2-.
Embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail, but protection range of the present utility model is not limited to the following stated.
As shown in Figures 2 and 3, based on the plate that is merged of several samples, it comprises that at least two splicings, at the same concatenation unit 1 that is merged the variety classes model on plate, remain with interval between two adjacent concatenation units 1; Described different types of model refers to the circuit theory difference of the model for splicing, for example, be respectively LED drive circuit and sound control circuit for the model splicing.
Preferably, described concatenation unit 1 is made up of at least two splicing subelements 11, and splicing subelement 11 is made up of at least one congener model, between splicing subelement 11, is provided with interval; The number of plies of the model that described congener model refers to is identical, is all single sided board, double sided board or multi-layer sheet.
Preferably, the described plate that is merged is provided with line areas and non-conductive district 2, and described concatenation unit 1 splices in line areas, and described non-conductive district 2 is not for comprising the region of any conducting wire.
Preferably, the surface in described non-conductive district 2 is covered with ink.
Claims (4)
1. the plate that is merged based on several samples, is characterized in that: it comprises that at least two splicings are at the same concatenation unit (1) that is merged the variety classes model on plate, and concatenation unit (1) remains with interval.
2. the plate that is merged based on several samples according to claim 1, it is characterized in that: described concatenation unit (1) is made up of at least two splicing subelements (11), splicing subelement (11) is made up of at least one congener model, between splicing subelement (11), is provided with interval.
3. the plate that is merged based on several samples according to claim 1, it is characterized in that: the described plate that is merged is provided with line areas and non-conductive district (2), described concatenation unit (1) splices in line areas, and described non-conductive district (2) is not for comprising the region of any conducting wire.
4. the plate that is merged based on several samples according to claim 1, is characterized in that: the surface in described non-conductive district (2) is covered with ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420064918.8U CN203691754U (en) | 2014-02-13 | 2014-02-13 | Combined and jointed board based on various kinds of samples |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420064918.8U CN203691754U (en) | 2014-02-13 | 2014-02-13 | Combined and jointed board based on various kinds of samples |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203691754U true CN203691754U (en) | 2014-07-02 |
Family
ID=51013602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420064918.8U Expired - Lifetime CN203691754U (en) | 2014-02-13 | 2014-02-13 | Combined and jointed board based on various kinds of samples |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203691754U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103747614A (en) * | 2014-02-13 | 2014-04-23 | 遂宁市广天电子有限公司 | Multi-sample-based spliced board and production process for same |
| CN105072813A (en) * | 2015-08-13 | 2015-11-18 | 广州杰赛科技股份有限公司 | Printed board combination production method |
| CN105678408A (en) * | 2015-12-30 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Printed circuit board (PCB) combining and joining method and system |
-
2014
- 2014-02-13 CN CN201420064918.8U patent/CN203691754U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103747614A (en) * | 2014-02-13 | 2014-04-23 | 遂宁市广天电子有限公司 | Multi-sample-based spliced board and production process for same |
| CN103747614B (en) * | 2014-02-13 | 2017-10-24 | 遂宁市广天电子有限公司 | Plate and its production technology are merged based on several samples |
| CN105072813A (en) * | 2015-08-13 | 2015-11-18 | 广州杰赛科技股份有限公司 | Printed board combination production method |
| CN105678408A (en) * | 2015-12-30 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Printed circuit board (PCB) combining and joining method and system |
| WO2017113838A1 (en) * | 2015-12-30 | 2017-07-06 | 广州兴森快捷电路科技有限公司 | Pcb panelization method and system |
| US10614386B2 (en) | 2015-12-30 | 2020-04-07 | Guangzhou Fastprint Circuit Tech Co., Ltd. | PCB board assembling method and assembling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140702 |