CN105682363A - Fabrication method of PCB with metalized plate edges - Google Patents
Fabrication method of PCB with metalized plate edges Download PDFInfo
- Publication number
- CN105682363A CN105682363A CN201610107236.4A CN201610107236A CN105682363A CN 105682363 A CN105682363 A CN 105682363A CN 201610107236 A CN201610107236 A CN 201610107236A CN 105682363 A CN105682363 A CN 105682363A
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- CN
- China
- Prior art keywords
- boards
- edges
- pcb
- hole
- ply wood
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
Abstract
The invention relates to the technical field of circuit board production, in particular to a fabrication method of a PCB with metalized plate edges. The sequence of fabricating plate edge grooves and stamp holes is adjusted; and the stamp holes are drilled after pattern plating, so that the problem that connection positions are easily broken off in the plating procedure after being drilled with the stamp holes can be solved. The edge parts of the plate edge grooves are set into squares, so that, compared with the roundness in the prior art, the area of each connection position is larger; and the possibility that the connection positions are broken off in the plating procedure is further reduced. The hole edge distances between the connection positions and the stamp holes, which are different in sizes, are set according to the plate thickness, so that the possibility that the connection positions are broken off in the plating procedure can also be further reduced.
Description
Technical field
The present invention relates to board production technical field, particularly relate to the making method of the PCB of a kind of edges of boards metallization.
Background technology
PCB (PrintedCircuitBoard), Chinese is printed circuit board, also known as printed-wiring board (PWB), is important electronic unit, is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection. The technological process of production of PCB is generally as follows: sawing sheet → interior layer pattern → internal layer etching → internal layer AOI → brown → pressing → boring → heavy copper → electric plating of whole board → outer graphics → graphic plating → etching → skin AOI → silk print welding resistance, character → surface treatment → shaping → electrical testing → FQC → packaging. Wherein, in order to raise the efficiency, convenient production, can be stitched together during sawing sheet a set of module figure (set) of composition by multiple unit figure (unit), be stitched together a composition production unit (panel) again by many set of modules figure, base material is then cut out according to the size of production unit and is cut, then corresponding to multiple unit plate region for making forming unit plate in the multi-ply wood formed after pressing. For the ease of the later stage, unit plate is separated from whole plate; usually can along the multiple edges of boards groove of the surrounding gong in unit plate region in multi-ply wood; leaving the region of non-gong groove between adjacent two edges of boards grooves so that each unit plate region still can link together forms a complete plate, this region is called connection bit. Usually can bore except burr hole in the end of edges of boards groove to reduce being formed of burr when the later stage is shaping; in order to more easily break connection breaking position when the later stage splits unit plate, row's stamp hole (the groove limit, same side of the Kong Xinyu gong groove of same row's stamp hole is on the same line) can be bored respectively at the two ends of connection bit. When the edges of boards of product requirement unit plate are non-metallic, stamp hole normally bores out in the lump with circuit hole after pressing, edges of boards groove then last shaping time just make. When the edges of boards of product requirement unit plate metallize, when prior art bores circuit hole after pressing, stamp hole and edges of boards groove are together made, through follow-up heavy copper and electric plating of whole board process, edges of boards groove is metallized, be i.e. the edges of boards metallization of unit plate. There is very big defect in the method for this kind of edges of boards metallization, owing to the area of the connection bit between two edges of boards grooves is less, when multi-ply wood is through the gantry such as electric plating of whole board and graphic plating line, when flying bar decline, multi-ply wood contacts with the Building V of equipment, multi-ply wood is big and uneven by power, easily cause the part connection bit on multi-ply wood to fracture, thus cause disconnected plate, produce to scrap.
Summary of the invention
The present invention is directed to the making method of existing edges of boards metallization PCB in electroplating process, disconnected plate easily to occur and produce the problem scrapped, it is provided that the making method of the PCB of a kind of edges of boards metallization avoiding connection bit in electroplating process to be fractureed.
For achieving the above object, the present invention is by the following technical solutions.
A making method of the PCB of edges of boards metallization, comprises the following steps:
S1 holes: bore circuit hole on multilayer boards, and the multiple edges of boards groove of surrounding gong along the unit plate region in multi-ply wood, the region between adjacent two edges of boards grooves is connection bit; Core material and outer copper foil pressing are integrated formation by prepreg by described multi-ply wood.
Preferably, described edges of boards groove is square elongated slot.
The heavy copper of S2 and electric plating of whole board: multi-ply wood carries out heavy copper and electric plating of whole board process, make the circuit hole on multi-ply wood and the metallization of edges of boards groove.
S3 outer-layer circuit figure: by positive blade technolgy by the Graphic transitions on the outer film to, on multi-ply wood, forming outer-layer circuit figure.
S4 graphic plating: according to the outer-layer circuit figure on multi-ply wood successively electro-coppering and eleetrotinplate.
S5 bores stamp hole: bore row's stamp hole respectively at the two ends of connection bit.
Preferably, the end being also included in edges of boards groove is bored except burr hole.
Preferably, when the thickness of PCB finished product is 0.3-0.8mm, the length of described connection bit is 4.5mm, and the hole back gauge of adjacent two stamp holes is 0.35mm; When the thickness of PCB finished product is 0.81-1.3mm, the length of described connection bit is 3.0mm, and the hole back gauge of adjacent two stamp holes is 0.3mm; When the thickness of PCB finished product is greater than 1.3mm, the length of described connection bit is 3.0mm, and the hole back gauge of adjacent two stamp holes is 0.25mm.
S6 skin etching: first take off the film on multi-ply wood, then by alkali etching, the copper beyond outer-layer circuit is removed, then take off tin layers, outer-layer circuit is displayed.
Operation after S7: carry out solder mask making, surface treatment and forming processes successively on multilayer boards according to prior art, obtained PCB finished product.
Compared with prior art, the invention has the beneficial effects as follows: the present invention makes the sequencing of edges of boards groove and stamp hole by adjustment, bores stamp hole again, the problem easily fractureed in the plating process after can avoiding boring stamp hole in connection bit after graphic plating. The end of edges of boards groove is arranged to square, circle compared to existing technology, the area of connection bit can be made relatively large, reduce the possibility that connection bit is fractureed in the plating process further. According to plate thick different size size is set connection bit and stamp hole between hole back gauge, it is possible to reduce the possibility that connection bit is fractureed in the plating process further.
Accompanying drawing explanation
Fig. 1 is the multiple-plate structural representation after boring stamp hole in embodiment and removing burr hole;
Fig. 2 is the enlarged view of A local in Fig. 1.
Embodiment
In order to understand the technology contents of the present invention more fully, below in conjunction with specific embodiment, the technical scheme of the present invention is described further and illustrates.
Embodiment
The present embodiment provides the making method of the PCB that a kind of edges of boards metallize, and the method can reduce the possibility that in electroplating work procedure, connection bit is fractureed.
Concrete making step is as follows:
(1) multi-ply wood
According to prior art, make internal layer circuit (formation central layer) → pressing through sawing sheet → negative film technique successively, base material is made into the multi-ply wood do not holed, the plate being namely formed as one by core material, prepreg and outer copper foil pressing; Obtained multi-ply wood comprises multiple region for making forming unit plate, and this region is called unit plate region.
(2) hole
Borehole data is utilized to bore circuit hole on multilayer boards, and the multiple edges of boards groove of surrounding gong along the unit plate region in multi-ply wood, described edges of boards groove is square elongated slot, and the region between adjacent two edges of boards grooves is connection bit.
And the thick length that connection bit is set of the plate according to PCB finished product, specific as follows: when the thickness of PCB finished product is 0.3-0.8mm, the length of connection bit is 4.5mm; When the thickness of PCB finished product is 0.81-1.3mm, the length of connection bit is 3.0mm; When the thickness of PCB finished product is greater than 1.3mm, the length of connection bit is 3.0mm.
(3) heavy copper and electric plating of whole board
Multi-ply wood is carried out heavy copper and electric plating of whole board process, makes the circuit hole on multi-ply wood and the metallization of edges of boards groove.
(4) outer-layer circuit figure
By positive blade technolgy by the Graphic transitions on the outer film to, on multi-ply wood, forming outer-layer circuit figure.
(5) graphic plating
According to the outer-layer circuit figure on multi-ply wood successively electro-coppering and eleetrotinplate.
(6) bore stamp hole and bore except burr hole
As depicted in figs. 1 and 2, on multi-ply wood 100, row's stamp hole 113 is bored at the two ends of each connection bit 112 respectively, bores except burr hole 114 in the end of edges of boards groove 111 simultaneously. Fig. 1 and Fig. 2 comprise multi-ply wood 100, unit plate region 110, edges of boards groove 111, connection bit 112, stamp hole 113, except burr hole 114.
The thick hole back gauge that adjacent two stamp holes in same row's stamp hole are set of plate according to PCB finished product, specific as follows: when the thickness of PCB finished product is 0.3-0.8mm, the hole back gauge of adjacent two stamp holes is 0.35mm; When the thickness of PCB finished product is 0.81-1.3mm, the hole back gauge of adjacent two stamp holes is 0.3mm; When the thickness of PCB finished product is greater than 1.3mm, the hole back gauge of adjacent two stamp holes is 0.25mm.
(7) outer etching
First take off the film on multi-ply wood, then by alkali etching, the copper beyond outer-layer circuit is removed, then take off tin layers, outer-layer circuit is displayed.
(8) operation afterwards
Solder mask making, surface treatment and forming processes is carried out successively on multilayer boards, obtained PCB finished product according to prior art.
The above only illustrates the technology contents of the present invention further with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by the protection of the present invention.
Claims (6)
1. the making method of the PCB of an edges of boards metallization, it is characterised in that, comprise the following steps:
S1 holes: bore circuit hole on multilayer boards, and the multiple edges of boards groove of surrounding gong along the unit plate region in multi-ply wood, the region between adjacent two edges of boards grooves is connection bit; Core material and outer copper foil pressing are integrated formation by prepreg by described multi-ply wood;
The heavy copper of S2 and electric plating of whole board: multi-ply wood carries out heavy copper and electric plating of whole board process, make the circuit hole on multi-ply wood and the metallization of edges of boards groove;
S3 outer-layer circuit figure: by positive blade technolgy by the Graphic transitions on the outer film to, on multi-ply wood, forming outer-layer circuit figure;
S4 graphic plating: according to the outer-layer circuit figure on multi-ply wood successively electro-coppering and eleetrotinplate;
S5 bores stamp hole: bore row's stamp hole respectively at the two ends of connection bit;
S6 skin etching: first take off the film on multi-ply wood, then by alkali etching, the copper beyond outer-layer circuit is removed, then take off tin layers, outer-layer circuit is displayed;
Operation after S7: carry out solder mask making, surface treatment and forming processes successively on multilayer boards according to prior art, obtained PCB finished product.
2. the making method of PCB of a kind of edges of boards metallization according to claim 1, it is characterised in that, in step S1, described edges of boards groove is square elongated slot.
3. the making method of PCB of a kind of edges of boards metallization according to claim 1, it is characterised in that, in step S5, the end being also included in edges of boards groove is bored except burr hole.
4. the making method of PCB of a kind of edges of boards metallization according to claim 1, it is characterised in that, when the thickness of PCB finished product is 0.3-0.8mm, the length of described connection bit is 4.5mm, and the hole back gauge of adjacent two stamp holes is 0.35mm.
5. the making method of PCB of a kind of edges of boards metallization according to claim 1, it is characterised in that, when the thickness of PCB finished product is 0.81-1.3mm, the length of described connection bit is 3.0mm, and the hole back gauge of adjacent two stamp holes is 0.3mm.
6. the making method of PCB of a kind of edges of boards metallization according to claim 1, it is characterised in that, when the thickness of PCB finished product is greater than 1.3mm, the length of described connection bit is 3.0mm, and the hole back gauge of adjacent two stamp holes is 0.25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610107236.4A CN105682363B (en) | 2016-02-25 | 2016-02-25 | A kind of production method of the PCB of edges of boards metallization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610107236.4A CN105682363B (en) | 2016-02-25 | 2016-02-25 | A kind of production method of the PCB of edges of boards metallization |
Publications (2)
| Publication Number | Publication Date |
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| CN105682363A true CN105682363A (en) | 2016-06-15 |
| CN105682363B CN105682363B (en) | 2018-10-02 |
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| CN201610107236.4A Active CN105682363B (en) | 2016-02-25 | 2016-02-25 | A kind of production method of the PCB of edges of boards metallization |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231802A (en) * | 2016-09-06 | 2016-12-14 | 江门崇达电路技术有限公司 | A kind of manufacture method of metallized semi groove |
| CN109462949A (en) * | 2018-11-16 | 2019-03-12 | 深圳崇达多层线路板有限公司 | A kind of production method of the PCB for the bound edge that metallizes |
| CN111031666A (en) * | 2019-12-03 | 2020-04-17 | 欣强电子（清远）有限公司 | Large typesetting and processing method for optical module PCB product |
| CN114650652A (en) * | 2022-04-21 | 2022-06-21 | 加宏科技（无锡）股份有限公司 | Stamp hole arrangement structure for PCB and corresponding PCB forming method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101795531A (en) * | 2010-03-11 | 2010-08-04 | 深圳和而泰智能控制股份有限公司 | Stamp hole connection structure, circuit board and circuit board dividing method |
| CN102497728A (en) * | 2011-11-30 | 2012-06-13 | 常州市双进电子有限公司 | Printed circuit board (PCB) |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
-
2016
- 2016-02-25 CN CN201610107236.4A patent/CN105682363B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101795531A (en) * | 2010-03-11 | 2010-08-04 | 深圳和而泰智能控制股份有限公司 | Stamp hole connection structure, circuit board and circuit board dividing method |
| CN102497728A (en) * | 2011-11-30 | 2012-06-13 | 常州市双进电子有限公司 | Printed circuit board (PCB) |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231802A (en) * | 2016-09-06 | 2016-12-14 | 江门崇达电路技术有限公司 | A kind of manufacture method of metallized semi groove |
| CN106231802B (en) * | 2016-09-06 | 2019-05-03 | 江门崇达电路技术有限公司 | A kind of production method of metallized semi slot |
| CN109462949A (en) * | 2018-11-16 | 2019-03-12 | 深圳崇达多层线路板有限公司 | A kind of production method of the PCB for the bound edge that metallizes |
| CN111031666A (en) * | 2019-12-03 | 2020-04-17 | 欣强电子（清远）有限公司 | Large typesetting and processing method for optical module PCB product |
| CN114650652A (en) * | 2022-04-21 | 2022-06-21 | 加宏科技（无锡）股份有限公司 | Stamp hole arrangement structure for PCB and corresponding PCB forming method |
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| Publication number | Publication date |
|---|---|
| CN105682363B (en) | 2018-10-02 |
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