CN105682363B - A kind of production method of the PCB of edges of boards metallization - Google Patents
A kind of production method of the PCB of edges of boards metallization Download PDFInfo
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- CN105682363B CN105682363B CN201610107236.4A CN201610107236A CN105682363B CN 105682363 B CN105682363 B CN 105682363B CN 201610107236 A CN201610107236 A CN 201610107236A CN 105682363 B CN105682363 B CN 105682363B
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- edges
- boards
- pcb
- hole
- connection position
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to board production technical field, specially a kind of production method of the PCB of edges of boards metallization.The present invention bores stamp hole again by adjusting the sequencing of edges of boards slot and stamp hole is made after graphic plating, the problem of can avoid being easy to be broken off in the plating process after brill stamp hole in connection position.By the end set squarely of edges of boards slot, circle compared with prior art can make the area of connection position relatively large, further decrease the possibility that connection position is broken off in the plating process.Hole back gauge between the connection position and stamp hole of different sizes is set according to plate thickness, can also further decrease the possibility that connection position is broken off in the plating process.
Description
Technical field
The present invention relates to a kind of production methods for the PCB that board production technical field more particularly to edges of boards metallize.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board, is important
Electronic unit, be the supporter of electronic component, be electronic component electrical connection carrier.The technological process of production of PCB
It is general as follows：Sawing sheet → inner figure → internal layer etching → internal layer AOI → brown → pressing → drilling → heavy copper → electric plating of whole board
→ outer graphics → graphic plating → etching → outer layer AOI → silk-screen welding resistance, character → surface treatment → molding → electrical testing →
FQC → packaging.Wherein, in order to improve efficiency, facilitate production, multiple unit figures (unit) can be stitched together composition by when sawing sheet
A set of module figure (set), then by more cover die block graphicses be stitched together composition one production unit (panel), base material then according to
The size of production unit is cut, and is then accordingly contained in the multi-layer board formed after pressing multiple for making the unit for forming cell board
Plate region.Cell board is separated from whole plate for the ease of the later stage, it will usually along the four of cell board region in multi-layer board
All multiple edges of boards slots of gong, there are the region of non-gong slot so that each unit plate region remains to be connected to one between two neighboring edges of boards slot
It rises and constitutes a complete plate, which is known as connection position.Formation in order to reduce burr when being molded in the later stage would generally be in plate
The end of side slot, which is bored, removes burr hole, can be at the both ends of connection position point in order to be easier to break connection breaking position when later stage split cells plate
It Zuan not strip hole (the homonymy trough rim of the Kong Xinyu gong slots of same row's stamp hole is on the same line).When product requirement unit
When the edges of boards of plate are non-metallic, stamp hole is typically to be drilled out together with circuit hole after pressing, and edges of boards slot is then molded finally
When just make.When the metallization of the edges of boards of product requirement cell board, the prior art is when boring circuit hole after pressing by stamp hole
It is made together with edges of boards slot, so that edges of boards slot is metallized through subsequent heavy copper and electric plating of whole board processing, i.e. the edges of boards metal of cell board
Change.There are prodigious defects for the method for this edges of boards metallization, since the area of the connection position between two edges of boards slots is smaller, when more
Laminate is by gantry line such as electric plating of whole board and graphic plating, and multi-layer board is contacted with the Building V of equipment when flying bar to decline, multi-layer board stress
Big and uneven, the part connection position easily led on multi-layer board fractures, to cause disconnected plate, generation to scrap.
Invention content
The present invention is susceptible in electroplating process disconnected plate for the production method of existing edges of boards metallization PCB and is generated
The problem of scrapping, the production method that a kind of PCB for the edges of boards metallization that connection position is broken off in avoidable electroplating process is provided.
To achieve the above object, the present invention uses following technical scheme.
A kind of production method of the PCB of edges of boards metallization, includes the following steps：
S1 drills：Circuit hole, and the multiple edges of boards slots of surrounding gong in the cell board region in multi-layer board are bored on multilayer boards,
Region between adjacent two edges of boards slot is connection position；The multi-layer board is pressed core material and outer copper foil by prepreg
It is integrated composition.
Preferably, the edges of boards slot is rectangular elongated slot.
The heavy copper of S2 and electric plating of whole board：Heavy copper and electric plating of whole board processing are carried out to multi-layer board, make circuit hole on multi-layer board and
Edges of boards slot metallizes.
S3 outer-layer circuit figures：By positive blade technolgy by the pattern transfer to multi-layer board on the outer layer film, outer layer is formed
Line pattern.
S4 graphic platings：According to the outer-layer circuit figure on multi-layer board successively electro-coppering and electrotinning.
S5 bores stamp hole：Strip hole is bored respectively at the both ends of connection position.
Preferably, further include boring to remove burr hole in the end of edges of boards slot.
Preferably, when the thickness of PCB finished products is 0.3-0.8mm, the length of the connection position is 4.5mm, adjacent two stamp
The hole back gauge in hole is 0.35mm；When the thickness of PCB finished products is 0.81-1.3mm, the length of the connection position is 3.0mm, adjacent two
The hole back gauge of stamp hole is 0.3mm；When the thickness of PCB finished products is more than 1.3mm, the length of the connection position is 3.0mm, adjacent two
The hole back gauge of stamp hole is 0.25mm.
S6 outer layers etch：The film on multi-layer board is first taken off, is then removed the copper other than outer-layer circuit by alkali etching,
Then tin layers are taken off, outer-layer circuit is made to display.
Process after S7：Solder mask making, surface treatment and forming processes are carried out on multilayer boards successively according to the prior art,
PCB finished products are made.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention is by adjusting making edges of boards slot and stamp hole
Sequencing bores stamp hole again after graphic plating, can avoid being easy to be rolled in the plating process after boring stamp hole in connection position
Disconnected problem.By the end set squarely of edges of boards slot, circle compared with prior art can make the area of connection position relatively
Greatly, the possibility that connection position is broken off in the plating process is further decreased.The connection position of different sizes is set according to plate thickness
And the hole back gauge between stamp hole, it can also further decrease the possibility that connection position is broken off in the plating process.
Description of the drawings
Fig. 1 is stamp hole to be bored in embodiment and except multiple-plate structural schematic diagram behind burr hole；
Fig. 2 is the enlarged drawing of the parts A in Fig. 1.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme of the present invention
It is described further and illustrates.
Embodiment
The present embodiment provides the production method of the PCB of edges of boards metallization a kind of, this method can be reduced in electroplating work procedure and be connected
The possibility that position is broken off.
Specific making step is as follows：
(1) multi-layer board
According to the prior art, passes through sawing sheet → negative film technique successively and make internal layer circuit (forming core plate) → pressing, by base
Material is fabricated to the multi-layer board not drilled, i.e., the plate being press-fitted together as one to form by core material, prepreg and outer copper foil；It is made
Multi-layer board include multiple for making the region for forming cell board, which is known as cell board region.
(2) it drills
Bore circuit hole, and the multiple plates of surrounding gong in the cell board region in multi-layer board on multilayer boards using borehole data
Side slot, the edges of boards slot are rectangular elongated slot, and the region between adjacent two edges of boards slot is connection position.
And the length of connection position is set according to the plate thickness of PCB finished products, it is specific as follows：The thickness of PCB finished products is 0.3-
When 0.8mm, the length of connection position is 4.5mm；When the thickness of PCB finished products is 0.81-1.3mm, the length of connection position is 3.0mm；
When the thickness of PCB finished products is more than 1.3mm, the length of connection position is 3.0mm.
(3) heavy copper and electric plating of whole board
Heavy copper and electric plating of whole board processing are carried out to multi-layer board, make the circuit hole on multi-layer board and the metallization of edges of boards slot.
(4) outer-layer circuit figure
By positive blade technolgy by the pattern transfer to multi-layer board on the outer layer film, outer-layer circuit figure is formed.
(5) graphic plating
According to the outer-layer circuit figure on multi-layer board successively electro-coppering and electrotinning.
(6) it bores stamp hole and bores and remove burr hole
As depicted in figs. 1 and 2, strip hole 113 is bored at the both ends of each connection position 112 respectively on multi-layer board 100, simultaneously
It is bored in the end of edges of boards slot 111 and removes burr hole 114.Fig. 1 and Fig. 2 includes multi-layer board 100, cell board region 110, edges of boards slot
111, connection position 112, stamp hole 113, remove burr hole 114.
The hole back gauge of adjacent two stamp hole in same row's stamp hole is set according to the plate thickness of PCB finished products, it is specific as follows：PCB
When the thickness of finished product is 0.3-0.8mm, the hole back gauge of adjacent two stamp hole is 0.35mm；The thickness of PCB finished products is 0.81-
When 1.3mm, the hole back gauge of adjacent two stamp hole is 0.3mm；When the thickness of PCB finished products is more than 1.3mm, the hole of adjacent two stamp hole
Back gauge is 0.25mm.
(7) outer layer etches
The film on multi-layer board is first taken off, then the copper other than outer-layer circuit is removed by alkali etching, then takes off tin
Layer, makes outer-layer circuit display.
(8) process afterwards
Carry out solder mask making, surface treatment and forming processes on multilayer boards successively according to the prior art, be made PCB at
Product.
It is described above only with embodiment come the technology contents that further illustrate the present invention, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (6)
1. a kind of production method of the PCB of edges of boards metallization, which is characterized in that include the following steps：
S1 drills：Circuit hole, and the multiple edges of boards slots of surrounding gong in the cell board region in multi-layer board are bored on multilayer boards, it is adjacent
Region between two edges of boards slots is connection position；Core material and outer copper foil pressing are one by prepreg by the multi-layer board
Body is constituted；
The heavy copper of S2 and electric plating of whole board：Heavy copper and electric plating of whole board processing are carried out to multi-layer board, make circuit hole and the edges of boards on multi-layer board
Slot metallizes；
S3 outer-layer circuit figures：By positive blade technolgy by the pattern transfer to multi-layer board on the outer layer film, outer-layer circuit is formed
Figure；
S4 graphic platings：According to the outer-layer circuit figure on multi-layer board successively electro-coppering and electrotinning；
S5 bores stamp hole：Strip hole is bored respectively at the both ends of connection position；
S6 outer layers etch：The film on multi-layer board is first taken off, is then removed the copper other than outer-layer circuit by alkali etching, then
Tin layers are taken off, outer-layer circuit is made to display；
Process after S7：Solder mask making, surface treatment and forming processes are carried out on multilayer boards successively according to the prior art, are made
PCB finished products.
2. a kind of production method of the PCB of edges of boards metallization according to claim 1, which is characterized in that described in step S1
Edges of boards slot is rectangular elongated slot.
3. a kind of production method of the PCB of edges of boards metallization according to claim 1, which is characterized in that in step S5, also wrap
It includes to bore in the end of edges of boards slot and removes burr hole.
4. a kind of production method of the PCB of edges of boards metallization according to claim 1, which is characterized in that the thickness of PCB finished products
For 0.3-0.8mm when, the length of the connection position is 4.5mm, and the hole back gauge of adjacent two stamp hole is 0.35mm.
5. a kind of production method of the PCB of edges of boards metallization according to claim 1, which is characterized in that the thickness of PCB finished products
For 0.81-1.3mm when, the length of the connection position is 3.0mm, and the hole back gauge of adjacent two stamp hole is 0.3mm.
6. a kind of production method of the PCB of edges of boards metallization according to claim 1, which is characterized in that the thickness of PCB finished products
When more than 1.3mm, the length of the connection position is 3.0mm, and the hole back gauge of adjacent two stamp hole is 0.25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610107236.4A CN105682363B (en) | 2016-02-25 | 2016-02-25 | A kind of production method of the PCB of edges of boards metallization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610107236.4A CN105682363B (en) | 2016-02-25 | 2016-02-25 | A kind of production method of the PCB of edges of boards metallization |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105682363A CN105682363A (en) | 2016-06-15 |
| CN105682363B true CN105682363B (en) | 2018-10-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610107236.4A Active CN105682363B (en) | 2016-02-25 | 2016-02-25 | A kind of production method of the PCB of edges of boards metallization |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231802B (en) * | 2016-09-06 | 2019-05-03 | 江门崇达电路技术有限公司 | A kind of production method of metallized semi slot |
| CN109462949B (en) * | 2018-11-16 | 2021-04-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB with metalized edge |
| CN111031666A (en) * | 2019-12-03 | 2020-04-17 | 欣强电子（清远）有限公司 | Large typesetting and processing method for optical module PCB product |
| CN114650652A (en) * | 2022-04-21 | 2022-06-21 | 加宏科技（无锡）股份有限公司 | Stamp hole arrangement structure for PCB and corresponding PCB forming method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101795531A (en) * | 2010-03-11 | 2010-08-04 | 深圳和而泰智能控制股份有限公司 | Stamp hole connection structure, circuit board and circuit board dividing method |
| CN102497728A (en) * | 2011-11-30 | 2012-06-13 | 常州市双进电子有限公司 | Printed circuit board (PCB) |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
-
2016
- 2016-02-25 CN CN201610107236.4A patent/CN105682363B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101795531A (en) * | 2010-03-11 | 2010-08-04 | 深圳和而泰智能控制股份有限公司 | Stamp hole connection structure, circuit board and circuit board dividing method |
| CN102497728A (en) * | 2011-11-30 | 2012-06-13 | 常州市双进电子有限公司 | Printed circuit board (PCB) |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
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| CN105682363A (en) | 2016-06-15 |
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