CN104427786A - Processing method of printed circuit board - Google Patents
Processing method of printed circuit board Download PDFInfo
- Publication number
- CN104427786A CN104427786A CN201310364788.XA CN201310364788A CN104427786A CN 104427786 A CN104427786 A CN 104427786A CN 201310364788 A CN201310364788 A CN 201310364788A CN 104427786 A CN104427786 A CN 104427786A
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- Prior art keywords
- wiring board
- printed wiring
- hole
- layer
- blind hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention is applicable to the technical field of printed circuit boards and provides a processing method of a printed circuit board and aims at solving a problem, which exists in the prior art, that before lamination, when a blind hole is drilled in a core board, core board fracture or fold is likely to happen. The method includes the following steps: a pre-procedure: laminating an outer-layer substrate, a prepreg and another outer-layer substrate sequentially and carrying out lamination processing so as to form a multi-layer printed circuit board; hole processing: processing a blind hole, which extends from the core board to the prepreg, in the multilayer printed circuit board; copper deposition: carrying out copper deposition processing on the blind-hole printed circuit board so as to form a copper layer; hole filling: using a filler to fill the blind hole fully; and outer-layer processing: manufacturing a line pattern. Through blind-hole processing on the multilayer printed circuit board after the lamination processing and hole filling processing of the blind hole, electrical connection with the inner-layer core board is realized so that a problem that in a process of hole processing in the inner-layer core board, fracture or fold happens is solved so that realization of high-density interconnection of printed circuit boards is facilitated.
Description
Technical field
The invention belongs to printed wiring board technical field, particularly relate to a kind of processing method of printed wiring board.
Background technology
Along with the develop rapidly of electronic technology, electronic product is tending towards microminiaturization, lighting, highly integrated gradually, and printed wiring board is the requisite parts of electronic product, and this inevitable requirement printed wiring board also wants miniaturization and and densification.Printed wiring board densification can depend on the blind hole that interlayer connects and circuit, and determines in conjunction with the performance of electronic product, and therefore, the blind hole of printed wiring board makes and becomes one of key of printed wiring board technical development.
Usually, for multilayer printed wiring board, blind hole comprises and extends to the blind hole of internal layer from the outer surface of printed wiring board and extend to the buried via hole of another internal layer from an internal layer.And, adopt blind hole to be the effective ways improving multilayer printed wiring board density, reduce the number of plies and plate face size, and the quantity of through hole can be greatly reduced.
At present, when making the blind hole of multilayer printed wiring board, normally forming blind hole by carrying out boring process to central layer before pressing process, namely respectively each central layer being holed so that form corresponding blind hole after pressing before pressing process.Because the Thickness Ratio of central layer is thinner, thickness is at 0.05-0.3mm, and the aperture of institute's drilling blind hole is at 0.1-0.5mm, easily cause central layer fracture or produce impression, and manufacture difficulty is large when carrying out boring process to central layer.
Summary of the invention
The object of the present invention is to provide a kind of processing method of printed wiring board, to adopt after pressing processing blind hole on printed wiring board and fill and lead up the mode of this blind hole, being intended to solve in prior art on central layer, before pressing, during drilling blind hole, easily occurring that central layer fractures or the problem of folding line.
The embodiment of the present invention realizes like this, a processing method for printed wiring board, at least provide an outer base material, prepreg and another outer base material, described outer base material comprises central layer and is arranged at the copper foil layer at least one surface of described central layer, it is characterized in that, comprise the following steps:
Front operation, provided described outer base material, described prepreg and outer base material described in another are stacked in order and described prepreg between the described copper foil layer of base material outer described in two, and carry out lamination treatment formed multilayer printed wiring board;
Machining hole, described multilayer printed wiring board is processed the blind hole extended to described prepreg from described central layer;
Heavy copper, carries out heavy Copper treatment to the surface hole wall of described blind hole and described printed wiring board being processed with described blind hole and forms layers of copper;
Filling perforation, utilizes filler to fill and fills up described blind hole; And
Outer process, the described layers of copper of described printed wiring board makes line pattern.
Further, described machining hole step is the via utilizing laser to process described blind hole and through described outer base material and described prepreg on described printed wiring board, and carries out heavy Copper treatment by heavy copper step to the hole wall of described via.
Further, the processing method of described printed wiring board also comprises brown step, described brown step is between described front process and described machining hole step, be specially: brown process is carried out to the described multilayer printed wiring board after lamination treatment, form brown film on the copper foil layer surface of described printed wiring board.
Further, described filling perforation step utilizes plating mode fill out copper to described blind hole and described blind hole filled up.
Further, described machining hole step adopts back drill mode to carry out back drill processing on described printed wiring board, and described blind hole is back drill hole.
Further, also comprise before filling perforation step and plate electric treatment is carried out to the described back drill hole through heavy Copper treatment, and adopt vacuum mode to be inserted in described blind hole by resin to complete filling perforation step.
Further, further comprising the steps of between filling perforation step and outer treatment step:
Abrasive belt grinding, the described printed wiring board surface after polishing filling perforation process, residues in the described resin on printed wiring board surface when removing filling perforation process;
Outer boring, described printed wiring board processes via; And
Outer heavy copper, carries out heavy Copper treatment to the hole wall of described via.
Further, also comprise in described front process:
Sawing sheet, provides described central layer and carries out sawing sheet to it;
Inner figure, adopts pad pasting, exposure, the described copper foil layer of development to described central layer to carry out inner figure making;
Internal layer etches, and etches and striping process, described central layer forms inner line figure to described central layer;
Internal layer circuit detects, and adopts automated optical detection equipment to detect described inner line figure;
Lamination, described outer base material, described prepreg and outer base material described in another are stacked in order and described prepreg between the inner line figure of central layer described in two;
Pressing, adopts pressing machine to carry out lamination treatment.
Further, the step of described skin process comprises:
Graphic transitions, adopts pad pasting, exposure, development to carry out outer graphics making to the layers of copper of described printed wiring board;
Etching, carries out skin etching and striping process to described printed wiring board, described printed wiring board is formed outer-layer circuit figure.
The processing method of printed wiring board provided by the invention is by carrying out blind hole processing to the multilayer printed wiring board after lamination treatment, and filling perforation process is carried out to realize and the electric connection of core material to blind hole, namely without the need to carrying out Drilling operation to core material before lamination treatment, avoid and occur fractureing or creasing problem in the core material course of processing, and be conducive to the high density interconnect realizing printed wiring board, be convenient to realize printed wiring board miniaturization and and densification.
Accompanying drawing explanation
Fig. 1 is the flow chart of the processing method of the printed wiring board that the embodiment of the present invention provides.
Fig. 2 is the structural representation electroplating filling perforation on printed wiring board that the embodiment of the present invention provides.
Fig. 3 is the structural representation of the resin filling perforation on printed wiring board that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Please refer to Fig. 1 to Fig. 3, the processing method of the printed wiring board that the embodiment of the present invention provides, one outer base material 12, prepreg 11 and another outer base material 12 are at least provided, described outer base material 12 comprises central layer 121 and is arranged at copper foil layer L1 and/or L2 on described at least one surface of central layer 121, comprises the following steps:
S1: front operation, thered is provided described outer base material 12, described prepreg 11 and outer base material 12 described in another are stacked in order and described prepreg 11 between the described copper foil layer L1 of base material 12 outer described in two, and carry out lamination treatment formed multilayer printed wiring board;
S2: machining hole, described multilayer printed wiring board is processed the blind hole 122,123 extended from described central layer 121 to described prepreg 11;
S3: heavy copper, carries out heavy Copper treatment to the surface hole wall of described blind hole 122,123 and described printed wiring board being processed with described blind hole 122 and forms layers of copper (sign);
S4: filling perforation, utilizes filler 2,4 to fill and fills up described blind hole 122,123; And
S5: outer process, the described layers of copper of described printed wiring board makes line pattern.
The processing method of this printed wiring board adopts the printed wiring board after lamination treatment to carry out Drilling operation, described printed wiring board is formed blind hole 122,123, and filling perforation process is carried out to realize and the electric connection of core material 121 to this blind hole 122,123, namely without the need to carrying out Drilling operation to core material 121 before lamination treatment, avoid and occur fractureing or creasing problem in core material 121 course of processing, and be conducive to the high density interconnect realizing printed wiring board, be convenient to realize printed wiring board miniaturization and and densification.
Understandably, multilayer printed wiring board described in this can be four layers of printed wiring board, six layers of printed wiring board or other random layer printed wiring boards.For four layers of printed wiring board, by an outer base material 12, prepreg 11 and another outer base material 12 sequentially lamination lamination and formed, described outer base material 12 comprises central layer 121 and is arranged at the copper foil layer L1 at least one surface of central layer 121; For six layers of printed wiring board (not shown), by an outer base material, a prepreg, internal layer base material, second half cured sheets and another outer base material sequentially lamination lamination and formed, described outer base material comprises central layer and is arranged at the copper foil layer at least one surface of central layer, and described internal layer base material comprises central layer and is arranged at the copper foil layer of central layer two apparent surface.Form the printed wiring board of other numbers of plies according to aforesaid way, do not do enumeration at this.
Understandably, according to actual needs in upper surface and/or the lower surface processing blind slot of multilayer printed wiring board, and the blind slot degree of depth is determined according to actual demand, to play line conduction effect.Particularly, for four layers of printed wiring board, described blind hole 122,123 extends to copper foil layer in this outer base material 12 along outer base material 12 surface of multilayer printed wiring board; For six layers and above printed wiring board, described blind hole extends to the copper foil layer of this outer base material along the outer substrate surface of multilayer printed wiring board, and/or extending to the copper foil layer of internal layer base material along the outer substrate surface of multilayer printed wiring board through described outer base material and the prepreg outer base material and internal layer base material, the copper foil layer of this internal layer base material is positioned at the side away from this outer base material.
Please refer to Fig. 1 to Fig. 3, be described for the processing method of four layers of printed wiring board to printed wiring board.
The processing method of printed wiring board provided by the invention, provide an outer base material 12, prepreg 11 and another outer base material 12, described outer base material 12 comprises central layer 121 and is arranged at the copper foil layer L1 of described central layer 121 liang of apparent surfaces, comprises the following steps:
S1: front operation, provided described outer base material 12, described prepreg 11 and outer base material 12 described in another are stacked in order and described prepreg 11 between base material 12 outer described in two, and carry out lamination treatment and form four layers of printed wiring board; Understandably, the copper foil layer of two apparent surfaces of outer base material 12 is defined as from outside to inside successively the first copper foil layer L1, the second copper foil layer L2, the 3rd copper foil layer L3 and the 4th copper foil layer L4, prepreg 11 is between the second copper foil layer L2 and third layer Copper Foil L3.
S2: machining hole, described four layers of printed wiring board are processed the blind hole 122,123 extended from described central layer 121 to described prepreg 11; Understandably, this blind hole 122 extends to the second copper foil layer L2 from the first copper foil layer L1 and/or extends to the 3rd copper foil layer L3 from the 4th copper foil layer L4, and namely the bottom of blind hole 122 is positioned at the second copper foil layer L2 and/or the 3rd copper foil layer L3.
S3: heavy copper, carries out heavy Copper treatment to the surface hole wall of described blind hole 122,123 and described printed wiring board being processed with described blind hole 122,123 and forms layers of copper (sign);
S4: filling perforation, utilizes filler 2,4 to fill and fills up described blind hole 122,123; And
S5: outer process, the described layers of copper of described printed wiring board makes line pattern.
Please refer to Fig. 1 and Fig. 2, further, described machining hole step S2 is the via 3 utilizing laser to process described blind hole 122 and through described outer base material 12 and described prepreg 11 on described printed wiring board, and carries out heavy Copper treatment by the heavy hole wall of copper step S3 to described via 3.Be the printed wiring board that 0.075-0.175 millimeter and radius-thickness ratio are less than 1 for aperture, utilize laser processing blind hole 122 and via 3 on printed wiring board, improve working (machining) efficiency, and, this blind hole 122 penetrates the first copper foil layer L1 of this printed wiring board and/or the 4th copper foil layer L4 and core material 121, until the second copper foil layer L2 and/or the 3rd copper foil layer L3, does not penetrate prepreg 11, this via 3 penetrates the outside base material 12 of this printed wiring board, and penetrates prepreg 11.More preferably, this laser is carbon dioxide laser, Nd:YAG laser or excimer laser, when adopting carbon dioxide laser, first etching being needed to the Copper Foil at Drilling operation place, then carrying out processing blind hole by laser 122 and/or via 3.
Further, the processing method of described printed wiring board also comprises brown step, described brown step is between described front process S1 and described machining hole step S2, be specially: brown process is carried out to the described multilayer printed wiring board after lamination treatment, at the first copper foil layer L1 and the 4th copper foil layer L4 surface formation brown film of described printed wiring board.By carrying out oxidation processes to the first copper foil layer L1 and the 4th copper foil layer L4, form a layer thickness on the first copper foil layer L1 and the 4th copper foil layer L4 surface evenly and the brown film of micro-rough.Alternatively, adopt chemical method to carry out brown process, namely adopt oxidation solution to carry out oxidation processes to copper foil surface.
Please refer to Fig. 2, further, described filling perforation step S4 utilizes plating mode fill out copper 2 to described blind hole 122 and described blind hole 122 filled up.Adopt electro-coppering 2 to fill up this blind hole 122 and form electrical connection between printed wiring board ectonexine circuit, improve connection reliability and the loading density of printed wiring board, and the heat dispersion between plate can be improved.
Please refer to Fig. 1 and Fig. 3, further, described machining hole step adopts back drill mode to carry out back drill processing on described printed wiring board, and described blind hole is back drill hole 123.Thickness for core material 121 is greater than 0.15 millimeter or aperture when being greater than 0.175 millimeter, mechanical drill is adopted to carry out back drill processing on printed wiring board, described back drill hole 123 penetrates printed wiring board first copper foil layer L1 and/or the 4th copper foil layer L4 and core material 121, until the second copper foil layer L2 and/or the 3rd copper foil layer L3, and do not penetrate prepreg 11, realize electrically conducting of the first copper foil layer L1 and the second copper foil layer L2 and/or person the 3rd copper foil layer L3 and the 4th copper foil layer L4.
Please refer to Fig. 3, further, also comprise before filling perforation step S4 and plate electric treatment is carried out to the described back drill hole 123 through heavy Copper treatment, and adopt vacuum mode to be inserted in described blind hole 123 by resin ink 4 to complete filling perforation step.On the hole wall in back drill hole 123, the layers of copper of desired thickness is formed after plate electric treatment, and utilize vacuum taphole machine that the resin ink 4 of one-component or two component is filled described back drill hole 123, adopt screen printing mode that resin ink 4 is inserted described back drill hole 123, ensure that inside, described back drill hole 123 is filled full, without quality abnormals such as cavities.More preferably, described resin ink 4 is photocurable resin ink or thermosetting resin ink.
Further, the processing method of described printed wiring board is further comprising the steps of between filling perforation step S4 and outer treatment step S5 also comprises:
Abrasive belt grinding, the described printed wiring board surface after polishing filling perforation process, residues in the described resin ink 4 on printed wiring board surface when removing filling perforation process;
Outer boring, described printed wiring board is processed via 5; And
Outer heavy copper, carries out heavy Copper treatment to the hole wall of described via 5.
Remove both sides, back drill hole 123 by the processing mode of abrasive belt grinding and have more the resin ink 4 in aperture and the resin ink 4 of printed wiring board remained on surface, thus reach resin ink 4 reserved in hole, make the resin ink 4 in back drill hole 123 be polished smooth.According to the hardness of the resin ink 4 after the kind of resin ink 4 and precuring, adopt different nog plate modes, such as, for photocurable resin ink, adopt ultraviolet photoetching with primary solidification, and use conventional polish-brush to remove; For thermosetting resin ink, the ceramic brush roll of high rigidity is adopted to remove.Machine drilling is carried out to the printed wiring board after abrasive belt grinding, processes the via 5 of through printed wiring board, and heavy Copper treatment is carried out to the hole wall of via 5, realize the electrical connection of core material 121 circuit and outer-layer circuit.
Further, described front process S1 comprises:
Sawing sheet, provides described central layer 121 and carries out sawing sheet to it;
Inner figure, adopts pad pasting, exposure, the described copper foil layer of development to described central layer 121 to carry out inner figure making; Understandably, carry out inner figure making to the one side copper foil layer of central layer 121, this copper foil layer is the second copper foil layer L2 or the 3rd copper foil layer L3 that fit with prepreg 11.
Internal layer etches, and etches and striping process, described central layer 121 forms inner line figure to described central layer 121; Understandably, internal layer etching carries out through the second copper foil layer L2 of inner figure process and the 3rd copper foil layer L3, and inner line figure and the prepreg 11 of formation are fitted.
Internal layer circuit detects, and adopts automated optical detection equipment to detect described inner line figure;
Lamination, described outer base material 12, described prepreg 11 and outer base material 12 described in another are stacked in order and described prepreg 11 between the inner line figure of central layer described in two 121; Understandably, prepreg 11 is between the second copper foil layer L2 and the 3rd copper foil layer L3.
Pressing, adopts pressing machine to carry out lamination treatment.
According to the size of required printed wiring board, the process of large-sized core material 121 sawing sheet is obtained the core material 121 of required size size, by pasting dry film on core material 121, exposure and development treatment and internal layer etching making inner line figure, particularly, one deck light-sensitive surface is attached at the copper foil surface of core material 121, core material 121 after pad pasting is exposed and development treatment, for acid etching, have the negative film film of line pattern to keep off drafting to expose before light source, the part of printing opacity is cured, lighttight part is still pasted light-sensitive surface, fade away the light-sensitive surface not having to solidify, the printed wiring board posting solidification light-sensitive surface is carried out etch processes, to not etch away by the layers of copper of light-sensitive surface protection, layers of copper by light-sensitive surface protection is retained, finally by striping process, just on core material 121, form required line pattern.More preferably, etch processes mode can be alkali etching or acid etching, adopts alkali etching to need to electroplate one deck resist layer on solidification light-sensitive surface.And adopt automated optical detection equipment to detect the defects such as the open circuit of inner line figure.The number of plies according to printed wiring board carries out lamination and lamination treatment, obtains required multilayer printed wiring board.
Further, the step S5 of described skin process comprises:
Graphic transitions, adopts pad pasting, exposure, development to carry out outer graphics making to the layers of copper of described printed wiring board; Understandably, this layers of copper is the first copper foil layer L1 and/or the 4th copper foil layer L4.
Etching, carries out skin etching and striping process to described printed wiring board, described printed wiring board is formed outer-layer circuit figure.Outer graphics transfer and pattern etch process are carried out to the printed wiring board after filling perforation process, namely on outer copper foil layer L1, L4 of printed wiring board, forms required line pattern.Specifically, at the outer copper foil layer L1 of printed wiring board, L4 upper attaching one deck light-sensitive surface, to the printed wiring board to explosure after pad pasting process and development treatment, for alkali etching, have the positive film of line pattern to keep off drafting to expose before light source, lighttight part is cured, the part of printing opacity is still pasted light-sensitive surface, the light-sensitive surface of solidification electroplates one deck resist layer, such as zinc-plated, remove the light-sensitive surface not having to solidify, printed wiring board after electroplating processes is carried out alkali etching process, to not etch away by the layers of copper of resist layer protection, the copper foil layer L1 of resist layer will be coated with, L4 remains, stripping tin liquor is finally adopted to remove resist layer, obtain required outer-layer circuit figure.According to acid etching, then do not need to carry out zinc-plated process.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. a processing method for printed wiring board, at least provide an outer base material, prepreg and another outer base material, described outer base material comprises central layer and is arranged at the copper foil layer at least one surface of described central layer, it is characterized in that, comprises the following steps:
Front operation, provided described outer base material, described prepreg and outer base material described in another are stacked in order and described prepreg between the described copper foil layer of base material outer described in two, and carry out lamination treatment formed multilayer printed wiring board;
Machining hole, described multilayer printed wiring board is processed the blind hole extended to described prepreg from described central layer;
Heavy copper, carries out heavy Copper treatment to the surface hole wall of described blind hole and described printed wiring board being processed with described blind hole and forms layers of copper;
Filling perforation, utilizes filler to fill and fills up described blind hole; And
Outer process, the described layers of copper of described printed wiring board makes line pattern.
2. the processing method of printed wiring board as claimed in claim 1, it is characterized in that, described machining hole step is the via utilizing laser to process described blind hole and through described outer base material and described prepreg on described printed wiring board, and carries out heavy Copper treatment by heavy copper step to the hole wall of described via.
3. the processing method of printed wiring board as claimed in claim 2, it is characterized in that, also comprise brown step, described brown step is between described front process and described machining hole step, be specially: brown process is carried out to the described multilayer printed wiring board after lamination treatment, form brown film on the copper foil layer surface of described printed wiring board.
4. the processing method of the printed wiring board as described in claims 1 to 3 any one, is characterized in that, described filling perforation step utilizes plating mode fill out copper to described blind hole and described blind hole filled up.
5. the processing method of printed wiring board as claimed in claim 1, is characterized in that, described machining hole step adopts back drill mode to carry out back drill processing on described printed wiring board, and described blind hole is back drill hole.
6. the processing method of printed wiring board as claimed in claim 5, is characterized in that, also comprises and carry out plate electric treatment to the described back drill hole through heavy Copper treatment before filling perforation step, and adopts vacuum mode to be inserted in described blind hole by resin to complete filling perforation step.
7. the processing method of printed wiring board as claimed in claim 6, is characterized in that, further comprising the steps of between filling perforation step and outer treatment step:
Abrasive belt grinding, the described printed wiring board surface after polishing filling perforation process, residues in the described resin on printed wiring board surface when removing filling perforation process;
Outer boring, described printed wiring board processes via; And
Outer heavy copper, carries out heavy Copper treatment to the hole wall of described via.
8. the processing method of printed wiring board as claimed in claim 1, is characterized in that, also comprise in described front process:
Sawing sheet, provides described central layer and carries out sawing sheet to it;
Inner figure, adopts pad pasting, exposure, the described copper foil layer of development to described central layer to carry out inner figure making;
Internal layer etches, and etches and striping process, described central layer forms inner line figure to described central layer;
Internal layer circuit detects, and adopts automated optical detection equipment to detect described inner line figure;
Lamination, described outer base material, described prepreg and outer base material described in another are stacked in order and described prepreg between the inner line figure of central layer described in two;
Pressing, adopts pressing machine to carry out lamination treatment.
9. the processing method of printed wiring board as claimed in claim 1, is characterized in that, the step of described skin process comprises:
Graphic transitions, adopts pad pasting, exposure, development to carry out outer graphics making to the layers of copper of described printed wiring board;
Etching, carries out skin etching and striping process to described printed wiring board, described printed wiring board is formed outer-layer circuit figure.
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| CN201310364788.XA CN104427786A (en) | 2013-08-20 | 2013-08-20 | Processing method of printed circuit board |
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| CN201310364788.XA CN104427786A (en) | 2013-08-20 | 2013-08-20 | Processing method of printed circuit board |
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| CN105578801B (en) * | 2015-12-15 | 2018-04-03 | 深圳崇达多层线路板有限公司 | A kind of preparation method in the back drill hole of the consent of solder mask half |
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| CN109548276A (en) * | 2018-12-28 | 2019-03-29 | 郑州云海信息技术有限公司 | A kind of large capacity high-layer communication backboard and processing method |
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| CN111465222A (en) * | 2020-04-21 | 2020-07-28 | 大连崇达电子有限公司 | Method for improving out-of-tolerance control of outer-layer impedance and multilayer circuit board |
| CN112672521A (en) * | 2021-01-19 | 2021-04-16 | 中国电子科技集团公司第二十九研究所 | Method and device for processing blind groove structure of multilayer board |
| CN113347798A (en) * | 2021-06-02 | 2021-09-03 | 珠海市汇一宏光电有限公司 | Method and system for manufacturing connected strip-shaped circuit board with multiple circuits |
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| CN114190011A (en) * | 2021-11-11 | 2022-03-15 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
| CN114190011B (en) * | 2021-11-11 | 2024-02-23 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
| CN115023067A (en) * | 2022-05-23 | 2022-09-06 | 高德(江苏)电子科技股份有限公司 | Processing technology for improving alignment precision of printed circuit board |
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