CN103025051A - High density interconnect (HDI) plate with mechanic back drilling structure and manufacturing method thereof - Google Patents
High density interconnect (HDI) plate with mechanic back drilling structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN103025051A CN103025051A CN2012104699571A CN201210469957A CN103025051A CN 103025051 A CN103025051 A CN 103025051A CN 2012104699571 A CN2012104699571 A CN 2012104699571A CN 201210469957 A CN201210469957 A CN 201210469957A CN 103025051 A CN103025051 A CN 103025051A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- foil layer
- layer
- back drill
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention further provides a high density interconnect (HDI) plate with a mechanic back drilling structure and a manufacturing method thereof. The method comprises that: S1: a first copper foil layer, a first core plate, a second core plate and a sixth copper foil layer are correspondingly subjected to laminating together; S2: the first copper foil layer is subjected to mechanic back drilling processing with the drilling depth reaching a third copper foil layer, and the first copper foil layer, the second copper foil layer and the third copper foil layer are correspondingly connected; S3: the sixth copper foil layer is subjected to the mechanic back drilling processing with the drilling depth reaching a fourth copper foil layer, and the sixth copper foil layer, a fifth copper foil layer and the fourth copper foil layer are correspondingly connected. By adopting a manufacturing way that two core plates are firstly subjected to the laminating one time and then are subjected to the mechanic back drilling processing one time, the production cycle of the HDI plate is greatly shortened, the production cost is reduced, at the same time, the problem of panel expansion caused by multiple times of laminating, laser drillings and abrasive belt grindings is avoided, and the counterpoint accuracy between layers is guaranteed. Compared with the prior art, the HDI plate has the advantages of simple manufacturing process, high production efficiency, low cost and the like.
Description
Technical field:
The invention belongs to the printed wiring board manufacture technology field, what be specifically related to is HDI plate of a kind of mechanical back drill pore structure and preparation method thereof.
Background technology:
The HDI wiring board also claims the high density interconnect plate, is the higher circuit board of a kind of circuit distribution density that uses little blind buried via hole technology, and it has the production cost that can reduce multi-layer PCB board, increases the advantages such as line density, reliability height, good electrical property.
At present the HDI wiring board mainly adopts laser drill, and it is made flow process and is: for the first time lamination → first time blind hole windowing make → for the first time laser drill → filling perforation first time electroplates → for the first time abrasive belt grinding → first time inner figure → pressing second time → second time blind hole windowing laser drill making → second time → filling perforation second time abrasive belt grinding plating → second time → second time graphic making.
Take six layers of laser drill HDI plate as example, at first the inner figure making is carried out in ground floor and the second layer Copper Foil of both sides about the central layer, then paste respectively prepreg on the ground floor after brown is processed and the second layer Copper Foil; Corresponding covering the 3rd layer and the 4th layer of Copper Foil on prepreg, carry out the lamination first time, form four laminates, after pressing the 3rd layer and the 4th layer of Copper Foil carry out blind hole windowing making or Direct Laser boring afterwards, then carrying out hole metallization and filling perforation electroplates, make the 3rd layer and the conducting of ground floor Copper Foil, the 4th layer and the conducting of second layer Copper Foil.
The 3rd layer and the 4th layer of Copper Foil are carried out inner figure to be made, repeat above-mentioned steps, paste prepreg and layer 5 Copper Foil at the 3rd layer, the 4th layer of upper prepreg and the layer 6 Copper Foil of pasting, carry out the pressing second time, and carry out at layer 5 Copper Foil, layer 6 Copper Foil that blind hole windowing is made or Direct Laser boring, then carrying out hole metallization and filling perforation electroplates, make layer 5 and the 3rd layer of Copper Foil conducting, the 4th layer and the conducting of layer 6 Copper Foil are then carried out graphic making to layer 5, layer 6 Copper Foil at last.
Only need repeat above-mentioned steps and get final product for making multi-layer sheet more than six layers, it is in requisition for repeatedly pressing and repeatedly laser drill, and there is following shortcoming in this mode:
One, repeatedly pressing and repeatedly laser drill, larger on the harmomegathus impact of each copper foil layer, cause easily a layer inclined to one side problem;
Two, the flow process more complicated is made in repeatedly pressing and repeatedly laser drill, and not only production efficiency is lower, and cost of manufacture is higher.
Summary of the invention:
For this reason, the object of the present invention is to provide HDI plate of a kind of mechanical back drill pore structure and preparation method thereof, to solve in the present laser drill HDI plate manufacturing process, because of needs repeatedly pressing and laser drill repeatedly, and cause the layer that occurs partially, make the problem that flow process is complicated, production efficiency is low and cost of manufacture is high.
For achieving the above object, the present invention is mainly by the following technical solutions:
A kind of HDI plate of mechanical back drill pore structure comprises the first central layer and the second central layer, and described the first central layer one side is provided with the second copper foil layer, and opposite side is provided with the 3rd copper foil layer; The second central layer one side is provided with the 4th copper foil layer, opposite side is provided with the 5th copper foil layer, bonding by the second prepreg between described the 3rd copper foil layer and the 4th copper foil layer, be pasted with the first prepreg on described the second copper foil layer, be coated with the first copper foil layer on the first prepreg, be provided with the first mechanical back drill hole that is connected with the second copper foil layer, the 3rd copper foil layer respectively on the first copper foil layer; Be pasted with the 3rd prepreg on described the 5th copper foil layer, be coated with the 6th copper foil layer on described the 3rd prepreg, be provided with the second mechanical back drill hole that is connected with the 5th copper foil layer, the 4th copper foil layer respectively on the 6th copper foil layer.
Preferably, be provided with the first laser blind hole that is connected with the second copper foil layer on described the first copper foil layer.
Preferably, be provided with the second laser blind hole that is connected with the 5th copper foil layer on described the 6th copper foil layer.
Preferably, described the first copper foil layer is provided with and runs through the first central layer and the second central layer, and the through hole that is connected with the second copper foil layer, the 3rd copper foil layer, the 4th copper foil layer, the 5th copper foil layer and the 6th copper foil layer.
Preferably, described the first copper foil layer is pressed together on the second copper foil layer by the first prepreg; Described the 6th copper foil layer is pressed together on the 5th copper foil layer by the 3rd prepreg.
In addition, the present invention also provides a kind of HDI board manufacturing method of mechanical back drill pore structure, comprising:
S1, the first copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence are pressed together;
S2, carry out mechanical back drill hole processing at the first copper foil layer, drilling depth reaches the 3rd copper foil layer, and makes the first copper foil layer, the corresponding connection with the 3rd copper foil layer of the second copper foil layer;
S3, carry out mechanical back drill hole processing at the 6th copper foil layer, drilling depth reaches the 4th copper foil layer, and makes the 6th copper foil layer, the corresponding connection with the 4th copper foil layer of the 5th copper foil layer.
Preferably, S1 specifically comprises:
S101, at the second copper foil layer of the first central layer first prepreg of fitting, cover the first copper foil layer at the first prepreg;
S102, paste the 3rd prepreg at the 5th copper foil layer of the second central layer, cover the 6th copper foil layer at the 3rd prepreg;
S103, paste the 3rd prepreg at the 3rd copper foil layer of the first central layer, the 4th copper foil layer of the second central layer is corresponding to the 3rd prepreg and the applying of the 3rd copper foil layer;
S104, the first copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence are pressed together.
Preferably, S2 also comprises:
Carry out laser blind hole processing at the first copper foil layer, drilling depth reaches the second copper foil layer, and connects the first copper foil layer and the second copper foil layer by this laser blind hole;
Above-mentioned laser blind hole and mechanical back drill hole are carried out the hole metallization processing, make between the first copper foil layer and the second copper foil layer by the laser blind hole conducting; Make between the first copper foil layer, the second copper foil layer, the 3rd copper foil layer by the hole conducting of mechanical back drill.
Preferably, S3 also comprises:
Carry out laser blind hole processing at the 6th copper foil layer, drilling depth reaches the 5th copper foil layer, and connects the 6th copper foil layer and the 5th copper foil layer by this laser blind hole;
Above-mentioned laser blind hole and mechanical back drill hole are carried out the hole metallization processing, make between the 6th copper foil layer and the 5th copper foil layer by the laser blind hole conducting; Make between the 6th copper foil layer, the 5th copper foil layer, the 4th copper foil layer by the hole conducting of mechanical back drill.
Preferably, the laser blind hole behind the hole metallization and mechanical back drill hole are carried out the resin filling perforation.
The HDI plate of mechanical back drill pore structure of the present invention, adopt first lamination of two central layers, then at the production method in disposable mechanical back drill hole, greatly shortened the production cycle of HDI plate, reduced production cost, avoid simultaneously pressing repeatedly, repeatedly laser drill and repeatedly abrasive belt grinding and the sheet material harmomegathus problem that occurs, guaranteed the aligning accuracy of interlayer.Compared with prior art, it is simple that the present invention has the flow process of making, and production efficiency is high, low cost and other advantages.
Description of drawings:
Fig. 1 is the cutaway view of the HDI plate of the present invention's machinery back drill pore structure.
Fig. 2 is the manufacture method flow chart of the HDI plate of the present invention's machinery back drill pore structure.
Identifier declaration among the figure: the first copper foil layer 1, the second copper foil layer 2, the 3rd copper foil layer 3, the 4th copper foil layer 4, the 5th copper foil layer 5, the 6th copper foil layer 6, the first central layer 7, the second central layer 8, the first prepreg 9, the second prepreg 10, the 3rd prepreg 11, the first laser blind hole 12, the 13, second mechanical back drill hole 14, the first mechanical back drill hole, the second laser blind hole 15, through hole 16.
Embodiment:
For setting forth thought of the present invention and purpose, the present invention is described further below in conjunction with the drawings and specific embodiments.
See also shown in Figure 1ly, Fig. 1 is the cutaway view of the HDI plate of the present invention machinery back drill pore structure.The invention provides a kind of HDI plate of mechanical back drill pore structure, comprise the first central layer 7 and the second central layer 8, described the first central layer 7 upsides are provided with the second copper foil layer 2, and downside is provided with the 3rd copper foil layer 3; The upside of the second central layer 8 is provided with the 4th copper foil layer 4, be arranged with the 5th copper foil layer 5, bonding by the second prepreg 10 between described the 3rd copper foil layer 3 and the 4th copper foil layer 4, be pasted with the first prepreg 9 on described the second copper foil layer 2, be coated with the first copper foil layer 1 on the first prepreg 9, described the first copper foil layer 1 is pressed together on the second copper foil layer 2 by the first prepreg 9; Be pasted with the 3rd prepreg 11 on the 5th copper foil layer 5, be coated with the 6th copper foil layer 6 on described the 3rd prepreg 11, described the 6th copper foil layer 6 is pressed together on the 5th copper foil layer 5 by the 3rd prepreg 11; And the first central layer 7 and the second central layer 8 press together by the second prepreg 10 correspondences, and between the first copper foil layer 1 and the second copper foil layer 2, between the 3rd copper foil layer 3 and the 4th copper foil layer 4 and all can pass through one step press between the 5th copper foil layer 5 and the 6th copper foil layer 6.
Be provided with the first laser blind hole 12 and the first mechanical back drill hole 13 on the first copper foil layer 1, and all process by hole metallization in the first laser blind hole 12 and the first mechanical back drill hole 13, described the first laser blind hole 12 is used for realizing that the first copper foil layer 1 is connected with the conducting of the second copper foil layer 2; The described first mechanical back drill hole 13 is used for realizing that the conducting between the first copper foil layer 1, the second copper foil layer 2 and the 3rd copper foil layer 3 connects.
Be provided with the second laser blind hole 15 and the second mechanical back drill hole 14 on the 6th copper foil layer 6, and all process by hole metallization in the second laser blind hole 15 and the second mechanical back drill hole 14, described the second laser blind hole 15 is used for realizing that the 6th copper foil layer 6 is connected with the conducting of the 5th copper foil layer 5; The described second mechanical back drill hole 14 is used for realizing that the conducting between the 6th copper foil layer 6, the 5th copper foil layer 5 and the 4th copper foil layer 4 connects.
In addition, also be provided with the through hole 16 that is applied in the first copper foil layer 1, the second copper foil layer 2, the 3rd copper foil layer 3, the 4th copper foil layer 4, the 5th copper foil layer 5, the 6th copper foil layer 6, the first central layer 7 and the second central layer 8, carry out hole metallization in this through hole 16 and process, can realize that by through hole the conducting between the first copper foil layer 1, the second copper foil layer 2, the 3rd copper foil layer 3, the 4th copper foil layer 4, the 5th copper foil layer 5, the 6th copper foil layer 6 connects.
After pressing is finished between the present invention's the first copper foil layer 1, the first central layer 7, the second central layer 8 and the 6th copper foil layer 6, carry out the processing of back drill hole by rig or the gong machine with severity control function, the hole is got into the copper sheet of the 3rd copper foil layer or got into from the 6th copper foil layer on the copper sheet of the 4th copper foil layer from the first copper foil layer, again through heavy copper coin electricity, with back drill hole hole metallization, then by the vacuum resin consent that the back drill stopple is full, can finish the conducting of whole HDI plate.
Need to prove that foregoing description only is the explanation that six laminates are carried out, structure of the present invention also goes for the HDI plate more than six layers.
More than be the explanation to the HDI plate of the present invention machinery back drill pore structure, be further described below in conjunction with the manufacture method of the HDI plate of 2 pairs of the present invention's machinery of accompanying drawing back drill pore structure.
The present invention also provides a kind of manufacture method of HDI plate of mechanical back drill pore structure, and it specifically comprises:
S1, the first copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence are pressed together;
S101, at the second copper foil layer of the first central layer first prepreg of fitting, cover the first copper foil layer at the first prepreg;
Before this, need to carry out the inner figure making to the second copper foil layer of the first central layer upside and the 3rd copper foil layer of downside, and above-mentioned the 3rd copper foil layer and the second copper foil layer carried out the internal layer etching and internal layer detects, then respectively the 3rd copper foil layer and the second copper foil layer are carried out the brown processing, to strengthen the adhesion between the second copper foil layer and the first prepreg, then corresponding to the first prepreg covering the first copper foil layer afterwards.
S102, paste the 3rd prepreg at the 5th copper foil layer of the second central layer, cover the 6th copper foil layer at the 3rd prepreg;
The 4th copper foil layer of the second central layer upside and the 5th copper foil layer of downside are carried out the inner figure making, and above-mentioned the 4th copper foil layer and the 5th copper foil layer carried out the internal layer etching and internal layer detects, then respectively the 4th copper foil layer and the 5th copper foil layer are carried out the brown processing, to strengthen the adhesion between the 5th copper foil layer and the 3rd prepreg, then corresponding to the 3rd prepreg covering the 6th copper foil layer afterwards.
S103, paste the 3rd prepreg at the 3rd copper foil layer of the first central layer, the 4th copper foil layer of the second central layer is corresponding to the 3rd prepreg and the applying of the 3rd copper foil layer;
To fitting by the 3rd prepreg through the 3rd copper foil layer after the brown, the 4th copper foil layer.
S104, the first copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence are pressed together.
S2, carry out mechanical back drill hole processing at the first copper foil layer, drilling depth reaches the 3rd copper foil layer, and makes the first copper foil layer, the corresponding connection with the 3rd copper foil layer of the second copper foil layer;
Carry out laser blind hole processing at the first copper foil layer simultaneously, drilling depth reaches the second copper foil layer, and connects the first copper foil layer and the second copper foil layer by this laser blind hole;
Then above-mentioned laser blind hole and mechanical back drill hole are carried out the hole metallization processing, make between the first copper foil layer and the second copper foil layer by the laser blind hole conducting; Make between the first copper foil layer, the second copper foil layer, the 3rd copper foil layer by the hole conducting of mechanical back drill, and the resin filling perforation is carried out in the laser blind hole behind the hole metallization and mechanical back drill hole electroplated, make the first copper foil layer thickness reach requirement, and it is carried out abrasive belt grinding, make line pattern.
S3, carry out mechanical back drill hole processing at the 6th copper foil layer, drilling depth reaches the 4th copper foil layer, and makes the 6th copper foil layer, the corresponding connection with the 4th copper foil layer of the 5th copper foil layer.
Carry out laser blind hole processing at the 6th copper foil layer, drilling depth reaches the 5th copper foil layer, and connects the 6th copper foil layer and the 5th copper foil layer by this laser blind hole;
Then above-mentioned laser blind hole and mechanical back drill hole are carried out the hole metallization processing, make between the 6th copper foil layer and the 5th copper foil layer by the laser blind hole conducting, and the laser blind hole behind the hole metallization and mechanical back drill hole carried out resin filling perforation, plating, make that the copper of the 6th copper foil layer is thick to reach requirement, carry out again abrasive belt grinding, make line pattern.
In above-mentioned laser drill and machine drilling, also need to drill through the hole, run through whole plate and the 6th copper foil layer conducting to realize the first copper foil layer, need also that accordingly this through hole is carried out hole metallization and process, realize the conducting of each copper foil layer.
Be the explanation of carrying out as example take six layers of mechanical back drill hole HDI plate among the present invention, the mode described in the present invention also can be applied to the making of multi-layer H DI plate, and technique scheme only is one of them preferred embodiment of the present invention.
The present invention with original the first copper foil layer to the second copper foil layer, the second copper foil layer to the three copper foil layers adopt the mode in laser stacking hole to replace by mechanical back drill hole, changed the structure of pressing, change an original central layer into two central layers, only need one step press, the production cost that reduces shortened on the production cycle.
Use first pressing again the method in property machinery back drill hole make, discharged because the pressing laser drill sheet material harmomegathus problem that causes of abrasive belt grinding flow process repeatedly repeatedly repeatedly guarantees interlayer alignment precision.
The present invention has avoided pressing repeatedly, repeatedly laser drill and repeatedly abrasive belt grinding and the sheet material harmomegathus problem that occurs, has guaranteed the aligning accuracy of interlayer.
More than be that HDI plate and preparation method thereof to a kind of mechanical back drill pore structure provided by the present invention is described in detail, used specific case herein structural principle of the present invention and execution mode are set forth, above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. the HDI plate of a mechanical back drill pore structure is characterized in that comprising the first central layer (7) and the second central layer (8), and described the first central layer (7) one sides are provided with the second copper foil layer (2), and opposite side is provided with the 3rd copper foil layer (3); The second central layer (8) one sides are provided with the 4th copper foil layer (4), opposite side is provided with the 5th copper foil layer (5), bonding by the second prepreg (10) between described the 3rd copper foil layer (3) and the 4th copper foil layer (4), be pasted with the first prepreg (9) on described the second copper foil layer (2), be coated with the first copper foil layer (1) on the first prepreg (9), be provided with the first mechanical back drill hole (13) that is connected with the second copper foil layer (2), the 3rd copper foil layer (3) respectively on the first copper foil layer (1); Be pasted with the 3rd prepreg (11) on described the 5th copper foil layer (5), be coated with the 6th copper foil layer (6) on described the 3rd prepreg (11), be provided with the second mechanical back drill hole (14) that is connected with the 5th copper foil layer (5), the 4th copper foil layer (4) respectively on the 6th copper foil layer (6).
2. the HDI plate of mechanical back drill pore structure according to claim 1 is characterized in that being provided with on described the first copper foil layer (1) the first laser blind hole (12) that is connected with the second copper foil layer (2).
3. the HDI plate of mechanical back drill pore structure according to claim 1 is characterized in that being provided with on described the 6th copper foil layer (6) the second laser blind hole (15) that is connected with the 5th copper foil layer (5).
4. the HDI plate of mechanical back drill pore structure according to claim 1, it is characterized in that described the first copper foil layer (1) is provided with runs through the first central layer (7) and the second central layer (8), and the through hole (16) that is connected with the second copper foil layer (2), the 3rd copper foil layer (3), the 4th copper foil layer (4), the 5th copper foil layer (5) and the 6th copper foil layer (6).
5. the HDI plate of mechanical back drill pore structure according to claim 1 is characterized in that described the first copper foil layer (1) is pressed together on the second copper foil layer (2) by the first prepreg (9); Described the 6th copper foil layer (6) is pressed together on the 5th copper foil layer (5) by the 3rd prepreg (11).
6. the HDI board manufacturing method of a mechanical back drill pore structure is characterized in that comprising:
S1, the first copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence are pressed together;
S2, carry out mechanical back drill hole processing at the first copper foil layer, drilling depth reaches the 3rd copper foil layer, and makes the first copper foil layer, the corresponding connection with the 3rd copper foil layer of the second copper foil layer;
S3, carry out mechanical back drill hole processing at the 6th copper foil layer, drilling depth reaches the 4th copper foil layer, and makes the 6th copper foil layer, the corresponding connection with the 4th copper foil layer of the 5th copper foil layer.
7. the HDI board manufacturing method of mechanical back drill pore structure according to claim 6 is characterized in that S1 specifically comprises:
S101, at the second copper foil layer of the first central layer first prepreg of fitting, cover the first copper foil layer at the first prepreg;
S102, paste the 3rd prepreg at the 5th copper foil layer of the second central layer, cover the 6th copper foil layer at the 3rd prepreg;
S103, paste the 3rd prepreg at the 3rd copper foil layer of the first central layer, the 4th copper foil layer of the second central layer is corresponding to the 3rd prepreg and the applying of the 3rd copper foil layer;
S104, the first copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence are pressed together.
8. the HDI board manufacturing method of mechanical back drill pore structure according to claim 6 is characterized in that S2 also comprises:
Carry out laser blind hole processing at the first copper foil layer, drilling depth reaches the second copper foil layer, and connects the first copper foil layer and the second copper foil layer by this laser blind hole;
Above-mentioned laser blind hole and mechanical back drill hole are carried out the hole metallization processing, make between the first copper foil layer and the second copper foil layer by the laser blind hole conducting; Make between the first copper foil layer, the second copper foil layer, the 3rd copper foil layer by the hole conducting of mechanical back drill.
9. the HDI board manufacturing method of mechanical back drill pore structure according to claim 6 is characterized in that S3 also comprises:
Carry out laser blind hole processing at the 6th copper foil layer, drilling depth reaches the 5th copper foil layer, and connects the 6th copper foil layer and the 5th copper foil layer by this laser blind hole;
Above-mentioned laser blind hole and mechanical back drill hole are carried out the hole metallization processing, make between the 6th copper foil layer and the 5th copper foil layer by the laser blind hole conducting; Make between the 6th copper foil layer, the 5th copper foil layer, the 4th copper foil layer by the hole conducting of mechanical back drill.
10. it is characterized in that: the laser blind hole behind the hole metallization and mechanical back drill hole are carried out the resin filling perforation according to claim 8 or the HDI board manufacturing method of 9 described mechanical back drill pore structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210469957.1A CN103025051B (en) | 2012-11-20 | 2012-11-20 | HDI plate of a kind of mechanical back drill pore structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210469957.1A CN103025051B (en) | 2012-11-20 | 2012-11-20 | HDI plate of a kind of mechanical back drill pore structure and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103025051A true CN103025051A (en) | 2013-04-03 |
| CN103025051B CN103025051B (en) | 2016-02-24 |
Family
ID=47973024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210469957.1A Active CN103025051B (en) | 2012-11-20 | 2012-11-20 | HDI plate of a kind of mechanical back drill pore structure and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103025051B (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260350A (en) * | 2013-05-07 | 2013-08-21 | 梅州市志浩电子科技有限公司 | Blind buried orifice plate laminating method and blind buried orifice plate manufactured with blind buried orifice plate laminating method |
| CN104378932A (en) * | 2013-08-14 | 2015-02-25 | 北大方正集团有限公司 | Manufacturing method of multi-layer PCB and multi-layer PCB |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
| CN104869763A (en) * | 2014-02-25 | 2015-08-26 | 深圳崇达多层线路板有限公司 | High-density interconnected PCB and processing method thereof |
| CN105407657A (en) * | 2014-09-16 | 2016-03-16 | 深南电路有限公司 | High density interconnect circuit board and processing method thereof |
| CN105491817A (en) * | 2014-09-16 | 2016-04-13 | 深南电路有限公司 | High-density interconnection circuit board and processing method therefor |
| CN105873381A (en) * | 2015-11-06 | 2016-08-17 | 珠海市创元开耀电子材料有限公司 | HDI circuit board and manufacture method thereof |
| CN106061119A (en) * | 2016-07-06 | 2016-10-26 | 四川海英电子科技有限公司 | Method for manufacturing multi-stage random-layer blind holes |
| CN106211640A (en) * | 2016-08-12 | 2016-12-07 | 江门崇达电路技术有限公司 | The manufacture method of high density interconnecting board |
| WO2017156678A1 (en) * | 2016-03-14 | 2017-09-21 | 深圳崇达多层线路板有限公司 | Method for manufacturing stacked holes of circuit board |
| CN107529293A (en) * | 2017-09-18 | 2017-12-29 | 广东欧珀移动通信有限公司 | A kind of mobile terminal, multilayer PCB circuit board and its manufacture method |
| CN107787130A (en) * | 2016-08-24 | 2018-03-09 | 北大方正集团有限公司 | The manufacture method of multilayer circuit board |
| CN108040428A (en) * | 2017-12-12 | 2018-05-15 | 惠州市金百泽电路科技有限公司 | The production method that a kind of high-order HDI folds the rigid-flexible combined circuit plate in hole |
| CN108260303A (en) * | 2017-12-05 | 2018-07-06 | 深圳崇达多层线路板有限公司 | The production method that laser drill and back drill hole are filled out in a kind of while plating |
| CN111757602A (en) * | 2020-06-02 | 2020-10-09 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of blind hole |
| CN114340223A (en) * | 2021-12-08 | 2022-04-12 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer board based on high aspect ratio selective semiconductor through hole |
| CN114423161A (en) * | 2021-12-27 | 2022-04-29 | 生益电子股份有限公司 | PCB processing method and PCB |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080042248A1 (en) * | 2006-08-21 | 2008-02-21 | Ravi Nalla | Method of enabling solder deposition on a substrate and electronic package formed thereby |
| CN101640983A (en) * | 2009-09-10 | 2010-02-03 | 深南电路有限公司 | Processing method of printing circuit board blind hole |
| CN102149253A (en) * | 2010-12-29 | 2011-08-10 | 东莞生益电子有限公司 | Method for making PCB (Printed Circuit Board) by laminating high-frequency materials and common FR4 materials in one step |
| CN102427685A (en) * | 2011-11-22 | 2012-04-25 | 深圳崇达多层线路板有限公司 | Manufacturing process of HDI (High Density Interconnection) board |
| CN102740584A (en) * | 2011-03-31 | 2012-10-17 | 深南电路有限公司 | Printed circuit board and processing method thereof |
-
2012
- 2012-11-20 CN CN201210469957.1A patent/CN103025051B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080042248A1 (en) * | 2006-08-21 | 2008-02-21 | Ravi Nalla | Method of enabling solder deposition on a substrate and electronic package formed thereby |
| CN101640983A (en) * | 2009-09-10 | 2010-02-03 | 深南电路有限公司 | Processing method of printing circuit board blind hole |
| CN102149253A (en) * | 2010-12-29 | 2011-08-10 | 东莞生益电子有限公司 | Method for making PCB (Printed Circuit Board) by laminating high-frequency materials and common FR4 materials in one step |
| CN102740584A (en) * | 2011-03-31 | 2012-10-17 | 深南电路有限公司 | Printed circuit board and processing method thereof |
| CN102427685A (en) * | 2011-11-22 | 2012-04-25 | 深圳崇达多层线路板有限公司 | Manufacturing process of HDI (High Density Interconnection) board |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260350A (en) * | 2013-05-07 | 2013-08-21 | 梅州市志浩电子科技有限公司 | Blind buried orifice plate laminating method and blind buried orifice plate manufactured with blind buried orifice plate laminating method |
| CN104378932A (en) * | 2013-08-14 | 2015-02-25 | 北大方正集团有限公司 | Manufacturing method of multi-layer PCB and multi-layer PCB |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
| CN104869763A (en) * | 2014-02-25 | 2015-08-26 | 深圳崇达多层线路板有限公司 | High-density interconnected PCB and processing method thereof |
| CN104869763B (en) * | 2014-02-25 | 2018-06-15 | 深圳崇达多层线路板有限公司 | High density interconnects printed board and its processing method |
| CN105407657A (en) * | 2014-09-16 | 2016-03-16 | 深南电路有限公司 | High density interconnect circuit board and processing method thereof |
| CN105491817A (en) * | 2014-09-16 | 2016-04-13 | 深南电路有限公司 | High-density interconnection circuit board and processing method therefor |
| CN105491817B (en) * | 2014-09-16 | 2018-06-12 | 深南电路有限公司 | High-density interconnected circuit board and its processing method |
| CN105407657B (en) * | 2014-09-16 | 2019-03-01 | 深南电路有限公司 | High-density interconnected circuit board and its processing method |
| CN105873381A (en) * | 2015-11-06 | 2016-08-17 | 珠海市创元开耀电子材料有限公司 | HDI circuit board and manufacture method thereof |
| CN105873381B (en) * | 2015-11-06 | 2019-04-09 | 武汉光谷创元电子有限公司 | HDI circuit board and its manufacturing method |
| WO2017156678A1 (en) * | 2016-03-14 | 2017-09-21 | 深圳崇达多层线路板有限公司 | Method for manufacturing stacked holes of circuit board |
| CN106061119A (en) * | 2016-07-06 | 2016-10-26 | 四川海英电子科技有限公司 | Method for manufacturing multi-stage random-layer blind holes |
| CN106211640A (en) * | 2016-08-12 | 2016-12-07 | 江门崇达电路技术有限公司 | The manufacture method of high density interconnecting board |
| CN107787130B (en) * | 2016-08-24 | 2019-11-08 | 北大方正集团有限公司 | The manufacturing method of multilayer circuit board |
| CN107787130A (en) * | 2016-08-24 | 2018-03-09 | 北大方正集团有限公司 | The manufacture method of multilayer circuit board |
| CN107529293A (en) * | 2017-09-18 | 2017-12-29 | 广东欧珀移动通信有限公司 | A kind of mobile terminal, multilayer PCB circuit board and its manufacture method |
| CN108260303A (en) * | 2017-12-05 | 2018-07-06 | 深圳崇达多层线路板有限公司 | The production method that laser drill and back drill hole are filled out in a kind of while plating |
| CN108040428A (en) * | 2017-12-12 | 2018-05-15 | 惠州市金百泽电路科技有限公司 | The production method that a kind of high-order HDI folds the rigid-flexible combined circuit plate in hole |
| CN108040428B (en) * | 2017-12-12 | 2020-04-24 | 惠州市金百泽电路科技有限公司 | Manufacturing method of high-order HDI (high Density interconnection) laminated hole rigid-flex circuit board |
| CN111757602A (en) * | 2020-06-02 | 2020-10-09 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of blind hole |
| CN114340223A (en) * | 2021-12-08 | 2022-04-12 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer board based on high aspect ratio selective semiconductor through hole |
| CN114340223B (en) * | 2021-12-08 | 2023-11-14 | 江苏普诺威电子股份有限公司 | Manufacturing method of high aspect ratio-based selective semi-conductive hole multilayer board |
| CN114423161A (en) * | 2021-12-27 | 2022-04-29 | 生益电子股份有限公司 | PCB processing method and PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103025051B (en) | 2016-02-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103025051B (en) | HDI plate of a kind of mechanical back drill pore structure and preparation method thereof | |
| CN102548186A (en) | Hexamethylene diisocyanate (HDI) plate with symmetrically pressed structure and manufacturing method thereof | |
| CN104168711B (en) | The compression method of cavity circuit plate and its preparation method of pressing structure | |
| CN102625604B (en) | Manufacturing method for high-density interconnection printed board | |
| CN103260350B (en) | Blind buried via hole plate compression method | |
| CN101662897B (en) | Manufacturing method for multilayer stacking printed wiring board | |
| CN104168727B (en) | Multi-layer PCB board pressing plate manufacture method | |
| CN106211638A (en) | A kind of processing method of ultra-thin multilayer printed circuit board | |
| CN110602900A (en) | Multilayer and multistage HDI plate manufacturing method and device | |
| CN109496073A (en) | A kind of more process for pressing of HDI | |
| US20100038125A1 (en) | Additional functionality single lamination stacked via with plated through holes for multilayer printed circuit boards | |
| CN108235602A (en) | The processing method that second order buries copper billet circuit board | |
| CN101699930A (en) | Glue filling and laminating method of circuit board | |
| CN104202904B (en) | The pressing structure of the circuit board with lateral grooves and the preparation method of circuit board | |
| CN106376176A (en) | Printed circuit board and fabrication method thereof | |
| TW201743671A (en) | Manufacturing method of high-density multilayer board | |
| CN102869208A (en) | Method for controlling depth of two-sided inserting blind hole of printed circuit board | |
| CN219876245U (en) | circuit board | |
| CN103179785A (en) | Circuit board and manufacture method thereof | |
| CN103582321B (en) | Multilayer circuit board and preparation method thereof | |
| CN104159397B (en) | The pressing structure of cavity PCB plate and the compression method of cavity PCB plate | |
| CN105491817A (en) | High-density interconnection circuit board and processing method therefor | |
| CN103369872A (en) | Method for laminating multilayer printed circuit board | |
| CN107454761A (en) | High density increasing layer multi-layer board manufacturing method | |
| CN102281711A (en) | Laminated circuit board and board producing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |