CN103025051B - HDI plate of a kind of mechanical back drill pore structure and preparation method thereof - Google Patents

HDI plate of a kind of mechanical back drill pore structure and preparation method thereof Download PDF

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Publication number
CN103025051B
CN103025051B CN201210469957.1A CN201210469957A CN103025051B CN 103025051 B CN103025051 B CN 103025051B CN 201210469957 A CN201210469957 A CN 201210469957A CN 103025051 B CN103025051 B CN 103025051B
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copper foil
foil layer
layer
prepreg
mechanical
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CN103025051A (en
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黄海蛟
姜雪飞
李学明
叶应才
朱拓
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Shenzhen Suntak Multilayer PCB Co Ltd
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Shenzhen Suntak Multilayer PCB Co Ltd
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Abstract

Present invention also offers HDI plate of a kind of mechanical back drill pore structure and preparation method thereof, comprising: S1, the first copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence to be pressed together; S2, on the first copper foil layer, carry out mechanical back drill hole machined, drilling depth reaches the 3rd copper foil layer, and makes that the first copper foil layer, the second copper foil layer are corresponding with the 3rd copper foil layer to be connected; S3, on the 6th copper foil layer, carry out mechanical back drill hole machined, drilling depth reaches the 4th copper foil layer, and makes that the 6th copper foil layer, the 5th copper foil layer are corresponding with the 4th copper foil layer to be connected.The present invention adopts two pieces of central layers first lamination, then at the production method in disposable machine uniformly back drill hole, greatly shorten the production cycle of HDI plate, reduce production cost, avoid repeatedly pressing, repeatedly laser drill and repeatedly abrasive belt grinding and the sheet material harmomegathus problem occurred simultaneously, ensure that the aligning accuracy of interlayer.Compared with prior art, it is simple that the present invention has Making programme, and production efficiency is high, low cost and other advantages.

Description

HDI plate of a kind of mechanical back drill pore structure and preparation method thereof
Technical field:
The invention belongs to printed wiring board manufacture technology field, what be specifically related to is HDI plate of a kind of mechanical back drill pore structure and preparation method thereof.
Background technology:
HDI wiring board also claims high density interconnect plate, is the circuit board using a kind of circuit distribution density of micro-blind buried via hole technology higher, its have can reduce multi-layer PCB board production cost, increase the advantages such as line density, reliability are high, good electrical property.
Current HDI wiring board mainly adopts laser drill, and its Making programme is: → first time abrasive belt grinding → first time inner figure → second time pressing → second time blind hole windowing making → laser drill for the second time → second time filling perforation plating → abrasive belt grinding → second time graphic making is for the second time electroplated in lamination for the first time → first time blind hole windowing making → first time laser drill → first time filling perforation.
For six layers of laser drill HDI plate, first inner figure making is carried out to the ground floor of the upper and lower both sides of central layer and second layer Copper Foil, the ground floor then after brown process and second layer Copper Foil paste prepreg respectively; Corresponding overlays third layer and the 4th layer of Copper Foil on prepreg, carry out first time lamination, form four laminates, third layer afterwards after pressing and the 4th layer of Copper Foil carry out blind hole windowing making or Direct Laser boring, then hole metallization and filling perforation plating is carried out, make third layer and the conducting of ground floor Copper Foil, the 4th layer and the conducting of second layer Copper Foil.
Inner figure making is carried out to third layer and the 4th layer of Copper Foil, repeat above-mentioned steps, third layer is pasted prepreg and layer 5 Copper Foil, 4th layer of upper subsides prepreg and layer 6 Copper Foil, carry out second time pressing, and on layer 5 Copper Foil, layer 6 Copper Foil, carry out blind hole windowing making or Direct Laser boring, then hole metallization and filling perforation plating is carried out, make layer 5 and the conducting of third layer Copper Foil, 4th layer and the conducting of layer 6 Copper Foil, finally then carry out graphic making to layer 5, layer 6 Copper Foil.
Multi-layer sheet for making more than six layers only need repeat above-mentioned steps, and it is in requisition for repeatedly pressing and repeatedly laser drill, and this mode exists following shortcoming:
One, repeatedly pressing and repeatedly laser drill, comparatively large on the harmomegathus impact of each copper foil layer, easily cause the inclined problem of layer;
Two, repeatedly pressing and repeatedly laser drill, Making programme more complicated, not only production efficiency is lower, and cost of manufacture is higher.
Summary of the invention:
For this reason, the object of the present invention is to provide HDI plate of a kind of mechanical back drill pore structure and preparation method thereof, to solve in current laser drill HDI plate manufacturing process, because of needs repeatedly pressing and repeatedly laser drill, and cause the problem that layer is inclined, Making programme is complicated, production efficiency is low and cost of manufacture is high that occurs.
For achieving the above object, the present invention is mainly by the following technical solutions:
A HDI plate for mechanical back drill pore structure, comprises the first central layer and the second central layer, and described first central layer side is provided with the second copper foil layer, and opposite side is provided with the 3rd copper foil layer; Second central layer side is provided with the 4th copper foil layer, opposite side is provided with the 5th copper foil layer, described 3rd copper foil layer is bonding by the second prepreg with between the 4th copper foil layer, described second copper foil layer is pasted with the first prepreg, first prepreg is coated with the first copper foil layer, the first copper foil layer is provided with the first mechanical back drill hole be connected with the second copper foil layer, the 3rd copper foil layer respectively; Described 5th copper foil layer is pasted with the 3rd prepreg, described 3rd prepreg is coated with the 6th copper foil layer, the 6th copper foil layer is provided with the second mechanical back drill hole be connected with the 5th copper foil layer, the 4th copper foil layer respectively.
Preferably, described first copper foil layer is provided with the first laser blind hole be connected with the second copper foil layer.
Preferably, described 6th copper foil layer is provided with the second laser blind hole be connected with the 5th copper foil layer.
Preferably, described first copper foil layer is provided with and runs through the first central layer and the second central layer, and the through hole be connected with the second copper foil layer, the 3rd copper foil layer, the 4th copper foil layer, the 5th copper foil layer and the 6th copper foil layer.
Preferably, described first copper foil layer is pressed together on the second copper foil layer by the first prepreg; Described 6th copper foil layer is pressed together on the 5th copper foil layer by the 3rd prepreg.
In addition, present invention also offers a kind of HDI board manufacturing method of mechanical back drill pore structure, comprising:
S1, the first copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence to be pressed together;
S2, on the first copper foil layer, carry out mechanical back drill hole machined, drilling depth reaches the 3rd copper foil layer, and makes that the first copper foil layer, the second copper foil layer are corresponding with the 3rd copper foil layer to be connected;
S3, on the 6th copper foil layer, carry out mechanical back drill hole machined, drilling depth reaches the 4th copper foil layer, and makes that the 6th copper foil layer, the 5th copper foil layer are corresponding with the 4th copper foil layer to be connected.
Preferably, S1 specifically comprises:
S101, the first prepreg of fitting on the second copper foil layer of the first central layer, the first prepreg covers the first copper foil layer;
S102, on the 5th copper foil layer of the second central layer paste the 3rd prepreg, on the 3rd prepreg cover the 6th copper foil layer;
S103, on the 3rd copper foil layer of the first central layer, paste the 3rd prepreg, the 4th copper foil layer correspondence of the second central layer is fitted by the 3rd prepreg and the 3rd copper foil layer;
S104, the first copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence to be pressed together.
Preferably, S2 also comprises:
First copper foil layer carries out laser blind hole processing, and drilling depth reaches the second copper foil layer, and connects the first copper foil layer and the second copper foil layer by this laser blind hole;
Hole metallization process is carried out to above-mentioned laser blind hole and mechanical back drill hole, makes between the first copper foil layer and the second copper foil layer by laser blind hole conducting; Make between the first copper foil layer, the second copper foil layer, the 3rd copper foil layer by mechanical back drill hole conducting.
Preferably, S3 also comprises:
6th copper foil layer carries out laser blind hole processing, and drilling depth reaches the 5th copper foil layer, and connects the 6th copper foil layer and the 5th copper foil layer by this laser blind hole;
Hole metallization process is carried out to above-mentioned laser blind hole and mechanical back drill hole, makes between the 6th copper foil layer and the 5th copper foil layer by laser blind hole conducting; Make between the 6th copper foil layer, the 5th copper foil layer, the 4th copper foil layer by mechanical back drill hole conducting.
Preferably, resin filling perforation is carried out to the laser blind hole after hole metallization and mechanical back drill hole.
The HDI plate of mechanical back drill pore structure of the present invention, adopt two pieces of central layers first lamination, then at the production method in disposable machine uniformly back drill hole, greatly shorten the production cycle of HDI plate, reduce production cost, avoid repeatedly pressing, repeatedly laser drill and repeatedly abrasive belt grinding and the sheet material harmomegathus problem occurred simultaneously, ensure that the aligning accuracy of interlayer.Compared with prior art, it is simple that the present invention has Making programme, and production efficiency is high, low cost and other advantages.
Accompanying drawing illustrates:
Fig. 1 is the cutaway view of the HDI plate of the present invention's machinery back drill pore structure.
Fig. 2 is the manufacture method flow chart of the HDI plate of the present invention's machinery back drill pore structure.
Identifier declaration in figure: the first copper foil layer 1, second copper foil layer 2, the 3rd copper foil layer 3, the 4th copper foil layer 4, the 5th copper foil layer 5, the 6th copper foil layer 6, first central layer 7, second central layer 8, first prepreg 9, second prepreg 10, the 3rd prepreg 11, first laser blind hole 12, first mechanical back drill hole 13, second mechanical back drill hole 14, second laser blind hole 15, through hole 16.
Embodiment:
For setting forth thought of the present invention and object, below in conjunction with the drawings and specific embodiments, the present invention is described further.
Shown in Figure 1, Fig. 1 is the cutaway view of the HDI plate of the present invention's machinery back drill pore structure.The invention provides a kind of HDI plate of mechanical back drill pore structure, comprise the first central layer 7 and the second central layer 8, be provided with the second copper foil layer 2 on the upside of described first central layer 7, downside is provided with the 3rd copper foil layer 3; The upside of the second central layer 8 is provided with the 4th copper foil layer 4, be arranged with the 5th copper foil layer 5, described 3rd copper foil layer 3 is bonding by the second prepreg 10 with between the 4th copper foil layer 4, described second copper foil layer 2 is pasted with the first prepreg 9, first prepreg 9 is coated with the first copper foil layer 1, described first copper foil layer 1 is pressed together on the second copper foil layer 2 by the first prepreg 9; 5th copper foil layer 5 is pasted with the 3rd prepreg 11, described 3rd prepreg 11 is coated with the 6th copper foil layer 6, described 6th copper foil layer 6 is pressed together on the 5th copper foil layer 5 by the 3rd prepreg 11; And the first central layer 7 and the second central layer 8 are pressed together by the second prepreg 10 correspondence, and all by one step press between the first copper foil layer 1 and the second copper foil layer 2, between the 3rd copper foil layer 3 and the 4th copper foil layer 4 and between the 5th copper foil layer 5 and the 6th copper foil layer 6.
First copper foil layer 1 is provided with the first laser blind hole 12 and the first mechanical back drill hole 13, and equal passing hole metalized in the first laser blind hole 12 and the first mechanical back drill hole 13, described first laser blind hole 12 is connected with the conducting of the second copper foil layer 2 for realizing the first copper foil layer 1; Described first mechanical back drill hole 13 connects for the conducting realized between the first copper foil layer 1, second copper foil layer 2 and the 3rd copper foil layer 3.
6th copper foil layer 6 is provided with the second laser blind hole 15 and the second mechanical back drill hole 14, and equal passing hole metalized in the second laser blind hole 15 and the second mechanical back drill hole 14, described second laser blind hole 15 is connected with the conducting of the 5th copper foil layer 5 for realizing the 6th copper foil layer 6; Described second mechanical back drill hole 14 connects for the conducting realized between the 6th copper foil layer 6, the 5th copper foil layer 5 and the 4th copper foil layer 4.
In addition, also be provided with the through hole 16 being applied in the first copper foil layer 1, second copper foil layer 2, the 3rd copper foil layer 3, the 4th copper foil layer 4, the 5th copper foil layer 5, the 6th copper foil layer 6, first central layer 7 and the second central layer 8, carry out hole metallization process in this through hole 16, the conducting that can be realized between the first copper foil layer 1, second copper foil layer 2, the 3rd copper foil layer 3, the 4th copper foil layer 4, the 5th copper foil layer 5, the 6th copper foil layer 6 by through hole is connected.
After between the present invention first copper foil layer 1, first central layer 7, second central layer 8 and the 6th copper foil layer 6, pressing completes, back drill hole machined is carried out by the rig or gong machine with severity control function, the copper sheet of the 3rd copper foil layer is got into from the first copper foil layer in hole or gets into the copper sheet of the 4th copper foil layer from the 6th copper foil layer, again through heavy copper plate electric, by back drill hole hole metallization, then by vacuum resin consent, back drill stopple is full, the conducting of whole HDI plate can be completed.
It should be noted that, foregoing description is only the explanation carried out six laminates, and structure of the present invention also goes for the HDI plate of more than six layers.
Be more than the explanation of the HDI plate to the present invention's machinery back drill pore structure, the manufacture method below in conjunction with the HDI plate of accompanying drawing 2 pairs of the present invention's machinery back drill pore structures is further described.
Present invention also offers a kind of manufacture method of HDI plate of mechanical back drill pore structure, it specifically comprises:
S1, the first copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence to be pressed together;
S101, the first prepreg of fitting on the second copper foil layer of the first central layer, the first prepreg covers the first copper foil layer;
Before this, the 3rd copper foil layer of the second copper foil layer on the upside of to the first central layer and downside is needed to carry out inner figure making, and internal layer etching and internal layer detection are carried out to above-mentioned 3rd copper foil layer and the second copper foil layer, then respectively brown process is carried out to the 3rd copper foil layer and the second copper foil layer, to strengthen the adhesion between the second copper foil layer and the first prepreg, then correspondence covers the first copper foil layer on the first prepreg afterwards.
S102, on the 5th copper foil layer of the second central layer paste the 3rd prepreg, on the 3rd prepreg cover the 6th copper foil layer;
Inner figure making is carried out to the 5th copper foil layer of the 4th copper foil layer on the upside of the second central layer and downside, and internal layer etching and internal layer detection are carried out to above-mentioned 4th copper foil layer and the 5th copper foil layer, then respectively brown process is carried out to the 4th copper foil layer and the 5th copper foil layer, to strengthen the adhesion between the 5th copper foil layer and the 3rd prepreg, then correspondence covers the 6th copper foil layer on the 3rd prepreg afterwards.
S103, on the 3rd copper foil layer of the first central layer, paste the 3rd prepreg, the 4th copper foil layer correspondence of the second central layer is fitted by the 3rd prepreg and the 3rd copper foil layer;
To the 3rd copper foil layer after brown, the 4th copper foil layer by the 3rd prepreg laminating.
S104, the first copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence to be pressed together.
S2, on the first copper foil layer, carry out mechanical back drill hole machined, drilling depth reaches the 3rd copper foil layer, and makes that the first copper foil layer, the second copper foil layer are corresponding with the 3rd copper foil layer to be connected;
On the first copper foil layer, carry out laser blind hole processing, drilling depth reaches the second copper foil layer, and connects the first copper foil layer and the second copper foil layer by this laser blind hole simultaneously;
Then hole metallization process is carried out to above-mentioned laser blind hole and mechanical back drill hole, make between the first copper foil layer and the second copper foil layer by laser blind hole conducting; Make between the first copper foil layer, the second copper foil layer, the 3rd copper foil layer by mechanical back drill hole conducting, and resin filling perforation plating is carried out to the laser blind hole after hole metallization and mechanical back drill hole, make the first copper foil layer thickness reach requirement, and abrasive belt grinding is carried out to it, make line pattern.
S3, on the 6th copper foil layer, carry out mechanical back drill hole machined, drilling depth reaches the 4th copper foil layer, and makes that the 6th copper foil layer, the 5th copper foil layer are corresponding with the 4th copper foil layer to be connected.
6th copper foil layer carries out laser blind hole processing, and drilling depth reaches the 5th copper foil layer, and connects the 6th copper foil layer and the 5th copper foil layer by this laser blind hole;
Then hole metallization process is carried out to above-mentioned laser blind hole and mechanical back drill hole, make between the 6th copper foil layer and the 5th copper foil layer by laser blind hole conducting, and resin filling perforation, plating are carried out to the laser blind hole after hole metallization and mechanical back drill hole, make that the copper of the 6th copper foil layer is thick reaches requirement, carry out abrasive belt grinding again, make line pattern.
While above-mentioned laser drill and machine drilling, also need holes drilled through, run through whole plate and the 6th copper foil layer conducting to realize the first copper foil layer, also need accordingly to carry out hole metallization process to this through hole, realize the conducting of each copper foil layer.
Be the explanation carried out for six layers of mechanical back drill hole HDI plate in the present invention, the mode described in the present invention also can be applied to the making of multi-layer H DI plate, and technique scheme is only one of them preferred embodiment of the present invention.
The present invention by original first copper foil layer to the second copper foil layer, second copper foil layer adopts the mode in laser stacking hole to be replaced by mechanical back drill hole to the 3rd copper foil layer, change the structure of pressing, change an original central layer into two central layers, only need one step press, the production cost reduced, shortened on the production cycle.
Use the method in first pressing property machinery back drill hole again to make, discharged due to the repeatedly pressing repeatedly laser drill repeatedly sheet material harmomegathus problem that causes of abrasive belt grinding flow process, ensured interlayer alignment precision.
Present invention, avoiding repeatedly pressing, repeatedly laser drill and repeatedly abrasive belt grinding and the sheet material harmomegathus problem occurred, ensure that the aligning accuracy of interlayer.
More than that HDI plate of a kind of mechanical back drill pore structure provided by the present invention and preparation method thereof is described in detail, apply specific case herein to set forth structural principle of the present invention and execution mode, above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.

Claims (2)

1. the HDI plate of a mechanical back drill pore structure, it is characterized in that comprising the first central layer (7) and the second central layer (8), described first central layer (7) side is provided with the second copper foil layer (2), and opposite side is provided with the 3rd copper foil layer (3), second central layer (8) side is provided with the 4th copper foil layer (4), opposite side is provided with the 5th copper foil layer (5), described 3rd copper foil layer (3) is bonding by the second prepreg (10) with between the 4th copper foil layer (4), described second copper foil layer (2) is pasted with the first prepreg (9), first prepreg (9) is coated with the first copper foil layer (1), first copper foil layer (1) is provided with respectively with the second copper foil layer (2), the first mechanical back drill hole (13) that 3rd copper foil layer (3) connects, described first copper foil layer (1) is provided with the first laser blind hole (12) be connected with the second copper foil layer (2), described 5th copper foil layer (5) is pasted with the 3rd prepreg (11), described 3rd prepreg (11) is coated with the 6th copper foil layer (6), 6th copper foil layer (6) is provided with the second mechanical back drill hole (14) be connected with the 5th copper foil layer (5), the 4th copper foil layer (4) respectively, described 6th copper foil layer (6) is provided with the second laser blind hole (15) be connected with the 5th copper foil layer (5), wherein, described HDI plate also comprises and runs through the first central layer (7), the second central layer (8), the first prepreg (9), the second prepreg (10), the 3rd prepreg (11), the first copper foil layer (1) to the through hole of the 6th copper foil layer (6), and this through hole passing hole metalized makes the first copper foil layer (1) be connected with the conducting between the second copper foil layer (2), the 3rd copper foil layer (3), the 4th copper foil layer (4), the 5th copper foil layer (5) and the 6th copper foil layer (6), and described first copper foil layer (1) is pressed together on the second copper foil layer (2) by the first prepreg (9), described 6th copper foil layer (6) is pressed together on the 5th copper foil layer (5) by the 3rd prepreg (11).
2. a HDI board manufacturing method for mechanical back drill pore structure, is characterized in that comprising:
S1, the first prepreg of fitting on the second copper foil layer of the first central layer, the first prepreg covers the first copper foil layer; 5th copper foil layer of the second central layer pastes the 3rd prepreg, the 3rd prepreg covers the 6th copper foil layer; 3rd copper foil layer of the first central layer pastes the second prepreg, the 4th copper foil layer correspondence of the second central layer is fitted by the second prepreg and the 3rd copper foil layer; First copper foil layer, the first central layer, the second central layer and the 6th copper foil layer correspondence are pressed together;
S2, on the first copper foil layer, carry out laser blind hole processing, drilling depth reaches the second copper foil layer, and connects the first copper foil layer and the second copper foil layer by this laser blind hole; First copper foil layer carries out mechanical back drill hole machined, makes drilling depth reach the 3rd copper foil layer, hole metallization process is carried out to above-mentioned laser blind hole and mechanical back drill hole; And resin filling perforation is carried out to the laser blind hole after hole metallization and mechanical back drill hole, make between the first copper foil layer and the second copper foil layer by laser blind hole conducting; Make between the first copper foil layer, the second copper foil layer, the 3rd copper foil layer by mechanical back drill hole conducting;
S3, on the 6th copper foil layer, carry out laser blind hole processing, drilling depth reaches the 5th copper foil layer, and connects the 6th copper foil layer and the 5th copper foil layer by this laser blind hole; 6th copper foil layer carries out mechanical back drill hole machined, drilling depth is made to reach the 4th copper foil layer, hole metallization process is carried out to above-mentioned laser blind hole and mechanical back drill hole, and resin filling perforation is carried out to the laser blind hole after hole metallization and mechanical back drill hole, make between the 6th copper foil layer and the 5th copper foil layer by laser blind hole conducting; Make between the 6th copper foil layer, the 5th copper foil layer, the 4th copper foil layer by mechanical back drill hole conducting.
CN201210469957.1A 2012-11-20 2012-11-20 HDI plate of a kind of mechanical back drill pore structure and preparation method thereof Active CN103025051B (en)

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