CN102427685A - Manufacturing process of HDI (High Density Interconnection) board - Google Patents
Manufacturing process of HDI (High Density Interconnection) board Download PDFInfo
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- CN102427685A CN102427685A CN2011103731999A CN201110373199A CN102427685A CN 102427685 A CN102427685 A CN 102427685A CN 2011103731999 A CN2011103731999 A CN 2011103731999A CN 201110373199 A CN201110373199 A CN 201110373199A CN 102427685 A CN102427685 A CN 102427685A
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- circuit board
- multilayer circuit
- copper
- board
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Abstract
The invention relates to a manufacturing process of an HDI (High Density Interconnection) board. The manufacturing process comprises the following steps of: A, carrying out browning treatment on a multilayer circuit board so that a browned film is formed on the surface of a copper foil layer, and carrying out laser hole drilling on the surface of the copper foil to form laser blind holes; B, carrying out hole drilling on the multilayer circuit board through a drill bit to form mechanical drill holes; C, carrying out outer-layer copper precipitation on the multilayer circuit board so that copper layers are formed in the laser blind holes and the mechanical drill holes, and carrying out electroplating treatment on the multilayer circuit board, so that the copper coppers in the laser blind holes and the mechanical drill holes are thickened; and D, carrying out outer-layer pattern making on the multilayer circuit board, and carrying out pattern electroplating, outer-layer etching, silk-screen mask soldering and surface treatment to obtain the HDI board as a finished product. Compared with the prior art, the manufacturing process disclosed by the invention has the advantages of avoiding processes, such as outer-layer copper precipitation, board electroplating, outer-layer pattern hole-electroplating, porefilling electroplating, mold stripping, board grinding with an abrasive belt and the like which are adopted after laser hole drilling, greatly shortening production cycle and reducing production cost; meanwhile, according to the manufacturing process disclosed by the invention, because the process of grinding the board with the abrasive belt is not required, size stability of the circuit board is relatively better, and the circuit board cannot deform.
Description
Technical field:
The invention belongs to the wiring board manufacture technology field, what be specifically related to is a kind of making flow process of HDI plate.
Background technology:
The HDI circuit board is also claimed the high density interconnect plate, is meant the aperture below 6mil, the ring of orifice ring footpath (Hole Pad) below 0.25mm, contactor density 130 points/square the time more than, live width/spacing is the printed circuit board (PCB) below the 3mil/3mil.The HDI circuit board can reduce production cost, the increase line density of multi-layer PCB board, has advantages such as reliability height, good electrical property.
The production procedure of HDI circuit board at present is: open material, and------------------filling perforation is electroplated 2---and moved back film, and-----------------FQC---packing--is tested--in moulding to graphic plating to outer heavy copper 2---lamina rara externa electricity 2---outer graphics to the abrasive band nog plate to outer plating hole pattern to brown 2--laser drill to lamination to internal layer AOI---brown to Nei layer pattern after the moulding in surface treatment in silk-screen resistance weldering in outer etching in outer boring for outer heavy copper, plate to take off the brown layer in the internal layer etching; In this flow process; To sinking copper behind the HDI circuit board laser drill; Make and form the copper layer in the laser blind hole; Make between outer copper foil and the core material and realize electric interconnection; Again the HDI circuit board is electroplated afterwards, made the copper layer thickening in the laser blind hole; Then chew through brill again and carry out skin boring, wiring board is sunk the copper electroplating processes.
And since the client to the improving constantly of laser blind hole reliability requirement, outer laser blind hole all require all to fill up or degree of filling up greater than 85%, cause blind hole filling perforation and line pattern to separate and make, so just increased production procedure and production cycle; And also need the abrasive band nog plate after the filling perforation, and make the wiring board distortion easily, the back operation is brought quality hidden danger.
Summary of the invention:
In view of above problem, the object of the present invention is to provide a kind of making flow process of HDI plate, with solve that present HDI circuit board all fills up because of outer laser blind hole requirement or degree of filling up greater than 85% o'clock, existing production procedure increases and elongated problem of production cycle.
For realizing above-mentioned purpose, the present invention mainly adopts following technical scheme:
A kind of making flow process of HDI plate comprises step:
A, multilayer circuit board is carried out brown handle, make the copper foil layer surface form the brown film, and copper foil surface is carried out laser drill, form laser blind hole;
B, chew through brill multilayer circuit board is holed, form machine drilling;
C, above-mentioned multilayer circuit board is carried out the heavy copper of skin, make to form the copper layer in laser blind hole, the machine drilling, afterwards multilayer circuit board is carried out electroplating processes, make above-mentioned Kong Zhongtong layer thickening;
D, above-mentioned multilayer circuit board is carried out outer graphics make, and carry out graphic plating, outer etching, silk-screen resistance weldering, surface treatment, obtain the HDI board finished product.
Wherein include before the steps A:
Select copper-clad plate to open material, the internal layer graphic making is carried out in the copper-clad plate of splitting behind the material, carries out the internal layer etching afterwards; On the inner plating face, form circuitous pattern; Then the wiring board upper and lower surface is covered prepreg and Copper Foil respectively, carry out lamination, obtain multilayer circuit board.
Wherein laser blind hole penetrates two copper foil layers and the prepreg up and down of multilayer circuit board in the steps A, does not penetrate inner plating.
Wherein machine drilling penetrates two copper foil layers and the prepreg up and down of multilayer circuit board among the step B, and penetrates inner plating.
Wherein in the steps A multilayer circuit board is carried out brown and handle, make the copper foil layer surface form the brown film, the absorptance when increasing laser drill through this brown film.
Wherein also comprise after the steps A: multilayer circuit board is taken off the brown film handle.
The present invention is after to the multilayer circuit board laser drill; Again wiring board is carried out machine drilling; And after laser drill and machine drilling, wiring board is being carried out the heavy copper plating of skin, graphic plating processing; Laser blind hole is filled up as requested or fill full scale to reach more than 85%, obtain the HDI board finished product.Compared with prior art; The present invention has avoided the heavy copper of the skin after the laser drill, plate electricity, outer plating hole pattern, filling perforation to electroplate, move back flow processs such as film and abrasive band nog plate; Shortened the production cycle greatly, reduced production cost, the present invention simultaneously is not owing to need the abrasive band nog plate; Therefore the dimensional stability of wiring board is better relatively, can not produce distortion.
Description of drawings:
Fig. 1 is the structural representation of laser blind hole on the multilayer circuit board of the present invention and machine drilling.
Fig. 2 is a process chart of the present invention.
Embodiment:
For setting forth thought of the present invention and purpose, will combine accompanying drawing and specific embodiment that the present invention is done further explanation below.
The present invention is to provide a kind of making flow process of HDI plate, be mainly used in and solve in the present HDI plate manufacturing process, because of outer laser blind hole require all to fill up or degree of filling up greater than 85% o'clock, the problem that the production procedure that is caused is many, the production cycle is grown.
Like Fig. 1, shown in Figure 2, the present invention is to provide a kind of making flow process of HDI plate, comprise step:
A, multilayer circuit board is carried out brown handle, make the copper foil layer surface form the brown film, and copper foil surface is carried out laser drill, form laser blind hole;
Wherein comprise before the steps A:
Select copper-clad plate to open material, alligatoring is carried out on the copper-clad plate surface of splitting behind the material, pastes dry film or wet film, then film picture is overlying on dry film or the wet film; Carry out exposure imaging, realize the internal layer graphic making, carry out the internal layer etching afterwards, on the plate face, form circuitous pattern; Then wiring board is detected, afterwards the plate face is carried out brown and handle, form oxidation-resistant film; Then descend in the circuit board the two sides to cover prepreg and Copper Foil respectively, and carry out lamination, make multilayer circuit board through laminating machine.
Then above-mentioned multilayer circuit board is carried out once more brown and handle, so that the copper foil layer surface forms the brown film, the absorptance when increasing laser drill through this brown film is convenient to follow-up laser drill.
Because the copper foil layer surface is formed with the brown film, when copper foil surface is carried out laser drill, penetrable copper foil layer of laser and semi-solid preparation layer, and can not penetrate core material, therefore can form laser blind hole.
B, chew through brill multilayer circuit board is holed, form machine drilling;
After to the multilayer circuit board laser drill; Take off the brown film to it handles; Its surperficial brown film is removed, chew through the brill of rig then this wiring board is carried out machine drilling, machine drilling penetrates two copper foil layers and the prepreg up and down of multilayer circuit board; And penetrate inner plating, form through hole.
C, above-mentioned multilayer circuit board is carried out the heavy copper of skin, make to form the copper layer in laser blind hole, the machine drilling, afterwards multilayer circuit board is carried out electroplating processes, make above-mentioned Kong Zhongtong layer thickening;
D, above-mentioned multilayer circuit board is carried out outer graphics make, and carry out graphic plating, outer etching, silk-screen resistance weldering, surface treatment, obtain the HDI board finished product.
The making flow process of HID plate of the present invention is made flow process relatively with existing traditional HID plate; But in the knowledge capital invention flow process after the laser drilling blind hole; Directly carry out the power auger through hole, avoided the heavy copper of laser drill skin afterwards, plate electricity, outer plating hole pattern, filling perforation plating, moved back flow processs such as film and abrasive band nog plate, shortened the production cycle greatly; Reduced production cost; And the present invention not be owing to need carry out the abrasive band nog plate to wiring board, so the dimensional stability of wiring board is better relatively, can not produce distortion.
More than be that the making flow process of a kind of HDI plate provided by the present invention has been carried out detailed introduction; Used concrete example among this paper structural principle of the present invention and execution mode are set forth, above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (6)
1. the making flow process of a HDI plate is characterized in that comprising step:
A, multilayer circuit board is carried out brown handle, make the copper foil layer surface form the brown film, and copper foil surface is carried out laser drill, form laser blind hole;
B, chew through brill multilayer circuit board is holed, form machine drilling;
C, above-mentioned multilayer circuit board is carried out the heavy copper of skin, make to form the copper layer in laser blind hole, the machine drilling, afterwards multilayer circuit board is carried out electroplating processes, make above-mentioned Kong Zhongtong layer thickening;
D, above-mentioned multilayer circuit board is carried out outer graphics make, and carry out graphic plating, outer etching, silk-screen resistance weldering, surface treatment, obtain the HDI board finished product.
2. the making flow process of HDI plate according to claim 1 is characterized in that including before the steps A:
Select copper-clad plate to open material, the internal layer graphic making is carried out in the copper-clad plate of splitting behind the material, carries out the internal layer etching afterwards; On the inner plating face, form circuitous pattern; Then the wiring board upper and lower surface is covered prepreg and Copper Foil respectively, carry out lamination, obtain multilayer circuit board.
3. the making flow process of HDI plate according to claim 1 is characterized in that laser blind hole in the steps A penetrates two copper foil layers and the prepreg up and down of multilayer circuit board, does not penetrate inner plating.
4. the making flow process of HDI plate according to claim 1 is characterized in that machine drilling penetrates two copper foil layers and the prepreg up and down of multilayer circuit board among the step B, and penetrates inner plating.
5. the making flow process of HDI plate according to claim 1 is characterized in that in the steps A multilayer circuit board being carried out brown handles, and makes the copper foil layer surface form the brown film, the absorptance when increasing laser drill through this brown film.
6. the making flow process of HDI plate according to claim 1 is characterized in that also comprising after the steps A: multilayer circuit board is taken off the brown film handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2011103731999A CN102427685A (en) | 2011-11-22 | 2011-11-22 | Manufacturing process of HDI (High Density Interconnection) board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103731999A CN102427685A (en) | 2011-11-22 | 2011-11-22 | Manufacturing process of HDI (High Density Interconnection) board |
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| CN102427685A true CN102427685A (en) | 2012-04-25 |
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| CN2011103731999A Pending CN102427685A (en) | 2011-11-22 | 2011-11-22 | Manufacturing process of HDI (High Density Interconnection) board |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025051A (en) * | 2012-11-20 | 2013-04-03 | 深圳崇达多层线路板有限公司 | High density interconnect (HDI) plate with mechanic back drilling structure and manufacturing method thereof |
| CN103037640A (en) * | 2012-06-05 | 2013-04-10 | 北京凯迪思电路板有限公司 | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
| CN104768337A (en) * | 2015-03-30 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Production method for HDI plate |
| CN104869763A (en) * | 2014-02-25 | 2015-08-26 | 深圳崇达多层线路板有限公司 | High-density interconnected PCB and processing method thereof |
| CN105517374A (en) * | 2015-12-17 | 2016-04-20 | 深圳崇达多层线路板有限公司 | Method for making HDI board with thin core board |
| CN105873381A (en) * | 2015-11-06 | 2016-08-17 | 珠海市创元开耀电子材料有限公司 | HDI circuit board and manufacture method thereof |
| CN106211640A (en) * | 2016-08-12 | 2016-12-07 | 江门崇达电路技术有限公司 | The manufacture method of high density interconnecting board |
| CN106507613A (en) * | 2016-10-11 | 2017-03-15 | 江苏博敏电子有限公司 | A kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique |
| CN107172829A (en) * | 2017-07-12 | 2017-09-15 | 信丰迅捷兴电路科技有限公司 | The through hole copper precipitation unit and its control method of a kind of high density HDI multilayer circuit boards |
| CN107347229A (en) * | 2016-05-06 | 2017-11-14 | 鹤山市中富兴业电路有限公司 | The process of wiring board selective resin consent |
| CN107454760A (en) * | 2017-08-24 | 2017-12-08 | 高德（无锡）电子有限公司 | The radium-shine through-hole approaches of carbon dioxide laser |
| CN111479391A (en) * | 2020-04-16 | 2020-07-31 | 广东通元精密电路有限公司 | HDI board manufacturing method for any-order interconnection and HDI board |
| CN114158195A (en) * | 2021-12-03 | 2022-03-08 | 四会富仕电子科技股份有限公司 | Method for manufacturing precise circuit with assistance of laser |
| CN114980498A (en) * | 2022-05-09 | 2022-08-30 | 江西福昌发电路科技有限公司 | High-density interconnection printed board and processing method thereof |
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Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103037640A (en) * | 2012-06-05 | 2013-04-10 | 北京凯迪思电路板有限公司 | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate |
| CN103037640B (en) * | 2012-06-05 | 2015-07-22 | 北京凯迪思电路板有限公司 | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate |
| CN103025051B (en) * | 2012-11-20 | 2016-02-24 | 深圳崇达多层线路板有限公司 | HDI plate of a kind of mechanical back drill pore structure and preparation method thereof |
| CN103025051A (en) * | 2012-11-20 | 2013-04-03 | 深圳崇达多层线路板有限公司 | High density interconnect (HDI) plate with mechanic back drilling structure and manufacturing method thereof |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
| CN104869763B (en) * | 2014-02-25 | 2018-06-15 | 深圳崇达多层线路板有限公司 | High density interconnects printed board and its processing method |
| CN104869763A (en) * | 2014-02-25 | 2015-08-26 | 深圳崇达多层线路板有限公司 | High-density interconnected PCB and processing method thereof |
| CN104768337A (en) * | 2015-03-30 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Production method for HDI plate |
| CN105873381B (en) * | 2015-11-06 | 2019-04-09 | 武汉光谷创元电子有限公司 | HDI circuit board and its manufacturing method |
| CN105873381A (en) * | 2015-11-06 | 2016-08-17 | 珠海市创元开耀电子材料有限公司 | HDI circuit board and manufacture method thereof |
| CN105517374B (en) * | 2015-12-17 | 2019-02-05 | 深圳崇达多层线路板有限公司 | A kind of production method of thin core plate HDI plate |
| CN105517374A (en) * | 2015-12-17 | 2016-04-20 | 深圳崇达多层线路板有限公司 | Method for making HDI board with thin core board |
| CN107347229A (en) * | 2016-05-06 | 2017-11-14 | 鹤山市中富兴业电路有限公司 | The process of wiring board selective resin consent |
| CN106211640A (en) * | 2016-08-12 | 2016-12-07 | 江门崇达电路技术有限公司 | The manufacture method of high density interconnecting board |
| CN106507613A (en) * | 2016-10-11 | 2017-03-15 | 江苏博敏电子有限公司 | A kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique |
| CN107172829A (en) * | 2017-07-12 | 2017-09-15 | 信丰迅捷兴电路科技有限公司 | The through hole copper precipitation unit and its control method of a kind of high density HDI multilayer circuit boards |
| CN107454760A (en) * | 2017-08-24 | 2017-12-08 | 高德（无锡）电子有限公司 | The radium-shine through-hole approaches of carbon dioxide laser |
| CN111479391A (en) * | 2020-04-16 | 2020-07-31 | 广东通元精密电路有限公司 | HDI board manufacturing method for any-order interconnection and HDI board |
| CN114158195A (en) * | 2021-12-03 | 2022-03-08 | 四会富仕电子科技股份有限公司 | Method for manufacturing precise circuit with assistance of laser |
| CN114158195B (en) * | 2021-12-03 | 2023-10-24 | 四会富仕电子科技股份有限公司 | Method for manufacturing precise circuit with assistance of laser |
| CN114980498A (en) * | 2022-05-09 | 2022-08-30 | 江西福昌发电路科技有限公司 | High-density interconnection printed board and processing method thereof |
| CN114980498B (en) * | 2022-05-09 | 2024-04-02 | 江西福昌发电路科技有限公司 | High-density interconnection printed board and processing method thereof |
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Application publication date: 20120425 |