CN104918416B - Circuit board resistance welding processing method and outer layer super thick copper circuit board - Google Patents
Circuit board resistance welding processing method and outer layer super thick copper circuit board Download PDFInfo
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- CN104918416B CN104918416B CN201410088266.6A CN201410088266A CN104918416B CN 104918416 B CN104918416 B CN 104918416B CN 201410088266 A CN201410088266 A CN 201410088266A CN 104918416 B CN104918416 B CN 104918416B
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Abstract
The invention discloses a kind of circuit board resistance welding processing method and outer layer super thick copper circuit board, existing bubbles of ink, ink such as fall off at the technical problems when solving to carry out welding resistance processing to outer layer super-thick copper circuit in the prior art.The above method can include: press insulating layer in circuit board surface, fill and lead up the trace clearance of the outer layer super thick copper wire of the circuit board by the insulating layer；It is surface-treated, so that the outer layer super thick copper wire is revealed in circuit board surface, and the insulating layer in the trace clearance is concordant with the outer layer super thick copper wire surface；By the outer layer super-thick copper route plating thicken, and thickening layer with a thickness of 0.5OZ to 1.5OZ；Solder resist is set in trace clearance between the thickening layer.
Description
Technical field
The present invention relates to circuit board technology fields, and in particular to a kind of circuit board resistance welding processing method and outer layer super-thick copper electricity
Road plate.
Background technique
The thickness of its outer-layer circuit layer of outer layer super thick copper circuit board reaches 15 ounces (OZ, 1OZ are approximately equal to 0.035 millimeter)
Or more, when carrying out welding resistance processing to it, generally requires and carry out multiple silk-screen, such as 6 times or more, each silk-screen is certain thickness
Solder resist, until the gap of outer-layer circuit layer is filled and led up by solder resist.
But the technique has the drawback that since the drop of route and substrate is larger, that is, trace clearance is deeper, causes
Bubble in the solder resist of printing such as ink cannot escape completely, be easy to appear bubbles of ink；Since ink is too thick, it is subsequent not
Ink can be exposed completely, then be easy to appear the problem of ink falls off；Also, silk-screen number is more, complicated for operation.
Summary of the invention
The embodiment of the present invention provides a kind of circuit board resistance welding processing method and outer layer super thick copper circuit board, to solve existing skill
Existing bubbles of ink, ink such as fall off at the technical problems when carrying out welding resistance processing to outer layer super-thick copper circuit board in art.
First aspect present invention provides a kind of circuit board resistance welding processing method, comprising:
Insulating layer is pressed in circuit board surface, makes the trace clearance of the outer layer super thick copper wire of the circuit board by described exhausted
Edge layer is filled and led up；
It is surface-treated, so that the outer layer super thick copper wire is revealed in circuit board surface, and in the trace clearance
Insulating layer is concordant with the outer layer super thick copper wire surface；
By the outer layer super-thick copper route plating thicken, and thickening layer with a thickness of 0.5OZ to 1.5OZ；
Solder resist is set in trace clearance between the thickening layer.
Second aspect of the present invention provides a kind of outer layer super thick copper circuit board, comprising:
Internal layer multi-layer board and the outer layer super thick copper wire for being formed in the internal layer multilayer plate surface, the outer layer super thick copper wire
Insulating layer and solder resist are filled in the trace clearance on road, wherein the insulating layer is located at the middle and lower part of trace clearance, the resistance
Solder flux is located at the top of trace clearance, and the solder resist with a thickness of 0.5OZ to 1.5OZ.
Therefore in technical solution of the embodiment of the present invention, by pressing insulating layer in circuit board surface, by outer layer super thick
The trace clearance of copper wire is filled and led up, and the outer layer super-thick copper route revealed plating is then thickened 0.5OZ to 1.5OZ, in this way,
When carrying out welding resistance processing, it is thus only necessary to which the solder resist of setting 0.5OZ to 1.5OZ thickness is in the trace clearance between thickening layer
Can, and for the thickness of 0.5OZ to 1.5OZ, it is only necessary to a silk-screen, it is easy to operate, and be not in bubbles of ink and
The problems such as ink falls off.
Detailed description of the invention
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of flow chart of circuit board resistance welding processing method provided in an embodiment of the present invention；
The schematic diagram in Fig. 2 a to 2g each process segment when being using present invention method production circuit board.It is specific real
Apply mode
The embodiment of the present invention provides a kind of circuit board resistance welding processing method and outer layer super thick copper circuit board, to solve existing skill
Existing bubbles of ink, ink such as fall off at the technical problems when carrying out welding resistance processing to outer layer super-thick copper circuit in art.
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
The model that the present invention protects all should belong in member's every other embodiment obtained without making creative work
It encloses.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Referring to FIG. 1, the embodiment of the present invention provides a kind of circuit board resistance welding processing method, it may include:
110, insulating layer is pressed in circuit board surface, makes the trace clearance of outer layer super thick copper wire of the circuit board by institute
Insulating layer is stated to fill and lead up.
In the embodiment of the present invention, described circuit board is outer layer super thick copper circuit board, which includes internal layer multi-layer board
With the outer layer super thick copper wire for being formed in internal layer multi-layer board two sides.Wherein, internal layer multi-layer board includes at least one layer of thickness in 2OZ
Line layer below, the thickness of outer layer super thick copper wire, generally can be in 15OZ or more at least in 12OZ or more.
In a kind of embodiment, as shown in Figure 2 a, under type such as can be used, the outer layer super thick copper circuit board is made: in internal layer
The two sides of multi-layer board 20 all presses super thick copper foil layer 30, and the internal layer multi-layer board 20 includes at least one layer of internal layer circuit layer 21, institute
The thickness for stating super thick copper foil layer 30 is greater than or equal to 15OZ, and the logicalnot circuit graph area of the inner surface of the super thick copper foil layer 30
Domain subtracts thickness by preparatory etching；It presses and then etches the logicalnot circuit graphics field of the outer surface of the super thick copper foil layer 30
Removal, that is, form outer layer super thick copper wire 31；To which outer layer super thick copper circuit board be made, as shown in Figure 2 b.
Wherein, the thickness that the logicalnot circuit graphics field of the inner surface of the super thick copper foil layer 30 subtracts thickness by preparatory etching can
With in the one third of overall thickness or so of super thick copper foil layer, for example, being directed to the super thick copper foil layer of 15OZ thickness, etching subtracts thick
Thickness can be 5OZ；Then, after pressing, from another side, required thickness is arrived into remaining 10OZ etching removal
For 15OZ or more than outer layer super thick copper wire.
In some embodiments of the invention, the influence of subsequent processing operations, the outer layer of provided super thick copper circuit board are considered
The thickness of super thick copper wire is than big 0.1 millimeter of thickness or so finally needed.
In this step, insulating layer is pressed in circuit board surface, is made between the route of outer layer super thick copper wire of the circuit board
Gap is filled and led up by the insulating layer.In some embodiments of the invention, described insulating layer can use prepreg (i.e. PP piece).By
In the mobility of PP piece, outermost layer cannot function as in pressing.Therefore, as shown in Figure 2 c, described in some embodiments of the invention
Circuit board surface press insulating layer can include: circuit board two sides respectively all press insulating layer 41, block piece 42 and vacation
Core plate 43；Piece 42 and false core plate 43 are blocked after the completion of pressing, described in removal.
Wherein, described block piece and false core plate play assisted compression, are only used as outermost layer during the pressing process, prevent
It is only flowed everywhere as the prepreg of insulating layer, and improves the profile pattern of circuit board whole plate after pressing using false core plate.
After pressing, prepreg is cured as insulating layer, can remove and block piece and false core plate.Described false core plate is that have centainly firmly
The insulation board of degree can be glass mat or glass fiber resin plate, such as the insulation board of FR4 material.Some embodiments
In, the copper foil layer on double face copper two sides can be etched and be removed, retain intermediate insulating layer as the vacation core plate.Described resistance
Exhausted piece 42 can be used as using double-sided adhesive or Teflon for preventing insulating layer 41 and false core plate 43 from bonding and block piece 42.
After pressing, as shown in Figure 2 d, the trace clearance between outer layer super thick copper wire 31 is filled by insulating layer 41, and
And due to the mobility of prepreg, the upper surface of outer layer super thick copper wire 31 can be all coated in insulating layer 41, and cannot
It reveals.
120, it is surface-treated, the outer layer super thick copper wire is made to be revealed in circuit board surface, and the trace clearance
Interior insulating layer is concordant with the outer layer super thick copper wire surface.
In this step, controlled depth milling technique can be used, circuit board is surface-treated, comprising: distinguishes on the two sides of circuit board
Controlled depth milling is carried out, the insulating layer 41 on the circuit board two sides is subtracted into thickness, until the outer layer super thick copper wire 31 reveals, such as
Shown in Fig. 2 e.Circuit board after surface treatment, outer layer super thick copper wire 31 are revealed in circuit board surface, and between the route
Insulating layer 41 and 31 flush of outer layer super thick copper wire in gap.
After surface treatment, if necessary, drilling processing can be carried out to circuit board, process institute on circuit boards
The various via holes needed.
130, by the outer layer super-thick copper route plating thicken, and thickening layer with a thickness of 0.5OZ to 1.5OZ.
As shown in figure 2f, in this step, heavy copper and plating are carried out to circuit board, on the one hand, in the two sides of circuit board all shapes
At one layer of electroplated layer 50, on the other hand, the various conducting hole metallizations that will be processed.In the present embodiment, preferably in circuit board table
The electroplated layer 50 that face is formed with a thickness of h, the thickness of h should be greater than or be equal to 0.5OZ, but be less than or equal to 1.5OZ, general to may be selected
H is equal to 1OZ.
Then, outer graphics technique can be used, by the line pattern regions of superficies (i.e. outer layer super thick copper wire 31
Region) and via hole position, protected with etchant resist, be then etched, the electroplated layer of logicalnot circuit graphics field is etched
Removal, finally, only forming one layer of plating thickening layer 51 above outer layer super-thick copper route 31, and the thickness of the thickening layer exists
Between 0.5OZ to 1.5OZ, as shown in Figure 2 g.
It can be seen that in the circuit board from Fig. 2 g, the overwhelming majority of outer layer super thick copper wire 31 is all embedded in absolutely
Among edge layer 31, the part that surface exposes is only thickening layer 51 of the thickness between 0.5OZ to 1.5OZ, that is to say, that with
The outer-layer circuit of the circuit board of ordinary copper thickness is identical.
140, solder resist is set in the trace clearance between the thickening layer.
In this step, welding resistance processing is carried out in the superficies of circuit board.Due to the exhausted big portion of outer layer super thick copper wire 31
It point is all embedded among insulating layer 31, surface only exposes thickening layer 51 of the thickness between 0.5OZ to 1.5OZ, and common
The outer-layer circuit of the circuit board of copper thickness is identical, therefore, in this step, private network printing technology can be used and print in circuit board surface and hinder
Solder flux, and, it is only necessary to one-step print, adequate thickness being printed in the trace clearance between thickening layer 51, (0.5OZ is arrived
Solder resist 1.5OZ).After printing, conventional curing process can be used, such as exposure technology etc. solidifies solder resist.
Since only silk-screen is primary, and the thickness of solder resist is no more than 1.5OZ, therefore: the bubble in solder resist such as ink
It can easily escape, it is not easy to bubbles of ink occur；Ink can be exposed completely, be firmly fixed on circuit board surface, do not allowed
Easily there is the problem of ink falls off.
To sum up, the embodiment of the invention provides a kind of circuit board resistance welding processing methods leads to for outer layer super thick copper circuit board
It crosses and presses insulating layer in circuit board surface, the trace clearance of outer layer super thick copper wire is filled and led up, the outer layer that then will be revealed
The plating of super-thick copper route thickens 0.5OZ to 1.5OZ, in this way, the drop between outer-layer circuit and substrate exists when carrying out welding resistance processing
Between 0.5OZ to 1.5OZ, it is thus only necessary to the solder resist of 0.5OZ to 1.5OZ thickness is set, and for 0.5OZ to 1.5OZ
Thickness, it is only necessary to a silk-screen, it is easy to operate, be not in bubbles of ink and the problems such as ink falls off.
In addition, filling insulating layer due to being pressed together in the gap of outer layer super thick copper wire using collectivization, then deep by control
The technology for revealing outer layer super thick copper wire is milled, can not have to consider alignment issues, it can be achieved that the complete of trace clearance
Filling, the relatively not technology in silk-screen resin fill line gap, be not in because align it is inaccurate caused by catastrophic loophole problem,
It is not in the solder mask air bubble problem occurred when subsequent welding resistance caused by not being completely filled because of trace clearance is processed.
Embodiment two,
Fig. 2 g is please referred to, the embodiment of the present invention provides a kind of outer layer super thick copper circuit board, comprising:
Internal layer multi-layer board 20 and the outer layer super thick copper wire 31 for being formed in the internal layer multilayer plate surface, the outer layer super thick
Insulating layer 41 is filled in the trace clearance of copper wire, wherein the insulating layer is located at the middle and lower part of trace clearance, outer than described
Low 0.5OZ to the 1.5OZ in surface of layer super thick copper wire 31.
In some embodiments, the table on insulating layer 41 can also be filled in the trace clearance of outer layer super thick copper wire 31
Face, the solder resist with a thickness of 0.5OZ to 1.5OZ.
Wherein, the thickness of the outer layer super thick copper wire 31 can be greater than or equal to 12 Ο Ζ, or be greater than or equal to 15 Ο
Ζ.The internal layer multi-layer board 20 includes at least one layer of internal layer circuit layer 21, and the thickness of the internal layer circuit layer 21 is less than or equal to 2
ΟΖ。
To sum up, the embodiment of the invention provides a kind of outer layer super thick copper circuit board, between the route of outer layer super thick copper wire
Insulating layer is filled in gap, and the thickness of insulating layer is 0.5OZ to 1.5OZ slightly lower than circuit surface, in this way, carrying out welding resistance processing
When, the drop between outer-layer circuit and substrate is between 0.5OZ to 1.5OZ, it is thus only necessary to 0.5OZ to 1.5OZ thickness be arranged
Solder resist, and for the thickness of 0.5OZ to 1.5OZ, it is only necessary to a silk-screen, it is easy to operate, it is not in ink
The problems such as bubble and ink fall off.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for the various method embodiments described above, for simple description, therefore, it is stated as a series of
Combination of actions, but those skilled in the art should understand that, the present invention is not limited by described sequence of movement because according to
According to the present invention, certain steps can use other sequences or carry out simultaneously.Secondly, those skilled in the art should also know that,
The embodiments described in the specification are all preferred embodiments, and not necessarily the present invention must for related actions and modules
Must.
It is provided for the embodiments of the invention circuit board resistance welding processing method above and outer layer super thick copper circuit board carries out
It is discussed in detail, but the above description of the embodiment is only used to help understand the method for the present invention and its core ideas, should not be understood
For limitation of the present invention.Those skilled in the art, according to the thought of the present invention, the invention discloses technical scope
Interior, any changes or substitutions that can be easily thought of, should be covered by the protection scope of the present invention.
Claims (7)
1. a kind of circuit board resistance welding processing method characterized by comprising
Insulating layer is pressed in circuit board surface, makes the trace clearance of outer layer super thick copper wire of the circuit board by the insulating layer
It fills and leads up, wherein the circuit board includes internal layer multi-layer board and the outer layer super thick copper wire for being formed in internal layer multi-layer board two sides；
By the outer layer super-thick copper route plating thicken, and thickening layer with a thickness of 0.5OZ to 1.5OZ；
Solder resist is set in trace clearance between the thickening layer.
2. the method according to claim 1, wherein it is described circuit board surface press insulating layer before, also wrap
It includes:
Super thick copper foil layer is all pressed on the two sides of interior layer multi-layer plate, the internal layer multi-layer board includes at least one layer of internal layer circuit layer,
The thickness of the super thick copper foil layer is greater than or equal to 15OZ, and the logicalnot circuit graphics field of the inner surface of the super thick copper foil layer
Thickness is subtracted by preparatory etching；
The logicalnot circuit graphics field of the outer surface of the super thick copper foil layer is etched into removal, outer layer super thick copper wire is formed, obtains
To the circuit board with outer layer super thick copper wire.
3. the method according to claim 1, wherein described include: in circuit board surface pressing insulating layer
Insulating layer is all pressed respectively on the two sides of circuit board, blocks piece and false core plate；
Piece and false core plate are blocked after the completion of pressing, described in removal.
4. the method according to claim 1, wherein carry out surface treatment include:
Controlled depth milling is carried out respectively on the two sides of circuit board, the insulating layer on the circuit board two sides is subtracted into thickness, until the outer layer is super
Thick copper circuit reveals.
5. the method according to claim 1, wherein described thicken packet for outer layer super-thick copper route plating
It includes:
Heavy copper and plating are carried out to the circuit board, all formed respectively with a thickness of 0.5OZ to 1.5OZ on the two sides of the circuit board
Coating；
The coating of logicalnot circuit graphics field is removed using etch process, one layer of coating is retained in the outer layer super thick copper wire
As thickening layer.
6. the method according to claim 1, wherein it is described by the outer layer super-thick copper route plating thicken before
Further include:
Via hole is processed on the circuit board.
7. the method according to claim 1, wherein being arranged in the trace clearance between the thickening layer
Solder resist includes:
Using silk-screen printing technique, solder resist is printed in the trace clearance between the thickening layer on the circuit board surface, and
The solder resist is solidified.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410088266.6A CN104918416B (en) | 2014-03-11 | 2014-03-11 | Circuit board resistance welding processing method and outer layer super thick copper circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410088266.6A CN104918416B (en) | 2014-03-11 | 2014-03-11 | Circuit board resistance welding processing method and outer layer super thick copper circuit board |
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| Publication Number | Publication Date |
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| CN104918416A CN104918416A (en) | 2015-09-16 |
| CN104918416B true CN104918416B (en) | 2019-03-05 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107295746B (en) | 2016-03-31 | 2021-06-15 | 奥特斯(中国)有限公司 | Device carrier and method for manufacturing the same |
| CN107295747B (en) * | 2016-03-31 | 2021-03-12 | 奥特斯(中国)有限公司 | Device carrier and method of manufacturing a device carrier |
| CN106535490A (en) * | 2016-07-22 | 2017-03-22 | 无锡深南电路有限公司 | Ultra-thick copper printed board and solder resisting processing method |
| CN109496082A (en) * | 2018-10-13 | 2019-03-19 | 奥士康科技股份有限公司 | A kind of super thick copper sheet anti-welding printing method |
| CN109640529A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of manufacture craft of two-sided super thick copper sheet |
| CN110831339A (en) * | 2019-11-14 | 2020-02-21 | 江苏上达电子有限公司 | Graphic design method for avoiding ink bubbles |
| CN111328205A (en) * | 2020-03-18 | 2020-06-23 | 四川英创力电子科技股份有限公司 | Processing technology of planar thick copper PCB |
| CN113056100A (en) * | 2021-02-26 | 2021-06-29 | 惠州市金百泽电路科技有限公司 | Manufacturing method of high-precision buried conductive carbon oil resistor printed circuit board |
| CN114143959A (en) * | 2021-11-19 | 2022-03-04 | 苏州浪潮智能科技有限公司 | PCB for improving impedance stability of outer layer circuit, and implementation method and device |
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| KR100771293B1 (en) * | 2005-11-07 | 2007-10-29 | 삼성전기주식회사 | Printed circuit board and method for manufacturing the same |
| CN101861049B (en) * | 2009-04-08 | 2012-03-07 | 昆山市华升电路板有限公司 | Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof |
| CN101534612B (en) * | 2009-04-10 | 2011-03-16 | 深圳市博敏电子有限公司 | Resistance welding superposition technology for PCB thick copper lines |
| CN103108490B (en) * | 2011-11-11 | 2015-10-07 | 深南电路有限公司 | A kind of circuit processing method of super-thick copper wiring board |
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