CN106535490A - Ultra-thick copper printed board and solder resisting processing method - Google Patents
Ultra-thick copper printed board and solder resisting processing method Download PDFInfo
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- CN106535490A CN106535490A CN201610860419.3A CN201610860419A CN106535490A CN 106535490 A CN106535490 A CN 106535490A CN 201610860419 A CN201610860419 A CN 201610860419A CN 106535490 A CN106535490 A CN 106535490A
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- thick copper
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- printed board
- copper wire
- wire layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention discloses an ultra-thick copper printed board and a solder resisting processing method. With the solder resisting processing method adopted, solder resisting processing difficulties of an ultra-thick copper printed board can be eliminated. The method includes the following steps that: an ultra-thick copper printed board is provided, and an ultra-thick copper circuit layer is formed at least one side of the ultra-thick copper printed board, and the thickness of the ultra-thick copper circuit layer is not smaller than 10OZ; frameless prepregs are pressed onto the ultra-thick copper circuit layer, and the frameless prepregs are used to fill line gaps; and solder resisting processing is performed on the line gap-filled ultra-thick copper circuit layer. The invention also provides a corresponding ultra-thick copper printed board.
Description
This application claims submitting Patent Office of the People's Republic of China, Application No. 201610586449.X, invention name on July 22nd, 2016
A kind of referred to as priority of the Chinese patent application of " super-thick copper printed board and its resistance welding processing method ", entire contents are by drawing
With being incorporated in the present application.
Technical field
The present invention relates to printed circuit board manufacture technology field, and in particular to a kind of super-thick copper printed board and its welding resistance processing
Method.
Background technology
Printed circuit board (Printed Circuit Board, PCB), also known as printed circuit board (PCB), abbreviation circuit board or printing
Plate, is the supplier of electronic devices and components electrical connection.Generally, printed board needs to carry out welding resistance processing, using one layer of resistance of coating
Wlding material, plays welding resistance insulation, the effect for preventing circuit from aoxidizing.
With the development of printed board processing technology, start at present outer-layer circuit thickness degree occur more than 5OZ even 10OZ's
Super-thick copper printed board.For super-thick copper printed board, there is very big difficulty in welding resistance processing, this is because：The thick copper on its top layer
Line layer thickness is too big, and trace clearance is too deep, and when carrying out welding resistance processing using silk screen printing, solder resist material is difficult to be sufficient filling with line
Road gap especially bottom, has that bottom is hanging；And cause substantial amounts of space and bubble to exist, and it is follow-up to solder resist material
When being solidified, bubble dissipation can have a strong impact on solidification quality again.Ultimately result in, easily foaming is de- to process the solder mask for being formed
Fall, quality does not pass a test.
At present, a kind of solution is, by repeatedly printing solder resist material and multiexposure, multiple exposure, improves welding resistance quality, but
It is that practice finds that this method can not solve trace clearance, and especially bottom is difficult to the defect being sufficient filling with, therefore can not be effective
Solve the above problems, and, the welding resistance process-cycle is increased, production efficiency is reduced；And repeatedly, there is ink in printing-ink
Layering reduces the problem of reliability.
Also a kind of solution is, before printing solder resist material, first printing resin is filling the line of thick copper circuit layer
Road gap, then carries out welding resistance processing, again to improve welding resistance quality to a certain extent.But, using the method, in printing resin
When, however it remains problems with：1st, because trace clearance is too deep, the resin of printing is difficult to be sufficient filling with trace clearance especially bottom
Portion, has that bottom is hanging；2nd, a large amount of bubbles can be produced during printing resin, it is impossible to obtain to send out completely, can have a strong impact on print
Brush quality；3rd, there are alignment issues in silk screen printing, and operation difficulty is big；4th, the technique adopts typography, is not suitable for processing top layer
Line layer thickness is in more than 10OZ super-thick copper printed boards.
The content of the invention
The embodiment of the present invention provides a kind of super-thick copper printed board and its resistance welding processing method, to contribute to solving super-thick copper print
There is a welding resistance processing difficult problem in making sheet.
First aspect present invention provides a kind of resistance welding processing method of super-thick copper printed board, including：There is provided super-thick copper to print
Plate, at least one side of the super-thick copper printed board are formed with super thick copper wire layer, and the thickness of the super thick copper wire layer is not less than
10OZ；Exoskeletal prepreg is pressed in the super thick copper wire layer, using between the exoskeletal prepreg fill line
Gap；Welding resistance processing is carried out in the super thick copper wire layer for being filled with trace clearance.
Second aspect present invention provides a kind of super-thick copper printed board, including：At least one side shape of the super-thick copper printed board
It is not less than 10OZ into the thickness for having super thick copper wire layer, the super thick copper wire layer；The trace clearance of the super thick copper wire layer
In be filled with exoskeletal prepreg；It is filled with the super thick copper wire layer of trace clearance and is provided with solder mask.
Therefore, in some feasible embodiments of the invention, by the super thick copper wire layer in super-thick copper printed board
It is upper to press exoskeletal prepreg, trace clearance can be sufficient filling with, space and bubble can be avoided to produce, next
Only need to once conventional welding resistance printing and welding resistance processing is completed by exposing, can greatly improve welding resistance quality, improve welding resistance
Working (machining) efficiency, and it is applied to more than 10OZ super-thick copper printed boards.
The method with traditional super-thick copper printed board, repeatedly compare with the solder-resisting manufacturing methods of exposure by printing, only once need to hinder
Weldering printing and exposure, can largely shorten the process-cycle, improve efficiency；Trace clearance is additionally, since by exoskeletal half
Cured sheets are sufficient filling with, and are favorably improved super-thick copper printed board welding resistance quality.
The method compared with first printing resin carries out the manufacture method of welding resistance processing again, due to being using process for pressing and pressure
What is closed is prepreg, relative to the typography using resin, can be with significantly more efficient realization fully filling out to trace clearance
Fill, prevent space bubble and exist, and press super-thick copper printed board of the fill method suitable for 10OZ or even more than 15OZ.
Description of the drawings
In order to be illustrated more clearly that embodiment of the present invention technical scheme, below will be to institute in embodiment and description of the prior art
The accompanying drawing that needs are used is briefly described, it should be apparent that, drawings in the following description are only some enforcements of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can be being obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is the schematic flow sheet of the resistance welding processing method of super-thick copper printed board provided in an embodiment of the present invention；
Fig. 2 a are the structural representations of the super-thick copper printed board in one embodiment of the invention；
Fig. 2 b are the structural representations for carrying out lamination pressing to super-thick copper printed board；
Fig. 2 c are the structural representations of the super-thick copper printed board after lamination pressing；
Fig. 2 d are the schematic diagrams of the super-thick copper printed board for completing trace clearance filling；
Fig. 2 e are the structural representations of the super-thick copper printed board for completing welding resistance processing.
Specific embodiment
The embodiment of the present invention provides a kind of resistance welding processing method of super-thick copper printed board, to contribute to solving super-thick copper printing
There is a welding resistance processing difficult problem in plate.The embodiment of the present invention also provides corresponding super-thick copper printed board.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, is clearly and completely described to the technical scheme in the embodiment of the present invention, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than the embodiment of whole.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment obtained under the premise of creative work is not made by member, should all belong to the model of present invention protection
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Fig. 1 is refer to, the embodiment of the present invention provides a kind of resistance welding processing method of super-thick copper printed board, and the method can be wrapped
Include：
110th, super-thick copper printed board is provided, at least one side of the super-thick copper printed board is formed with super thick copper wire layer, institute
The thickness for stating super thick copper wire layer is not less than 10OZ.
In the embodiment of the present invention, the super-thick copper printed board refers to that one or both sides surface has the printing of super thick copper foil layer
Plate.As shown in Figure 2 a, be the super-thick copper printed board 20 for having completed outer graphics processing structural representation, the super-thick copper prints
Plate 20 includes：Positioned at the super thick copper wire layer 201 of one or both sides, positioned at one or more layers internal layer circuit layer 202 of internal layer, with
And, the insulating barrier 203 between each line layer.Wherein, the thickness of super thick copper foil layer super thick copper wire layer in other words is not less than
The Chinese entitled ounce of 10OZ, OZ, 1OZ are approximately equal to 0.035mm, herein by taking thickness 15OZ as an example.
Herein, addition process or the various methods such as subtractive process or two-sided etching method can be adopted to realize that outer graphics are processed.
Optionally, after outer graphics, also perform brown and process, i.e. carrying out surface cleaning and roughness to the thick copper circuit layer increases
Process, to increase inter-layer bonding force in follow-up pressing step.
120th, exoskeletal prepreg is pressed in the super thick copper wire layer, filled using the exoskeletal prepreg
Trace clearance.
In this step, super-thick copper printed board 20 is carried out into stacking pressing behaviour with exoskeletal prepreg 21 according to processing instruction
Make.Specifically, as shown in Figure 2 b, one or more exoskeletal semi-solid preparation can be overlapped above the super thick copper wire layer 201
Piece 21；Then, as shown in Figure 2 c, pressed using vacuum pressing-combining technique.
Wherein, the thickness of the exoskeletal prepreg 21 of overlapping is calculated according to the residual copper rate of outer layer so that super thick copper wire layer
201 trace clearance can be completely filled.The exoskeletal prepreg 21 refers to the pure PP without supporting reinforced structure
(Prepreg).The pressing step can adopt press, and by the plate for having overlapped, being sent into press carries out vacuum pressing-combining.Optionally,
Also need to after pressing to 20 edges of boards gummosis grinding process of the super-thick copper printed board, unnecessary PP will be remained and removed.
Optionally, before subsequent step is carried out, in addition it is also necessary to remove plate face cull in the super thick copper wire layer 201 with
Super thick copper wire layer 201 is manifested, and, remove the coarse oxide layer of 201 copper face of super thick copper wire layer.Specifically can be using grinding
Method for example, carries out rough lapping and fine gtinding to the super-thick copper printed board 20 successively removing, by grind remove it is described
The coarse oxide layer of plate face cull and copper face in super thick copper wire layer 201.Super-thick copper Jing after above-mentioned steps process is printed
Plate 20 is as shown in Figure 2 d.
130th, welding resistance processing is carried out in the super thick copper wire layer for being filled with trace clearance.
Optionally, before welding resistance processing, can be to have passed through the super-thick copper printed board 20 of rough lapping and fine gtinding
Super roughening treatment before welding resistance is carried out, to improve surface adhesion, i.e. improve the adhesion of plate face and solder mask, improve welding resistance
Quality.
Fig. 2 e are refer to, welding resistance processing is carried out in this step, generally, it is possible to use silk screen printing process carry out welding resistance processing, i.e.
One-step print and single exposure are carried out in the super thick copper wire layer 201 using ink printer, is realized in the super-thick copper
Solder mask 22 is coated on line layer 201.As the trace clearance of super thick copper wire layer 201 is sufficient filling with, this step
In, it is only necessary to once the processing of conventional welding resistance is capable of achieving very high welding resistance quality.
As described above, present invention method is probably comprised the following steps that：Super-thick copper printed board outer-layer circuit system
Before work → → brown → → lamination → → quick pressing → → pressing post processing → → corase grind plate → → fine nog plate → → welding resistance
The successive process such as process → → welding resistance → → exposure → → character.
Based on above-mentioned technique, only need an ink printer exposure complete the welding resistance technique of super-thick copper plate, than
The laborious time-consuming method of traditional multiple printing multiexposure, multiple exposure, greatly shortens the process-cycle；One-step print is only needed, is not existed
After ink repeatedly prints, adhesion is not enough and receive the problem of thermally stratified layer, improves welding resistance reliability and exterior quality；
Therefore, in some feasible embodiments of the invention, by the super thick copper wire layer in super-thick copper printed board
It is upper to press exoskeletal prepreg, trace clearance can be sufficient filling with, space and bubble can be avoided to produce, next
Only need to once conventional welding resistance printing and welding resistance processing is completed by exposing, can greatly improve welding resistance quality, improve welding resistance
Working (machining) efficiency, and it is applied to more than 10OZ super-thick copper printed boards.
The method with traditional super-thick copper printed board, repeatedly compare with the solder-resisting manufacturing methods of exposure by printing, only once need to hinder
Weldering printing and exposure, can largely shorten the process-cycle, improve efficiency；Trace clearance is additionally, since by exoskeletal half
Cured sheets are sufficient filling with, and are favorably improved super-thick copper printed board welding resistance quality.
The method compared with first printing resin carries out the manufacture method of welding resistance processing again, due to being using process for pressing and pressure
What is closed is prepreg, relative to the typography using resin, can be with significantly more efficient realization fully filling out to trace clearance
Fill, prevent space bubble and exist, and press super-thick copper printed board of the fill method suitable for 10OZ or even more than 15OZ.
Embodiment two,
Fig. 2 e are refer to, the embodiment of the present invention provides a kind of super-thick copper printed board 20, and the super-thick copper printed board 20 is extremely
Few to be simultaneously formed with super thick copper wire layer 201, the thickness of the super thick copper wire layer 201 is not less than 10OZ；The super thick copper cash
Exoskeletal prepreg 21 is filled with the trace clearance of road floor 201；It is filled with the super thick copper wire layer of trace clearance
Solder mask 22 is provided with 201.
Optionally, the thickness of the super thick copper wire layer 201 is not less than 15OZ.
More than, the embodiment of the invention discloses a kind of super-thick copper printed board, the super-thick copper printed board can adopt embodiment one
Disclosed method is prepared, and with regard to the more detailed description of the super-thick copper printed board, refer to the description in embodiment one.
Therefore, in some feasible embodiments of the invention, a kind of super-thick copper printed board is disclosed, its super thick copper cash
Exoskeletal prepreg is filled with the trace clearance of road floor, therefore, when welding resistance is processed, space and bubble can be avoided from producing
It is raw, it is only necessary to which that once the printing of conventional welding resistance and exposure can complete welding resistance processing, can greatly improve welding resistance quality, improve resistance
Weldering working (machining) efficiency, and it is applied to more than 10OZ super-thick copper printed boards.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in certain embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for aforesaid each method embodiment, in order to be briefly described, therefore which is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention do not limited by described sequence of movement because according to
According to the present invention, some steps can adopt other orders or while carry out.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and involved action and the module not necessarily present invention are musted
Must.
The super-thick copper printed board for being provided to the embodiment of the present invention above and its resistance welding processing method are described in detail,
But the explanation of above example is only intended to help and understands the method for the present invention and its core concept, should not be construed as to the present invention
Restriction.Those skilled in the art, according to the present invention thought, the invention discloses technical scope in, can be easily
The change or replacement expected, should all be included within the scope of the present invention.
Claims (10)
1. a kind of resistance welding processing method of super-thick copper printed board, it is characterised in that include：
Super-thick copper printed board is provided, at least one side of the super-thick copper printed board is formed with super thick copper wire layer, the super-thick copper
The thickness of line layer is not less than 10OZ；
Exoskeletal prepreg is pressed in the super thick copper wire layer, using between the exoskeletal prepreg fill line
Gap；
Welding resistance processing is carried out in the super thick copper wire layer for being filled with trace clearance.
2. method according to claim 1, it is characterised in that described to press exoskeletal half in the super thick copper wire layer
Before cured sheets, also include：
Surface cleaning is carried out to the thick copper circuit layer and roughness increase is processed.
3. method according to claim 1, it is characterised in that described to press exoskeletal half in the super thick copper wire layer
Cured sheets include：
One or more exoskeletal prepreg is overlapped above the super thick copper wire layer；
Pressed using vacuum pressing-combining technique.
4. method according to claim 1, it is characterised in that described to press exoskeletal half in the super thick copper wire layer
After cured sheets, also include：
To the super-thick copper printed board edges of boards gummosis grinding process.
5. method according to claim 1, it is characterised in that described to carry out welding resistance processing in the super thick copper wire layer
Before, also include：
Remove the coarse oxide layer of the plate face cull and copper face in the super thick copper wire layer.
6. method according to claim 5, it is characterised in that the plate face cull in the removing super thick copper wire layer
And the coarse oxide layer of copper face includes：
Rough lapping and fine gtinding are carried out successively to the super-thick copper printed board, is removed in the super thick copper wire layer by grinding
Plate face cull and copper face coarse oxide layer.
7. method according to claim 5, it is characterised in that described that rough lapping is carried out successively to the super-thick copper printed board
After fine gtinding, also include：
The super-thick copper printed board to have passed through rough lapping and fine gtinding carries out super roughening treatment before welding resistance.
8. method according to claim 1, it is characterised in that described to be filled with the super thick copper wire of trace clearance
Carrying out welding resistance processing on layer includes：
One-step print and exposure are carried out in the super thick copper wire layer using ink printer, is realized in the super thick copper wire
Solder mask is coated on layer.
9. a kind of super-thick copper printed board, it is characterised in that
At least one side of the super-thick copper printed board is formed with super thick copper wire layer, and the thickness of the super thick copper wire layer is not less than
10OZ；
Exoskeletal prepreg is filled with the trace clearance of the super thick copper wire layer；
It is filled with the super thick copper wire layer of trace clearance and is provided with solder mask.
10. super-thick copper printed board according to claim 9, it is characterised in that
The thickness of the super thick copper wire layer is not less than 15OZ.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610586449 | 2016-07-22 | ||
| CN201610586449X | 2016-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106535490A true CN106535490A (en) | 2017-03-22 |
Family
ID=58344455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610860419.3A Pending CN106535490A (en) | 2016-07-22 | 2016-09-28 | Ultra-thick copper printed board and solder resisting processing method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734850A (en) * | 2017-09-18 | 2018-02-23 | 维沃移动通信有限公司 | The preparation method and printed circuit board (PCB) of a kind of printed circuit board (PCB) |
| CN108770217A (en) * | 2018-08-03 | 2018-11-06 | 诚亿电子（嘉兴）有限公司 | PCB plate production method with internal layer super thick copper coin |
| CN108990262A (en) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | The manufacture craft of two-sided thick copper circuit board |
| CN109496082A (en) * | 2018-10-13 | 2019-03-19 | 奥士康科技股份有限公司 | A kind of super thick copper sheet anti-welding printing method |
| CN110139465A (en) * | 2019-03-28 | 2019-08-16 | 厦门大学 | A kind of high current pcb board |
| CN111328205A (en) * | 2020-03-18 | 2020-06-23 | 四川英创力电子科技股份有限公司 | Processing technology of planar thick copper PCB |
| CN111818738A (en) * | 2020-07-08 | 2020-10-23 | 沪士电子股份有限公司 | Method for processing thick copper PCB by using prepreg without glass cloth |
| CN114143959A (en) * | 2021-11-19 | 2022-03-04 | 苏州浪潮智能科技有限公司 | PCB for improving impedance stability of outer layer circuit, and implementation method and device |
| CN114828460A (en) * | 2022-06-15 | 2022-07-29 | 长沙牧泰莱电路技术有限公司 | Glue filling method for thick copper printed circuit board |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734850A (en) * | 2017-09-18 | 2018-02-23 | 维沃移动通信有限公司 | The preparation method and printed circuit board (PCB) of a kind of printed circuit board (PCB) |
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| CN108990262A (en) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | The manufacture craft of two-sided thick copper circuit board |
| CN108990262B (en) * | 2018-03-20 | 2021-07-09 | 东莞市若美电子科技有限公司 | Manufacturing process of double-sided thick copper circuit board |
| CN108770217A (en) * | 2018-08-03 | 2018-11-06 | 诚亿电子（嘉兴）有限公司 | PCB plate production method with internal layer super thick copper coin |
| CN109496082A (en) * | 2018-10-13 | 2019-03-19 | 奥士康科技股份有限公司 | A kind of super thick copper sheet anti-welding printing method |
| CN110139465A (en) * | 2019-03-28 | 2019-08-16 | 厦门大学 | A kind of high current pcb board |
| CN111328205A (en) * | 2020-03-18 | 2020-06-23 | 四川英创力电子科技股份有限公司 | Processing technology of planar thick copper PCB |
| CN111818738A (en) * | 2020-07-08 | 2020-10-23 | 沪士电子股份有限公司 | Method for processing thick copper PCB by using prepreg without glass cloth |
| CN114143959A (en) * | 2021-11-19 | 2022-03-04 | 苏州浪潮智能科技有限公司 | PCB for improving impedance stability of outer layer circuit, and implementation method and device |
| CN114828460A (en) * | 2022-06-15 | 2022-07-29 | 长沙牧泰莱电路技术有限公司 | Glue filling method for thick copper printed circuit board |
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