CN104427776B - The manufacture method of negative and positive copper thickness printed wiring board - Google Patents
The manufacture method of negative and positive copper thickness printed wiring board Download PDFInfo
- Publication number
- CN104427776B CN104427776B CN201310364780.3A CN201310364780A CN104427776B CN 104427776 B CN104427776 B CN 104427776B CN 201310364780 A CN201310364780 A CN 201310364780A CN 104427776 B CN104427776 B CN 104427776B
- Authority
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- China
- Prior art keywords
- copper face
- copper
- wiring board
- thick
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Abstract
The present invention, there is provided a kind of manufacture method of the thick printed wiring board of negative and positive copper, separates etching process, it is intended to the problem of solution can not process fine-line in the prior art suitable for printed circuit board (PCB) processing technique field using thick copper face and thin copper face.The manufacture method comprises the following steps：There is provided copper thickness different printed wiring boards；Conducting wire is made, the first conducting wire and the second conducting wire is made on thick copper face and thin copper face respectively；And post processing.The step of making the first conducting wire on thick copper face includes：Outer graphics transfer, pattern tin plating and alkali etching；The step of making the second conducting wire on thin copper face includes：Outer graphics are shifted and acid etching.This method makes the first conductive pattern and the second conductive pattern on thick copper face and thin copper face respectively, to make fine-line on the printed wiring board of different copper thicknesses, is adapted to the printed wiring board that processing two sides copper thickness extreme difference is arbitrary value.
Description
Technical field
The invention belongs to the manufacture of printed circuit board (PCB) processing technique field, more particularly to a kind of thick printed wiring board of negative and positive copper
Method.
Background technology
In the manufacture of printed wiring board, etch process is a wherein indispensable important step.In particular with
Microelectric technique is developed rapidly, and the extensive use of large scale integrated circuit and super large-scale integration makes printed wiring board
On conductor width and spacing it is less and less, wiring density and precision also more and more higher, precision and tolerance to etching are proposed
More Gao Gengyan technical requirements, the quality of etching quality directly influences the quality good or not of printed wiring board.
For copper thickness identical printed wiring board, generally, etched simultaneously using two sides, you can meet and require.But,
For the different printed wiring board of copper thickness, two sides is etched simultaneously can not meet requirement, and at present, common mode has：It is a kind of
It is that the circuit etching compensation rate on two sides is compensated on an equal basis by the thicker one side of copper thickness, then is etched；Another is two
Face makes circuit etching compensation by actual copper thickness, and by adjusting etching pressure during etching, this mode is suitable only for two sides copper
Paper tinsel thickness extreme difference is less than or equal to 1 ounce of situation.However, both modes are suitable only for the print of the non-constant width of circuit spacing
Wiring board processed, it is impossible to process the printed wiring board of fine-line, moreover, can not also process two sides copper thickness extreme difference more than 1 big belly
The printed wiring board of department.
The content of the invention
It is an object of the invention to provide a kind of manufacture method of the thick printed wiring board of negative and positive copper, using thick copper face and thin copper
Face separates etching process, it is intended to the problem of solution can not process fine-line in the prior art.
The embodiment of the present invention is achieved in that a kind of manufacture method of the thick printed wiring board of negative and positive copper includes following step
Suddenly：
Printed wiring board is provided, the printed wiring board includes the thick copper face and thin copper that copper thickness is different and is oppositely arranged
Face；
Conducting wire is made, the first conducting wire and the second conduction is made on the thick copper face and the thin copper face respectively
Circuit；And
Post processing, the welding resistance shielded is made in first conducting wire and the second conducting wire surface
Layer, and processing and forming is carried out to the printed wiring board；
Wherein, first conducting wire is made on the thick copper face, including：
Outer graphics are shifted, and positive circuit, and the exposed thin copper face are made on the thick copper face；
Pattern tin plating, it is tin plating to the printed wiring board whole plate, and shape on the positive circuit and on the thin copper face
Into resist layer；
Alkali etching, etches the Lu Tong areas for being exposed to the resist layer, and forms described first on the thick copper face and lead
Electric line；
The second conducting wire is made on the thin copper face, including：
Outer graphics are shifted, and negative film circuit is made on the thin copper face, and anticorrosion protection film is made on the thick copper face；
Acid etching, etches the thin copper face, and form the second conducting wire on the thin copper face.
Further, the step of also including making the film in the step of making conducting wire, it is specially：According to the print
The line pattern to be configured on wiring board processed makes the positive film and the negative film film, and the positive film is arranged at the thick copper
To make the positive circuit on face, the negative film film is arranged on the thin copper face to make the negative film circuit.
Further, the step of carrying out outer graphics transfer to the thick copper face includes：
Pad pasting, attaches film layer against corrosion, and the exposed thin copper face on the thick copper face；
Exposure, the film surface against corrosion is attached at by the positive film, under ultraviolet light, and the positive is luxuriant and rich with fragrance
Line pattern on woods, which is transferred to the thick copper face, to be needed to make the position of circuit；
Development, carries out development treatment to the printed wiring board after exposed processing, institute is formed on the thick copper face
The circuit needed.
Further, the step of graphic plating includes：
One layer of thickening layers of copper is electroplated on copper facing, the circuit formed on the thick copper face and the thin copper face；And
It is tin plating, one layer of tin is electroplated in the thickening layers of copper, the resist layer is formed.
Further, the step of alkali etching includes：
Striping, removes the film layer against corrosion attached on the thick copper face；
Etching, is etched using alkaline etching liquid to the thick copper face, and the alkaline etching liquid is sal-ammoniac copper
Etching solution；And
Tin is shelled, the resist layer is removed using tin liquor is shelled.
Further, the step of carrying out outer graphics transfer to the thin copper face includes：
Pad pasting, photoresistive mask is made on the thin copper face and the thick copper face；
Exposure, the negative film film is attached at the photoresistive mask surface of the thin copper face, under ultraviolet light, by institute
State the line pattern on the negative film film be transferred to the thin copper face need make circuit position；
Development, carries out development treatment to the printed wiring board after exposed processing, institute is formed on the thin copper face
The circuit needed.
Further, the step of acid etching includes：
Etching, the copper face being exposed on the thin copper face outside the photoresistive mask is etched using acidic etching liquid；And
Striping, removes the photoresistive mask on the thin copper face and the thick copper face.
Further, the acidic etching liquid is hydrochloric acid-ferric trichloride, hydrochloric acid-chlorine, hydrochloric acid-hydrogen peroxide, hydrochloric acid-chlorine
Change sodium or acid copper chloride etching liquid.
Further there is provided include the step of printed wiring board：
Pressing, by prepreg, internal layer circuit the plate copper foil lamination different with thickness and is pressed, and obtains described
Printed wiring board；
Drilling：Via hole is processed on the printed wiring board；
Heavy copper：Copper-coating is carried out to the via hole and in the hole wall formation layers of copper of the via hole；
Copper facing：One copper plate is plated to the hole wall of the via hole and the thick copper face of the printed wiring board and thin copper face.
Further, the step of post processing includes：
Welding resistance, solder mask is coated using wire mark mode on the thick copper face and the thin copper face, forms the welding resistance
Layer；
Character, character marking ink is coated using wire mark mode on the solder mask；And
Shaping, sharp processing is carried out to the printed wiring board.
The manufacture method for the thick printed wiring board of negative and positive copper that the present invention is provided on thick copper face and thin copper face by separately making
Make corresponding first conducting wire and the second conducting wire, when making the first conducting wire on thick copper face, protected using resist layer
Protect thin copper face, it is ensured that be only etched on thick copper face；When making the second conducting wire on thin copper face, on thick copper face
Form anticorrosion protection film, it is ensured that be only etched on thin copper face.So, thick copper face and thin copper face are etched respectively
Processing obtains corresponding conducting wire, and this method can make fine-line on the printed wiring board of different copper thicknesses,
Moreover, not limited by copper thickness extreme difference.
Brief description of the drawings
Fig. 1 is the flow chart of the manufacture method of the thick printed wiring board of negative and positive copper provided in an embodiment of the present invention.
Fig. 2 is the flow chart of making conducting wire provided in an embodiment of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Please Parameter Map 1 and Fig. 2, the manufacture method of the thick printed wiring board of negative and positive copper provided in an embodiment of the present invention includes following
Step：
S1：Printed wiring board is provided, the printed wiring board include copper thickness different and the thick copper face that is oppositely arranged and
Thin copper face；It is to be appreciated that the thick copper face and thin copper face in the present embodiment are relative concept.
S2：Conducting wire is made, the first conducting wire and second is made on the thick copper face and the thin copper face respectively
Conducting wire；It is to be appreciated that S2 points of step for making conducting wire is to make the first conducting wire on the thick copper face
Step S2a and the step of make the second conducting wire S2b on the thin copper face.
S3：Post processing, the resistance shielded is made in first conducting wire and the second conducting wire surface
Layer, and processing and forming is carried out to the printed wiring board；
Wherein, S2a：First conducting wire is made on the thick copper face, including：
S21, outer graphics transfer makes positive circuit, and the exposed thin copper face on the thick copper face；
S22, pattern tin plating is tin plating to the printed wiring board whole plate, and on the positive circuit and the thin copper face
Upper formation resist layer；
S23, alkali etching, etching is exposed to the Lu Tong areas of the resist layer, and forms on the thick copper face described the
One conducting wire；
S2b：The second conducting wire is made on the thin copper face, including：
S24, outer graphics transfer, negative film circuit is made on the thin copper face, guarantor against corrosion is made on the thick copper face
Cuticula；
S25, acid etching etches the thin copper face, and form the second conducting wire on the thin copper face.
The manufacture method is existed using the first conducting wire and the second conducting wire is fabricated separately to thick copper face and thin copper face
When thick copper face makes the first conducting wire, resist layer is made on thin copper face, to be etched to thick copper face；In thin copper face
During the second conducting wire of upper making, anticorrosion protection film is made on thick copper face, to be etched to thin copper face.By respectively
Make the first conductive pattern and the second conductive pattern on thick copper face and thin copper face, can different copper thicknesses printed wiring
Fine-line is made on plate, and the manufacture method is not limited by two sides copper thickness extreme difference, for two sides copper thickness pole
Difference is more than 1 ounce of printed wiring board, still ensures that circuit quality.
Further, the step of also including making the film in the step S2 for making conducting wire, it is specially：According to described
The line pattern to be configured on printed wiring board makes the positive film and the negative film film, and the positive film is arranged at the thickness
To make the positive circuit on copper face, the negative film film is arranged on the thin copper face to make the negative film circuit.Print
The line pattern to be configured on wiring board processed refers to according to different use demands, the line map set on printed wiring board
Shape, the line pattern is different and different because use demand.Alternatively, the positive film and the negative film film are using photograph
Phase method and be made.
Fig. 2 is refer to, the step S21 that the thick copper face carries out outer graphics transfer is included：
Pad pasting, attaches film layer against corrosion, and the exposed thin copper face on the thick copper face；
Exposure, the film surface against corrosion is attached at by the positive film, under ultraviolet light, and the positive is luxuriant and rich with fragrance
Line pattern on woods, which is transferred to the thick copper face, to be needed to make the position of circuit；
Development, carries out development treatment to the printed wiring board after exposed processing, institute is formed on the thick copper face
The circuit needed.
More preferably, film layer against corrosion is attached on thick copper face using heat posted mode.Thick copper face after pad pasting processing is carried out
Exposure and development treatment, i.e., using the energy of ultraviolet light, make the photoactive substance in film layer against corrosion carry out photochemical reaction, to reach
The effect of selective local crane span structure hardening, and the purpose of image transfer is completed, and in the presence of liquid medicine sodium carbonate, will be unexposed
After partial film layer against corrosion dissolves and rinsed, photosensitive part is left, required line pattern is formed on thick copper face.
Fig. 2 is refer to, further, the step S22 of the graphic plating includes：
One layer of thickening layers of copper is electroplated on copper facing, the circuit formed on the thick copper face and the thin copper face；And
It is tin plating, one layer of tin is electroplated in the thickening layers of copper, the resist layer is formed.
Printed wiring board after to being handled through outer graphics carries out graphic plating, the circuit formed in thick copper face and thin copper
Copper facing and tin plating processing are distinguished on face, the resist layer of alkali resistant etching is formed, plays a part of protection circuit figure.
Fig. 2 is refer to, further, the step S23 of the alkali etching includes：
Striping, removes the film layer against corrosion attached on the thick copper face；
Etching, is etched using alkaline etching liquid to the thick copper face, and the alkaline etching liquid is sal-ammoniac copper
Etching solution；And
Tin is shelled, the resist layer is removed using tin liquor is shelled.
Using going film liquid to remove the film layer against corrosion on thick copper face, in order to subsequently carry out alkali etching processing to thick copper face,
Alternatively, this goes film liquid for sodium hydroxide solution or organic goes film liquid.The layers of copper on thick copper face is entered using alkaline etching liquid
Row etching process, and the resist layer on printed wiring board is divested, alternatively, the stripping tin liquor is salpeter solution.
The step S24 that the thin copper face carries out outer graphics transfer is included：
Pad pasting, photoresistive mask is made on the thin copper face and the thick copper face；
Exposure, the negative film film is attached at the photoresistive mask surface of the thin copper face, under ultraviolet light, by institute
State the line pattern on the negative film film be transferred to the thin copper face need make circuit position；
Development, carries out development treatment to the printed wiring board after exposed processing, institute is formed on the thin copper face
The circuit needed.
The step of to carrying out outer graphics transfer on thick copper face, is similar, and difference is, during pad pasting, on thick copper face
Also photoresistive mask is attached to protect thick copper face not etched by acidic etching liquid；During exposure, it is attached at using the negative film film thin
The photoresistive mask surface of copper face, and subjected to development, line pattern needed for being formed on thin copper face.Alternatively, it is described against corrosion to cover
Mould is acid resistance film layer, more preferably, and the photoresistive mask is organic film resist layer.
Further, the step S25 of the acid etching includes：
Etching, the copper face being exposed on the thin copper face outside the photoresistive mask is etched using acidic etching liquid；And
Striping, removes the photoresistive mask on the thin copper face and the thick copper face.
Acidic etching liquid is chemically reacted with the copper on thin copper face, circuit needed for being formed on thin copper face, and utilization is gone
Film liquid removes the photoresistive mask on thin copper face and thick copper face, obtains the line pattern on thin copper face.Alternatively, this goes film liquid to be alkali
Property go film liquid, more preferably, this go film liquid be potassium hydroxide or sodium hydroxide solution.
More preferably, the acidic etching liquid is hydrochloric acid-ferric trichloride, hydrochloric acid-chlorine, hydrochloric acid-hydrogen peroxide, hydrochloric acid-chlorination
Sodium or acid copper chloride etching liquid.The copper of the acidic etching liquid and thin copper face chemically reacts, the line formed on thin copper face
Road figure.
Further include there is provided the step S1 of printed wiring board：
Pressing, by the different copper foil of thickness, prepreg and internal layer circuit plate lamination and is pressed, and obtains described
Printed wiring board；
Drilling：Via hole is processed on the printed wiring board；
Heavy copper：Copper-coating is carried out to the via hole and in the hole wall formation layers of copper of the via hole；
Copper facing：One copper plate is plated to the hole wall of the via hole and the thick copper face of the printed wiring board and thin copper face.
More preferably, the printed wiring board is the multilayer circuit board through pressing processing.In other embodiments, the printed wiring
Plate is to include substrate and be attached at the apparent surface of substrate two and the different layers of copper of copper thickness, can be as in multilayer circuit board
Laminate.And the printed wiring board after pressing is drilled, heavy copper and copper plating treatment, make via hole and thick copper face and thin copper face
Mutual conduction.
Further, the step S3 of post processing includes：
Welding resistance, solder mask is coated using wire mark mode on the thick copper face and the thin copper face, forms the welding resistance
Layer；
Character, character marking ink is coated using wire mark mode on the solder mask；And
Shaping, sharp processing is carried out to the printed wiring board.
Best printed wiring board finished product is obtained by welding resistance, character and forming processes.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. the manufacture method of the thick printed wiring board of a kind of negative and positive copper, it is characterised in that comprise the following steps：
Printed wiring board is provided, the printed wiring board includes the thick copper face and thin copper face that copper thickness is different and is oppositely arranged；
Conducting wire is made, the first conducting wire and the second conductor wire is made on the thick copper face and the thin copper face respectively
Road；And
Post processing, the solder mask shielded is made in first conducting wire and the second conducting wire surface, and
Processing and forming is carried out to the printed wiring board；
Wherein, first conducting wire is made on the thick copper face, including：
Outer graphics are shifted, and positive circuit, and the exposed thin copper face are made on the thick copper face；
Pattern tin plating, it is tin plating to the printed wiring board whole plate, and use is formed on the positive circuit and on the thin copper face
In the resist layer of resistance alkaline etching liquid；
Alkali etching, etching is exposed to the Lu Tong areas of the resist layer, and forms on the thick copper face first conductor wire
Road；
The second conducting wire is made on the thin copper face, including：
Outer graphics are shifted, and negative film circuit is made on the thin copper face, and anticorrosion protection film is made on the thick copper face；
Acid etching, etches the thin copper face, and form the second conducting wire on the thin copper face.
2. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 1, it is characterised in that making conducting wire
The step of in also include make the film the step of, be specially：According to the line map shape to be configured on the printed wiring board
Make the positive film and the negative film film, the positive film is arranged on the thick copper face to make the positive circuit, described negative
The piece film is arranged on the thin copper face to make the negative film circuit.
3. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 2, it is characterised in that enter to the thick copper face
The step of row outer graphics are shifted includes：
Pad pasting, attaches film layer against corrosion, and the exposed thin copper face on the thick copper face；
Exposure, is attached at the film surface against corrosion, under ultraviolet light, by the positive film by the positive film
Line pattern be transferred to the thick copper face need make circuit position；
Development, development treatment is carried out to the printed wiring board after exposed processing, required for being formed on the thick copper face
Circuit.
4. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 3, it is characterised in that the pattern tin plating
Step includes：
One layer of thickening layers of copper is electroplated on copper facing, the circuit formed on the thick copper face and the thin copper face；And
It is tin plating, one layer of tin is electroplated in the thickening layers of copper, the resist layer is formed.
5. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 4, it is characterised in that the alkali etching
Step includes：
Striping, removes the film layer against corrosion attached on the thick copper face；
Etching, is etched using alkaline etching liquid to the thick copper face, and the alkaline etching liquid etches for sal-ammoniac copper
Liquid；And
Tin is shelled, the resist layer is removed using tin liquor is shelled.
6. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 2, it is characterised in that enter to the thin copper face
The step of row outer graphics are shifted includes：
Pad pasting, photoresistive mask is made on the thin copper face and the thick copper face；
Exposure, the negative film film is attached at the photoresistive mask surface of the thin copper face, under ultraviolet light, will be described negative
Line pattern on the piece film, which is transferred to the thin copper face, to be needed to make the position of circuit；
Development, development treatment is carried out to the printed wiring board after exposed processing, required for being formed on the thin copper face
Circuit.
7. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 6, it is characterised in that the acid etching
Step includes：
Etching, the copper face being exposed on the thin copper face outside the photoresistive mask is etched using acidic etching liquid；And
Striping, removes the photoresistive mask on the thin copper face and the thick copper face.
8. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 7, it is characterised in that the acidic etching liquid
For hydrochloric acid-ferric trichloride, hydrochloric acid-chlorine, hydrochloric acid-hydrogen peroxide, hydrochloric acid-sodium chloride or acid copper chloride etching liquid.
9. the manufacture method of the thick printed wiring board of negative and positive copper as described in claim 1 to 8 any one, it is characterised in that carry
The step of for printed wiring board, includes：
Pressing, by prepreg, internal layer circuit the plate copper foil lamination different with thickness and is pressed, and obtains the printing
Wiring board；
Drilling：Via hole is processed on the printed wiring board；
Heavy copper：Copper-coating is carried out to the via hole and in the hole wall formation layers of copper of the via hole；
Copper facing：One copper plate is plated to the hole wall of the via hole and the thick copper face of the printed wiring board and thin copper face.
10. the manufacture method of the thick printed wiring board of negative and positive copper as claimed in claim 9, it is characterised in that the step of post processing
Include：
Welding resistance, solder mask is coated using wire mark mode on the thick copper face and the thin copper face, forms the solder mask；
Character, character marking ink is coated using wire mark mode on the solder mask；And
Shaping, sharp processing is carried out to the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310364780.3A CN104427776B (en) | 2013-08-20 | 2013-08-20 | The manufacture method of negative and positive copper thickness printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310364780.3A CN104427776B (en) | 2013-08-20 | 2013-08-20 | The manufacture method of negative and positive copper thickness printed wiring board |
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| CN104427776A CN104427776A (en) | 2015-03-18 |
| CN104427776B true CN104427776B (en) | 2017-11-07 |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578774A (en) * | 2015-12-25 | 2016-05-11 | 惠州中京电子科技有限公司 | Fabrication method for female and male copper thicknesses of printed circuit board (PCB) |
| CN106211600B (en) * | 2016-07-28 | 2019-03-05 | 陈国富 | The production method that the LED printed wiring board of copper etching area can be saved |
| CN106852033A (en) * | 2017-04-06 | 2017-06-13 | 昆山苏杭电路板有限公司 | High precision part very high current printed circuit board processing method |
| CN107683025B (en) * | 2017-11-01 | 2021-04-27 | 汕头凯星印制板有限公司 | Manufacturing method of PCB with same layer surface and non-uniform copper thickness |
| CN108811353A (en) * | 2018-08-15 | 2018-11-13 | 江门崇达电路技术有限公司 | A kind of engraving method of two sides different Cu thickness PCB |
| CN110267448A (en) * | 2019-06-04 | 2019-09-20 | 深圳市迅捷兴科技股份有限公司 | Complex copper thick substrate production method |
| CN112235951B (en) * | 2020-10-20 | 2021-09-21 | 盐城维信电子有限公司 | Method for manufacturing circuit boards with different copper thicknesses |
| CN113133214A (en) * | 2021-04-07 | 2021-07-16 | 洛阳伟信电子科技有限公司 | Method for manufacturing asymmetric copper thick multilayer board |
| CN113840478A (en) * | 2021-09-08 | 2021-12-24 | 景旺电子科技(珠海)有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN114158195B (en) * | 2021-12-03 | 2023-10-24 | 四会富仕电子科技股份有限公司 | Method for manufacturing precise circuit with assistance of laser |
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| JP4626068B2 (en) * | 2001-02-28 | 2011-02-02 | ソニー株式会社 | Etching method and etching apparatus |
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|---|---|---|---|---|
| CN101230226A (en) * | 2007-01-25 | 2008-07-30 | 新应材股份有限公司 | New process of double-faced micro-shadow etching and components of protective coating thereof |
| CN102651946A (en) * | 2012-04-05 | 2012-08-29 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
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