CN113133214A

CN113133214A - Method for manufacturing asymmetric copper thick multilayer board

Info

Publication number: CN113133214A
Application number: CN202110370811.0A
Authority: CN
Inventors: 郭晓文; 代凤双; 张彦峰
Original assignee: LUOYANG WEIXIN ELECTRONIC TECHNOLOGY CO LTD
Current assignee: LUOYANG WEIXIN ELECTRONIC TECHNOLOGY CO LTD
Priority date: 2021-04-07
Filing date: 2021-04-07
Publication date: 2021-07-16

Abstract

The invention has introduced the preparation method of a asymmetric copper thick multiply wood, include in the production run of the printed board, according to the copper foil thickness that each layer of printed board designs the requirement at first, choose the appropriate double-sided copper clad laminate to lay off, etch and remove the copper foil of one side among them, choose prepreg and copper foil with appropriate thickness again, laminate, make the core plate material of the required asymmetric copper thickness, use the above-mentioned core plate to make the corresponding circuit pattern; finally, all the inner layers are sequentially manufactured according to the method, and the outer layer patterns are manufactured by laminating. The invention has strong applicability and reliable quality, and can manufacture high-quality multilayer boards with asymmetric copper thickness.

Description

Method for manufacturing asymmetric copper thick multilayer board

Technical Field

The invention relates to the field of manufacturing of printed boards, in particular to a manufacturing method of an asymmetric copper thick multilayer board.

Background

With the continuous development of printed board technology, especially the emergence of high-power military and avionic products, the functional requirements of customers on the printed board to be realized are higher and higher, and the complexity of the printed board processing technology is also increased continuously. In order to improve the heat dissipation and excessive current capacity of the printed board, the thickness of conductor copper needs to be increased in the inner layer pattern of some multilayer board parts, and meanwhile, the thickness of other layer patterns needs to be thin copper. In this case, the conventional core-board lamination process cannot meet the processing requirement.

Disclosure of Invention

The invention aims to solve the technical problem of providing a method for manufacturing a multilayer board with an asymmetric copper thickness, which can manufacture a multilayer board with high quality, and has strong processing operability and high efficiency; and the quality is reliable and the cost is economical.

In order to solve the technical problems, the invention adopts the following technical scheme:

a method for manufacturing an asymmetric copper thick multilayer board comprises the following steps:

step 1: manufacturing an asymmetric copper thick core plate; firstly, according to the thickness of copper foil required by each layer of a printed board, selecting a double-sided copper-clad laminate with the proper thickness and the copper foil thickness of a for blanking, etching the copper foil on one side, filling a prepreg with the proper thickness, pasting the copper foil with the thickness of b, and laminating to manufacture a core board with the copper foil thickness of a on one side and the copper foil thickness of b on one side; by using the method, each core plate material with asymmetric copper thickness is manufactured by lamination;

step 2: and (3) using the core plate materials to sequentially and correspondingly manufacture circuit patterns of each layer: firstly, carrying out dry film protection on the surface A, exposing the surface B to prepare a pattern, processing the copper thickness of the pattern on the surface B to the required thickness by an electroplating method, and etching to prepare a circuit pattern; the same method, make A surface circuit figure, namely B surface carries on the dry film protection, expose and make figure in A surface, process the copper thickness of A surface figure to the necessary thickness with the electroplating method, etch and make the circuit figure;

the surface A refers to the surface corresponding to the printed board with the side copper foil of which the thickness is a; the side B refers to the side corresponding to the printed board with the side copper foil thickness of B;

and step 3: blackening treatment: blackening the core plate to improve the bonding force of the inner layer; the blackening treatment can passivate the copper surface, enhance the surface coarsening degree of the inner-layer copper foil and further improve the bonding force of the inner layer; ,

and 4, step 4: laminating the laminated plates: adopting a pin positioning method to carry out lamination;

and 5: and after laminating, secondary drilling is carried out on a drilling machine, and the printed board is normally processed until a finished product is obtained.

Specifically, the number of laminated layers of the laminated plate is 2-5.

In the production process of the printed board in the technical scheme, firstly, according to the thickness of copper foil required by each layer of the printed board, a double-sided copper-clad foil board with proper copper thickness and board thickness is selected for blanking, the copper foil on one side of the double-sided copper-clad foil board is etched, and then a prepreg and the copper foil with proper thickness are selected for lamination to manufacture a core board material with the required asymmetric copper thickness; then, the core plate materials are used for correspondingly manufacturing circuit patterns of all layers in sequence: firstly, performing dry film protection on the surface A, manufacturing a surface B pattern, electroplating copper on the pattern to a required thickness, and etching to manufacture a surface B circuit pattern. The same method is used to make A-line circuit pattern. All the inner layers are sequentially manufactured according to the method, lamination is carried out, and the outer layer of the printed board is normally processed until a finished product is obtained.

These technical solutions, including the improved technical solution and the further improved technical solution, can also be combined or combined with each other, thereby achieving better technical effects.

By adopting the technical scheme, the invention has the following beneficial effects:

the manufacturing method of the asymmetric copper-thick multilayer board of the invention can meet the requirements of customers on different copper thicknesses and can reduce the production cost by manufacturing the core board with the asymmetric copper thickness. And circuit patterns are respectively manufactured according to different base copper thicknesses on two sides of the core plate, so that circuit deformation caused by different side etching amounts can be effectively avoided. The line manufacturing precision can be effectively improved, and the processing capacity is improved.

The invention has strong applicability and reliable quality, can improve the processing capacity and can manufacture high-quality multilayer boards with asymmetric copper thickness.

Drawings

Fig. 1 is a schematic diagram of core board manufacturing of the method for manufacturing an asymmetric copper thick multilayer board of the present invention.

Fig. 2 is a state of the multilayer board after lamination in the manufacturing method of the asymmetric copper thick multilayer board of the present invention.

In the figure, 1-copper clad laminate, 2-prepreg and 3-copper foil.

Detailed Description

The patent is further illustrated below with reference to examples. The scope of protection of the patent is not limited to the specific embodiments.

Example 1

The finished multilayer boards with copper thicknesses of 140 μm and 70 μm, respectively, are exemplified. Firstly, according to the thickness of copper foil required by each layer of the printed board, selecting a double-sided copper-clad foil board with the thickness of 0.3mm and the thickness of 105 mu m copper for blanking, etching the copper foil on one side, and then selecting a 2116 prepreg with the thickness of 0.1mm and a copper foil with the thickness of 35 mu m for laminating to manufacture a core board material with the required asymmetric copper thickness. The core plate had a copper thickness of 105 μm on the A side and 35 μm on the B side.

And (3) manufacturing a corresponding circuit pattern by using the obtained core board: firstly, carrying out dry film protection on the surface A, exposing the surface B to prepare a pattern, electroplating copper on the pattern until the thickness of the pattern reaches 140 mu m, and etching to prepare a circuit pattern. And (4) carrying out dry film protection on the surface B by the same method, exposing the surface A to prepare a pattern, electroplating copper on the pattern until the thickness is 70 mu m, and etching to prepare a circuit pattern. Thus, an inner layer pattern is produced.

All the inner layers are sequentially manufactured according to the method, lamination is carried out, secondary drilling is carried out after lamination, and the outer layer of the printed board is normally processed until a finished product is obtained.

The core plate with the asymmetric copper thickness is manufactured, so that the individual requirements of different copper thicknesses of patterns of each layer of a customer can be met, and the production cost can be reduced. And circuit patterns are respectively manufactured according to different base copper thicknesses on two sides of the core plate, so that circuit deformation caused by different side etching amounts can be effectively avoided. The line manufacturing precision can be effectively improved, and the processing capacity is improved.

The invention has strong applicability and reliable quality, and can manufacture high-quality multilayer boards with asymmetric copper thickness.

Claims

1. A method for manufacturing an asymmetric copper thick multilayer board is characterized by comprising the following steps: the method comprises the following steps:

and step 3: blackening treatment: blackening the core plate to improve the bonding force of the inner layer;

2. The method for making an asymmetric copper thick multilayer board according to claim 1, characterized in that: the laminated number of the laminated plates is 2-5.