CN117881112B - 28-Layer 8-order Ultra HDI and manufacturing method thereof - Google Patents
28-Layer 8-order Ultra HDI and manufacturing method thereof Download PDFInfo
- Publication number
- CN117881112B CN117881112B CN202410276404.7A CN202410276404A CN117881112B CN 117881112 B CN117881112 B CN 117881112B CN 202410276404 A CN202410276404 A CN 202410276404A CN 117881112 B CN117881112 B CN 117881112B
- Authority
- CN
- China
- Prior art keywords
- layer
- rtf
- copper
- separated
- hdi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 80
- 239000011889 copper foil Substances 0.000 claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 238000009713 electroplating Methods 0.000 claims abstract description 10
- 238000003475 lamination Methods 0.000 claims abstract description 10
- 238000005553 drilling Methods 0.000 claims abstract description 9
- 101001134276 Homo sapiens S-methyl-5'-thioadenosine phosphorylase Proteins 0.000 claims abstract description 8
- 102100022050 Protein canopy homolog 2 Human genes 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000002253 acid Substances 0.000 claims abstract description 6
- 230000008021 deposition Effects 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims description 5
- 230000003746 surface roughness Effects 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims description 2
- 238000011156 evaluation Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 124
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 4
- 239000011229 interlayer Substances 0.000 abstract description 3
- YXLXNENXOJSQEI-UHFFFAOYSA-L Oxine-copper Chemical compound [Cu+2].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 YXLXNENXOJSQEI-UHFFFAOYSA-L 0.000 abstract 1
- 239000003292 glue Substances 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 8
- 238000013461 design Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a 28-layer 8-order Ultra HDI and a manufacturing method thereof, which relate to the technical field of printed circuit board processing, and the method comprises the following steps: pressing: 12 RTF copper foils and 8 PP 1037 copper foils are stacked and pressed; and (3) reducing copper browning: two sides are respectively laminated with an RTF copper foil and separated by a PP; reducing the copper thickness of the outermost layer to 4-6 mu m; laser drilling: designing 6-8 laser inner targets; the laser aperture is 70 mu m plus or minus 5 mu m; removing the glue by plasma; copper deposition; hole filling electroplating; line film sticking: adopting a special dry film of MSAP; acid etching of the negative film; judging: if 16 RTF copper foils are laminated in the steps, ending; if not, the process is started from the copper-reduced browning. The scheme adopts the technologies of ultra-fine circuit manufacture, ultra-thin dielectric layer lamination, micro blind hole manufacture, interlayer alignment and the like, the line width and line distance reach 30 mu m/20 mu m, the dielectric layer is 30 mu m, and the aperture of the blind hole is 75 mu m.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a 28-layer 8-order Ultra HDI and a manufacturing method thereof.
Background
Ultra HIGH DENSITY Interconnecter Chinese is Ultra high density interconnection board, abbreviated as Ultra HDI, which refers to the product with line width and line distance less than 50 μm, dielectric layer thickness less than 50 μm, blind hole diameter less than 75 μm. Ultra HDI promotes the development of HDI to a more precise direction, so that intelligent mobile terminals and intelligent wearing are rapidly popularized in the market, and are rapidly promoted to be new.
The following problems exist in making conventional HDI products: the two surfaces of the selected copper foil are respectively a smooth surface and a roughened surface, the roughened surface is generally adhered with resin, the smooth surface is used for adhering a dry film, but the smooth surface has poor binding force, is not beneficial to adhering the dry film and is also not beneficial to manufacturing a fine circuit; when drilling, the laser internal targets are generally only 4, the alignment degree is required to be improved, and the like. The invention improves the processes of drilling, manufacturing circuits and the like, and selects special copper foil and dry film to obtain a 28-layer 8-order Ultra HDI product, wherein the line width and line distance reach 30 mu m/20 mu m, the dielectric layer is 30 mu m, and the aperture of the blind hole is 75 mu m.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides a 28-layer 8-order Ultra HDI and a manufacturing method thereof, wherein the line width and line distance reach 30 mu m/20 mu m, the dielectric layer is 30 mu m, and the aperture of a blind hole is 75 mu m.
In order to achieve the object of the invention, the following scheme is adopted:
a28-layer 8-order Ultra HDI manufacturing method comprises the following steps:
S1, laminating: providing 12 RTF copper foils, wherein the surface roughness evaluation parameter Rz is less than or equal to 2 mu m, and the copper thickness is 12 mu m; providing 8 pieces of PP 1037; stacking RTF copper foil and PP1037, wherein the RTF copper foil of the 9 th layer and the 10 th layer, the 11 th layer and the 12 th layer, the 13 th layer and the 14 th layer, the 15 th layer and the 16 th layer, the 17 th layer and the 18 th layer and the 19 th layer and the 20 th layer are separated by one PP1037, and the RTF copper foil of the 14 th layer and the 15 th layer is separated by two PP 1037; pressing, wherein the thickness of the medium layer after pressing is not more than 30 mu m;
S2, copper browning reduction: laminating an RTF copper foil on the top and the bottom of the lamination structure prepared in the previous step, and separating the lamination structure from the lamination structure by adopting a PP; reducing the copper thickness of the outermost layer to 4-6 mu m;
S3, laser drilling: designing 6-8 laser inner targets; the laser aperture is 70 mu m plus or minus 5 mu m, and the AOI is confirmed by automatic optical detection;
S4, plasma photoresist removal: removing surface residues after laser drilling;
S5, copper deposition;
S6, hole filling electroplating: the copper thickness after electroplating ranges from 15 μm to 20 μm;
S7, line film sticking: the film is a special dry film for MSAP, the thickness is 15 mu m, the resolution meets 10 mu m/10 mu m, the minimum line width of the dry film reaches 10 mu m, the dry film adhesive force test meets 10 mu m/10 mu m, and the line with the line width of 10 mu m does not drop the dry film after etching;
S8, negative acid etching: after etching, the aperture of the obtained blind hole is 75 mu m, and the line width and line distance are 30 mu m/20 mu m;
S9, judging: if 16 RTF copper foils are laminated in the steps, ending; if not, continuing to execute from S2;
in step S2, the layer 9 laminated RTF copper foil is separated by a piece of PP 1037; the 21 st layer of laminated RTF copper foil is separated by a piece of PP 1037; the remaining layers of laminated RTF copper foil are separated by a sheet of PP 1017.
Further, in step S7, parameters of film lamination: coarsening speed in pretreatment is 1.5m/min, film pasting speed is 1.5m/min, film pasting temperature is 110+/-5 ℃, and film pressing pressure is 1.5Kg/cm 2.
In step S7, the dry film dedicated to MSAP is selected from ADH-158 type of Asahi chemical.
Further, in step S8, the exposure machine used in the etching process uses a core mark MAS 8.
Further, in step S8, the outer layer line exposure uses the laser inner target as the alignment target hole for the split exposure: the PE and JE values were set at 10. Mu.m.
Further, the blind hole size is consistent with the pad size.
The 28-layer 8-order Ultra HDI is manufactured by adopting the 28-layer 8-order Ultra HDI manufacturing method, and comprises 28 RTF copper foils, 14 PP 1017 sheets and 10 PP 1037 sheets which are overlapped;
From top to bottom, two adjacent layers of RTF copper foils from layer 1 to layer 8 are separated by a PP 1017 sheet; the RTF copper foil from the 8 th layer to the 10 th layer is respectively separated by a PP 1037, the 11 th layer and the 12 th layer, the 13 th layer and the 14 th layer, the 15 th layer and the 16 th layer, the 17 th layer and the 18 th layer, the 19 th layer and the 20 th layer, the 20 th layer and the 21 th layer are respectively separated by a PP 1037, and the 14 th layer and the 15 th layer are respectively separated by two PP 1037; two adjacent layers of RTF copper foils from 21 layers to 28 layers are separated by a piece of PP 1017.
The invention has the beneficial effects that:
1. By adopting the technologies of Ultra-fine circuit manufacture, ultra-thin dielectric layer lamination, micro blind hole manufacture, interlayer alignment and the like, 28 layers of 8-order Ultra HDI products can be manufactured.
2. Regarding ultra-fine line fabrication: the special RTF copper foil is adopted, roughening treatment is carried out on two sides, the surface roughness assessment parameter is small, and a good etching effect can be obtained when etching is carried out subsequently; when the copper is reduced to brown, the thickness of the copper at the outermost layer is reduced to 4-6 mu m, the substrate cannot be leaked, and the circuit requirement can be met after hole filling electroplating in the later stage; and a special MSAP special dry film is adopted, and the semi-additive dry film is combined with negative film acid etching, so that the fine circuit manufacturing is facilitated.
3. Regarding blind hole fabrication and alignment: the size of the blind hole is consistent with that of the bonding pad, so that the blind hole processing technology is simplified; during etching, 6-8 laser inner targets are adopted as alignment target holes for outer layer line exposure, so that the alignment degree can be improved; after etching, the alignment degree of the blind holes and the circuit pads is less than or equal to 5 mu m.
4. Beneficial effects of ultra-fine circuitry on circuit board and its performance: (1) The circuit board has the advantages that the circuit is finer, the distance between the components is greatly reduced, the size of the circuit board is obviously reduced, and meanwhile, the whole weight is reduced, so that the circuit board is suitable for being applied to portable and wearable equipment; (2) The higher wiring density allows more electronic components to be placed in a limited space, so that the integration level of the circuit board is improved, and a system with more complex functions can be designed; (3) The signal integrity is enhanced, the fine line design is beneficial to reducing loss and delay in the signal transmission process, improving the signal integrity and the time sequence performance of the system, supporting higher frequency components and faster data transmission rate, such as being applied to 5G communication and high-speed memory interfaces.
5. Beneficial effects of ultra-thin dielectric layers on circuit boards and their performance: the dielectric layer is used as an insulating and isolating material between adjacent conductive layers, the ultrathin dielectric layer can shorten the transmission time of signals between different layers, and for high-speed signals, lower signal delay is meant, and the signal transmission speed is improved.
6. Beneficial effects of micro blind holes on circuit board and its performance: the space is greatly saved, the three-dimensional wiring capacity of the circuit board is enhanced, the interference can be reduced, and the signal quality is improved.
Drawings
FIG. 1 shows a prior art blind hole design schematic;
FIG. 2 shows a schematic diagram of blind via design in this embodiment;
FIG. 3 shows a schematic design of a laser inner target;
FIG. 4 is a schematic view showing a 12-layer copper foil laminate structure;
Fig. 5 shows a schematic diagram of a 28-layer copper foil structure.
Detailed Description
Example 1
The embodiment provides a 28-layer 8-order Ultra HDI manufacturing method, which comprises the following steps:
S1, laminating: as shown in FIG. 4, providing 12 copper foils, wherein the copper foils are special RTF copper foils, the copper thickness is 12 μm, and the surface roughness rating parameter Rz is less than or equal to 2 μm, because the RTF copper foils are roughened on both sides and the surface roughness rating parameter of the RTF copper foils is small, and better etching effect can be obtained when subsequent etching is performed; providing 8 sheets of PP 1037, wherein the PP Chinese is prepreg; stacking the RTF copper foil and the PP 1037, wherein the UltraHDI layers are 28 layers, and the 12 RTF copper foils pressed in the pressing step correspond to the 9 th layer to the 20 th layer of the 28 layers, and the 9 th layer and the 10 th layer, the 11 th layer and the 12 th layer, the 13 th layer and the 14 th layer, the 15 th layer and the 16 th layer, the 17 th layer and the 18 th layer, the 19 th layer and the 20 th layer, and the 20 th layer and the 21 th layer of the RTF copper foil are separated by one PP 1037 from top to bottom, and the 14 th layer and the 15 th layer are separated by two PP 1037; and (5) pressing, wherein the thickness of the medium layer after pressing is 30 mu m.
S2, copper browning reduction: as shown in fig. 5, an RTF copper foil is laminated on the top and bottom of the laminated structure prepared in the previous step, and is separated from the laminated structure by a PP, and the RTF copper foil is generally used as a communication product to prevent skin effect, and is not generally applied to copper-brown reduction technology; then the copper thickness of the outermost layer is reduced to 4-6 mu m, the median value is 5 mu m, the copper is generally reduced to 6-8 mu m in the prior art, and experiments show that the too thin copper thickness is easy to leak out of the substrate, the too thick copper thickness cannot meet the circuit requirement after hole filling electroplating in the later stage.
S3, laser drilling: the Mitsubishi laser machine is adopted, 4 laser inner targets in the prior art are generally designed, and 6-8 laser inner targets are designed here for increasing the alignment degree, as shown in fig. 3; the laser aperture was 70 μm.+ -. 5 μm and confirmed by automatic optical inspection of AOI.
S4, plasma photoresist removal: the removal of surface residues after laser drilling, plasma desmutting is prior art and will not be described in detail here.
S5, copper deposition: for the prior art, this is not explained in detail here.
S6, hole filling electroplating: the copper thickness is increased by 12 mu m after electroplating, the copper thickness is controlled to be 15 mu m-20 mu m in the step, and the electroplating range is controlled to be +/-1.5 mu m.
S7, line film sticking: the film is a MSAP special dry film selected from ADH-158 model of Asahi chemical, dry film thickness of 15 μm, dry film adhesion test of 10 μm/10 μm, and resolution of 10 μm/10 μm.
Film sticking parameters: coarsening speed in pretreatment is 1.5m/min, film pasting speed is 1.5m/min, film pasting temperature is 110+/-5 ℃, and film pressing pressure is 1.5Kg/cm 2.
S8, negative acid etching: the pore diameter of the blind hole obtained after etching is 75 μm, and the line width line distance is 30 μm/20 μm. In the step, the exposure machine adopts core-stitch MAS 8, and the outer layer line exposure adopts laser inner targets as alignment target holes for split exposure: PE and JE are set to 10 μm, PE is called Pitch Error, chinese is Pitch Error; JE is totally called Jogging Error, chinese is inching error, and the smaller the JE value is, the more accurate the circuit is.
The special dry film for MSAP is a half-addition dry film, and the embodiment combines the half-addition dry film with negative acid etching, thereby being beneficial to fine circuit manufacture.
S9, judging: if 16 RTF copper foils are laminated in the steps, wherein 8 copper foils are laminated at the top and 8 copper foils are laminated at the bottom, finishing the manufacturing flow; if not, execution continues from S2.
It must be stated that: in step S2, the layer 9 laminated RTF copper foil is separated from the layer 8 by a sheet of PP 1037; the 21 st layer of laminated RTF copper foil is separated from the 20 th layer by a PP 1037 sheet; the remaining layers of laminated RTF copper foil are separated by a sheet of PP 1017.
Regarding the fabrication of blind holes, as shown in FIG. 1, the size of blind holes designed in the prior art is smaller than that of the bonding pads, and the size of annular rings of the blind holes is B/2-A/2; as shown in fig. 2, the size of the blind hole designed in the embodiment is consistent with the size of the bonding pad, so that the blind hole processing technology is simplified; during etching, the outer layer circuit is exposed by adopting a laser inner target as a positioning target hole; after etching, the alignment degree of the blind holes and the circuit pads is less than or equal to 5 mu m.
In conclusion, 28 layers of 8-order Ultra HDI products can be manufactured by adopting the technologies of Ultra-fine circuit manufacture, ultra-thin dielectric layer lamination, micro blind hole manufacture, interlayer alignment and the like, wherein the line width and line distance reach 30 mu m/20 mu m, the dielectric layer is 30 mu m, and the blind hole aperture is 75 mu m.
Example 2
The embodiment provides a 28-layer 8-order Ultra HDI which is manufactured by adopting the manufacturing method of the embodiment 1, and the Ultra HDI structure is shown in fig. 4 and 5 and comprises 28 RTF copper foils, 14 PP 1017 sheets and 10 PP 1037 sheets which are overlapped.
From top to bottom, two adjacent layers of RTF copper foils from layer 1 to layer 8 are separated by a PP 1017 sheet; the RTF copper foil from the 8 th layer to the 10 th layer is respectively separated by a PP 1037, the 11 th layer and the 12 th layer, the 13 th layer and the 14 th layer, the 15 th layer and the 16 th layer, the 17 th layer and the 18 th layer, the 19 th layer and the 20 th layer, the 20 th layer and the 21 th layer are respectively separated by a PP 1037, and the 14 th layer and the 15 th layer are respectively separated by two PP 1037; two adjacent layers of RTF copper foils from 21 layers to 28 layers are separated by a piece of PP 1017.
The above embodiments are merely for illustrating the technical ideas and features of the present invention, and are not meant to be exclusive or limiting. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.
Claims (7)
1. A28-layer 8-order Ultra HDI manufacturing method is characterized by comprising the following steps:
S1, laminating: providing 12 RTF copper foils, wherein the surface roughness evaluation parameter Rz is less than or equal to 2 mu m, and the copper thickness is 12 mu m; providing 8 pieces of PP 1037; stacking RTF copper foil and PP 1037, wherein the RTF copper foil of the 9 th layer and the 10 th layer, the 11 th layer and the 12 th layer, the 13 th layer and the 14 th layer, the 15 th layer and the 16 th layer, the 17 th layer and the 18 th layer and the 19 th layer and the 20 th layer are separated by one PP 1037, and the RTF copper foil of the 14 th layer and the 15 th layer is separated by two PP 1037; pressing, wherein the thickness of the medium layer after pressing is not more than 30 mu m;
s2, copper browning reduction: laminating an RTF copper foil on the top and the bottom of the lamination structure prepared in the previous step respectively, and separating the lamination structure from the lamination structure by adopting a PP; reducing the copper thickness of the outermost layer to 4-6 mu m;
S3, laser drilling: designing 6-8 laser inner targets; the laser aperture is 70 mu m plus or minus 5 mu m, and is confirmed by automatic optical detection;
S4, plasma photoresist removal: removing surface residues after laser drilling;
S5, copper deposition;
S6, hole filling electroplating: the copper thickness after electroplating ranges from 15 μm to 20 μm;
S7, line film sticking: the film is a special dry film for MSAP, the thickness is 15 mu m, the dry film adhesive force test meets 10 mu m/10 mu m, and the resolution meets 10 mu m/10 mu m;
S8, negative acid etching: after etching, the aperture of the obtained blind hole is 75 mu m, and the line width and line distance are 30 mu m/20 mu m;
S9, judging: if 16 RTF copper foils are laminated in the steps, ending; if not, continuing to execute from S2;
in step S2, the layer 9 laminated RTF copper foil is separated by a piece of PP 1037; the 21 st layer of laminated RTF copper foil is separated by a piece of PP 1037; the remaining layers of laminated RTF copper foil are separated by a sheet of PP 1017.
2. The 28-layer 8-order Ultra HDI production method according to claim 1, wherein the film sticking parameters in step S7: coarsening speed in pretreatment is 1.5m/min, film pasting speed is 1.5m/min, film pasting temperature is 110+/-5 ℃, and film pressing pressure is 1.5Kg/cm 2.
3. The 28-layer 8-order Ultra HDI production method according to claim 1, wherein in step S7, the MSAP-specific dry film is selected from ADH-158 type of asahi chemical.
4. The 28-layer 8-order Ultra HDI production method according to claim 1, wherein in step S8, an exposure machine used in the etching process uses a core stick MAS 8.
5. The 28-layer 8-order Ultra HDI production method according to claim 4, wherein in step S8, the outer layer line exposure uses a laser inner target as a alignment target hole for split exposure: the PE and JE values were set at 10. Mu.m.
6. The 28-layer 8-step Ultra HDI fabrication method of claim 1, wherein the blind via size is consistent with the pad size.
7. A 28-layer 8-order Ultra HDI manufactured by the 28-layer 8-order Ultra HDI manufacturing method according to any one of claims 1 to 5, comprising 28 RTF copper foils, 14 PP 1017 and 10 PP 1037 stacked;
From top to bottom, two adjacent layers of RTF copper foils from layer 1 to layer 8 are separated by a PP 1017 sheet; the RTF copper foil from the 8 th layer to the 10 th layer is respectively separated by a PP 1037, the 11 th layer and the 12 th layer, the 13 th layer and the 14 th layer, the 15 th layer and the 16 th layer, the 17 th layer and the 18 th layer, the 19 th layer and the 20 th layer, the 20 th layer and the 21 th layer are respectively separated by a PP 1037, and the 14 th layer and the 15 th layer are respectively separated by two PP 1037; two adjacent layers of RTF copper foils from 21 layers to 28 layers are separated by a piece of PP 1017.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410276404.7A CN117881112B (en) | 2024-03-12 | 2024-03-12 | 28-Layer 8-order Ultra HDI and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410276404.7A CN117881112B (en) | 2024-03-12 | 2024-03-12 | 28-Layer 8-order Ultra HDI and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117881112A CN117881112A (en) | 2024-04-12 |
| CN117881112B true CN117881112B (en) | 2024-05-07 |
Family
ID=90579665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410276404.7A Active CN117881112B (en) | 2024-03-12 | 2024-03-12 | 28-Layer 8-order Ultra HDI and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117881112B (en) |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1174643A (en) * | 1997-08-28 | 1999-03-16 | Fuji Photo Film Co Ltd | Production of multilayer wiring board, image forming method and transfer sheet being employed therein |
| EP1061785A2 (en) * | 1999-06-17 | 2000-12-20 | Mitsubishi Gas Chemical Company, Inc. | High-density multi-layered printed wiring board having highly reliably through hole and method of producing said printed wiring board |
| JP2003046218A (en) * | 2001-07-16 | 2003-02-14 | Kinko Denshi Kofun Yugenkoshi | Method of laminating copper foil upon printed circuit board |
| US6736988B1 (en) * | 1999-11-04 | 2004-05-18 | Mitsubishi Gas Chemical Company, Inc. | Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board |
| JP2005353841A (en) * | 2004-06-10 | 2005-12-22 | Nippon Mektron Ltd | Circuit board and its manufacturing method |
| CN102781172A (en) * | 2012-07-24 | 2012-11-14 | 广东达进电子科技有限公司 | Production method for mirror-surface aluminum base board |
| CN105101623A (en) * | 2015-08-27 | 2015-11-25 | 高德（无锡）电子有限公司 | Circuit board with ultra-thin medium layers and fabrication technology of circuit board |
| JP2016127136A (en) * | 2014-12-26 | 2016-07-11 | 大日本印刷株式会社 | Led-mounted module |
| CN110996565A (en) * | 2019-12-30 | 2020-04-10 | 东莞市若美电子科技有限公司 | Pressing method for 5G circuit board |
| CN111132474A (en) * | 2019-12-27 | 2020-05-08 | 广东科翔电子科技股份有限公司 | High-frequency board and laminating method thereof |
| CN111741614A (en) * | 2020-06-05 | 2020-10-02 | 广州美维电子有限公司 | Fine circuit PCB processing method |
| CN112533383A (en) * | 2020-12-11 | 2021-03-19 | 胜宏科技（惠州）股份有限公司 | 22-layer low-loss PCB manufacturing method |
| CN114685991A (en) * | 2020-12-28 | 2022-07-01 | 中山台光电子材料有限公司 | Resin composition and article thereof |
| CN115003039A (en) * | 2022-07-25 | 2022-09-02 | 广东通元精密电路有限公司 | Thick copper HDI circuit board and manufacturing method of fine circuit thereof |
| CN116156741A (en) * | 2023-04-23 | 2023-05-23 | 南昌龙旗信息技术有限公司 | Printed circuit board and mobile device |
| CN116646254A (en) * | 2023-05-31 | 2023-08-25 | 江苏普诺威电子股份有限公司 | Packaging carrier plate with high aspect ratio via hole and processing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI759144B (en) * | 2020-12-28 | 2022-03-21 | 大陸商中山台光電子材料有限公司 | Resin composition and its products |
-
2024
- 2024-03-12 CN CN202410276404.7A patent/CN117881112B/en active Active
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1174643A (en) * | 1997-08-28 | 1999-03-16 | Fuji Photo Film Co Ltd | Production of multilayer wiring board, image forming method and transfer sheet being employed therein |
| EP1061785A2 (en) * | 1999-06-17 | 2000-12-20 | Mitsubishi Gas Chemical Company, Inc. | High-density multi-layered printed wiring board having highly reliably through hole and method of producing said printed wiring board |
| US6736988B1 (en) * | 1999-11-04 | 2004-05-18 | Mitsubishi Gas Chemical Company, Inc. | Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board |
| JP2003046218A (en) * | 2001-07-16 | 2003-02-14 | Kinko Denshi Kofun Yugenkoshi | Method of laminating copper foil upon printed circuit board |
| JP2005353841A (en) * | 2004-06-10 | 2005-12-22 | Nippon Mektron Ltd | Circuit board and its manufacturing method |
| CN102781172A (en) * | 2012-07-24 | 2012-11-14 | 广东达进电子科技有限公司 | Production method for mirror-surface aluminum base board |
| JP2016127136A (en) * | 2014-12-26 | 2016-07-11 | 大日本印刷株式会社 | Led-mounted module |
| CN105101623A (en) * | 2015-08-27 | 2015-11-25 | 高德（无锡）电子有限公司 | Circuit board with ultra-thin medium layers and fabrication technology of circuit board |
| CN111132474A (en) * | 2019-12-27 | 2020-05-08 | 广东科翔电子科技股份有限公司 | High-frequency board and laminating method thereof |
| CN110996565A (en) * | 2019-12-30 | 2020-04-10 | 东莞市若美电子科技有限公司 | Pressing method for 5G circuit board |
| CN111741614A (en) * | 2020-06-05 | 2020-10-02 | 广州美维电子有限公司 | Fine circuit PCB processing method |
| CN112533383A (en) * | 2020-12-11 | 2021-03-19 | 胜宏科技（惠州）股份有限公司 | 22-layer low-loss PCB manufacturing method |
| CN114685991A (en) * | 2020-12-28 | 2022-07-01 | 中山台光电子材料有限公司 | Resin composition and article thereof |
| CN115003039A (en) * | 2022-07-25 | 2022-09-02 | 广东通元精密电路有限公司 | Thick copper HDI circuit board and manufacturing method of fine circuit thereof |
| CN116156741A (en) * | 2023-04-23 | 2023-05-23 | 南昌龙旗信息技术有限公司 | Printed circuit board and mobile device |
| CN116646254A (en) * | 2023-05-31 | 2023-08-25 | 江苏普诺威电子股份有限公司 | Packaging carrier plate with high aspect ratio via hole and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117881112A (en) | 2024-04-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110139505B (en) | Manufacturing method of rigid-flex board with local flexible board layering | |
| CN104244616B (en) | A kind of preparation method of centreless thin base sheet | |
| CN109219273B (en) | PCB laminating structure based on buffer material and laminating method | |
| CN111556660B (en) | Manufacturing method of thick copper circuit board and thick copper circuit board | |
| CN101203095A (en) | Method for preparation of multi-layer flexible circuit board | |
| CN113347808B (en) | Method for manufacturing multilayer circuit board with thick copper and ultra-fine circuit | |
| CN113163622B (en) | Thermoplastic polyimide subtraction process for ultrathin rigid-flexible printed circuit board | |
| CN109890149B (en) | Manufacturing method of double-sided compression-joint PCB and PCB | |
| US9265146B2 (en) | Method for manufacturing a multi-layer circuit board | |
| KR20090038635A (en) | Manufacturing method of multi-layer circuit board | |
| CN110831355B (en) | Preparation method of printed circuit board of 5G base station coupler | |
| CN116646254A (en) | Packaging carrier plate with high aspect ratio via hole and processing method thereof | |
| KR100477378B1 (en) | Manufacturing method for Multi-layer Flexible Printed Circuit Board | |
| CN112888171B (en) | Method and device for processing blind slot of multilayer printed board | |
| CN117881112B (en) | 28-Layer 8-order Ultra HDI and manufacturing method thereof | |
| CN113115519B (en) | Soft and hard combined circuit board and processing method thereof | |
| CN114885524A (en) | Manufacturing method of dense copper slurry hole circuit board and circuit board | |
| KR20150061108A (en) | The manufacturing method of printed circuit board | |
| CN117881096B (en) | Heat dissipation packaging substrate and processing method thereof | |
| CN117615513A (en) | Processing method of optical module PCB with binding pads | |
| CN116507047B (en) | Manufacturing method of odd laminated layer circuit board with core board structure | |
| CN217088243U (en) | Multilayer blind hole microwave board formed by mixed pressing of nickel-phosphorus sheet resistance materials | |
| CN111312680B (en) | Bearing plate of coreless packaging substrate and preparation method | |
| CN112118688A (en) | Process for increasing layer of back-adhesive copper foil | |
| CN113133214A (en) | Method for manufacturing asymmetric copper thick multilayer board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |