CN111556660B - Manufacturing method of thick copper circuit board and thick copper circuit board - Google Patents
Manufacturing method of thick copper circuit board and thick copper circuit board Download PDFInfo
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- CN111556660B CN111556660B CN202010289532.7A CN202010289532A CN111556660B CN 111556660 B CN111556660 B CN 111556660B CN 202010289532 A CN202010289532 A CN 202010289532A CN 111556660 B CN111556660 B CN 111556660B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a thick copper circuit board and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: according to the size of the jointed board, a thick copper foil with the thickness more than or equal to 12oz, a thin copper foil with the thickness of 0.5oz, a light plate, an auxiliary plate and PP are cut out; forming a circuit pattern on the first surface of the thick copper foil by a negative film process, etching an inner layer circuit with the thickness of half of the circuit pattern, then removing the film, and filling gaps among the circuit patterns with resin; riveting the auxiliary board and the thick copper foil together, then manufacturing corresponding inner-layer circuits on the second surface of the auxiliary board through a negative film process, filling gaps among circuit patterns with resin, and then removing the auxiliary board; laminating the thick copper foil, the PP and the optical plate to form a thick copper inner layer plate, laminating the thick copper inner layer plate, the thin copper foil and the PP to form a thick copper multilayer printed board; and finally, sequentially carrying out post-processes on the thick copper multilayer printed board to obtain the thick copper circuit board. The method can realize the manufacture of the thick copper circuit board with the inner layer copper thickness more than or equal to 12oz and the line width and line gap less than or equal to 0.7 mm.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a thick copper circuit board and a manufacturing method thereof.
Background
The thick copper circuit board is a product with a thicker copper thickness than that of a conventional circuit board, is used for bearing heavy current, dissipating heat and reducing thermal strain, and is mainly used for communication equipment, aerospace, network energy, new energy automobile power supplies and the like.
Due to the structural particularity of the thick copper circuit board, besides certain particularity in material selection, many manufacturing processes also have uniqueness, which becomes a process difficulty, such as etching of the thick copper circuit board. In the etching process of the circuit board, the etching solution not only generates a downward etching effect on a copper surface, but also generates an etching effect, namely lateral erosion, on the left and right directions, the lateral erosion is inevitable, the ratio of the lateral erosion width to the etching depth is called as an etching factor, and the etching key of the thick copper circuit board is to solve the problem of the etching factor.
The common etching method of the thick copper circuit board at present is that two times of etching are adopted, and the upper and lower directions of the thick copper circuit board are changed in the two times of etching, so that the two surfaces of the thick copper circuit board are respectively sprayed with etching liquid from bottom to top and sprayed with the etching liquid from top to bottom once in the downward direction and the upward direction, the outer layer of the thick copper circuit board is good in etching uniformity, the dense circuit area can be etched completely, and the problems of over etching and young etching lines in the area with few circuits are prevented; however, the etching technology of the existing thick copper circuit board can only meet the etching requirement of a light thick copper circuit board, and for a thick copper circuit board with a larger thickness, for example, a circuit board with a copper thickness of more than or equal to 12OZ and a line width and a line gap of less than or equal to 0.7mm, the thick copper circuit board cannot be manufactured due to the existence of etching factors.
Disclosure of Invention
The invention provides a method for manufacturing a thick copper circuit board, aiming at the problem that the existing step board has the defects, and the method adopts the mode that the inner layer circuit is manufactured on the existing thick copper foil and then is laminated with a light board to form an inner layer board, so that the thick copper circuit board with the inner layer copper thickness more than or equal to 12oz and the line width and line gap less than or equal to 0.7mm can be manufactured.
In order to solve the technical problem, the invention provides a method for manufacturing a thick copper circuit board, which comprises the following steps:
s1, cutting thick copper foil with the thickness of more than or equal to 12oz, thin copper foil with the thickness of 0.5oz, a light plate, an auxiliary plate and PP according to the size of the spliced plate;
s2, pasting a film on the thick copper foil, forming a circuit pattern on the first surface of the thick copper foil through exposure and development in sequence, and covering and protecting the whole second surface of the thick copper foil by the film;
s3, etching an inner layer circuit on the first surface of the thick copper foil by etching, wherein the etching depth is half of the thickness of the thick copper foil, and removing the film after etching;
s4, filling gaps among the circuit patterns with resin on the first surface etched with the inner layer circuit in the thick copper foil, curing the resin through baking the board, and then removing the resin protruding out of the board surface through grinding the board;
s5, overlapping the auxiliary board and the thick copper foil and then riveting the auxiliary board and the thick copper foil together, wherein the auxiliary board is in contact with the first surface filled with resin in the thick copper foil;
s6, pasting a film on the second surface of the thick copper foil, forming a circuit pattern corresponding to the inner layer circuit on the first surface on the second surface of the thick copper foil through exposure and development in sequence, and etching the inner layer circuit on the second surface of the thick copper foil through etching, wherein the etching depth is half of the thickness of the thick copper foil, so that the resin filled between the circuit patterns is exposed;
s7, filling gaps among the circuit patterns with resin on the second surface of the thick copper foil, curing the resin through baking, removing the resin protruding out of the board surface through grinding the board, and removing the auxiliary board;
s8, laminating the thick copper foil, the PP, the light plate, the PP and the thick copper foil of the manufactured inner-layer circuit in sequence to form a thick copper inner-layer plate;
s9, laminating the thin copper foil, the PP, the thick copper inner layer plate, the PP and the thin copper foil in sequence to form a thick copper multilayer printed board;
s10, the thick copper multilayer printed board is sequentially subjected to the working procedures of drilling, copper deposition, full-board electroplating, outer layer circuit manufacturing, solder mask manufacturing, surface treatment and forming to obtain the thick copper circuit board.
Further, the following steps are included between steps S1 and S2:
s101, drilling riveting holes at the same positions of the edges of the thick copper foil, the optical plate, the auxiliary plate and the PP plate.
Further, in step S8, the thick copper inner layer board is pre-riveted by a rivet passing through the corresponding riveting hole before lamination.
Furthermore, in steps S3 and S6, the line width and the line gap of the inner layer line are both less than or equal to 0.7 mm.
Further, in steps S4 and S7, the temperature of the baked board is controlled at 145-155 ℃ for 60 min.
Further, in steps S4 and S7, the temperature of the baked board is 150 ℃.
Further, in steps S4 and S7, the resin protruding from the plate surface is removed by sanding the plate to make the plate surface flat.
Further, the optical plate is an inner layer base material left after the copper clad core plate is etched to remove the outer layer copper foil.
Also provides another manufacturing method of the thick copper circuit board, which comprises the following steps:
s1, cutting thick copper foil with the thickness of more than or equal to 12oz, thin copper foil with the thickness of 0.5oz, a light plate, an auxiliary plate and PP according to the size of the spliced plate;
s2, pasting a film on the thick copper foil, forming a circuit pattern on the first surface of the thick copper foil through exposure and development in sequence, and covering and protecting the whole second surface of the thick copper foil by the film;
s3, etching an inner layer circuit on the first surface of the thick copper foil by etching, wherein the etching depth is half of the thickness of the thick copper foil, and removing the film after etching;
s4, filling gaps among the circuit patterns with resin on the first surface etched with the inner layer circuit in the thick copper foil, curing the resin through baking the board, and then removing the resin protruding out of the board surface through grinding the board;
s5, overlapping the auxiliary board and the thick copper foil and then riveting the auxiliary board and the thick copper foil together, wherein the auxiliary board is in contact with the first surface filled with resin in the thick copper foil;
s6, pasting a film on the second surface of the thick copper foil, forming a circuit pattern corresponding to the inner layer circuit on the first surface on the second surface of the thick copper foil through exposure and development in sequence, and etching the inner layer circuit on the second surface of the thick copper foil through etching, wherein the etching depth is half of the thickness of the thick copper foil, so that the resin filled between the circuit patterns is exposed;
s7, filling gaps among the circuit patterns with resin on the second surface of the thick copper foil, curing the resin through baking, removing the resin protruding out of the board surface through grinding the board, and removing the auxiliary board;
s8, laminating the thick copper foil, the PP, the light plate, the PP and the thick copper foil of the manufactured inner-layer circuit in sequence to form a thick copper inner-layer plate;
and S9, sequentially carrying out solder mask layer manufacturing, surface treatment and forming on the thick copper inner layer plate to obtain the thick copper circuit board.
The thick copper circuit board is manufactured by the manufacturing method of any one of the thick copper circuit boards.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, firstly, a thick copper foil with a corresponding size is formed according to the thickness of inner layer copper required by design, inner layer circuits are manufactured on the thick copper foil by utilizing two-sided etching modes, and the depth of the two-sided etching is half of the thickness of the thick copper foil, so that the thickness of each etching is reduced, and the influence of etching factors on circuit manufacturing is reduced, thereby realizing the manufacturing of a thick copper circuit board with the thickness of the inner layer copper being more than or equal to 12oz and the line width and line gap being less than or equal to 0.7mm, and the common thickness is etched by the two-sided etching, and ensuring that the line width and line gap of the inner layer circuits corresponding to the upper part and the lower part of the inner layer circuits after the two-sided etching are basically the same; and the resin is adopted to fill the gaps among the circuits after the inner layer circuits are etched and formed on the first surface of the thick copper foil, so that the strength of the circuit layer is improved, the quality problems of deformation and the like in the subsequent process caused by insufficient strength after etching are avoided, and the line width and line gap of the inner layer circuits which are manufactured firstly in the first surface and are influenced by secondary lateral erosion caused by the fact that etching liquid flows into the inner layer circuits manufactured firstly in the first surface when the inner layer circuits on the second surface are etched are prevented; and before the inner layer circuit of the second surface is manufactured, the thick copper foil and the auxiliary plate are riveted together, so that the supporting strength of the first surface of the thick copper foil is further improved, and the problem that the thick copper foil is bent and broken due to the influence of spraying pressure during secondary etching is avoided.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
The method for manufacturing a thick copper circuit board shown in this embodiment sequentially includes the following processing steps:
(1) cutting: cutting thick copper foil with the thickness of more than or equal to 12oz, thin copper foil with the thickness of 0.5oz, an optical plate, an auxiliary plate and PP according to the size of a jointed board of 520mm multiplied by 420mm, wherein 1oz is 36 mu m; the optical plate is preferably an inner-layer base material left after the copper foil on the outer layer is etched by adopting a copper-clad core plate, and the appropriate copper-clad core plate is selected according to the required plate thickness; the auxiliary board is a hard board.
(2) Drilling a riveting hole: and drilling riveting holes at the same positions of the edges of the thick copper foil, the optical plate, the auxiliary plate and the PP plate.
(3) And inner layer pattern: and pasting a dry film or a wet film on the thick copper foil, forming a circuit pattern on the first surface of the thick copper foil through exposure and development in sequence, exposing the copper layer part outside the circuit pattern, exposing the dry film or the wet film on the second surface of the thick copper foil through whole surface exposure during exposure, and covering and protecting the whole surface of the second surface of the thick copper foil by the dry film or the wet film.
(4) And etching: and etching an inner layer circuit on the first surface of the thick copper foil through acid etching, wherein line width and line gap of the inner layer circuit are less than or equal to 0.7mm, etching depth is half of the thickness of the thick copper foil, and stripping after etching is completed.
(5) And resin filling: filling gaps among circuit patterns on the first surface etched with the inner layer circuit in the thick copper foil with resin, curing the resin through a baking plate, and removing the resin protruding out of the plate surface through a belt grinding plate to flatten the plate surface; wherein the temperature during baking is controlled at 145-155 ℃ for 60min, the temperature during baking is preferably 150 ℃, and the temperature and time during baking are controlled, so that the filling resin is cured while the material characteristics of the thick copper foil are prevented from being influenced, and the alignment error between the inner layer circuits in two etching processes is reduced.
(6) And riveting: and overlapping the auxiliary plate and the thick copper foil, and riveting and fixing the auxiliary plate and the thick copper foil together, wherein the auxiliary plate is in contact with the first surface filled with resin in the thick copper foil.
(7) And inner layer pattern: and adhering a dry film or a wet film on the second surface of the thick copper foil, forming circuit patterns corresponding to the front and the back of the inner layer circuit on the first surface on the second surface of the thick copper foil through exposure and development in sequence, etching the inner layer circuit on the second surface of the thick copper foil through acid etching, wherein the etching depth is half of the thickness of the thick copper foil, and thus, the resin filled between the circuit patterns is exposed.
(8) And resin filling: filling gaps among the circuit patterns on the second surface of the thick copper foil with resin, curing the resin through baking the copper foil, removing the resin protruding out of the surface of the copper foil through a sanding plate to flatten the surface of the copper foil, and then removing the auxiliary plate; wherein the temperature during baking is controlled at 145-155 ℃ for 60min, and the temperature during baking is preferably 150 ℃.
According to the number of the thick copper inner layer circuit layers of the thick copper circuit board to be manufactured and the step (3)
(8) The method of (1) produces a plurality of thick copper foils with corresponding inner layer circuit designs.
(9) And one-time pressing: and (3) according to the browning speed of the bottom copper, brown the thick copper foil, the PP, the light board, the PP and the thick copper foil of the manufactured inner layer circuit in sequence, then the thick copper foil, the PP, the light board, the PP and the thick copper foil penetrate through corresponding riveting holes through rivets, then pre-riveting and fixing are carried out, and then the thick copper inner layer board is formed by pressing under proper laminating conditions according to the characteristics of the board.
(10) And secondary pressing: and (3) brown-oxidizing speed, namely brown-oxidizing the bottom copper according to the thickness of the bottom copper, laminating the thin copper foil, the PP, the thick copper inner layer plate, the PP and the thin copper foil in sequence, and then pressing the laminated copper inner layer plate, the PP and the thin copper foil under proper laminating conditions according to the characteristics of the plate to form the thick copper multilayer printed board.
(11) And drilling the outer layer, namely drilling on the thick copper multilayer printed board by using drilling data.
(12) And copper deposition, namely metallizing holes in the thick copper multilayer printed board, and testing the thickness of the deposited copper in the holes to be 0.5 mu m in a backlight test level 10.
(13) And electroplating the whole plate: and performing full-plate electroplating for 30min at a current density of 1.1ASF, wherein the thickness of surface copper is thickened to be more than or equal to 6 mu m during the full-plate electroplating.
(14) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on the thick copper multilayer printed board through development; and (2) outer layer pattern electroplating, then respectively plating copper and tin on the thick copper multilayer printed board, wherein the copper plating is performed for 60min by using a current density of 1.8ASD, the whole thickness of surface copper is plated to be 1oz thick, the tin plating is performed for 10min by using a current density of 1.2ASD, the tin thickness is 3-5 mu m, then sequentially stripping, etching and stripping, an outer layer circuit and an outer layer AOI are etched on the thick copper multilayer printed board, and then the defects of short circuit, circuit notch, circuit pinhole and the like of the outer layer circuit are detected, the defective scrapping treatment is performed, and the product without defects is discharged to the next process.
(15) Solder resist and silk screen printing of characters: according to the prior art and according to design requirements, a solder mask layer is manufactured on a thick copper multilayer printed board and characters are silk-screened.
(16) And surface treatment: according to the prior art and the chemical principle of copper surface communication at the position of the solder mask windowing according to the design requirements, nickel and gold with certain required thickness are uniformly deposited.
(17) And forming: according to the prior art and according to the design requirement, the thick copper circuit board with the inner layer copper thickness more than or equal to 12oz and the line width and line gap less than or equal to 0.7mm is manufactured.
(18) And electrical performance testing: and detecting the electrical performance of the thick copper circuit board, and entering the next processing link for the qualified thick copper circuit board.
(19) And final inspection: and (4) respectively measuring the appearance, the thickness of the hole copper, the thickness of the medium layer, the thickness of the green oil, the thickness of the inner layer copper and the like of the finished product, and discharging the qualified product.
Example 2
The method for manufacturing a thick copper circuit board shown in this embodiment sequentially includes the following processing steps:
(1) cutting: cutting thick copper foil with the thickness of more than or equal to 12oz, thin copper foil with the thickness of 0.5oz, an optical plate, an auxiliary plate and PP according to the size of a jointed board of 520mm multiplied by 420mm, wherein 1oz is 36 mu m; the optical plate is preferably an inner-layer base material left after the copper foil on the outer layer is etched by adopting a copper-clad core plate, and the appropriate copper-clad core plate is selected according to the required plate thickness; the auxiliary board is a hard board.
(2) Drilling a riveting hole: and drilling riveting holes at the same positions of the edges of the thick copper foil, the optical plate, the auxiliary plate and the PP plate.
(3) And inner layer pattern: and pasting a dry film or a wet film on the thick copper foil, forming a circuit pattern on the first surface of the thick copper foil through exposure and development in sequence, exposing the copper layer part outside the circuit pattern, exposing the dry film or the wet film on the second surface of the thick copper foil through whole surface exposure during exposure, and covering and protecting the whole surface of the second surface of the thick copper foil by the dry film or the wet film.
(4) And etching: and etching an inner layer circuit on the first surface of the thick copper foil through acid etching, wherein line width and line gap of the inner layer circuit are less than or equal to 0.7mm, etching depth is half of the thickness of the thick copper foil, and stripping after etching is completed.
(5) And resin filling: filling gaps among circuit patterns on the first surface etched with the inner layer circuit in the thick copper foil with resin, curing the resin through a baking plate, and removing the resin protruding out of the plate surface through a belt grinding plate to flatten the plate surface; wherein the temperature during baking is controlled at 145-155 ℃ for 60min, the temperature during baking is preferably 150 ℃, and the temperature and time during baking are controlled, so that the filling resin is cured while the material characteristics of the thick copper foil are prevented from being influenced, and the alignment error between the inner layer circuits in two etching processes is reduced.
(6) And riveting: and overlapping the auxiliary plate and the thick copper foil, and riveting and fixing the auxiliary plate and the thick copper foil together, wherein the auxiliary plate is in contact with the first surface filled with resin in the thick copper foil.
(7) And inner layer pattern: and adhering a dry film or a wet film on the second surface of the thick copper foil, forming circuit patterns corresponding to the front and the back of the inner layer circuit on the first surface on the second surface of the thick copper foil through exposure and development in sequence, etching the inner layer circuit on the second surface of the thick copper foil through acid etching, wherein the etching depth is half of the thickness of the thick copper foil, and thus, the resin filled between the circuit patterns is exposed.
(8) And resin filling: filling gaps among the circuit patterns on the second surface of the thick copper foil with resin, curing the resin through baking the copper foil, removing the resin protruding out of the surface of the copper foil through a sanding plate to flatten the surface of the copper foil, and then removing the auxiliary plate; wherein the temperature during baking is controlled at 145-155 ℃ for 60min, and the temperature during baking is preferably 150 ℃.
And (4) manufacturing a plurality of thick copper foils with corresponding inner layer circuit designs according to the number of the thick copper inner layer circuits of the thick copper circuit board to be manufactured and the method of the steps (3) to (8).
(9) And pressing: and (3) according to the browning speed of the bottom copper, brown the thick copper foil, the PP, the light board, the PP and the thick copper foil of the manufactured inner layer circuit in sequence, then the thick copper foil, the PP, the light board, the PP and the thick copper foil penetrate through corresponding riveting holes through rivets, then pre-riveting and fixing are carried out, and then the thick copper inner layer board is formed by pressing under proper laminating conditions according to the characteristics of the board.
(10) Solder resist and silk screen printing of characters: according to the prior art and according to the design requirements, a solder mask layer is manufactured on a thick copper inner-layer plate and characters are silk-screened.
(11) And surface treatment: according to the prior art and the chemical principle of copper surface communication at the position of the solder mask windowing according to the design requirements, nickel and gold with certain required thickness are uniformly deposited.
(12) And forming: according to the prior art and according to the design requirement, the thick copper circuit board with the inner layer copper thickness more than or equal to 12oz and the line width and line gap less than or equal to 0.7mm is manufactured.
(13) And electrical performance testing: and detecting the electrical performance of the thick copper circuit board, and entering the next processing link for the qualified thick copper circuit board.
(14) And final inspection: and (4) respectively measuring the appearance, the thickness of the hole copper, the thickness of the medium layer, the thickness of the green oil, the thickness of the inner layer copper and the like of the finished product, and discharging the qualified product.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A manufacturing method of a thick copper circuit board is characterized by comprising the following steps:
s1, cutting thick copper foil with the thickness of more than or equal to 12oz, thin copper foil with the thickness of 0.5oz, a light plate, an auxiliary plate and PP according to the size of the jointed plate, wherein the auxiliary plate is a hard plate;
s2, pasting a film on the thick copper foil, forming a circuit pattern on the first surface of the thick copper foil through exposure and development in sequence, and covering and protecting the whole second surface of the thick copper foil by the film;
s3, etching an inner layer circuit on the first surface of the thick copper foil by etching, wherein the etching depth is half of the thickness of the thick copper foil, and removing the film after etching;
s4, filling gaps among the circuit patterns with resin on the first surface etched with the inner layer circuit in the thick copper foil, curing the resin through baking the board, and then removing the resin protruding out of the board surface through grinding the board;
s5, overlapping the auxiliary board and the thick copper foil and then riveting the auxiliary board and the thick copper foil together, wherein the auxiliary board is in contact with the first surface filled with resin in the thick copper foil;
s6, pasting a film on the second surface of the thick copper foil, forming a circuit pattern corresponding to the inner layer circuit on the first surface on the second surface of the thick copper foil through exposure and development in sequence, and etching the inner layer circuit on the second surface of the thick copper foil through etching, wherein the etching depth is half of the thickness of the thick copper foil, so that the resin filled between the circuit patterns is exposed;
s7, filling gaps among the circuit patterns with resin on the second surface of the thick copper foil, curing the resin through baking, removing the resin protruding out of the board surface through grinding the board, and removing the auxiliary board;
s8, laminating the thick copper foil, the PP, the light plate, the PP and the thick copper foil of the manufactured inner-layer circuit in sequence to form a thick copper inner-layer plate;
s9, laminating the thin copper foil, the PP, the thick copper inner layer plate, the PP and the thin copper foil in sequence to form a thick copper multilayer printed board;
s10, the thick copper multilayer printed board is sequentially subjected to the working procedures of drilling, copper deposition, full-board electroplating, outer layer circuit manufacturing, solder mask manufacturing, surface treatment and forming to obtain the thick copper circuit board.
2. The method for manufacturing a thick copper circuit board according to claim 1, wherein the steps between S1 and S2 further comprise the steps of:
s101, drilling riveting holes at the same positions of the edges of the thick copper foil, the optical plate, the auxiliary plate and the PP plate.
3. The method of claim 2, wherein in step S8, the thick copper inner layer board is pre-riveted by a rivet passing through the corresponding riveting hole before pressing.
4. The method of claim 1, wherein in steps S3 and S6, the line width and the line gap of the inner layer circuit are both less than or equal to 0.7 mm.
5. The method as claimed in claim 1, wherein the baking temperature is controlled at 145-155 ℃ for 60min in steps S4 and S7.
6. The method of claim 5, wherein the baking temperature in steps S4 and S7 is 150 ℃.
7. The method of claim 1, wherein in steps S4 and S7, the resin protruding from the surface of the board is removed by sanding the board to make the surface flat.
8. The method of claim 1, wherein the optical board is an inner substrate of the copper-clad core board after etching away the outer copper foil.
9. A manufacturing method of a thick copper circuit board is characterized by comprising the following steps:
s1, cutting thick copper foil with the thickness of more than or equal to 12oz, thin copper foil with the thickness of 0.5oz, a light plate, an auxiliary plate and PP according to the size of the jointed plate, wherein the auxiliary plate is a hard plate;
s2, pasting a film on the thick copper foil, forming a circuit pattern on the first surface of the thick copper foil through exposure and development in sequence, and covering and protecting the whole second surface of the thick copper foil by the film;
s3, etching an inner layer circuit on the first surface of the thick copper foil by etching, wherein the etching depth is half of the thickness of the thick copper foil, and removing the film after etching;
s4, filling gaps among the circuit patterns with resin on the first surface etched with the inner layer circuit in the thick copper foil, curing the resin through baking the board, and then removing the resin protruding out of the board surface through grinding the board;
s5, overlapping the auxiliary board and the thick copper foil and then riveting the auxiliary board and the thick copper foil together, wherein the auxiliary board is in contact with the first surface filled with resin in the thick copper foil;
s6, pasting a film on the second surface of the thick copper foil, forming a circuit pattern corresponding to the inner layer circuit on the first surface on the second surface of the thick copper foil through exposure and development in sequence, and etching the inner layer circuit on the second surface of the thick copper foil through etching, wherein the etching depth is half of the thickness of the thick copper foil, so that the resin filled between the circuit patterns is exposed;
s7, filling gaps among the circuit patterns with resin on the second surface of the thick copper foil, curing the resin through baking, removing the resin protruding out of the board surface through grinding the board, and removing the auxiliary board;
s8, laminating the thick copper foil, the PP, the light plate, the PP and the thick copper foil of the manufactured inner-layer circuit in sequence to form a thick copper inner-layer plate;
and S9, sequentially carrying out solder mask layer manufacturing, surface treatment and forming on the thick copper inner layer plate to obtain the thick copper circuit board.
10. A thick copper wiring board, characterized by being manufactured by the method for manufacturing a thick copper wiring board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010289532.7A CN111556660B (en) | 2020-04-14 | 2020-04-14 | Manufacturing method of thick copper circuit board and thick copper circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010289532.7A CN111556660B (en) | 2020-04-14 | 2020-04-14 | Manufacturing method of thick copper circuit board and thick copper circuit board |
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| CN111988918A (en) * | 2020-09-15 | 2020-11-24 | 四川英创力电子科技股份有限公司 | Manufacturing method of thick copper circuit board |
| CN112888176A (en) * | 2020-12-30 | 2021-06-01 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing super-thick copper nickel-plated gold plate |
| CN112911813B (en) * | 2021-01-26 | 2022-07-12 | 深圳市景旺电子股份有限公司 | Manufacturing method for improving solder mask film print of PCB and prepared PCB |
| CN112969300A (en) * | 2021-01-28 | 2021-06-15 | 盐城维信电子有限公司 | Etching processing method for flexible circuit board |
| CN113873766A (en) * | 2021-09-30 | 2021-12-31 | 景旺电子科技(龙川)有限公司 | Printed board manufacturing method and printed board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060341A (en) * | 2001-08-08 | 2003-02-28 | Mitsubishi Gas Chem Co Inc | Method of manufacturing printed wiring board having minute pattern |
| CN102404942A (en) * | 2010-09-08 | 2012-04-04 | 田先平 | Method of manufacturing thick copper foil PCB (Printed Circuit Board) |
| CN105007696A (en) * | 2015-06-17 | 2015-10-28 | 深圳崇达多层线路板有限公司 | Method for press fitting thick copper printed circuit board |
| CN105208781A (en) * | 2015-08-10 | 2015-12-30 | 江门崇达电路技术有限公司 | Etching method for external layer of thick copper plate |
| CN108521726A (en) * | 2018-06-19 | 2018-09-11 | 惠州中京电子科技有限公司 | A kind of production method of super-thick copper PCB multilayer board |
-
2020
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060341A (en) * | 2001-08-08 | 2003-02-28 | Mitsubishi Gas Chem Co Inc | Method of manufacturing printed wiring board having minute pattern |
| CN102404942A (en) * | 2010-09-08 | 2012-04-04 | 田先平 | Method of manufacturing thick copper foil PCB (Printed Circuit Board) |
| CN105007696A (en) * | 2015-06-17 | 2015-10-28 | 深圳崇达多层线路板有限公司 | Method for press fitting thick copper printed circuit board |
| CN105208781A (en) * | 2015-08-10 | 2015-12-30 | 江门崇达电路技术有限公司 | Etching method for external layer of thick copper plate |
| CN108521726A (en) * | 2018-06-19 | 2018-09-11 | 惠州中京电子科技有限公司 | A kind of production method of super-thick copper PCB multilayer board |
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