CN110831336B - Resin hole plugging method for large-aperture back drilling hole - Google Patents
Resin hole plugging method for large-aperture back drilling hole Download PDFInfo
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- CN110831336B CN110831336B CN201911095491.1A CN201911095491A CN110831336B CN 110831336 B CN110831336 B CN 110831336B CN 201911095491 A CN201911095491 A CN 201911095491A CN 110831336 B CN110831336 B CN 110831336B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a resin hole plugging method for a large-aperture back drilling hole, which comprises the following steps: drilling a through hole on a production plate, wherein one surface of the production plate is a back drilling surface, and the other surface of the production plate is a non-back drilling surface; then sequentially carrying out copper deposition and full-plate electroplating to metalize the through holes; back drilling at the position corresponding to the metallized through hole in the back drilling surface by a depth control drilling method to form a step-shaped back drilling hole, wherein the aperture of the back drilling part is larger than that of the through hole; filling resin in the back drilled hole in a vertical vacuum hole plugging mode and curing; filling resin for the second time in the back drilling hole in a horizontal vacuum hole filling mode and curing; and removing the resin protruding out of the plate surface through a belt sanding plate. The method solves the quality problems that the conventional resin hole plugging process cannot manufacture or plug hole cavities, are not full, have sunken orifices and the like, ensures that the resin hole plugging is full, and ensures that the sunken orifices are smaller than 30 mu m.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a resin hole plugging method for a large-aperture back drilling hole.
Background
The PCB back drilling hole is a hole formed by removing a part of hole copper by using a depth control drilling method and only retaining a part of hole copper, and the key function of the back drilling hole is to reduce the reflection interference of the redundant hole copper on signals in the process of high-speed signal transmission so as to ensure the integrity of signal transmission. At present, back drilling is a manufacturing method with lower cost and capable of meeting the performance of a high-frequency and high-speed circuit board.
In recent years, the density of printed boards is continuously improved, the original continuously reduced planar density of aperture, line width and line distance tends to be a bottleneck, and the increase of the three-dimensional density becomes a new breakthrough point. Under the trend, many customers design the inner holes of the disc, namely, plugging the via holes by using resin plug holes, grinding and leveling the cured via holes by using abrasive belts, removing redundant resin at the hole openings, and then depositing copper on the surfaces of the plug holes, plating the circuit and manufacturing circuit patterns. A typical fabrication flow for PCBs with back drilled holes includes: the former process → pressing → drilling → copper deposition, board electric → back drilling → resin plug hole → sand belt template → copper deposition, board electric → outer layer pattern → pattern electroplating → outer layer etching → outer layer AOI → the latter process.
The common resin hole plugging processes include horizontal hole plugging, vertical vacuum hole plugging, horizontal vacuum hole plugging and the like, although the process principle is simpler, in the practical implementation process, the operation difficulty is higher due to the influence of the hole diameter, the aspect ratio, the hole shape, the requirement of the surface flatness and the like, and the quality problems of hole plugging insufficiency, poor air bubbles in the holes, hole opening depression and the like are easy to occur. Especially for the resin plug hole with large aperture not less than 1mm, the conventional manufacturing process can not be used for manufacturing, and the specific reasons are as follows:
1. because the aperture of the back drilling hole is too large (larger than 1mm), the method of horizontal hole plugging and horizontal vacuum hole plugging can cause the result that the resin is directly leaked from the other end of the hole after the resin is plugged from one end of the hole, and the resin hole plugging can not be manufactured;
2. since the back drilling hole is in a stepped hole shape, one end of the back drilling hole is large, the other end of the back drilling hole is small, the problem that resin ink is sparsely combined in the hole can occur by adopting vertical vacuum hole plugging, and the hole plugging is hollow and not full due to curing of a baking plate and shrinkage of resin; in order to ensure full hole filling, even if hole filling is carried out for multiple times, due to the fact that the process of extruding hole filling is adopted for vertical vacuum hole filling, and the problem of tension on the surface of resin, part of resin can be scraped away, so that a hole is sunken, the circuit is in an undulated state on the plate surface, and signal transmission is affected.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a resin hole plugging method for a large-aperture back drilling hole, which solves the quality problems that the conventional resin hole plugging process cannot manufacture or the hole plugging is hollow, not full, sunken in the hole opening and the like, and ensures that the resin hole plugging is full, and the sunken in the hole opening is less than 30 mu m.
In order to solve the technical problem, the invention provides a resin hole plugging method of a large-aperture back drilling hole, which comprises the following steps:
s1, drilling through holes on a production board, wherein one surface of the production board is a back drilling surface, and the other surface of the production board is a non-back drilling surface;
s2, sequentially carrying out copper precipitation and full-plate electroplating to metalize the through holes;
s3, back drilling is carried out at the position, corresponding to the metallized through hole, in the back drilling surface by a depth control drilling method to form a step-shaped back drilling hole, wherein the aperture of the back drilling part is larger than that of the through hole;
s4, filling resin in the back drilling hole in a vertical vacuum hole filling mode and curing;
s5, secondary resin filling and curing are carried out in the back drilling hole in a horizontal vacuum hole filling mode;
and S6, removing the resin protruding from the plate surface through a belt sanding plate.
Further, in step S2, the whole board is electroplated for 60min at a current density of 2.1ASF to make the thickness of the via copper equal to or greater than 20 μm.
Further, in step S4, the resin viscosity is controlled at 200-350 dpas.
Further, in step S5, the resin viscosity is controlled to be 400-900 dpas.
Further, in steps S4 and S5, the temperature during curing is 150 +/-5 ℃ and the time is 60 min.
Further, in steps S4 and S5, the back-drilled surface of the production board is faced upward when resin is caulked.
Further, in step S5, the resin ink is filled into the back-drilled hole by using a screen printing plate, an auxiliary light plate having the same size as the production plate is disposed on the surface of the screen printing plate, an auxiliary stepped hole having a smaller top and a larger bottom is disposed on the auxiliary light plate corresponding to the back-drilled hole of the production plate, and the minimum diameter of the auxiliary stepped hole is greater than or equal to the maximum diameter of the back-drilled hole.
Further, the aperture of the upper end of the auxiliary stepped hole is the same as that of the back-drilled part in the back-drilled hole, and the aperture of the lower end of the auxiliary stepped hole is 0.3mm larger than that of the back-drilled part in the back-drilled hole.
Further, the scraper pressure during silk-screen printing is 4-7.2kg/cm2And the scraping speed is 10-20 cm/s.
Further, the thickness-to-diameter ratio between the diameter of the upper end of the auxiliary shoulder hole and the thickness of the auxiliary light plate is controlled to be 1:1, and the step depth of the auxiliary shoulder hole is 1/2 of the thickness of the auxiliary light plate.
Furthermore, the production board is a core board or a multilayer board formed by pressing an inner core board and an outer copper foil into a whole through a prepreg.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, resin plugging is made by filling resin ink twice, firstly, resin is filled in a back drilling hole in a vertical vacuum plugging mode and is cured, so that the problem that a large-aperture back drilling hole cannot be made in a horizontal plugging mode is solved, and in addition, aiming at the problem that a plugging hole cavity and non-fullness are caused by resin shrinkage after the first vertical vacuum plugging hole is cured, the resin is filled in the back drilling hole for the second time in a horizontal vacuum plugging mode and is cured, so that the problems of the plugging hole cavity and the non-fullness existing after the first plugging hole is cured are solved, meanwhile, the problem of orifice dent caused by resin scraping by a scraper during horizontal vacuum plugging can be prevented, the resin plugging hole is ensured to be full, the orifice dent is smaller than 30 mu m, and the plugging quality is within the IPC three-level standard; the auxiliary light plate is adopted for horizontal vacuum hole plugging during second hole plugging, the auxiliary plate adopts a mode of reversely buckling an auxiliary stepped hole with a small upper part and a large lower part, so that the resin ink accurately flows into the back drilled hole, the problem of incomplete hole plugging is further solved, the area of the part, protruding out of the plate surface, of the resin ink is controlled within the range of the auxiliary stepped hole through the auxiliary stepped hole, and compared with a scraper in the prior art, the scraper directly scrapes on a silk screen, the scraper blade coating method reduces scraping force borne by resin in the hole during horizontal vacuum hole plugging scraping, and effectively solves the problem of orifice depression caused by scraping of orifice resin; according to the invention, the viscosity of the resin is controlled to be different when the hole is plugged twice, so that the hole can be plugged by matching with the corresponding hole plugging step better, the good combination of the hole plugging step and the hole plugging step at the later stage is ensured, and the problem of hole cavities is avoided.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The method for manufacturing a circuit board according to the present example, which can manufacture a high-quality large-aperture resin via hole, sequentially includes the following steps:
(1) cutting: the core plate and the auxiliary light plate are cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core plate is 0.35mm (excluding the thickness of the outer layer copper), and the thickness of the copper layers on the two surfaces of the core plate is 1 OZ.
(2) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of the inner layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And (3) laminating: and (3) brown-oxidizing at a speed of brown-oxidizing according to the thickness of the bottom copper, sequentially laminating the core plate, the prepreg and the outer copper foil as required, and then laminating the laminated plate by selecting proper lamination conditions according to the Tg of the plate to form a production plate, wherein one surface of the production plate is a back drilling surface, and the other surface of the production plate is a non-back drilling surface.
(4) Drilling: according to the existing drilling technology, through holes are drilled on the production plate according to design requirements.
(5) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(6) Electroplating the whole plate: and carrying out full-plate electroplating for 60min at a current density of 2.1ASF to ensure that the thickness of the hole copper is more than or equal to 20 mu m.
(7) Back drilling: and back drilling at the position corresponding to the metallized through hole in the back drilling surface by a depth control drilling method, wherein the aperture of the back drilling part is larger than that of the through hole, so that part of hole copper is removed, and the other part of hole copper is reserved to form a step-shaped back drilling hole.
(8) Drilling an auxiliary stepped hole: drilling an auxiliary stepped hole with a small upper part and a large lower part at a back drilling hole corresponding to the production plate on the auxiliary light plate, wherein the minimum diameter of the auxiliary stepped hole is more than or equal to the maximum aperture of the back drilling hole; specifically, the aperture of the upper end of the auxiliary stepped hole is the same as that of the back drilling part in the back drilling hole, the aperture of the lower end of the auxiliary stepped hole is 0.3mm larger than that of the back drilling part in the back drilling hole (namely, the aperture of one side is 0.15mm larger), the thickness-diameter ratio between the aperture of the upper end of the auxiliary stepped hole and the thickness of the auxiliary light plate is controlled to be 1:1 (namely, the thickness of the auxiliary light plate is the same as that of the through hole on the production plate), and the step depth of the auxiliary stepped hole is 1/2 of the thickness of the auxiliary light plate, namely, the.
(9) First hole plugging: filling resin in the back drilling hole by adopting a vertical vacuum hole plugging machine in a vertical vacuum hole plugging mode and curing, wherein the back drilling surface of the production plate faces upwards when the resin is filled, so that the resin ink flows from the top to the bottom in a large-to-small mode; specifically, the resin viscosity is controlled at 200-.
(10) Secondary hole plugging: secondary resin filling and curing are carried out in the back drilling hole by adopting a horizontal vacuum hole plugging machine in a horizontal vacuum hole plugging mode; specifically, the resin printing ink is filled in the back drilling hole by adopting a silk screen printing plate, and the process is as follows: firstly, placing a silk-screen printing plate on a production plate, then placing a manufactured auxiliary light plate on the surface of the silk-screen printing plate, enabling auxiliary stepped holes on the auxiliary light plate to correspond to back drilled holes one by one, then adding resin printing ink with the viscosity of 400-900dpas on the auxiliary light plate, starting a horizontal vacuum hole plugging machine, and setting the pressure of a scraper to be 4-7.2kg/cm2Scraping resin ink on the auxiliary light plate twice at a scraping speed of 10-20cm/s, enabling the resin ink to sequentially flow into the back drilling holes along the auxiliary stepped holes and the silk-screen dots on the auxiliary light plate, filling the back drilling holes, and then baking the plate to enable the resin ink to be cured, wherein the curing temperature is 150 +/-5 ℃ and the curing time is 60 min.
(11) Grinding a plate by using an abrasive belt: and removing the resin protruding out of the plate surface through a belt sanding plate.
(12) Copper deposition: and plating a layer of thin copper on the surface of the resin plug hole position by copper deposition.
(13) Electroplating the whole plate: and (4) performing full-plate electroplating for 30min at the current density of 1.1ASF to increase the plate surface copper thickness.
(14) Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(15) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved.
(16) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(17) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(18) And forming: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(19) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(20) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(21) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A resin hole plugging method for a large-aperture back drilling hole is characterized by comprising the following steps:
s1, drilling through holes on a production board, wherein one surface of the production board is a back drilling surface, and the other surface of the production board is a non-back drilling surface;
s2, sequentially carrying out copper precipitation and full-plate electroplating to metalize the through holes;
s3, back drilling is carried out at the position, corresponding to the metallized through hole, in the back drilling surface by a depth control drilling method to form a step-shaped back drilling hole, wherein the aperture of the back drilling part is larger than that of the through hole;
s4, filling resin in the back drilling hole in a vertical vacuum hole filling mode and curing;
s5, secondary resin filling and curing are carried out in the back drilling hole in a horizontal vacuum hole filling mode;
and S6, removing the resin protruding from the plate surface through a belt sanding plate.
2. The method for resin plug hole of large-aperture back-drilled hole according to claim 1, wherein in step S2, the whole plate is electroplated for 60min at a current density of 2.1ASF to make the hole copper thickness more than or equal to 20 μm.
3. The method for plugging a hole by a resin in a large-aperture back-drilled hole as claimed in claim 1, wherein the resin viscosity is controlled to be 200-350dpas in step S4.
4. The method for plugging a large-aperture back-drilled hole with resin as claimed in claim 1, wherein the resin viscosity is controlled to 400-900dpas in step S5.
5. The method for resin plug hole of large-aperture back-drilled hole according to claim 1, wherein the curing temperature is 150 ± 5 ℃ for 60min in steps S4 and S5.
6. The method for resin plugging of a large-aperture back-drilled hole according to claim 1, wherein the back-drilled surface of the production sheet is faced upward when resin is plugged in steps S4 and S5.
7. The method for plugging a large-aperture back hole with resin as claimed in claim 6, wherein in step S5, the resin ink is filled into the back hole by using a screen printing plate, an auxiliary light plate having the same size as the production plate is provided on the surface of the screen printing plate, and auxiliary stepped holes having a smaller top and a larger bottom are provided on the auxiliary light plate corresponding to the back hole of the production plate, and the minimum diameter of the auxiliary stepped holes is not less than the maximum aperture of the back hole.
8. The method of claim 7, wherein the diameter of the hole at the upper end of the auxiliary stepped hole is the same as the diameter of the back-drilled part of the back-drilled hole, and the diameter of the hole at the lower end of the auxiliary stepped hole is 0.3mm larger than the diameter of the back-drilled part of the back-drilled hole.
9. A method for plugging a large-aperture back-drilled hole with resin according to claim 7, wherein the scraper pressure during screen printing is 4-7.2kg/cm2And the scraping speed is 10-20 cm/s.
10. The method of claim 7, wherein the ratio of the thickness to the diameter of the upper end of the auxiliary stepped hole to the thickness of the auxiliary light panel is controlled to be 1:1, and the thicknesses of the upper and lower portions of the auxiliary stepped hole are the same.
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| CN201911095491.1A CN110831336B (en) | 2019-11-11 | 2019-11-11 | Resin hole plugging method for large-aperture back drilling hole |
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| CN201911095491.1A CN110831336B (en) | 2019-11-11 | 2019-11-11 | Resin hole plugging method for large-aperture back drilling hole |
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| CN110831336B true CN110831336B (en) | 2020-10-27 |
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| CN109688731A (en) * | 2018-09-30 | 2019-04-26 | 广州兴森快捷电路科技有限公司 | The preparation method of printed circuit board |
| CN109257884A (en) * | 2018-10-31 | 2019-01-22 | 珠海杰赛科技有限公司 | A kind of method and jig of macropore sheet resin consent |
| CN109957286A (en) * | 2019-03-22 | 2019-07-02 | 深圳市百柔新材料技术有限公司 | Ink and its preparation method and application |
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