CN112954903A - Ultrathin high-density printed board and manufacturing method thereof - Google Patents
Ultrathin high-density printed board and manufacturing method thereof Download PDFInfo
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- CN112954903A CN112954903A CN202110067846.7A CN202110067846A CN112954903A CN 112954903 A CN112954903 A CN 112954903A CN 202110067846 A CN202110067846 A CN 202110067846A CN 112954903 A CN112954903 A CN 112954903A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 64
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 84
- 229910052802 copper Inorganic materials 0.000 claims abstract description 57
- 239000010949 copper Substances 0.000 claims abstract description 57
- 239000011889 copper foil Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000005553 drilling Methods 0.000 claims abstract description 20
- 238000011049 filling Methods 0.000 claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 238000009713 electroplating Methods 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 238000000151 deposition Methods 0.000 claims abstract description 6
- 230000008021 deposition Effects 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 238000000227 grinding Methods 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 3
- 238000004042 decolorization Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 62
- 238000007747 plating Methods 0.000 description 9
- 230000007547 defect Effects 0.000 description 7
- 238000003475 lamination Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000006087 Brown hydroboration reaction Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
Abstract
The invention discloses an ultrathin high-density printed board and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: sequentially laminating the outer copper foil and the inner core board through prepregs and then pressing to form a production board; the thickness of the outer layer copper foil is 0.5 oz; the thickness of the surface copper layer in the production plate is reduced through microetching; carrying out browning treatment on the production plate; drilling blind holes on the production plate by laser; then, metallizing the hole by copper deposition and hole filling electroplating of the whole plate; and then sequentially manufacturing an outer layer circuit, a solder mask layer, silk-screen characters, surface treatment and forming on the production board to obtain the ultrathin high-density interconnection soft board. The method uses the copper foil with the thickness of 0.5oz to replace the copper foil with the thickness of 0.33oz in the conventional laser blind hole plate for pressing, and utilizes the characteristic that the copper teeth of the copper foil on the outer layer of 0.5oz are longer than the copper foil with the thickness of 0.33oz, so that the bonding force between the bonding pad and the base material surface is increased, the problem that the small bonding pad of the printed board falls off and is scrapped is avoided, and the laser drilling and the manufacturing of a precise circuit are realized by optimizing the process flow.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to an ultrathin high-density printed board and a manufacturing method thereof.
Background
The appearance of wearable electronic equipment brings much attention to the market, and the wearable equipment has four characteristics of integration, softness, wireless performance and universal use, so that the appearance of the wearable electronic equipment is new, and the future prospect is extremely good. The popularity of wearable electronic devices brings new performance and quality requirements to PCB products, and also creates new market opportunities for PCBs.
The wearable electronic device has a small internal space, and many chips and components are densely arranged on the motherboard to make room for batteries and other devices, so that the PCB is required to be designed to be light, thin, short, high-density, and highly integrated. The conventional manufacturing process of the high-density interconnection printed board comprises the following steps: cutting → inner layer pattern → inner layer etching → inner layer AOI → browning → pressing → laser drilling → de-browning → mechanical drilling → copper deposition → whole plate plating → hole plating pattern → hole filling plating → selective resin hole filling (if any) → ceramic grinding plate → outer layer pattern → pattern plating → outer layer etching → outer layer AOI → silk screen solder resist/character → surface processing → molding → electrical test → FOC → FQA → packaging; for laser blind hole plates, the thickness of the outer copper layer of the plate cannot be too thick for the purpose of laser drilling, and is generally controlled within 12 μm, so that the outer copper foil with the thickness of 0.33oz is generally adopted for lamination in the lamination process.
Aiming at the ultrathin high-density printed board, the total layer number is 4L, the board thickness is 0.39 +/-0.047 mm, the inner layer core board adopts a 0.10mm 1/1oz copper-clad board (1oz is approximately equal to 35 mu m), the aperture of the laser blind hole is 0.125mm, the minimum line width and line distance is 0.05/0.05mm, and the minimum BGA bonding pad size is 0.1 mm. The conventional process technology is too difficult to manufacture, and the manufacturing cannot be realized, mainly because the following reasons are adopted:
1. the size of the outer layer BGA bonding pad is only 0.1mm, the contact area of the outer layer BGA bonding pad and the substrate is too small, the bonding force with the substrate is limited, and the outer layer BGA bonding pad is easy to separate from the substrate after etching, so that the bonding pad falls off and is discarded;
2. the line width and the line distance are 0.05/0.05mm, the size of the bonding pad is 0.1mm, the circuit pattern is extremely fine, the surface copper is too thick by adopting the conventional electroplating and etching methods, the side etching is serious, and the circuit and the bonding pad cannot be manufactured.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for manufacturing an ultrathin high-density printed board, which uses 0.5 oz-thick copper foil to replace the 0.33 oz-thick copper foil in a conventional laser blind hole board for lamination, and utilizes the characteristic that the copper tooth of the 0.5oz outer-layer copper foil is longer than the 0.33oz copper foil, so that the bonding force between a bonding pad and a base material surface is increased, the problem that the printed board is scrapped due to the falling of a small bonding pad is avoided, and the laser drilling and the manufacturing of a precise circuit are realized by optimizing the process flow.
In order to solve the technical problem, the invention provides a method for manufacturing an ultrathin high-density printed board, which aims at the ultrathin high-density printed board with the line width and the line distance of 0.05mm and the minimum bonding pad size of only 0.1mm, and comprises the following steps:
s1, laminating the outer copper foil and the inner core plate in sequence through prepregs and then pressing to form a production plate; the thickness of the outer layer copper foil is 0.5 oz;
s2, thinning and producing the thickness of the surface copper layer in the plate through microetching;
s3, performing browning treatment on the production board;
s4, drilling blind holes on the production board by laser;
s5, metallizing the holes by copper deposition and hole filling electroplating of the whole board;
and S6, sequentially manufacturing an outer layer circuit, a solder mask layer, silk-screen characters, surface treatment and molding on the production board to obtain the ultrathin high-density interconnection soft board.
Further, in step S2, the thickness of the surface copper layer is reduced to 12 ± 1 μm by microetching thinning.
Further, in step S3, the thickness of the surface copper layer is reduced to 7-9 μm by browning treatment.
Further, in step S3, the browning process employs a TopBond LDD browning process.
Further, in step S4, after drilling the blind holes, holes to be filled with resin are drilled in the production board by mechanical drilling.
Further, the following steps are included between steps S4 and S5:
and S41, performing decolourization treatment on the production board.
Further, in step S5, the blind holes are filled by full-plate hole-filling electroplating, and the thickness of the copper layer on the hole wall of the plug hole is plated to be more than or equal to 18 μm, and the thickness of the copper layer on the surface is controlled to be 35 +/-5 μm.
Further, the following steps are included between steps S5 and S6:
s51, filling resin in the plug holes;
s52, removing the resin protruding from the board surface through board grinding;
s53, then, the thickness of the surface copper layer in the board is produced through micro-etching thinning;
s54, removing the resin protruding from the plate surface by grinding the plate.
Further, in step S53, the thickness of the surface copper layer is reduced to 16 ± 2 μm by microetching thinning.
Further, in step S54, the thickness of the surface copper layer is controlled to be 14 + -2 μm by grinding the board.
The invention also provides an ultrathin high-density printed board which is manufactured by adopting the manufacturing method of the ultrathin high-density printed board.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the copper foil with the thickness of 0.33OZ in the conventional laser blind hole plate is replaced by the copper foil with the thickness of 0.5OZ for lamination, and the characteristic that the copper tooth of the copper foil with the thickness of 0.5OZ is longer than that of the copper foil with the thickness of 0.33OZ is utilized, so that the bonding force between a bonding pad manufactured in the later stage and the base material surface is increased, and the problem that the small bonding pad falls off and is scrapped in the printed board is avoided; the method also realizes the manufacture of precise circuit patterns, avoids the problems that the copper is too thick and can not be manufactured by serious lateral etching, and solves the technical problem that the conventional process can not manufacture ultrathin high-density printed boards.
According to the invention, after resin hole plugging is performed on a plate with resin hole plugging, the thickness of a surface copper layer is controlled to be less than 18 μm by a way of three times of combined copper reduction through plate grinding, micro-etching copper reduction and plate grinding, so that the manufacturing of a precise circuit pattern is realized, and the problem that the precise circuit pattern cannot be manufactured due to overlarge copper thickness and serious lateral etching is avoided.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The manufacturing method of the ultrathin high-density printed board shown in this embodiment sequentially includes the following processing steps:
the method sequentially comprises the following treatment procedures:
(1) cutting: the inner core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the inner core board is 0.1mm (excluding the thickness of the outer copper foil), and the thickness of the outer copper foil of the inner core board is 1 oz.
(2) And manufacturing an inner layer circuit (negative film process): coating a photosensitive film on the inner layer core plate by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of inner layer circuits by using 5-6 exposure rulers (21 exposure rulers) by using a full-automatic exposure machine; etching the inner layer, etching an inner layer circuit on the exposed and developed inner layer core plate, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And pressing: the browning speed is that the copper thickness of the bottom copper is browned, the outer copper foil, the prepreg, the inner core board, the prepreg and the outer copper foil are sequentially overlapped according to requirements, and then the proper laminating condition is selected according to the Tg of the board material for lamination to form a 4-layer production board; wherein the thickness of the outer layer copper foil is 0.5 oz.
(4) Micro-etching to reduce copper: because the outer copper foil with the thickness of 0.5oz is adopted for pressing in the production board, the thickness of the outer copper foil is too large to carry out laser drilling, so that the thickness of the surface copper layer (namely the outer copper foil on two surfaces) in the production board is reduced by acid etching, and the thickness of the surface copper layer is reduced to 12 +/-1 mu m after reduction.
(5) And brown oxidation: the production plate is subjected to brown oxidation treatment by means of chemical reaction, so that the production plate is producedA brown oxide layer is formed on the surface of the copper layer of the plate, the roughness of the plate surface is increased, and the height and the shape of the browned surface can effectively absorb CO2Laser energy is convenient for later laser drilling; the thickness of the surface copper layer is reduced to 7-9 mu m through browning treatment, so that the thickness requirement of laser drilling is met; in a specific embodiment, the browning process adopts a TopBond LDD browning process, and compared with the conventional common browning process, the method can reduce the laser energy during drilling, has stable reaction on a copper surface with poor laser absorption capacity, is beneficial to minimizing the problems of copper sputtering or edge hanging and the like, and effectively improves the aperture uniformity during laser drilling and the quality of the drilled hole wall
(6) And laser drilling: blind holes with an aperture of 0.125mm were laser drilled in the production plate.
(7) And outer layer drilling: the production board is drilled with mechanical drilling to form holes and other vias to be filled with resin.
(8) And removing brown oxide: the production plate is subjected to browning removing treatment, so that the influence of a browning layer on the surface on the binding force between a copper plating layer and a plate surface copper layer in the later period is avoided.
(9) And copper deposition: the holes in the production plate were metallized, backlight tested for level 10, and the thickness of the copper deposit in the holes was 0.5 μm.
(10) And whole board hole filling electroplating: filling the blind holes by whole board filling hole electroplating, and plating the hole wall copper layer thickness of the plug holes and the via holes to be more than or equal to 18 mu m, and controlling the surface copper layer thickness to be 35 +/-5 mu m.
(11) Resin hole plugging: and filling resin in the plug holes by a screen printing mode and curing.
(12) Grinding the plate for the first time: and removing the resin protruding out of the board surface at the hole and the redundant resin on the board surface through a ceramic grinding board to enable the board surface to be flat.
(13) Micro-etching to reduce copper: the thickness of the surface copper layer is reduced to 16 +/-2 mu m by acid etching, so that the subsequent etching is convenient for manufacturing fine circuits, and the serious side etching and the circuit etching failure caused by the over-thick surface copper layer are avoided.
(14) And secondarily grinding the plate: and (3) grinding the excessive resin at the orifice after the micro-etching copper reduction by the ceramic grinding plate, carrying out micro-treatment on the surface, improving the uniformity and the evenness of the copper thickness of the plate surface, and controlling the thickness of the surface copper layer to be 14 +/-2 mu m after secondary plate grinding.
(15) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, respectively plating copper and tin on a production plate, wherein the copper plating is performed for 60min by using a current density of 1.8ASD, the tin plating is performed for 10min by using a current density of 1.2ASD, the tin thickness is 3-5 mu m, then sequentially stripping, etching and stripping the tin, an outer layer circuit and a bonding pad are etched on the production plate, the line width and the line distance of the outer layer circuit are both 0.05mm, the bonding pad comprises a bonding pad with the size of 0.1mm and an outer layer AOI, then the defects of the outer layer circuit such as short circuit, line gap, line pinhole and the like are inspected, the defective scrapping treatment is performed, and the product without defects is discharged to the next process.
(16) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, the TOP surface solder resist ink is added with a UL mark on the TOP surface character, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need welding, and the protective layer plays a role in beautifying the appearance.
(17) Surface treatment (nickel-gold deposition): the copper surface of the solder resisting windowing level is communicated with a chemical principle, and nickel and gold with certain required thickness are uniformly deposited.
(18) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(19) And forming: and (4) milling the shape according to the design requirement according to the prior art to obtain the ultrathin high-density printed board.
(20) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the ultrathin high-density printed board is inspected, and if a defect exists, the defect is repaired in time, so that excellent quality control is guaranteed to be provided for the customer.
(21) FQA: and (5) measuring whether the appearance, the hole copper thickness, the medium layer thickness, the green oil thickness, the inner layer copper thickness and the like of the ultrathin high-density printed board meet the requirements of customers or not again.
(22) And packaging: and (4) hermetically packaging the ultrathin high-density printed boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A manufacturing method of an ultrathin high-density printed board is characterized by comprising the following steps of aiming at the ultrathin high-density printed board with the line width and the line distance of 0.05mm and the minimum bonding pad size of only 0.1 mm:
s1, laminating the outer copper foil and the inner core plate in sequence through prepregs and then pressing to form a production plate; the thickness of the outer layer copper foil is 0.5 oz;
s2, thinning and producing the thickness of the surface copper layer in the plate through microetching;
s3, performing browning treatment on the production board;
s4, drilling blind holes on the production board by laser;
s5, metallizing the holes by copper deposition and hole filling electroplating of the whole board;
and S6, sequentially manufacturing an outer layer circuit, a solder mask layer, silk-screen characters, surface treatment and molding on the production board to obtain the ultrathin high-density interconnection soft board.
2. The method of manufacturing an ultra-thin high-density printed board as claimed in claim 1, wherein the thickness of the surface copper layer is reduced to 12 ± 1 μm by microetching thinning in step S2.
3. The method of manufacturing an ultra-thin high-density printed board as claimed in claim 2, wherein the thickness of the surface copper layer is reduced to 7-9 μm by browning treatment in step S3.
4. The method of manufacturing an ultra-thin high-density printed board as claimed in any one of claims 1 to 3, wherein in step S4, after drilling the blind holes, holes to be filled with resin are drilled in the production board by mechanical drilling.
5. The method of manufacturing an ultra-thin high-density printed board as claimed in claim 4, further comprising the steps between steps S4 and S5 of:
and S41, performing decolourization treatment on the production board.
6. The method for manufacturing an ultra-thin high-density printed board according to claim 5, wherein in step S5, the blind holes are filled and leveled by full board filling electroplating, the thickness of the copper layer on the hole wall of the plug hole is plated to be more than or equal to 18 μm, and the thickness of the copper layer on the surface is controlled to be 35 +/-5 μm.
7. The method of manufacturing an ultra-thin high-density printed board as claimed in claim 5, further comprising the steps between steps S5 and S6 of:
s51, filling resin in the plug holes;
s52, removing the resin protruding from the board surface through board grinding;
s53, then, the thickness of the surface copper layer in the board is produced through micro-etching thinning;
s54, removing the resin protruding from the plate surface by grinding the plate.
8. The method of manufacturing an ultra-thin high-density printed board as claimed in claim 7, wherein the thickness of the surface copper layer is reduced to 16 ± 2 μm by microetching thinning in step S53.
9. The method of manufacturing an ultra-thin high-density printed board as claimed in claim 7, wherein the thickness of the surface copper layer is controlled to 14 ± 2 μm by grinding the board in step S54.
10. An ultra-thin high-density printed board, characterized by being manufactured by the method of manufacturing an ultra-thin high-density printed board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110067846.7A CN112954903A (en) | 2021-01-19 | 2021-01-19 | Ultrathin high-density printed board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110067846.7A CN112954903A (en) | 2021-01-19 | 2021-01-19 | Ultrathin high-density printed board and manufacturing method thereof |
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| CN112954903A true CN112954903A (en) | 2021-06-11 |
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| CN202110067846.7A Pending CN112954903A (en) | 2021-01-19 | 2021-01-19 | Ultrathin high-density printed board and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114885527A (en) * | 2022-04-26 | 2022-08-09 | 深圳明阳电路科技股份有限公司 | PCB high-speed material and manufacturing method thereof |
| CN115226324A (en) * | 2022-09-20 | 2022-10-21 | 广东科翔电子科技股份有限公司 | Mini-LED small-spacing COB product gold manufacturing method |
| CN116828826A (en) * | 2023-08-31 | 2023-09-29 | 四川上达电子有限公司 | In-situ opposite blind hole stacking method for multilayer flexible printed circuit board |
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| CN115226324A (en) * | 2022-09-20 | 2022-10-21 | 广东科翔电子科技股份有限公司 | Mini-LED small-spacing COB product gold manufacturing method |
| CN116828826A (en) * | 2023-08-31 | 2023-09-29 | 四川上达电子有限公司 | In-situ opposite blind hole stacking method for multilayer flexible printed circuit board |
| CN116828826B (en) * | 2023-08-31 | 2024-01-02 | 四川上达电子有限公司 | In-situ opposite blind hole stacking method for multilayer flexible printed circuit board |
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Application publication date: 20210611 |