CN103917049A - Laser drilling plate machining method adopting secondary outer-layer core material for reducing copper - Google Patents
Laser drilling plate machining method adopting secondary outer-layer core material for reducing copper Download PDFInfo
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- CN103917049A CN103917049A CN201410148588.5A CN201410148588A CN103917049A CN 103917049 A CN103917049 A CN 103917049A CN 201410148588 A CN201410148588 A CN 201410148588A CN 103917049 A CN103917049 A CN 103917049A
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Abstract
The invention discloses a laser drilling plate machining method adopting a secondary outer-layer core material for reducing copper. The laser drilling plate machining method is characterized by comprising secondary outer-layer graph manufacturing, laminating and laser drilling. The laser drilling plate machining method specifically comprises the following steps that a secondary outer-layer core material is selected; a secondary outer-layer bearing plate is manufactured; a secondary outer-layer graph is manufactured; a skylight layer is manufactured; laser drilling is performed on a skylight printed board. In the machining process of a laser drilling plate, 0.5OZ copper foil is used for replacing 0.33OZ copper foil in the secondary outer-layer graph of a printed circuit board, the copper reducing technology is adopted, so that when laser drilling is performed, the problem of laser hole breakdown is completely solved, and the product yield is greatly improved. The conflict that the graph layer requires thinner copper foil and the laser hole bearing plate requires thicker copper foil is removed, and the wide promotional significance is achieved.
Description
Technical field
The present invention relates to the processing method of laser drilling process printed wiring board, specifically a kind of laser drilling orifice plate processing method that adopts time outer core to subtract copper.
Background technology
Along with improving constantly and the extensive even extensive use of very lagre scale integrated circuit (VLSIC) of the fast development of microelectric technique, PCB technical merit, for the bury/blind hole in a large amount of HDI circuit, standard machinery numerical control drilling machine can not meet the demands, must adopt laser drill process technology.The generation of laser drill process technology and develop rapidly are the distinctive marks of PCB industry technology development, are the revolutions of PCB drilling technique development.At present the popular laser drill processing mode of industry generally has two kinds: fenestration and Direct Laser boring method, no matter and be any method, the laser hole bottom of formation all needs to have the tray of one outer internal layer, as the interface channel of the signal of telecommunication.In laser drill process, can produce a large amount of heats, if tray thinner thickness, there will be laser to be burnt, there is laser hole breakdown problem, when serious, can cause layer short circuit, produce waste product: this just requires the design copper thickness of tray will reach certain safe threshold values, general, safe threshold values is 0.5OZ.
When client is for wiring density, the requirement of impedance requirement or line design precision and must use thinner (as 0.33OZ or lower) copper layer to do time outer figure layer time, conventionally adopt conventional method processing step as shown in Figure 2 to process, in figure, inferior outer core 1 is directly selected 0.33OZ base copper 1d, after follow-up processing, form 0.33OZ tray 1e, owing to having produced a large amount of heats in laser drill process, if select brown technique lamination process, because brown copper face roughness after treatment is larger, heat absorption capacity is strong, 0.33OZ tray 1e dispels the heat not in time, the laser hole 5 forming there will be laser hole to puncture the problem of 5a, when serious, can cause layer short circuit, produce waste product.Blackening craft on the contrary can address this problem, but selects blackening craft can cause the sharply increase of processing cost.
Summary of the invention
According to the technical problem of above-mentioned proposition, and provide a kind of laser drilling orifice plate processing method that adopts time outer core to subtract copper.The present invention mainly utilizes inferior outer core is subtracted to the method for copper, thereby has solved graph layer requirement compared with the contradiction of thin copper foil and the thicker Copper Foil of laser hole tray requirement.
The technological means that the present invention adopts is as follows:
Adopt time outer core to subtract a laser drilling orifice plate processing method for copper, it is characterized in that: comprise time outer graphics making, lamination and laser drill, concrete steps are as follows:
1) inferior outer core is selected: select 0.5OZ Copper Foil as inferior outer core;
2) inferior outer tray is made: inferior outer core is processed successively as follows: pre-treatment → pad pasting → exposure → development → subtract copper → demoulding; Wherein, the film using when exposure only has or not medicine film dead zone at inferior outer tray place, and all the other positions are all black Yao Mo district;
3) inferior outer graphics is made: above-mentioned outer core processed successively as follows: pre-treatment → pad pasting → exposure → development → etching → demoulding, obtains time outer graphics;
4) skylight layer is made: above-mentioned outer core processed successively as follows: brown → lamination → pre-treatment → pad pasting → exposure → development → etching → demoulding, obtains skylight layer printed board;
5) the layer printed board of above-mentioned skylight carried out to laser drill processing.
As preferably, step 2) in inferior outer printed board subtracted to copper add man-hour, subtracting copper amount is 3-12um.
As preferably, step 2) in inferior outer printed board subtracted to copper add man-hour, subtracting copper amount is 3-5um.
As preferably, step 2) described in inferior skin of time outer core accept the thick 0.5OZ(15-17um of being of rosette copper), the copper of all the other positions is thick reaches 0.33OZ(10-12um subtracting after copper).
As preferably, subtract copper amount, step 2 by adjustment) described in the copper of all the other positions of time outer core is thick after copper, reaches 1/7OZ(5um subtracting).
Compare compared with prior art, advantage of the present invention is apparent specific as follows:
1, there is the inferior outer graphics of the printed wiring board of laser drilling process to use 0.5OZ Copper Foil to substitute 0.33OZ Copper Foil or thinner Copper Foil, add man-hour carrying out laser drill, solved laser hole breakdown problem completely, improved greatly product yield.
2, method of the present invention has solved graph layer requirement compared with the contradiction of thin copper foil and the thicker Copper Foil of laser hole tray requirement, has dissemination widely.
Brief description of the drawings
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is processing step schematic diagram of the present invention.
Fig. 2 is conventional method processing step schematic diagram.
In figure: 1, inferior outer core 1a, 0.5OZ base copper 1b, 0.5OZ tray 1c, 0.5OZ base copper attenuated layer 1d, 0.33OZ base copper 1e, 0.33OZ tray 2, dry film 2a, be subject to light dry film 3, film 3a, puncture without medicine film dead zone 4, ultraviolet light 5, laser hole 5a, laser hole
Embodiment
Adopt time outer core to subtract a laser drilling orifice plate processing method for copper, comprise time outer graphics making, lamination and laser drill.
As shown in Figure 1, so that being thinned to 0.33OZ from 0.5OZ, the base copper thickness of inferior outer core is illustrated as example:
Inferior outer core 1 is selected 0.5OZ base copper 1a, paste dry film 2 thereon, and overlap film 3, under the irradiation of ultraviolet light 4, in the time developing, be retained on time outer core 1 without the light dry film 2a that is subject under medicine film dead zone 3a, through subtracting the effect of copper, exposed out 0.5OZ base copper 1a is thinned about 3-4um, become 0.5OZ base copper attenuated layer 1c, be subject to the 0.5OZ base copper 1a under light dry film 2a protection to become 0.5OZ tray 1b; Through follow-up lamination, the making of skylight layer, laser drill processing, form laser hole 5.
Inferior outer printed board is subtracted to copper and add man-hour, subtracting copper amount is 3-4um; Inferior skin of described time outer core is accepted the thick 0.5OZ(15-17um of being of rosette copper), the copper of all the other positions is thick reaches 0.33OZ(10-12um subtracting after copper).Use 0.5OZ Copper Foil to substitute 0.33OZ Copper Foil by the inferior outer graphics of the printed wiring board of laser drilling process, add man-hour carrying out laser drill, solved laser hole breakdown problem completely, improved greatly product yield; Method of the present invention has solved graph layer requirement compared with the contradiction of thin copper foil and the thicker Copper Foil of laser hole tray requirement, has dissemination widely.
The above; it is only preferably embodiment of the present invention; but protection scope of the present invention is not limited to this; any be familiar with those skilled in the art the present invention disclose technical scope in; be equal to replacement or changed according to technical scheme of the present invention and inventive concept thereof, within all should being encompassed in protection scope of the present invention.
Claims (5)
1. adopt time outer core to subtract a laser drilling orifice plate processing method for copper, it is characterized in that: comprise time outer graphics making, lamination and laser drill, concrete steps are as follows:
1) inferior outer core is selected: select 0.5OZ Copper Foil as inferior outer core;
2) inferior outer tray is made: inferior outer core is processed successively as follows: pre-treatment → pad pasting → exposure → development → subtract copper → demoulding; Wherein, the film using when exposure only has or not medicine film dead zone at inferior outer tray place, and all the other positions are all black Yao Mo district;
3) inferior outer graphics is made: above-mentioned outer core processed successively as follows: pre-treatment → pad pasting → exposure → development → etching → demoulding, obtains time outer graphics;
4) skylight layer is made: above-mentioned outer core processed successively as follows: brown → lamination → pre-treatment → pad pasting → exposure → development → etching → demoulding, obtains skylight layer printed board;
5) the layer printed board of above-mentioned skylight carried out to laser drill processing.
2. a kind of laser drilling orifice plate processing method that adopts time outer core to subtract copper according to claim 1, is characterized in that: step 2) in inferior outer printed board subtracted to copper add man-hour, subtracting copper amount is 3-12um.
3. a kind of laser drilling orifice plate processing method that adopts time outer core to subtract copper according to claim 2, is characterized in that: step 2) in inferior outer printed board subtracted to copper add man-hour, subtracting copper amount is 3-5um.
4. a kind of laser drilling orifice plate processing method that adopts time outer core to subtract copper according to claim 1, is characterized in that: step 2) described in inferior skin of time outer core accept the thick 0.5OZ of being of rosette copper, the copper of all the other positions is thick reaches 0.33OZ subtracting after copper.
5. a kind of laser drilling orifice plate processing method that adopts time outer core to subtract copper according to claim 4, is characterized in that: subtract copper amount, step 2 by adjustments) described in the copper of all the other positions of inferior outer core is thick after copper, reaches 1/7OZ subtracting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410148588.5A CN103917049A (en) | 2013-11-22 | 2014-04-14 | Laser drilling plate machining method adopting secondary outer-layer core material for reducing copper |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310603468.5 | 2013-11-22 | ||
| CN201310603468 | 2013-11-22 | ||
| CN201410148588.5A CN103917049A (en) | 2013-11-22 | 2014-04-14 | Laser drilling plate machining method adopting secondary outer-layer core material for reducing copper |
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| Publication Number | Publication Date |
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| CN103917049A true CN103917049A (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410148588.5A Pending CN103917049A (en) | 2013-11-22 | 2014-04-14 | Laser drilling plate machining method adopting secondary outer-layer core material for reducing copper |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028654A (en) * | 2016-06-21 | 2016-10-12 | 欣兴同泰科技（昆山）有限公司 | Drilling method of flexible circuit board |
| US9487441B2 (en) | 2011-10-28 | 2016-11-08 | Corning Incorporated | Glass articles with infrared reflectivity and methods for making the same |
| US10116035B2 (en) | 2015-04-30 | 2018-10-30 | Corning Incorporated | Electrically conductive articles with discrete metallic silver layers and methods for making same |
| CN112954903A (en) * | 2021-01-19 | 2021-06-11 | 江门崇达电路技术有限公司 | Ultrathin high-density printed board and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1075069A (en) * | 1996-06-27 | 1998-03-17 | Samsung Electro Mech Co Ltd | Manufacture of build-up multi-layer printed circuit board using yag laser |
| US6119335A (en) * | 1997-12-02 | 2000-09-19 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing multi-layer printed circuit board |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A kind of method of processing blind hole by laser |
| CN101677067A (en) * | 2008-09-19 | 2010-03-24 | 钰桥半导体股份有限公司 | Copper core layer multilayer packaging substrate manufacturing method |
-
2014
- 2014-04-14 CN CN201410148588.5A patent/CN103917049A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1075069A (en) * | 1996-06-27 | 1998-03-17 | Samsung Electro Mech Co Ltd | Manufacture of build-up multi-layer printed circuit board using yag laser |
| US6119335A (en) * | 1997-12-02 | 2000-09-19 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing multi-layer printed circuit board |
| CN101677067A (en) * | 2008-09-19 | 2010-03-24 | 钰桥半导体股份有限公司 | Copper core layer multilayer packaging substrate manufacturing method |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A kind of method of processing blind hole by laser |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9487441B2 (en) | 2011-10-28 | 2016-11-08 | Corning Incorporated | Glass articles with infrared reflectivity and methods for making the same |
| US9586861B2 (en) | 2011-10-28 | 2017-03-07 | Corning Incorporated | Glass articles with discrete metallic silver layers and methods for making the same |
| US9975805B2 (en) | 2011-10-28 | 2018-05-22 | Corning Incorporated | Glass articles with infrared reflectivity and methods for making the same |
| US11535555B2 (en) | 2011-10-28 | 2022-12-27 | Corning Incorporated | Glass articles with infrared reflectivity and methods for making the same |
| US10116035B2 (en) | 2015-04-30 | 2018-10-30 | Corning Incorporated | Electrically conductive articles with discrete metallic silver layers and methods for making same |
| CN106028654A (en) * | 2016-06-21 | 2016-10-12 | 欣兴同泰科技（昆山）有限公司 | Drilling method of flexible circuit board |
| CN112954903A (en) * | 2021-01-19 | 2021-06-11 | 江门崇达电路技术有限公司 | Ultrathin high-density printed board and manufacturing method thereof |
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Application publication date: 20140709 |