CN110366323B - Manufacturing method of circuit board solder mask layer - Google Patents
Manufacturing method of circuit board solder mask layer Download PDFInfo
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- CN110366323B CN110366323B CN201910598212.7A CN201910598212A CN110366323B CN 110366323 B CN110366323 B CN 110366323B CN 201910598212 A CN201910598212 A CN 201910598212A CN 110366323 B CN110366323 B CN 110366323B
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- solder mask
- circuit board
- ink
- curing
- filling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Abstract
The invention discloses a method for manufacturing a solder mask layer of a circuit board, which comprises the following steps: filling ink: filling ink between the circuit of the circuit board and the bonding pad; the method comprises the following steps of solder mask pretreatment: performing solder mask pretreatment on the circuit board subjected to the step of filling the ink; and (3) solder mask: covering the circuit board which is subjected to the step of pre-welding prevention treatment with welding prevention oil; and (3) curing: and curing the circuit board subjected to the solder mask step. The invention can enable the thickness of the solder mask at the edge of the circuit board to meet the requirement and can also enable the surface of the solder mask to be smooth and beautiful; meanwhile, the fabric grains of the circuit board can not be exposed during laser windowing and trimming.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a solder mask layer of a circuit board.
Background
The circuit board, also called as circuit board or printed circuit board, is one of the important parts in the electronic industry, and is the support of electronic components and carriers for electrical connection. The production flow of the circuit board sequentially comprises the following steps: the method comprises the steps of plate opening, inner layer circuit manufacturing, pressing, drilling, copper deposition, whole plate electroplating, outer layer circuit manufacturing, solder mask layer manufacturing, surface treatment and forming. The manufacturing of the solder mask layer is that a layer of solder mask ink is coated on the circuit board of which the outer layer circuit is manufactured except for the positions of a pad, a hole and the like for welding, so that the circuit board is protected and soldered.
In the prior art, the process flow for manufacturing the solder mask layer sequentially comprises the following steps: solder resist pretreatment, full-plate screen printing or solder resist spraying, prebaking, exposing, developing, character printing and curing. The process for manufacturing the solder mask layer has the following defects: as shown in fig. 1, the solder mask 4 'at the edge of the circuit 2 on the circuit board substrate 1 is thin and printed once, and the thickness of the solder mask 4' at the edge of the circuit 2 is usually only 5-7 um; due to the existence of a developing process, underrcut 5' appears at a solder mask opening window after development, so that the problem of ion pollution degree of a circuit board occurs; the process flow of exposure and development is required, the energy consumption is high, the process flow is complex, and the qualification rate is low; water is needed in the developing process, and a large amount of sewage is generated; the solder bridge resistance between the circuit 2 and the pad 3 is limited, and usually for the outer layer HOZ bottom copper, the solder bridge resistance is designed and manufactured between the pads, the spacing between the pads is about 7mil, which is a great challenge for the circuit board with more and more dense design in the traditional process; for a circuit board with dense circuits, the defect that solder mask oil is printed on a welding pad frequently occurs, and the precision is not high.
In order to solve the problem of thinner solder mask at the edge of the circuit, as shown in fig. 2-3, in the prior art, a first solder mask 6 'is printed at the edge of the circuit, and then a second solder mask 7' is coated on the circuit and the substrate of the circuit board. Although the thickness of the solder resist oil at the edge of the line can be increased, the following defects still exist: two layers of solder resist oil are arranged at the edge of the circuit, so that the solder resist oil is uneven and influences the appearance; the circuit edge is not covered tightly by ink, a cavity appears, and laser can be burnt on a base material when the laser windows and trims, so that the circuit board is exposed with cloth marks.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to: the manufacturing method of the circuit board solder mask layer is provided, which can enable the thickness of the solder mask oil at the edge of the circuit board to meet the requirement and enable the surface of the solder mask layer to be smooth and beautiful; meanwhile, the fabric grains of the circuit board can not be exposed during laser windowing and trimming.
The purpose of the invention is realized by adopting the following technical scheme:
a manufacturing method of a circuit board solder mask layer is characterized by comprising the following steps:
filling ink: filling ink between the circuit of the circuit board and the bonding pad;
the method comprises the following steps of solder mask pretreatment: performing solder mask pretreatment on the circuit board subjected to the step of filling the ink;
and (3) solder mask: covering the circuit board subjected to the step of the pre-welding prevention treatment with welding prevention oil;
and (3) curing: and curing the circuit board subjected to the solder mask step.
Further, in the step of filling ink, the filled ink is an insulating ink material.
Further, in the step of filling the ink, printing an ink pattern by using a printing technology according to the information of the CAM, and curing the ink pattern by using ultraviolet light.
Further, in the step of filling the ink, the thickness of the filled ink is 50-95% of the thickness of the circuit.
Further, the step of the pre-welding prevention treatment comprises the step of grinding the plate; and the step of grinding the board is to grind the ink on the surfaces of the circuit board and the bonding pad by using a grinding roller or a roller belt.
Further, a step of printing characters is included between the step of solder mask and the step of curing, and the step of printing characters is to print character patterns on the circuit board according to the information of the CAM and cure the printed character patterns by ultraviolet light.
Further, the step of curing further comprises a step of laser windowing, and the step of laser windowing is to eliminate the solder mask on the bonding pad by using laser according to the information of the CAM.
Further, in the step of solder mask, the step of covering the solder mask is to print a pattern of the solder mask by printing technology according to the data of the CAM, and to cure the printed pattern of the solder mask by ultraviolet light.
Further, in the step of preventing welding, after the base material surface of the circuit board is covered with the anti-welding oil, the height difference between the upper surface of the anti-welding oil and the upper surface of the bonding pad is not more than 25 um.
Further, in the step of filling the ink, the filled ink is a resin ink material.
Compared with the prior art, the invention has the beneficial effects that:
1. the manufacturing method of the circuit board solder mask layer comprises the steps of filling ink and grinding a plate before the solder mask oil is printed, so that the height difference between the circuit surface and the base material surface can be reduced, and the situations that the ink thickness of the edge of the circuit is thinner and the ink thickness of the base material surface is thicker can be avoided after the solder mask oil is printed, so that the solder mask oil thickness of the edge of the circuit board meets the requirement. And for the copper plate with thicker circuit, the anti-welding oil does not need to be printed for many times, so that the surface of the anti-welding layer is smooth and attractive.
2. According to the manufacturing method of the circuit board solder mask layer, the steps of exposure and development are not needed after the solder mask layer is printed, compared with the prior art, the process flow is simpler, the energy consumption can be effectively reduced, water is needed in the steps of exposure and development in the prior art, and therefore a large amount of waste water is generated. In addition, underrcut can occur at the solder resist ink windowing position after the developing process in the prior art, but the underrcut can not occur after the laser windowing step because the developing step is not performed, so that the problem of ion pollution is greatly improved.
3. According to the manufacturing method of the circuit board solder mask layer, the solder mask layer is manufactured by adopting a printing technology, digital partition control can be achieved, the printing thickness of different areas is controlled, the solder mask oil on the base material surface of the circuit board can be printed to be thin, the solder mask oil on the circuit surface is printed to be thick, the solder mask oil is not printed on the welding pad of the laser windowing and the process edge of the circuit board, the solder mask oil is greatly saved, meanwhile, the laser windowing is adopted instead of an exposure developing method, so that the solder mask bridge can be made to be thin, and the design density of the circuit board is greatly improved.
4. According to the manufacturing method of the circuit board welding-proof layer, the layer of printing ink is filled under the welding-proof oil, and the material of the filled printing ink is the resin printing ink material, so that the circuit substrate is not easy to burn when the laser is used for trimming, and the defect of cloth grain exposure is avoided.
Drawings
FIG. 1 is a prior art diagram of a printed solder mask on an outer circuit of a circuit board;
FIG. 2 is a prior art image of a printed circuit board with a first solder mask paste on the edge of the circuit board;
FIG. 3 is a prior art photograph of a second anti-weld paste printed over a first anti-weld paste;
FIG. 4 is a diagram of the circuit board of the present invention with ink filled between the circuit board and the bonding pad;
FIG. 5 is a diagram of a solder mask layer printed on an ink layer of the circuit board of the present invention;
in the figure, 1, a substrate of a wiring board; 2. a line; 3. a pad; 4', anti-welding oil; 5', Undercut; 6', first anti-welding oil; 7' and second anti-welding oil; 4. solder mask; 5. and (3) printing ink.
Detailed Description
The present invention is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment. The equipment and raw materials used are all available on the market or commonly used in the field. The methods in the following examples are conventional in the art unless otherwise specified.
A method for manufacturing a solder mask layer of a circuit board comprises the following steps:
step of filling ink 5: as shown in fig. 4, ink 5 is filled between the wiring 2 and the pad 3 on the wiring board substrate 1;
the method comprises the following steps of solder mask pretreatment: performing solder mask pretreatment on the circuit board subjected to the step of filling the ink 5;
and (3) solder mask: as shown in fig. 5, solder mask oil 4 is coated on the circuit board which is processed by the solder mask pretreatment;
and (3) curing: and curing the circuit board subjected to the solder mask step. The curing is high-temperature baking curing.
In a further embodiment, in the step of filling the ink 5, the filled ink 5 is an insulating ink 5 material.
As a further embodiment, in the step of filling the ink 5, the ink 5 pattern is printed by using a printing technique according to the CAM data, and the ink 5 pattern is cured by using ultraviolet light.
In a further embodiment, the step of filling the ink 5 has a thickness of the filling ink 5 of 50 to 95% of the thickness of the wiring 2.
As a further embodiment, the step of pre-solder mask treatment comprises the step of grinding the plate; the step of grinding the board is to grind the ink 5 on the surfaces of the circuit 2 and the bonding pad 3 of the circuit board by using a grinding roller or a roller belt.
As a further implementation mode, a step of printing characters is further included between the step of solder mask and the step of curing, and the step of printing characters is to print character patterns on the circuit board according to the CAM data and cure the printed character patterns by ultraviolet light.
As a further embodiment, the step of curing further includes a step of laser windowing after the step of curing, wherein the step of laser windowing is to remove the solder mask 4 on the pad 3 by laser according to the CAM data. Laser windowing is performed at the position of the bonding pad 3, and the reject ratio caused by the fact that the anti-welding oil 4 is attached to the bonding pad 3 is reduced.
As a further embodiment, in the step of solder masking, the solder mask 4 is covered by printing the pattern of the solder mask 4 by a printing technique according to the CAM data, and the printed pattern of the solder mask 4 is cured by ultraviolet light.
As a further embodiment, in the step of solder masking, after the base material surface of the wiring board is covered with the solder mask 4, the height difference between the upper surface of the solder mask 4 and the upper surface of the pad 3 is not more than 25 um. Can avoid preventing that solder paste 4 is stained with pad 3, can improve the density of circuit board design greatly.
In a further embodiment, in the step of filling the ink 5, the filled ink 5 is a resin ink 5 material having a material similar to that of the substrate of the wiring board.
Example 1:
a manufacturing method of a circuit board solder mask layer sequentially comprises the following steps:
filling ink: printing ink patterns between the circuit of the circuit board and the bonding pad by adopting a printing technology according to the information of the CAM, and curing the ink patterns by using ultraviolet light; the filled ink is a resin ink material; the thickness of the filled ink was 50% of the thickness of the wiring.
Pretreatment of solder resist: comprises the step of grinding a plate; the step of grinding the board is to grind off ink dropped on the surfaces of the circuit and the bonding pad of the circuit board by a grinding roller;
and (3) solder mask: covering the circuit board which is subjected to the pre-welding prevention treatment with anti-welding oil; the covering of the anti-welding oil is to print the pattern of the anti-welding oil by printing technology according to the CAM data and to cure the printed anti-welding oil pattern by ultraviolet light. The height between the upper surface of the solder resist and the upper surface of the pad after printing the solder resist was 5 μm on the substrate surface of the wiring board.
Printing characters: and printing character patterns on the circuit board according to the CAM data, and curing the printed character patterns by using ultraviolet light.
And (3) curing: and curing the circuit board subjected to the solder mask step.
Laser windowing: according to the CAM data, the solder mask on the pads is removed by a laser.
Example 2:
a manufacturing method of a circuit board solder mask layer sequentially comprises the following steps:
filling ink: printing ink patterns between the circuit of the circuit board and the bonding pad by adopting a printing technology according to the information of the CAM, and curing the ink patterns by using ultraviolet light; the filled ink is a resin ink material; the thickness of the filled ink was 95% of the thickness of the traces.
Pretreatment of solder resist: comprises the step of grinding a plate; the step of grinding the board is to grind off ink dropped on the surface of the circuit and the bonding pad of the circuit board by a grinding roller belt;
and (3) solder mask: covering the circuit board which is subjected to the pre-welding prevention treatment with anti-welding oil; the covering of the anti-welding oil is to print the pattern of the anti-welding oil by printing technology according to the CAM data and to cure the printed anti-welding oil pattern by ultraviolet light. The height between the upper surface of the solder resist and the upper surface of the pad after printing the solder resist was 10 μm on the substrate surface of the wiring board.
Printing characters: and printing character patterns on the circuit board according to the CAM data, and curing the printed character patterns by using ultraviolet light.
And (3) curing: and curing the circuit board subjected to the solder mask step.
Laser windowing: according to the CAM data, the solder mask on the pads is removed by a laser.
Example 3:
a manufacturing method of a circuit board solder mask layer sequentially comprises the following steps:
filling ink: printing ink patterns between the circuit of the circuit board and the bonding pad by adopting a printing technology according to the information of the CAM, and curing the ink patterns by using ultraviolet light; the filled ink is a resin ink material; the thickness of the filled ink was 65% of the line thickness.
Pretreatment of solder resist: comprises the step of grinding a plate; the step of grinding the board is to grind off ink dropped on the surfaces of the circuit and the bonding pad of the circuit board by a grinding roller;
and (3) solder mask: covering the circuit board which is subjected to the pre-welding prevention treatment with anti-welding oil; the covering of the anti-welding oil is to print the pattern of the anti-welding oil by printing technology according to the CAM data and to cure the printed anti-welding oil pattern by ultraviolet light. The height between the upper surface of the solder resist and the upper surface of the pad after printing the solder resist was 15 μm on the substrate surface of the wiring board.
Printing characters: and printing character patterns on the circuit board according to the CAM data, and curing the printed character patterns by using ultraviolet light.
And (3) curing: and curing the circuit board subjected to the solder mask step.
Laser windowing: according to the CAM data, the solder mask on the pads is removed by a laser.
Example 4:
a manufacturing method of a circuit board solder mask layer sequentially comprises the following steps:
filling ink: printing ink patterns between the circuit of the circuit board and the bonding pad by adopting a printing technology according to the information of the CAM, and curing the ink patterns by using ultraviolet light; the filled ink is a resin ink material; the thickness of the filled ink was 85% of the line thickness.
Pretreatment of solder resist: comprises the step of grinding a plate; the step of grinding the board is to grind off ink dropped on the surface of the circuit and the bonding pad of the circuit board by a grinding roller belt;
and (3) solder mask: covering the circuit board which is subjected to the pre-welding prevention treatment with anti-welding oil; the covering of the anti-welding oil is to print the pattern of the anti-welding oil by printing technology according to the CAM data and to cure the printed anti-welding oil pattern by ultraviolet light. The height between the upper surface of the solder resist and the upper surface of the pad after printing the solder resist was 22 μm on the substrate surface of the wiring board.
Printing characters: and printing character patterns on the circuit board according to the CAM data, and curing the printed character patterns by using ultraviolet light.
And (3) curing: and curing the circuit board subjected to the solder mask step.
Laser windowing: according to the CAM data, the solder mask on the pads is removed by a laser.
It should be noted that the anti-welding oil, the first anti-welding oil and the second anti-welding oil mentioned in the specification are all anti-welding oils, and the first and the second are only for convenience of description and have a distinguishing function.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (6)
1. A manufacturing method of a circuit board solder mask layer is characterized by comprising the following steps:
filling ink: filling ink between the circuit of the circuit board and the bonding pad;
the method comprises the following steps of solder mask pretreatment: performing solder mask pretreatment on the circuit board subjected to the step of filling the ink;
and (3) solder mask: covering the circuit board subjected to the step of the pre-welding prevention treatment with welding prevention oil;
and (3) curing: curing the circuit board subjected to the solder mask step;
the step of laser windowing is also included after the step of curing, and the step of laser windowing is to eliminate the solder mask on the bonding pad by laser according to the information of the CAM;
in the step of solder mask, the step of covering the solder mask is to print patterns of the solder mask by adopting a printing technology according to the information of CAM and carry out curing treatment on the printed patterns of the solder mask by using ultraviolet light;
in the step of filling the ink, printing an ink pattern by adopting a printing technology according to the information of the CAM, and curing the ink pattern by using ultraviolet light;
the step of the pre-welding prevention treatment comprises the step of grinding the plate; and the step of grinding the board is to grind the ink on the surfaces of the circuit board and the bonding pad by using a grinding roller or a roller belt.
2. The method for manufacturing a solder mask layer for circuit board according to claim 1, wherein in the step of filling ink, the filled ink is an insulating ink material.
3. The method for manufacturing a solder mask layer for circuit board according to claim 1, wherein in the step of filling the ink, the thickness of the filled ink is 50-95% of the thickness of the circuit.
4. The method for manufacturing a solder mask layer for circuit boards according to any one of claims 1 to 3, further comprising a step of printing characters between the step of solder mask and the step of curing, wherein the step of printing characters is to print text patterns on the circuit board according to CAM data and cure the printed text patterns with ultraviolet light.
5. The method of manufacturing a solder mask for circuit board according to claim 1, wherein in the step of solder mask, after the substrate surface of the circuit board is covered with the solder mask, a height difference between the upper surface of the solder mask and the upper surface of the bonding pad is not greater than 25 μm.
6. The method for manufacturing a solder mask layer for circuit boards according to claim 1, wherein in the step of filling the ink, the filled ink is a resin ink material.
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| CN113811097B (en) * | 2020-06-12 | 2023-06-20 | 庆鼎精密电子（淮安）有限公司 | Circuit board with high reflectivity and preparation method thereof |
| CN111741611A (en) * | 2020-07-27 | 2020-10-02 | 深圳市卓创通电子有限公司 | Laser solder mask processing technology of PCB |
| CN112087884A (en) * | 2020-08-17 | 2020-12-15 | 鹤山市中富兴业电路有限公司 | Solder mask manufacturing method of thick copper circuit board |
| CN112911813B (en) * | 2021-01-26 | 2022-07-12 | 深圳市景旺电子股份有限公司 | Manufacturing method for improving solder mask film print of PCB and prepared PCB |
| CN113038731A (en) * | 2021-02-22 | 2021-06-25 | 惠州市金百泽电路科技有限公司 | Method for manufacturing circuit board bonding pad |
| CN115279055B (en) * | 2022-08-09 | 2023-09-15 | 湖北龙腾电子科技股份有限公司 | Technological method for solving PAD on scattered ink of PCB character jet printer |
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| JPS62114288A (en) * | 1985-11-14 | 1987-05-26 | 沖電気工業株式会社 | Manufacture of printed circuit board |
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| CN101296570A (en) * | 2007-04-25 | 2008-10-29 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
| CN101861049B (en) * | 2009-04-08 | 2012-03-07 | 昆山市华升电路板有限公司 | Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof |
| CN101600299B (en) * | 2009-06-26 | 2011-03-09 | 陈立峰 | Rapid subtractive manufacturing process of circuit boards |
| CN103547081B (en) * | 2012-07-10 | 2016-09-28 | 深南电路有限公司 | Resistance welding processing method, system and the circuit board of a kind of super thick copper foil circuit board |
| CN106211580B (en) * | 2016-06-30 | 2019-01-18 | 广州兴森快捷电路科技有限公司 | A kind of method of pcb board dielectric thickness homogenization |
| CN109496082A (en) * | 2018-10-13 | 2019-03-19 | 奥士康科技股份有限公司 | A kind of super thick copper sheet anti-welding printing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS62114288A (en) * | 1985-11-14 | 1987-05-26 | 沖電気工業株式会社 | Manufacture of printed circuit board |
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