CN108617104A - The production method that the local figure copper thickness of printed circuit board thickeies - Google Patents
The production method that the local figure copper thickness of printed circuit board thickeies Download PDFInfo
- Publication number
- CN108617104A CN108617104A CN201810410460.XA CN201810410460A CN108617104A CN 108617104 A CN108617104 A CN 108617104A CN 201810410460 A CN201810410460 A CN 201810410460A CN 108617104 A CN108617104 A CN 108617104A
- Authority
- CN
- China
- Prior art keywords
- copper
- layers
- dry film
- thickness
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The present invention provides the production methods that a kind of local figure copper thickness of printed circuit board thickeies, and include the following steps：Supplied materials step；Drilling and counterbore step；First time plate electricity step；Patch dry film step for the first time；Exposure and first time development step for the first time；Parcel plating step；Move back film step for the first time；Second of plate electricity step；Spray printing anti-etching printing ink step；Second of patch dry film step；Second of exposure and second development step；Etching step；Film step is moved back for the second time, is avoided and is caused dry film to press the unreal situation for causing step position copper to be etched generation because of step position height when part thickeies, the Local Copper thickness thicker region for having thickness thicker to substrate；In addition, part is only needed once to thicken the printed circuit board that can be obtained the embodiment of the present application, shortens the thick copper production process in part, improve production efficiency.
Description
Technical field
The present invention relates to the production methods that a kind of local figure copper thickness of printed circuit board thickeies.
Background technology
With the development of electronic product, the design and application of printed circuit board increasingly tend to become privileged, such as some prints
Printed circuit board is because part is needed through high current, therefore table copper copper thickness can be required very thick (general big in graphics field in this section
In 70 μm).
The production method of the thick copper printed circuit board in traditional part is using dry film, exposure, development, the plating part areas Hou Tong
Domain process makes, and " a kind of production method of the thick copper PCB in part, should as disclosed in the Chinese patent application 201510811568.6
Method is after first making whole plate figure, then pastes dry film, exposure, development, the thick copper region in plating part；According to make copper thickness needs,
Repeat the above process ", although the method can realize printed circuit board part, thick copper is made, and comes with some shortcomings：As part adds
Thick copper thickness is too thick to form step with the region that need not be thickeied, and increase with plating number is repeated, step can be higher and higher, does
Film can not be sturdy in step position, can etch away step position layers of copper in etching, therefore the method can not make superelevation thickness copper；In addition,
Due to exposure accuracy, as exposure frequency increases, step will appear deviation situation in both sides up and down, make that copper need not be thickeied
Thick region is thickened.
Invention content
The purpose of the present invention is to provide the production methods that a kind of local figure copper thickness of printed circuit board thickeies, to solve
It is existing in the prior art since dry film is difficult to and is formed by stepped locations at copper thickness thicker region edge and is close to, cause not paste
The technical issues of tight part is etched.
To achieve the above object, the technical solution adopted by the present invention is：A kind of local figure copper of printed circuit board is provided
The production method that thickness thickeies, wherein include the following steps,
Substrate is provided；
Hole as PTH is processed to the substrate；
The first layers of copper is formed on the hole wall in the two sides of the substrate and the hole；
The first dry film is coated on first layers of copper surface on the substrate two sides；
First dry film is sequentially carried out to expose and for the first time develop for the first time, with the shape on first layers of copper surface
Figure is thickeied at default Local Copper thickness；
The default Local Copper thickness on first layers of copper surface thickeies the copper electroplating layer that predetermined thickness is formed on figure；
There is the first subregion being enclosed in except copper electroplating layer, the marginal surface of copper electroplating layer to have second on first layers of copper surface
Subregion；
Remove above-mentioned first dry film；
On first layers of copper surface on the substrate two sides, on the copper electroplating layer surface and the hole wall in the hole
The first layers of copper surface on form the second layers of copper；
To being coated in region corresponding with first subregion and second subregion on second layers of copper surface
Anti-etching printing ink layer；
The second dry film is coated on second layers of copper surface on the substrate two sides；
Second of exposure and second development are sequentially carried out to second dry film, with the shape on second layers of copper surface
At predetermined pattern；
Second layers of copper, first layers of copper are sequentially removed to obtain circuit pattern along the predetermined pattern；
Remove above-mentioned second dry film.
The beneficial effects of the present invention are：Compared with prior art, the present invention realizes the thickening of local figure copper thickness and makes,
Avoid causes dry film to press the unreal situation for causing step position copper to be etched generation when part thickeies because of step position height, to
The Local Copper thickness thicker region that substrate has thickness thicker；In addition, only needing once part to thicken can be obtained the embodiment of the present application
Printed circuit board, shorten the thick copper production process in part, improve production efficiency.
Description of the drawings
Fig. 1 is the flow for the production method that the local figure copper thickness of printed circuit board provided in an embodiment of the present invention thickeies
Figure；
Fig. 2 a be the production method of the embodiment of the present invention supplied materials step in circuit board schematic cross-sectional view；
Fig. 2 b are the drilling of the production method of the embodiment of the present invention and the schematic cross-sectional view of circuit board in counterbore step；
Fig. 2 c be the production method of the embodiment of the present invention first time plate electricity step in circuit board schematic cross-sectional view；
Fig. 2 d are to paste the schematic cross-sectional view of circuit board in dry film step the first time of the production method of the embodiment of the present invention；
Fig. 2 e be the production method of the embodiment of the present invention first time exposed and developed step in circuit board section view signal
Figure；
Fig. 2 f be the production method of the embodiment of the present invention copper electroplating layer step in circuit board schematic cross-sectional view；
Fig. 2 g are to move back the schematic cross-sectional view of circuit board in film step the first time of the production method of the embodiment of the present invention；
Fig. 2 h be the production method of the embodiment of the present invention second of plate electricity step in circuit board schematic cross-sectional view；
Fig. 2 i be the production method of the embodiment of the present invention spray printing anti-etching printing ink step in circuit board schematic cross-sectional view；
Fig. 2 j are second of schematic cross-sectional views for pasting circuit board in dry film step of the production method of the embodiment of the present invention；
Fig. 2 k are that circuit board cuts open in second of the production method of embodiment of the present invention exposure and second development step
Depending on schematic diagram；
Fig. 2 l are the etching steps of the production method of the embodiment of the present invention and move back the section view of circuit board in film step for the second time
Schematic diagram.
Main element symbol description
1：Substrate 1a：Hole
1b predetermined pattern 1c circuit patterns
2：First layers of copper 2a：First subregion
3 first dry film 3a preset Local Copper thickness and thicken figure
4：Copper electroplating layer 4a：Second subregion
5：Second layers of copper
6：Anti-etching printing ink layer
7：Second dry film
S1：Supplied materials step S2：Drilling and counterbore step
S3：First time plate electricity step S4：Patch dry film step for the first time
S5：Exposed and developed step S6 for the first time：Parcel plating step
S7：Move back film step S8 for the first time：Second of plate electricity step
S9：Spray printing anti-etching printing ink step S10：Second of patch dry film step
S11：Second of exposed and developed step S12：Etching step
S13：Film step is moved back for the second time
Specific implementation mode
In order to make technical problems, technical solutions and advantages to be solved be more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that described embodiment is the one of the present invention
Section Example, instead of all the embodiments.Based on described the embodiment of the present invention, those of ordinary skill in the art exist
The every other embodiment obtained under the premise of without creative work, shall fall within the protection scope of the present invention.
In order to make those skilled in the art more fully understand technical scheme of the present invention, with reference to specific attached drawing to this
The realization of invention is described in detail.
Unless otherwise defined, the technical term or scientific term used herein should be in fields of the present invention and has
The ordinary meaning that the personage of general technical ability is understood.Used in present patent application specification and claims " the
One ", " second " and similar word are not offered as any sequence, quantity or importance, and are used only to distinguish different
Component part.Equally, the similar word such as "one" or " one " does not indicate that quantity limits yet, but indicates that there are at least one.
As shown in Figure 1, being a preferred embodiment provided by the invention.
The production method that the local figure copper thickness of printed circuit board provided in this embodiment thickeies, includes the following steps：S1、
The supplied materials step of substrate 1 is provided；S2, drilling and the counterbore step that the hole 1a as PTH is processed to substrate 1；S3, in substrate 1
Two sides and hole 1a hole wall on form the first time plate electricity step of the first layers of copper 2；S4, the first layers of copper 2 on 1 two sides of substrate
The first time patch dry film step of the first dry film 3 is coated on surface；S5, first time exposure and first is sequentially carried out to the first dry film 3
Secondary development, to form the first time exposure and development for the first time that default Local Copper thickness thickeies figure 3a on 2 surface of the first layers of copper
Step；S6, the default Local Copper thickness on 2 surface of the first layers of copper thicken the office for the copper electroplating layer 4 that predetermined thickness is formed on figure 3a
Portion's plating step；First layers of copper, 2 surface has the first subregion 2a being enclosed in except copper electroplating layer 4, the surface of copper electroplating layer 4
Edge has the second subregion 4a；S7, the first time for removing above-mentioned first dry film 3 move back film step；S8, on 1 two sides of substrate
The of the second layers of copper 5 is formed on one layers of copper, 2 surface, on 4 surface of copper electroplating layer and on 2 surface of the first layers of copper of the hole wall of hole 1a
Secondary plate electricity step；S9, to being coated in region corresponding with the first subregion 2a and the second subregion 4a on 5 surface of the second layers of copper
The spray printing anti-etching printing ink step of anti-etching printing ink layer 6；S10, coating second is dry on 5 surface of the second layers of copper on 1 two sides of substrate
Second of patch dry film step of film 7；S11, second of exposure and second development are sequentially carried out to the second dry film 7, with second
Second of exposure and the second development step of predetermined pattern 1b are formed on 5 surface of layers of copper；S12, it is sequentially gone along predetermined pattern 1b
Except the second layers of copper 5, the first layers of copper 2 are to obtain the etching step of circuit pattern 1c；S13, remove above-mentioned second dry film 7 second
Move back film step.
Above-mentioned production method, including first time plate electricity step, first time patch dry film step, for the first time exposed and developed step
Suddenly, copper electroplating layer step, move back film step, second of plate electricity step, second patch dry film step, second of exposure and for the first time
Redevelopment step, moves back film step at etching step for the second time, realizes local figure copper thickness and thickeies making, avoids part and adds
It causes dry film to press the unreal situation for causing step position copper to be etched because of step position height when thick to occur, to which substrate 1 has thickness
The thicker Local Copper thickness thicker region of degree；In addition, part is only needed once to thicken the printed circuit that can be obtained the embodiment of the present application
Plate shortens the thick copper production process in part, improves production efficiency.
The system that the local figure copper thickness of printed circuit board provided by the invention is thickeied below with reference to attached drawing 2a to Fig. 2 l
It is described in detail as method.
Referring to Fig. 2 a, in step sl, substrate 1 is provided, the substrate 1 of the printed circuit board is single layer, doubling plate or more
Laminate, in the present embodiment, before step S1, first pass through circuit board software (such as genesis2000 softwares) produce it is default
Local Copper thickness thickeies figure 3a and stepped area figure.
Referring to Fig. 2 b, in step s 2, substrate 1 is processed as PTH (PLATING Through Hole, metallization
Hole) hole 1a, flow includes：
Drilling, with drilling device, machining function hole 1a, the functional hole 1a processed run through the two sides of substrate 1 on substrate 1
(surface and opposing face)；
Heavy copper, by redox principle on the hole wall of the functional hole 1a of motherboard substrate 1 in chemical deposition or plating
One layer of conductive metal copper becomes PTH to assign electric conductivity.
Referring to Fig. 2 c, in step s3, the first layers of copper 2 is formed on the hole wall of the two sides of substrate 1 and hole 1a, in this reality
Apply in example, using electrodeposition process on the two sides of substrate 1 and on the above-mentioned hole wall as the hole 1a of PTH according to appointed thickness into
The secondary copper facing of row, to form the first layers of copper 2, the thickness of first layers of copper 2 is 4 μm~8 μm, so that thickening is subsequently electroplated.
Referring to Fig. 2 d, in step s 4, the first dry film 3 is coated on 2 surface of the first layers of copper on 1 two sides of substrate, refer to
On 2 surface of the first layers of copper in addition to 2 surface of the first layers of copper formed on upper hole wall, whole face coats the first dry film 3, in this implementation
In example, the two sides and being able to for dry film crimping being applied to according to the pressure of setting using laminator substrate 1 is tightly attached to the of substrate 1
On one layers of copper, 2 surface.It is noted that spaced, the width at interval between the edge and the edge of substrate 1 of the first dry film 3
Degree is 8mm~12mm, preferably 10mm, that is, is reserved with not pad pasting region at the both side surface edge of substrate 1, as local electricity
Splint position when plating.
Referring to Fig. 2 e, in step s 5, the first dry film 3 is sequentially carried out to expose and for the first time develop for the first time, with the
It is formed on one layers of copper, 2 surface and presets Local Copper thickness thickening figure 3a, flow includes：
It exposes for the first time, is to be exposed to the substrate 1 for being coated with the first dry film 3 using ultraviolet light (UV light), is not needed with allowing
The film position light stiffening in the region of the thick copper of plating；
Develop for the first time, the substrate 1 after exposure is immersed into developer solution, unhardened film position is removed using developer solution, from
And etching region (the i.e. above-mentioned default Local Copper thickness thickening figure for being removed the first dry film 3 is obtained on 2 surface of the first layers of copper
It is not removed 3a) and the non-etched area of the first dry film 3.
Referring to Fig. 2 f, in step s 6, the default Local Copper thickness on 2 surface of the first layers of copper, which thickeies to be formed on figure 3a, to be made a reservation for
The copper electroplating layer 4 of thickness thickeies figure 3a using electrodeposition process according to predetermined thickness to default Local Copper thickness in the present embodiment
Copper facing thickening is carried out, to form the copper electroplating layer 4 locally thickeied, the thickness of the copper electroplating layer 4 is more than the thickness of the first layers of copper 2,
The thickness of copper electroplating layer 4 is 35 μm~105 μm.It is noted that 2 surface of the first layers of copper have be enclosed in copper electroplating layer 4 it
The marginal surface of the first outer subregion 2a, copper electroplating layer 4 have the second subregion 4a；The first subregion 2a and the second sub-district
Domain 4a is connected along the projection of 1 thickness direction of substrate on substrate 1, and constitutes above-mentioned stepped area figure.
Specifically, it is 1mm~3mm, preferably 2mm in width of the first subregion 2a on 4 surface of copper electroplating layer；Second son
Width of the region 4a on 2 surface of the first layers of copper is 1mm~3mm, preferably 2mm.
Referring to Fig. 2 g, in the step s 7, above-mentioned first dry film 3 is removed, can be used and move back film liquid by the first dry film on substrate 1
3 removals, it is conventional sodium hydroxide solution that this step, which moves back film liquid, and speed is normally to move back 3~5m/min of film speed.
Referring to Fig. 2 h, in step s 8, on 2 surface of the first layers of copper on 1 two sides of substrate, on 4 surface of copper electroplating layer and
The second layers of copper 5 is formed on 2 surface of the first layers of copper of the hole wall of hole 1a, in the present embodiment, in order to reduce the step gradient, convenient for the
Secondary patch dry film, to above-mentioned 1 surface of substrate for moving back film, using electrodeposition process on two sides (2 surface of the first layers of copper of substrate 1
On upper and 4 surface of copper electroplating layer) on and above-mentioned hole wall (on 2 surface of the first layers of copper) on plated again according to appointed thickness
Copper, to form the second layers of copper 5 that thickness is more than the first layers of copper 2, it is 10 μm~20 μm that the thickness of second layers of copper 5, which is thickness,.
Referring to Fig. 2 i, in step s 9, to corresponding with the first subregion 2a and the second subregion 4a on 5 surface of the second layers of copper
Region in coating anti-etching printing ink layer 6, in the present embodiment, on the through-thickness on 5 surface of the second layers of copper with the first sub-district
Domain 2a and the corresponding positions the second subregion 4a (i.e. stepped area figure), form anti-etching oil by ink-jet printer spray printing
Layer of ink 6, anti-etching printing ink layer 6 is UV curable ink-jet inks can be lost such as the cured acrylic acid mixed inks of UV with acid resistance
It carves.It should be noted that anti-etching printing ink layer 6 cover on the second layers of copper 5 surface region corresponding with the first subregion 2a and with
The corresponding regions second subregion 4a and the second layers of copper 5 region corresponding with 4 side wall of copper electroplating layer, thus by copper electroplating layer 4
It is wrapped within anti-etching printing ink layer 6 in substantially formed step edge, in this way, anti-etching printing ink layer 6 is formed by spray printing,
Because of step height when avoiding second of patch dry film, the second dry film 7 presses unreal and in etching at step layers of copper to be etched, to protect
Protect layers of copper at circuit step.
Referring to Fig. 2 j, in step 10, the second dry film 7 is coated on 5 surface of the second layers of copper on 1 two sides of substrate, second is dry
Film 7 covers the second layers of copper 5 of anti-etching printing ink layer 6 and basic covering, in the present embodiment, using laminator according to the pressure of setting
Dry film crimping is applied to the two sides of substrate 1 and is able to be tightly attached to 5 surface of the second layers of copper of substrate 1 and anti-etching printing ink layer 6 by power
Surface.It is noted that spaced between the edge and the edge of substrate 1 of the second dry film 7, the width at interval be 8mm~
12mm, preferably 10mm, that is, it is reserved with not pad pasting region at the both side surface edge of substrate 1, clamping plate when as parcel plating
Position
Referring to Fig. 2 k, in a step 11, second is sequentially carried out to the second dry film 7 and is exposed and second development, with the
Predetermined pattern 1b is formed on two layers of copper, 5 surface, flow includes：
Second of exposure is to be exposed to the substrate 1 for being coated with the second dry film 7 using ultraviolet light (UV light), is not needed with allowing
The film position light stiffening in the region of the thick copper of plating；
Second development, immerses developer solution by the substrate 1 after exposure, and unhardened film position is removed using developer solution, from
And the etching region (i.e. above-mentioned predetermined pattern 1b) for being removed the second dry film 7 is obtained on 5 surface of the second layers of copper and is not removed
The non-etched area of second dry film 7.
Referring to Fig. 2 l, in step 12, by etching solution chemistry sting erosion in the way of, sequentially remove second along predetermined pattern 1b
Layers of copper 5, the first layers of copper 2 to obtain circuit pattern 1c, non-etched area by the second dry film 7 and anti-etching printing ink floor 6 protection not by
Etching.
With continued reference to Fig. 2 l, in step s 13, above-mentioned second dry film 7 is removed, can be used and move back film liquid by the on substrate 1
Two dry films 7 remove, in the present embodiment, move back film liquid be it is organic move back film liquid, main ingredient is ethanol amine, and organic film is moved back using this
Liquid, film speed are that common dry film moves back the 1/4~1/3 of film speed.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modification, equivalent replacement or improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (10)
1. the production method that a kind of local figure copper thickness of printed circuit board thickeies, which is characterized in that include the following steps,
Substrate is provided；
Hole as PTH is processed to the substrate；
The first layers of copper is formed on the hole wall in the two sides of the substrate and the hole；
The first dry film is coated on first layers of copper surface on the substrate two sides；
First dry film is sequentially carried out to expose and for the first time develop for the first time, it is pre- to be formed on first layers of copper surface
If Local Copper thickness thickeies figure；
The default Local Copper thickness on first layers of copper surface thickeies the copper electroplating layer that predetermined thickness is formed on figure；It is described
There is the first subregion being enclosed in except copper electroplating layer, the marginal surface of copper electroplating layer to have the second sub-district on the first layers of copper surface
Domain；
Remove above-mentioned first dry film；
On first layers of copper surface on the substrate two sides, on the copper electroplating layer surface and the hole wall in the hole
The second layers of copper is formed on one layers of copper surface；
It is against corrosion to being coated in region corresponding with first subregion and second subregion on second layers of copper surface
Carve ink layer；
The second dry film is coated on second layers of copper surface on the substrate two sides；
Second of exposure and second development are sequentially carried out to second dry film, it is pre- to be formed on second layers of copper surface
Determine pattern；
Second layers of copper, first layers of copper are sequentially removed to obtain circuit pattern along the predetermined pattern；
Remove above-mentioned second dry film.
2. manufacturing method according to claim 1, which is characterized in that the first step region is on copper electroplating layer surface
Width is 1mm~3mm；Width of second subregion on the first layers of copper surface is 1mm~3mm.
3. manufacturing method according to claim 1, which is characterized in that the anti-etching printing ink layer is sprayed by ink-jet printer
Print.
4. manufacturing method according to claim 1, the anti-etching printing ink layer is that UV curable ink-jet inks are formed.
5. manufacturing method according to claim 1, which is characterized in that first layers of copper on the substrate two sides
It is spaced between the edge and the edge of the substrate of first dry film in the step of coating the first dry film on surface.
6. production method according to claim 5, which is characterized in that the width at the interval is 8mm~12mm.
7. manufacturing method according to claim 1, which is characterized in that the thickness of second layers of copper is more than first bronze medal
The thickness of layer.
8. manufacturing method according to claim 1, which is characterized in that the thickness of first layers of copper is 4 μm~8 μm, institute
The thickness for stating the second layers of copper is 10 μm~20 μm.
9. manufacturing method according to claim 1, which is characterized in that the thickness of the copper electroplating layer is 35 μm~105 μm.
10. manufacturing method according to claim 1, which is characterized in that in the step of the removal above-mentioned second dry film, adopt
The second dry film is removed with organic film liquid of moving back.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810410460.XA CN108617104B (en) | 2018-05-02 | 2018-05-02 | Method for manufacturing printed circuit board with thickened copper local pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810410460.XA CN108617104B (en) | 2018-05-02 | 2018-05-02 | Method for manufacturing printed circuit board with thickened copper local pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108617104A true CN108617104A (en) | 2018-10-02 |
| CN108617104B CN108617104B (en) | 2020-09-04 |
Family
ID=63661422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810410460.XA Active CN108617104B (en) | 2018-05-02 | 2018-05-02 | Method for manufacturing printed circuit board with thickened copper local pattern |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108617104B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996540A (en) * | 2019-12-31 | 2020-04-10 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN112423478A (en) * | 2020-10-30 | 2021-02-26 | 常州安泰诺特种印制板有限公司 | Manufacturing method of PCB screen printing type hole plugging air guide plate |
| CN113141726A (en) * | 2021-03-17 | 2021-07-20 | 东莞联桥电子有限公司 | Manufacturing method of circuit board with locally thickened plating layer |
| CN113473738A (en) * | 2021-07-02 | 2021-10-01 | 深圳市新宇腾跃电子有限公司 | Local copper plating method for FPC (flexible printed circuit) with power line |
| CN114080108A (en) * | 2020-08-18 | 2022-02-22 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN114501801A (en) * | 2020-10-28 | 2022-05-13 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN114615811A (en) * | 2020-12-07 | 2022-06-10 | 深南电路股份有限公司 | High-precision circuit processing method and high-precision circuit board |
| WO2022126451A1 (en) * | 2020-12-16 | 2022-06-23 | 深南电路股份有限公司 | Localized thick copper structure processing method, localized thick copper circuit board, and processing method |
| CN115103522A (en) * | 2022-02-22 | 2022-09-23 | 深圳市八达通电路科技有限公司 | Composite copper thick substrate and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06181381A (en) * | 1992-12-11 | 1994-06-28 | Nec Corp | Forming method of solder film |
| CN102651946A (en) * | 2012-04-05 | 2012-08-29 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
| CN203407095U (en) * | 2013-08-07 | 2014-01-22 | 东莞森玛仕格里菲电路有限公司 | Etching tool for PCB with copper thickness difference |
| CN107124830A (en) * | 2017-07-07 | 2017-09-01 | 台山市精诚达电路有限公司 | A kind of preparation method of FPC soft boards circuit |
-
2018
- 2018-05-02 CN CN201810410460.XA patent/CN108617104B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06181381A (en) * | 1992-12-11 | 1994-06-28 | Nec Corp | Forming method of solder film |
| CN102651946A (en) * | 2012-04-05 | 2012-08-29 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
| CN203407095U (en) * | 2013-08-07 | 2014-01-22 | 东莞森玛仕格里菲电路有限公司 | Etching tool for PCB with copper thickness difference |
| CN107124830A (en) * | 2017-07-07 | 2017-09-01 | 台山市精诚达电路有限公司 | A kind of preparation method of FPC soft boards circuit |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996540A (en) * | 2019-12-31 | 2020-04-10 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN114080108A (en) * | 2020-08-18 | 2022-02-22 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN114501801A (en) * | 2020-10-28 | 2022-05-13 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN112423478A (en) * | 2020-10-30 | 2021-02-26 | 常州安泰诺特种印制板有限公司 | Manufacturing method of PCB screen printing type hole plugging air guide plate |
| CN112423478B (en) * | 2020-10-30 | 2023-09-15 | 常州安泰诺特种印制板有限公司 | Manufacturing method of PCB mesh type plug hole air guide plate |
| CN114615811A (en) * | 2020-12-07 | 2022-06-10 | 深南电路股份有限公司 | High-precision circuit processing method and high-precision circuit board |
| WO2022126451A1 (en) * | 2020-12-16 | 2022-06-23 | 深南电路股份有限公司 | Localized thick copper structure processing method, localized thick copper circuit board, and processing method |
| CN113141726A (en) * | 2021-03-17 | 2021-07-20 | 东莞联桥电子有限公司 | Manufacturing method of circuit board with locally thickened plating layer |
| CN113141726B (en) * | 2021-03-17 | 2022-06-17 | 东莞联桥电子有限公司 | Manufacturing method of circuit board with locally thickened plating layer |
| CN113473738A (en) * | 2021-07-02 | 2021-10-01 | 深圳市新宇腾跃电子有限公司 | Local copper plating method for FPC (flexible printed circuit) with power line |
| CN115103522A (en) * | 2022-02-22 | 2022-09-23 | 深圳市八达通电路科技有限公司 | Composite copper thick substrate and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108617104B (en) | 2020-09-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108617104A (en) | The production method that the local figure copper thickness of printed circuit board thickeies | |
| CN104411106B (en) | A kind of preparation method of printed circuit board fine-line | |
| KR100834515B1 (en) | Method for forming photoresist-laminated substrate, method for plating insulating substrate, method for surface treating metal layer of circuit board, and method for manufacturing multi layer ceramic condenser using metal nanoparticles aerosol | |
| KR100427794B1 (en) | Method of manufacturing multilayer wiring board | |
| CN107567196B (en) | Method for manufacturing top nickel-palladium-gold and bottom hard gold plate | |
| TW201640965A (en) | Manufacturing method of flexible printed wiring board | |
| CN104427776B (en) | The manufacture method of negative and positive copper thickness printed wiring board | |
| CN104812171A (en) | Printed circuit board and processing method thereof | |
| CN104918414A (en) | Template electroplating peeling technology for conductive circuit | |
| CN104080275A (en) | Method for manufacturing stepped circuit board | |
| CN114222434B (en) | Manufacturing method of ladder circuit and circuit board | |
| CN107105577A (en) | It is a kind of to prepare two-sided and multilayer printed circuit template shifting process | |
| CN108834323A (en) | A kind of production method of fine ladder route | |
| CN105704948A (en) | Manufacturing method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN113056116A (en) | Method for plating hole copper and processing method of circuit board | |
| KR830008634A (en) | Manufacturing method of thick film fine pattern conductor | |
| CN110519934A (en) | A kind of method of the thick gold of circuit board electroplating | |
| CN104684265A (en) | Method for electroplating surface of circuit board | |
| CN105430925A (en) | Fabrication method of thick copper circuit board | |
| CN102523694A (en) | Method for avoiding substrate exposure during pattern transfer of step circuit boards | |
| CN101489355A (en) | Circuit board manufacturing method without tin plating, tin retreating and capable of saving copper and nickle | |
| CN108430171A (en) | The method that semi-additive process makes making hole conductive layer during printed circuit board | |
| CN107645842B (en) | Circuit embedded type single-sided flexible circuit board and preparation method thereof | |
| KR100735659B1 (en) | Micro circuit pattern formation technique by offset printing, and the related female type master plate production method | |
| TWI428977B (en) | Halftone with pattern and method for froming pattern on workpiece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Mei Mei Kong Inventor after: Fu Fengqi Inventor after: Lu Yuting Inventor after: Wang Jun Inventor before: Fu Fengqi Inventor before: Lu Yuting Inventor before: Wang Jun Inventor before: Mei Mei Kong |
|
| CB03 | Change of inventor or designer information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |