CN203407095U - Etching tool for PCB with copper thickness difference - Google Patents
Etching tool for PCB with copper thickness difference Download PDFInfo
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- CN203407095U CN203407095U CN201320478750.0U CN201320478750U CN203407095U CN 203407095 U CN203407095 U CN 203407095U CN 201320478750 U CN201320478750 U CN 201320478750U CN 203407095 U CN203407095 U CN 203407095U
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Abstract
The utility model relates to the field of PCB technology, and specially relates to an etching tool for a PCB with copper thickness difference. The etching tool comprises a thin copper area, a thick copper area with the upper end surface higher than the thin copper area, and a dry film tightly covering the upper end surfaces of the thin copper area and the thick copper area. The thick copper area is connected with the thin copper area to form a step; the external surface of the step is covered with a solder resist ink layer; the dry film positioned on the step forms a transition film region; and the transition film region is tightly attached to the external surface of the solder resist ink layer. According to the etching tool, employing the fluidity of solder resist ink, the step and the corner thereof are covered, the transition film region of the dry film is tightly attached to the solder resist ink layer, no gap exists, the area with height difference is protected from liquid medicine corrosion, and the product quality is guaranteed.
Description
technical field:
The utility model relates to PCB technical field, relates in particular to the thick PCB etch tool of a kind of difference of height copper structure.
background technology:
PCB(Printed Circuit Board, printed circuit board (PCB)) be important electronic unit, be the supporter of electronic devices and components, be the supplier of electronic devices and components electrical connection.At present, along with the fast development of PCB industry, its application is also more and more extensive.Electronic equipment is little arrives greatly computer, communication electronic device, military armament systems to electronic watch, calculator, general-purpose computer, as long as there are the electronic devices and components such as integrated circuit, the electric interconnection between them all will be used PCB.
In the manufacture craft of pcb board, often all need pcb board to carry out the processing such as etching and pressing.During PCB makes at present, after the etching of most PCB product, directly paste dry film and can complete etch process, also there are some products can relate to the situation that same etching face exists the thick difference of copper, such as the theoretical minimum difference of the copper thickness of the same etching face of some product requirement surpasses 40 μ m, difference of height region forms step, by the method for normal subsides dry film, make, dry film cannot complete height difference and surpass fitting tightly of 40 μ m, can there is space, the position of difference of height there will be bubble, cannot paste jail, while causing etching, liquid medicine can infiltrate, leave etching mark, ratio of defects reaches 100%, there is very big quality hidden danger in product like this, scrap PCB and cause the very big loss of cost, delayed production time progress simultaneously.
utility model content:
The purpose of this utility model is exactly to provide a kind of thick PCB etch tool of difference of height copper structure of protecting difference of height region can not infiltrate etching solution, assurance product quality for the deficiency of prior art existence.
To achieve these goals, the technical solution adopted in the utility model is:
The thick PCB etch tool of difference of height copper structure, include thin copper region, upper surface higher than the thick copper region in thin copper region, fit tightly the dry film that covers upper surface, Ji Houtong region, thin copper region, thick copper region and thin copper joint area form step, the outer surface of step is coated with welding resistance ink layer, the position that dry film is positioned at step forms transition film district, and transition film district fits tightly on the outer surface of welding resistance ink layer.
The outer surface of described welding resistance ink layer is smooth curved surface shape structure.
Position corresponding with corner under step on described welding resistance ink layer outer surface forms arc structure.
Position corresponding with corner on step on described welding resistance ink layer outer surface forms outer arcuate structure.
The upper surface in described thick copper region is higher than the upper surface at least 40 μ m in thin copper region.
The utility model beneficial effect is: the utility model includes thin copper region, upper surface is higher than the thick copper region in thin copper region, fit tightly the dry film that covers upper surface, Ji Houtong region, thin copper region, thick copper region and thin copper joint area form step, the outer surface of step is coated with welding resistance ink layer, the position that dry film is positioned at step forms transition film district, transition film district fits tightly on the outer surface of welding resistance ink layer, the utility model utilizes the fluid state of welding resistance ink by step and edge coverage thereof, the transition film district of dry film can be fitted tightly on welding resistance ink layer, can there is not space, prevent that etching solution from infiltrating, the not etched liquid medicine corrosion in protection difference of height region, guarantee product quality.
accompanying drawing explanation:
Fig. 1 is structural representation of the present utility model.
embodiment:
Below in conjunction with accompanying drawing, the utility model is further described, as shown in Figure 1, the thick PCB etch tool of difference of height copper structure, it include thin copper region 1, upper surface higher than the thick copper region 2 in thin copper region 1, fit tightly the dry film 3 that covers thin copper region 1 and 2 upper surfaces, thick copper region, the upper surface in thick copper region 2 is higher than the upper surface at least 40 μ m in thin copper region 1.Thick copper region 2 is connected to form step 4 with thin copper region 1, and the outer surface of step 4 is coated with welding resistance ink layer 5, and the formation transition film district 31， transition film district 31, position that dry film 3 is positioned at step 4 fits tightly on the outer surface of welding resistance ink layer 5.
The outer surface of welding resistance ink layer 5 is smooth curved surface shape structure, and the transition film district 31 of dry film 3 can be fitted tightly on the outer surface of welding resistance ink layer 5 better.Position corresponding with 4 times corners of step on welding resistance ink layer 5 outer surfaces forms arc structure, and position corresponding with corner on step 4 on welding resistance ink layer 5 outer surfaces forms outer arcuate structure, makes between transition film district 31 and welding resistance ink layer 5 in conjunction with tightr.
Manufacturing process of the present utility model is as follows: 1) before dry film 3 etchings, increase and print welding resistance flow process, whole plate is printed welding resistance ink, and preliminary drying; 2) be chosen in the exposure of the thick difference of height of copper junction, retain welding resistance ink protection difference of height region; 3) normal welding resistance is developed, and removes unnecessary welding resistance ink, does not do rear baking; 4) crossing dry film 3 pre-treatment pickling, normally paste dry film 3, do Etching; 5) low velocity takes off the film welding resistance ink that fades away, follow-up normal production.
The utility model utilizes the fluid state of welding resistance ink by step 4 and edge coverage thereof; the transition film district 31 of dry film 3 can be fitted tightly on welding resistance ink layer 5, can not have space, prevent that etching solution from infiltrating; the not etched liquid medicine corrosion in protection difference of height region, guarantees product quality.
Certainly, the above is only preferred embodiment of the present utility model, and the equivalence of doing according to structure, feature and principle described in the utility model patent claim therefore all changes or modifies, and is included in the utility model patent claim.
Claims (5)
1. the thick PCB etch tool of difference of height copper structure, include thin copper region (1), upper surface is higher than the thick copper region (2) in thin copper region (1), fit tightly the dry film (3) that covers thin copper region (1) and upper surface, thick copper region (2), thick copper region (2) is connected to form step (4) with thin copper region (1), it is characterized in that: the outer surface of described step (4) is coated with welding resistance ink layer (5), the position that dry film (3) is positioned at step (4) forms transition film district (31), transition film district (31) fits tightly on the outer surface of welding resistance ink layer (5).
2. the thick PCB etch tool of difference of height copper according to claim 1 structure, is characterized in that: the outer surface of described welding resistance ink layer (5) is smooth curved surface shape structure.
3. the thick PCB etch tool of difference of height copper according to claim 1 structure, is characterized in that: position corresponding with the lower corner of step (4) on described welding resistance ink layer (5) outer surface forms arc structure.
4. the thick PCB etch tool of difference of height copper according to claim 1 structure, is characterized in that: position corresponding with the upper corner of step (4) on described welding resistance ink layer (5) outer surface forms outer arcuate structure.
5. according to the thick PCB etch tool of the difference of height copper structure described in claim 1 ~ 4 any one, it is characterized in that: the upper surface in described thick copper region (2) is higher than the upper surface at least 40 μ m in thin copper region (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320478750.0U CN203407095U (en) | 2013-08-07 | 2013-08-07 | Etching tool for PCB with copper thickness difference |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320478750.0U CN203407095U (en) | 2013-08-07 | 2013-08-07 | Etching tool for PCB with copper thickness difference |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203407095U true CN203407095U (en) | 2014-01-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320478750.0U Expired - Fee Related CN203407095U (en) | 2013-08-07 | 2013-08-07 | Etching tool for PCB with copper thickness difference |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203407095U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617104A (en) * | 2018-05-02 | 2018-10-02 | 深圳市景旺电子股份有限公司 | The production method that the local figure copper thickness of printed circuit board thickeies |
| CN109661112A (en) * | 2017-10-12 | 2019-04-19 | 伟裕(厦门)电子有限公司 | A kind of hollow-out flexible wiring board and preparation method thereof of single layer copper multi-thickness structure |
| CN110505749A (en) * | 2019-08-01 | 2019-11-26 | 隽美经纬电路有限公司 | A kind of improvement band Air-gap FPC open circuit undesirable structure of notch |
| CN112312639A (en) * | 2019-07-25 | 2021-02-02 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN114080108A (en) * | 2020-08-18 | 2022-02-22 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN115103522A (en) * | 2022-02-22 | 2022-09-23 | 深圳市八达通电路科技有限公司 | Composite copper thick substrate and manufacturing method thereof |
-
2013
- 2013-08-07 CN CN201320478750.0U patent/CN203407095U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109661112A (en) * | 2017-10-12 | 2019-04-19 | 伟裕(厦门)电子有限公司 | A kind of hollow-out flexible wiring board and preparation method thereof of single layer copper multi-thickness structure |
| CN109661112B (en) * | 2017-10-12 | 2020-08-04 | 伟裕(厦门)电子有限公司 | Hollow flexible circuit board with single-layer copper and multiple-thickness structure and manufacturing method thereof |
| CN108617104A (en) * | 2018-05-02 | 2018-10-02 | 深圳市景旺电子股份有限公司 | The production method that the local figure copper thickness of printed circuit board thickeies |
| CN112312639A (en) * | 2019-07-25 | 2021-02-02 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN110505749A (en) * | 2019-08-01 | 2019-11-26 | 隽美经纬电路有限公司 | A kind of improvement band Air-gap FPC open circuit undesirable structure of notch |
| CN110505749B (en) * | 2019-08-01 | 2021-07-27 | 隽美经纬电路有限公司 | Structure for improving poor open circuit gap of FPC with Air-gap |
| CN114080108A (en) * | 2020-08-18 | 2022-02-22 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN115103522A (en) * | 2022-02-22 | 2022-09-23 | 深圳市八达通电路科技有限公司 | Composite copper thick substrate and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140122 Termination date: 20150807 |
|
| EXPY | Termination of patent right or utility model |