CN203608449U - A printed circuit board repairing copper foil - Google Patents
A printed circuit board repairing copper foil Download PDFInfo
- Publication number
- CN203608449U CN203608449U CN201320665216.0U CN201320665216U CN203608449U CN 203608449 U CN203608449 U CN 203608449U CN 201320665216 U CN201320665216 U CN 201320665216U CN 203608449 U CN203608449 U CN 203608449U
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- CN
- China
- Prior art keywords
- copper foil
- printed circuit
- circuit board
- repairing
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The utility model belongs to the field of circuit board welding, and more specifically relates to a printed circuit board repairing copper foil. The printed circuit board repairing copper foil comprises a copper foil. The copper foil is a copper sheet which is as thick as 0.2 millimeters. The width of the copper foil is nearly the same with the width of a to-be-repaired printed circuit board conductive wire, and the length of the copper foil is arbitrary. The printed circuit board repairing copper foil can be curled to be disc-shaped. Nicks are arranged in the surface of the copper foil. Complexing agent layers are sprayed on the upper and the lower surfaces of the copper foil. The repairing copper foil of the technical scheme of the utility model will be used for repairing and restoring defects such as cracks and reserved test points of printed circuit boards; the operation is rapid; the printed circuit board components welding time is saved; phenomenon that soldering tin connection on fault locations are difficult, and accordingly shedding and upwarp of copper foils on the fault locations due to multi-times of hot welding are overcome; therefore, the normal working of a circuit is guaranteed; the reliability is raised; the usage life of the circuit is prolonged; the printed circuit boards with small flaws can be restored; and the disability rate of the printed circuit boards is reduced.
Description
Technical field
The utility model belongs to circuit welding Copper Foil, relates in particular a kind of Copper Foil that can carry out to printed circuit board defect repair.
Background technology
Along with scientific and technological development, electronic devices and components and products thereof development is more rapid, and printed circuit board is the primary device of electronic devices and components development, the major advantage of printed circuit board has: 1, have repeatability and consistency with figure, reduce the mistake of wiring and assembling, saved maintenance, debugging and the review time of equipment; 2, can standardization in design, be beneficial to exchange; 3, wiring density is high, and volume is little, lightweight, is beneficial to the miniaturization of electronic equipment; 4, be beneficial to mechanization, automated production, improved labor productivity and reduced the cost of electronic equipment.Particularly important to the test of printed circuit board like this, on printed circuit board, be reserved with test point, these test points just there will be the phenomenon of bad connection in the welding process of printed circuit board and its components and parts, have a strong impact on smoothness and the normal work of circuit.
Utility model content
The technical problems to be solved in the utility model is to provide the Copper Foil that a kind of repairing that can freely not locate for printed circuit board defect and being connected is repaired.
For solving the problems of the technologies described above, the utility model provides a kind of printed circuit board to repair Copper Foil, comprises Copper Foil, and described Copper Foil is that thickness is the copper sheet of 0.2 millimeter, and described copper foil surface is provided with indentation, and Copper Foil upper and lower surface is all coated with complexing agent layer.
Preferably, described indentation is a determining deviation and is set in parallel in copper foil surface.
Preferably, the spacing between described indentation is 1～2 millimeter.
Described Copper Foil width and printed circuit board conducting wire width to be repaired adapts, and the length of Copper Foil is unrestricted, can need to wait according to packing to be curled into plate-like.
Adopt the beneficial effect of technique scheme to be: to adopt a kind of printed circuit board of technical solutions of the utility model to repair Copper Foil, it is 0.2 millimeter of Copper Foil that Copper Foil is made to thickness, repairing for test point weld on printed circuit board connects, or repair for the connection that occurs crack place on printed circuit board, can also be used for the circuit connecting welding of multilayer printed circuit board, the little printed circuit board as the music integrated circuit HY-100 that superposes again on main printed circuit board; Indentation is set on copper foil surface, be convenient to Copper Foil in use length and width as required cut off and fracture, operation fast, is saved printed circuit board component weld time; Adopt Copper Foil of the present utility model effectively to prevent that scolding tin is difficult to connect at fault location, so that repeatedly scald weldering, cause the come off phenomenon of perk of fault location Copper Foil, thereby guarantee the normal work of circuit, improve reliability, extend the useful life of circuit; This Copper Foil can also be repaired those printed circuit boards slightly defective, reduces the scrappage of printed circuit board.
Accompanying drawing explanation
Fig. 1 is the front view that a kind of printed circuit board of the utility model is repaired Copper Foil,
Fig. 2 is the side sectional view that a kind of printed circuit board of the utility model is repaired Copper Foil,
Wherein, 1, Copper Foil, 2, indentation, 3, complexing agent layer, 4, Copper Foil width.
Embodiment
Below in conjunction with Figure of description, the technical solution of the utility model and structure are described, so that those skilled in the art understand.
As shown in Figure 1, a kind of printed circuit board is repaired Copper Foil, comprises Copper Foil 1, and described Copper Foil 1 is that thickness is the copper sheet of 0.2 millimeter, and described Copper Foil 1 surface is provided with indentation 2, and Copper Foil 1 upper and lower surface is all coated with complexing agent layer 3, width 4.
Described indentation 2 is a determining deviation and is set in parallel in Copper Foil 1 surface.
The spacing that described indentation is 2 is 1～2 millimeter.
Described Copper Foil width 4 adapts with printed circuit board conducting wire width.
Above-mentionedly by reference to the accompanying drawings utility model is exemplarily described; obviously the utility model specific implementation is not subject to the restrictions described above; as long as this non-essential improvement that has adopted method design of the present utility model and technical scheme to carry out; or without improving, the design of utility model and technical scheme are directly applied to other occasions, all within protection range of the present utility model.
Claims (4)
1. printed circuit board is repaired a Copper Foil, comprises Copper Foil, it is characterized in that: described Copper Foil is that thickness is the copper sheet of 0.2 millimeter, and described copper foil surface is provided with indentation, and Copper Foil upper and lower surface is all coated with complexing agent layer.
2. a kind of printed circuit board according to claim 1 is repaired Copper Foil, it is characterized in that: described indentation is a determining deviation and is set in parallel in copper foil surface.
3. a kind of printed circuit board according to claim 2 is repaired Copper Foil, it is characterized in that: the spacing between described indentation is 1～2 millimeter.
4. a kind of printed circuit board according to claim 1 is repaired Copper Foil, it is characterized in that: described Copper Foil width and printed circuit board conducting wire width adapt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320665216.0U CN203608449U (en) | 2013-10-23 | 2013-10-23 | A printed circuit board repairing copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320665216.0U CN203608449U (en) | 2013-10-23 | 2013-10-23 | A printed circuit board repairing copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203608449U true CN203608449U (en) | 2014-05-21 |
Family
ID=50721102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320665216.0U Expired - Fee Related CN203608449U (en) | 2013-10-23 | 2013-10-23 | A printed circuit board repairing copper foil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203608449U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598209A (en) * | 2017-12-29 | 2018-09-28 | 南京日托光伏科技股份有限公司 | Restorative procedure after a kind of conductive core plate breakage of MWT photovoltaic solars component |
| CN109302793A (en) * | 2017-07-25 | 2019-02-01 | 双鸿电子(惠州)有限公司 | A kind of PCB mark mending method |
-
2013
- 2013-10-23 CN CN201320665216.0U patent/CN203608449U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109302793A (en) * | 2017-07-25 | 2019-02-01 | 双鸿电子(惠州)有限公司 | A kind of PCB mark mending method |
| CN108598209A (en) * | 2017-12-29 | 2018-09-28 | 南京日托光伏科技股份有限公司 | Restorative procedure after a kind of conductive core plate breakage of MWT photovoltaic solars component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140521 Termination date: 20141023 |
|
| EXPY | Termination of patent right or utility model |