CN203875442U - Intelligent wave solder - Google Patents
Intelligent wave solder Download PDFInfo
- Publication number
- CN203875442U CN203875442U CN201420090627.6U CN201420090627U CN203875442U CN 203875442 U CN203875442 U CN 203875442U CN 201420090627 U CN201420090627 U CN 201420090627U CN 203875442 U CN203875442 U CN 203875442U
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- China
- Prior art keywords
- supporting plate
- soldering
- wave
- preheating device
- control system
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- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
An intelligent wave solder comprises a visual system, a control system and an alarm system, wherein the control system comprises a guide rail, a soldering flux assembly, a preheating device, supporting plates and a cooling device, which are sequentially connected, and the preheating device is an infrared heating pipe. The supporting plates comprise upper and lower supporting plates vertically superposed on one another, a window for placing a circuit board is arranged in the upper supporting plate, and a through hole for inserting component pins is arranged in the lower supporting plate under the window. Compared with the prior art, the intelligent wave solder is simple in structure and reasonable in design, and has visual and alarm systems to reduce loss during operation of the wave solder and improve work efficiency.
Description
Technical field
The utility model relates to electronic welding equipment, specially refers to a kind of wave-soldering.
Background technology
Along with the low-carbon economy arrival in period, power-saving technology has been seen through industrial every field, crest welder refers to the solder wave through electrodynamic pump or the designing requirement of electromagnetic pump jet flow by the solder of fusing, same by forming to solder pot nitrogen injection, make the printed board that components and parts are housed in advance by solder wave, realize machinery and the solder being electrically connected between components and parts welding end or pin and printed board pad.Placing components, in the time of wave-soldering, need to be looked into dress in the circuit board by placing components, for preventing that the non-welding position of wiring board is not stained with scolder, conventionally adopt can not tin sticky at wiring board position post with high temperature gummed tape, tearing off completing after wave-soldering.Waste time and energy like this and after high temperature gummed tape tears off, flow down in the circuit board the residue of high temperature gummed tape, whole wiring board final mass is exerted an influence.Weld simultaneously in PCB process energy-conservation, save the problem that consumptive material Ye Shige producer will solve.Traditional crest welder, no matter PCB width is how many, and preheating needs how many electric energy, and the scolder that wave soldering needs is all many.
Utility model content
The purpose of this utility model is the technical problem existing for existing technology, can a kind of intelligent wave-soldering and provide.
The technical solution of the utility model: a kind of intelligent wave-soldering, described wave-soldering comprises vision system, control system, warning system, described control system comprises: guide rail, scaling powder assembly, preheating device, supporting plate, cooling device, and described guide rail, scaling powder assembly, preheating device, supporting plate are connected successively with cooling device; Described preheating device is infrared heating pipe.
Described supporting plate comprises upper and lower two blocks of supporting plates, and supporting plate is formed by stacking up and down, and described mounting plate has one for placing the window of wiring board, and the bottom plate of described beneath window has the through hole for placing components pin is installed.
Described supporting plate adopts epoxy resin to make.
Compared with prior art: the utility model is simple in structure, reasonable in design, more with vision and warning system, wave-soldering is reduced the loss in running, increase work efficiency.
Brief description of the drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the structural representation of control system;
Fig. 3 is workflow diagram of the present utility model.
In figure, the 1st, vision system, the 2nd, control system, the 3rd, warning system, 2-1 is guide rail, and 2-2 is scaling powder assembly, and 2-3 is preheating device, and 2-4 is supporting plate, 2-5 is cooling device.
Detailed description of the invention
Be below specific embodiment of the utility model by reference to the accompanying drawings, the technical solution of the utility model is further described, but the utility model be not limited to these embodiment.
As depicted in figs. 1 and 2, a kind of wave-soldering, a kind of intelligent wave-soldering, described wave-soldering comprises vision system 1, control system 2, warning system 3, described control system comprises: guide rail 2-1, scaling powder assembly 2-2, preheating device 2-3, supporting plate 2-4, cooling device 2-5, described guide rail, scaling powder assembly, preheating device, supporting plate are connected successively with cooling device; Described preheating device is infrared heating pipe.
As shown in Figure 2, described supporting plate comprises upper and lower two blocks of supporting plates, and supporting plate is formed by stacking up and down, and described mounting plate has one for placing the window of wiring board, and the bottom plate of described beneath window has the through hole for placing components pin is installed.Use after supporting plate, needn't use high temperature gummed tape, only wiring board directly need be placed in to the corresponding position of this frock, then placing components pin is inserted in respective through hole, complete after wave-soldering, only wiring board need taken off from supporting plate, on wiring board, can not leave any residual.
Described supporting plate adopts epoxy resin to make.
Wave-soldering refers to the solder (terne metal) of fusing, become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow, also can be by forming to solder pot nitrogen injection, make the printed board that components and parts are housed in advance by solder wave, realize machinery and the solder being electrically connected between components and parts welding end or pin and printed board pad.
As shown in Figure 3, wave-soldering flow process: element is inserted in corresponding component hole → pre-coated soldering flux → preheating (temperature 90-100 DEG C, length 1-1.1m) → wave-soldering (220-230 DEG C) is cooling → excise unnecessary plug-in unit pin → inspection.
Crest welder adopts heat radiation mode to carry out preheating substantially, and the most frequently used wave-soldering pre-heating mean has forced air convection current, electric hot plate convection current, electrical bar heating and infrared heating etc.In these methods, forced air convection current is considered to the most effective heat transmission method of crest welder in most of technique conventionally.After preheating, single ripple for wiring board (λ ripple) or double wave (flow-disturbing ripple and λ ripple) mode is welded.Just enough to the single ripple of punched-type element, when wiring board enters crest, the direction that scolding tin is mobile is contrary with the direct of travel of plank, can around component pin, produce eddy current.This just likes one and scrubs, and by the residue removal of all scaling powders and oxide-film above, in the time that solder joint arrives infiltration temperature, forms and infiltrates.For mixed technology groups piece installing, generally also adopt flow-disturbing ripple at λ wavefront.This ripple is narrow, when disturbance, with higher pressure at right angle, can make scolding tin penetrate into well and lay between compact pin and surface mounted component (SMD) pad, then completes the shaping of solder joint with λ ripple.Before the equipment to following and supplier do any evaluation, need to determine all technical specifications of the plank that weld with crest, because these can determine the performance of required machine.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various amendments or supplements or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Claims (2)
1. an intelligent wave-soldering, it is characterized in that: described wave-soldering comprises vision system (1), control system (2), warning system (3), described control system comprises: guide rail (2-1), scaling powder assembly (2-2), preheating device (2-3), supporting plate (2-4), cooling device (2-5), and described guide rail, scaling powder assembly, preheating device, supporting plate are connected successively with cooling device; Described preheating device is infrared heating pipe, described supporting plate comprises upper and lower two blocks of supporting plates, and upper and lower supporting plate is formed by stacking, and described mounting plate has one for placing the window of wiring board, and the bottom plate of described beneath window has the through hole for placing components pin is installed.
2. the intelligent wave-soldering of one according to claim 1, is characterized in that: described supporting plate adopts epoxy resin to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420090627.6U CN203875442U (en) | 2014-02-28 | 2014-02-28 | Intelligent wave solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420090627.6U CN203875442U (en) | 2014-02-28 | 2014-02-28 | Intelligent wave solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203875442U true CN203875442U (en) | 2014-10-15 |
Family
ID=51675985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420090627.6U Expired - Fee Related CN203875442U (en) | 2014-02-28 | 2014-02-28 | Intelligent wave solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203875442U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852018A (en) * | 2017-01-13 | 2017-06-13 | 昆山福烨电子有限公司 | A kind of immersed solder method of printed circuit board |
| CN112311195A (en) * | 2020-09-21 | 2021-02-02 | 江苏大学 | Cylindrical linear induction electromagnetic pump with axial guide vanes |
-
2014
- 2014-02-28 CN CN201420090627.6U patent/CN203875442U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852018A (en) * | 2017-01-13 | 2017-06-13 | 昆山福烨电子有限公司 | A kind of immersed solder method of printed circuit board |
| CN112311195A (en) * | 2020-09-21 | 2021-02-02 | 江苏大学 | Cylindrical linear induction electromagnetic pump with axial guide vanes |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141015 Termination date: 20190228 |