CN104507271B - The PCBA processing methods and PCBA board combined based on plug-in element technique and paster technique - Google Patents
The PCBA processing methods and PCBA board combined based on plug-in element technique and paster technique Download PDFInfo
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- CN104507271B CN104507271B CN201410842874.1A CN201410842874A CN104507271B CN 104507271 B CN104507271 B CN 104507271B CN 201410842874 A CN201410842874 A CN 201410842874A CN 104507271 B CN104507271 B CN 104507271B
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- plug
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- pcb board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Abstract
The invention discloses PCBA processing methods and PCBA board based on plug-in element technique and paster technique combination.Method includes step：S1 sticks plug-in components on the pcb board with patch pad, and fixed component, component encapsulate for plug-in unit；S2, the pcb board to posting component carry out automatic point heating welding, the pin of the component of plug-in unit encapsulation are welded on the patch pad of pcb board.There is pcb board the component and patch pad of plug-in unit encapsulation, the pin of the component of plug-in unit encapsulation to be welded on patch pad.The present invention has merged the advantages of plug-in unit technique and paster technique, utilize the component of plug-in unit encapsulation and the pcb board with patch pad, in conjunction with automatic point heating welding technique, save the cost of labor and Material Cost of PCBA processing, it reduces to the requirement of component heatproof, the production efficiency and product qualification rate of pcb board are improved, there is good economic and social benefit.It the composite can be widely applied to various PCBA processing technologys.
Description
Technical field
The present invention relates to circuit board manufacture field more particularly to a kind of PCBA method for processing semi-finished product, the invention further relates to
A kind of PCBA board.
Background technology
Printed circuit board, also known as printed circuit board, printed wiring board are often used english abbreviation PCB（Printed
circuit board）Or write PWB（Printed wire board）, using insulation board as base material, it is cut into certain size, up to
Attached less there are one conductive patterns, and are furnished with hole（Such as component hole, fastener hole, plated through-hole）, it is used for replacing previous device electronics
The chassis of component, and realize the interconnection between electronic component.Since this plate is made of electron printing,
Therefore it is referred to as " printing " circuit board.
PCBA is the abbreviation of English Printed Circuit Board+Assembly, that is to say, that PCB hollow plates pass through
SMT piece uploadings, using the entire processing procedure of DIP plug-in units, abbreviation PCBA.
There are two types of PCBA processing methods in the prior art：Plug-in unit technique and paster technique.
1. plug-in unit technique.
The step of plug-in unit technique is：Component is fixed on PCB（Such as：Rubberizing paper can be fixed simply using bonded adhesives etc.
The mode of component）, then artificial plug-in unit（Component is plug-in type with PCB）, then wave-soldering.The disadvantage of plug-in unit technique is plug-in unit
Process or the cost of the cost of labor of pin bending process are higher, efficiency is low；Advantage is the year-on-year paster technique of plug-in unit technique, to member
The temperature requirement of device is relatively low, and product cost is low.
2. paster technique.
The step of paster technique is：It first passes through manually or machine adds tin cream on PCB（Or similar it can simply fix component
Method）, then machine patch component（Component is sticked on tin cream, it is simple fixed；Component is patch type with PCB）, then return
Fluid welding.
The disadvantage of paster technique be it is more demanding to the temperature tolerance of component, such as use plug-in element, cause fraction defective
Height, the unqualified cost to caused by accordingly improve（If using SMD components, component cost itself will be high）；It is excellent
Gesture is the year-on-year plug-in unit technique of paster technique, has saved the cost that artificial plug-in unit is spent.
Invention content
In order to solve the above-mentioned technical problem, the object of the present invention is to provide one kind can saving artificial and component cost,
The PCBA board that the PCBA processing methods and the processing method of raising production efficiency and product qualification rate process again simultaneously.
The technical solution adopted in the present invention is：
A kind of PCBA processing methods combined based on plug-in element technique and paster technique comprising step：S1, with
Plug-in components are sticked on the pcb board of patch pad, and fixed component, the component encapsulate for plug-in unit；S2, to posting member
The pcb board of device carries out automatic point heating welding, the pin of the component of plug-in unit encapsulation is welded on the patch pad of pcb board
On.
Preferably, the step S1 specifically includes sub-step：S11, the first rubberizing paper on pcb board；S12 encapsulates plug-in unit
Component be simply secured on pcb board through automatic pasting technique.
Preferably, the step S2 is specially sub-step：S21 is automatically positioned solder joint；S22 tin and heats weldering on solder joint
It connects.
Preferably, further include step before the step S1：S0 carries out cutting processing to the component of plug-in unit encapsulation.
Preferably, the component is infrared tube.
A kind of PCBA board combined based on plug-in element technique and paster technique based on plug-in element technique, with plug-in unit
The pin of the component and patch pad of encapsulation, the component of the plug-in unit encapsulation is welded on patch pad.
Preferably, the component is infrared tube.
The beneficial effects of the invention are as follows：
A kind of PCBA processing methods combined based on plug-in element technique and paster technique of the present invention have merged plug-in unit technique
And the advantages of paster technique, using the component of plug-in unit encapsulation and the pcb board with patch pad, in conjunction with automatic point heating welding
Technology saves the cost of labor and Material Cost of PCBA processing, reduces to the requirement of component heatproof, improves pcb board
Production efficiency and product qualification rate have good economic and social benefit.
It the composite can be widely applied to various PCBA processing technologys.
The present invention another advantageous effect be：
A kind of PCBA board combined based on plug-in element technique and paster technique based on plug-in element technique of the present invention, is added
The advantages of work Process fusion plug-in unit technique and paster technique, utilizes the component of plug-in unit encapsulation and the PCB with patch pad
Plate saves the cost of labor and Material Cost of PCBA processing, reduces resistance to component in conjunction with automatic point heating welding technique
Temperature requires, and improves the production efficiency and product qualification rate of pcb board, has good economic and social benefit.
It the composite can be widely applied to various pcb boards.
Description of the drawings
The specific implementation mode of the present invention is described further below in conjunction with the accompanying drawings：
Fig. 1 is a kind of a kind of embodiment of PCBA processing methods combined based on plug-in element technique and paster technique of the present invention
Method flow diagram；
Fig. 2 is a kind of a kind of structure of embodiment of PCBA board combined based on plug-in element technique and paster technique of the present invention
Stereoscopic schematic diagram；
Fig. 3 is a kind of a kind of structure of embodiment of PCBA board combined based on plug-in element technique and paster technique of the present invention
Schematic side view；
Fig. 4 is a kind of a kind of structure of embodiment of PCBA board combined based on plug-in element technique and paster technique of the present invention
Schematic top plan view.
Specific implementation mode
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.
As shown in Figure 1, a kind of PCBA processing methods combined based on plug-in element technique and paster technique, feature are existed
In comprising step：S1 sticks plug-in components, and fixed component, the member device on the pcb board with patch pad
Part encapsulates for plug-in unit；S2, the automatic point heating welding of pcb board progress to posting component, drawing for the component that plug-in unit encapsulates
Foot is welded on the patch pad of pcb board.The automatic heating is welded as non-reflow Welding, for example utilizes automatic positioning welding
The pin for the component that machine encapsulates plug-in unit individually weld by heating.
As shown in Figures 2 to 4, the step S1 specifically includes sub-step：S11, the first rubberizing paper on pcb board 1；S12, member
Device 2PCB plates 1 are simply secured to the component 2 that plug-in unit encapsulates on pcb board 1 through automatic pasting technique.The paster technique,
Refer to that plug-in components 2 are attached on pcb board 1 using chip mounter, bonded adhesives, gummed paper or other can simply fix can be used to insert
The mode of part component 2 is first simply secured to plug-in components 2 on pcb board 1.
Preferably, the step S2 is specially sub-step：S21 is automatically positioned solder joint；S22 tin and heats weldering on solder joint
It connects.Wherein, 1 image of pcb board can be acquired by visual sensor, solder joint is found out using image analysis（The component 2 of plug-in unit encapsulation
Pin 21 and pcb board 1 patch pad 11 join position）, then manipulator is commanded tin and to heat welding on solder joint.
Preferably, further include step before the step S1：S0 carries out cutting processing to the component 2 of plug-in unit encapsulation.
Can cutting processing first be carried out to the component 2 of plug-in unit encapsulation, the pin 21 of component 2 is switched into unified and suitable height.
Preferably, the component 2 is infrared tube.By taking infrared tube as an example, since the infrared tube of plug-in unit encapsulation compares patch
The infrared tube of encapsulation have the advantages that it is at low cost, heat safe, and if require patch encapsulate infrared tube high temperature resistant, at
This can accordingly be increased, therefore select the infrared tube of plug-in unit encapsulation.
A kind of PCBA processing methods combined based on 2 technique of plug-in components and paster technique of the present invention have merged plug-in unit work
The advantages of skill and paster technique, is added using the component 2 of plug-in unit encapsulation and with the pcb board 1 of patch pad 11 in conjunction with automatic point
Hot weld connection technology saves the cost of labor and Material Cost of PCBA processing, reduces to the requirement of 2 heatproof of component, improves
The production efficiency and product qualification rate of pcb board 1 have good economic and social benefit.
It the composite can be widely applied to various PCBA processing technologys.
As shown in Figures 2 to 4, a kind of PCBA board combined based on plug-in element technique and paster technique, with plug-in unit
The pin 21 of the component 2 and patch pad 11 of encapsulation, the component 2 of the plug-in unit encapsulation is welded on patch pad 11.
Preferably, the component 2 is infrared tube.By taking infrared tube as an example, since the infrared tube of plug-in unit encapsulation compares patch
The infrared tube of encapsulation have the advantages that it is at low cost, heat safe, and if require patch encapsulate infrared tube high temperature resistant, at
This can accordingly be increased, therefore select the infrared tube of plug-in unit encapsulation.
A kind of PCBA board combined based on plug-in element technique and paster technique of the present invention, process have merged plug-in unit
The advantages of technique and paster technique, using the component 2 of plug-in unit encapsulation and with the pcb board 1 of patch pad 11, in conjunction with automatic point
Welding technique is heated, the cost of labor and Material Cost of PCBA processing are saved, reduces to the requirement of 2 heatproof of component, improves
The production efficiency and product qualification rate of pcb board 1 has good economic and social benefit.
It the composite can be widely applied to various pcb boards 1.
It is to be illustrated to the preferable implementation of the present invention, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations or be replaced under the premise of without prejudice to spirit of that invention
It changes, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (1)
1. a kind of PCBA processing methods combined based on plug-in element technique and paster technique, which is characterized in that it includes step：
S1 sticks plug-in components on the pcb board with patch pad, and fixed component, the component seal for plug-in unit
Dress；
S2, the pcb board to posting component carry out automatic point heating welding, the pin of the component of plug-in unit encapsulation are welded on
On the patch pad of pcb board；
The step S1 specifically includes sub-step：
S11, the first rubberizing paper on pcb board；
S12 is simply secured to the component that plug-in unit encapsulates on pcb board through automatic pasting technique；The step S2 is specially son
Step：
S21 is automatically positioned solder joint；
S22 tin and heats welding on solder joint；
Further include step before the step S1：
S0 carries out cutting processing to the component of plug-in unit encapsulation；
The component is infrared tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410842874.1A CN104507271B (en) | 2014-12-29 | 2014-12-29 | The PCBA processing methods and PCBA board combined based on plug-in element technique and paster technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410842874.1A CN104507271B (en) | 2014-12-29 | 2014-12-29 | The PCBA processing methods and PCBA board combined based on plug-in element technique and paster technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104507271A CN104507271A (en) | 2015-04-08 |
| CN104507271B true CN104507271B (en) | 2018-10-02 |
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| CN201410842874.1A Active CN104507271B (en) | 2014-12-29 | 2014-12-29 | The PCBA processing methods and PCBA board combined based on plug-in element technique and paster technique |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104968161A (en) * | 2015-06-30 | 2015-10-07 | 深圳市志祥科技有限公司 | LED lamp lighting device circuit board production process |
| CN105120602A (en) * | 2015-07-30 | 2015-12-02 | 柳州市美源科技股份有限公司 | Small and medium-sized PCB components mixed installing technology |
| CN105228345A (en) * | 2015-11-05 | 2016-01-06 | 福建众益太阳能科技股份公司 | Solar lamp, PCB and preparation method thereof for Solar lamp |
| CN106937482A (en) * | 2017-03-31 | 2017-07-07 | 柳州译海网络科技有限公司 | A kind of electronic product method for manufacturing of energy-saving and emission-reduction |
| DE102017209097A1 (en) * | 2017-05-31 | 2018-12-06 | Robert Bosch Gmbh | Connecting arrangement and corresponding method for mounting an electronic component on a printed circuit board |
| CN108668463A (en) * | 2018-04-04 | 2018-10-16 | 深圳珈伟光伏照明股份有限公司 | A kind of welding method of axial direction potted element |
| CN108617108A (en) * | 2018-06-28 | 2018-10-02 | 宁波高新区技领电源有限公司 | A kind of patch welding procedure of horizontal patch capacitor |
| CN110121238A (en) * | 2019-05-06 | 2019-08-13 | 深圳市华星光电技术有限公司 | A kind of package assembly and its method of the printed circuit board with plug-in type electrolytic capacitor |
| CN112996272B (en) * | 2021-02-02 | 2022-05-03 | 广州市爱浦电子科技有限公司 | Manufacturing method of power supply structure |
| CN113036574A (en) * | 2021-02-28 | 2021-06-25 | 四川威方达电子科技有限公司 | Production process of desktop power adapter |
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| JPH04314354A (en) * | 1991-04-12 | 1992-11-05 | Nippon Avionics Co Ltd | Surface mounting parts |
| JPH10247697A (en) * | 1997-03-04 | 1998-09-14 | Sony Corp | Surface mounting type semiconductor plastic package and its manufacture |
| CN202121094U (en) * | 2011-06-15 | 2012-01-18 | 杭州富阳恒泰汽车电器有限公司 | Surface-mount type connector assembly |
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| CN101575488A (en) * | 2008-05-08 | 2009-11-11 | 松下电器产业株式会社 | Surface mount adhesive, mounting structure including the same, and method for producing mounting structure |
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