CN105307419A - Manufacturing method for effectively reducing manufacturing cost of PCBA - Google Patents

Manufacturing method for effectively reducing manufacturing cost of PCBA Download PDF

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Publication number
CN105307419A
CN105307419A CN201510568503.3A CN201510568503A CN105307419A CN 105307419 A CN105307419 A CN 105307419A CN 201510568503 A CN201510568503 A CN 201510568503A CN 105307419 A CN105307419 A CN 105307419A
Authority
CN
China
Prior art keywords
pcb
reflow
plug
unit
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510568503.3A
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Chinese (zh)
Inventor
葛汝田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Langchao Electronic Information Industry Co Ltd
Inspur Electronic Information Industry Co Ltd
Original Assignee
Langchao Electronic Information Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Langchao Electronic Information Industry Co Ltd filed Critical Langchao Electronic Information Industry Co Ltd
Priority to CN201510568503.3A priority Critical patent/CN105307419A/en
Publication of CN105307419A publication Critical patent/CN105307419A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3415Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/045Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing

Abstract

The invention provides a manufacturing method for effectively reducing the manufacturing cost of a PCBA, and relates to the technical field of server PCBA manufacture. The method comprises the steps: 1) manufacturing a corresponding steel plate for solder paste printing, and carrying out the solder paste printing of the upper surfaces of all PTH elements; 2) enabling an insertion part of a PCB BOT surface and a PCB to be positioned through a carrier needing reflow: firstly placing the insertion part of the PCB BOT surface in the carrier, secondly placing the PCB into the Reflow carrier and guaranteeing a pin of the insertion part of the PCB BOT surface to be inserted into a PTH hole accurately, thirdly placing the insertion part of the PCB BOT surface on the PCB, and finally completing the welding of the Reflow and inspecting a surface effect. The method employs a production process of an SMT to completely replace a wave solder manufacture process, thereby avoiding a short-circuit problem after wave soldering, and reducing the adverse quality.

Description

A kind of manufacture method of effective reduction PCBA manufacturing cost
Technical field
The present invention relates to server PCBA manufacturing technology field, particularly relate to a kind of manufacture method of effective reduction PCBA manufacturing cost, main in order to solve the poor short circuit produced when PCA crosses Wavesolder processing procedure, reduce the complexity of manufacturing process simultaneously, reach the object reducing cost of goods manufactured and improve product competitiveness.
Background technology
General circuit board of server manufacturing process all can through SMT, Wavesolder flow process, and spacing due to part in Wavesolder flow process is more and more miniaturized, PCB circuit multiple stratification, after causing PCA to complete Wavesolder there is a lot of short circuit problems in the pin of part, this short circuit problem by manually additionally checking reparation, must waste a large amount of human costs.
, there is scaling powder and pollute, wave-soldering thermal shock, the PCBA damage problem of the potentialities such as edge PTH hole copper corrosion, thus reduce the life-span of PCBA in traditional wave-soldering process.
Summary of the invention
In order to solve this problem, propose a kind of manufacture method of effective reduction PCBA manufacturing cost herein, application Pin-through-hole Reflow Soldering Technology, element pasted on surface and a ventilating hole element reflow soldering are completed, can avoid carrying out again the thermal shock of wave soldering to printed board and components and parts, reduce processing link, reduce manufacturing cost, improve the quality of products.
Through-hole reflow soldering is when carrying out the welding of ventilating hole element in printed board, in advance by soldering paste silk-screen in specially designed via pad, then reflow soldering is passed through after ventilating hole element plug-in mounting together with element pasted on surface, the soldering paste pad that Liu Xiang's wettability is good under capillary effect of fusing and through-hole component go between, printed board metallization jack (namely solder flows again), and form the solder joint similar with manual welding, wave soldering, complete the interconnected of electric connection point.
Because part PCBA has two-sided PTH element (namely PCB's exists with all there being plug-in element below) above, adopt common PIP processing procedure cannot omit wave-soldering process completely, so for studying, and finally work out a kind of manufacture method of two-sided PIP processing procedure.
Technical scheme of the present invention is:
A manufacture method for effective reduction PCBA manufacturing cost, comprising:
1) make corresponding paste solder printing steel plate, the upper surface of all PTH elements is carried out paste solder printing;
2) with the carrier of reflow, the reeve part in PCBBOT face and PCB need be positioned,
First the plug-in unit part in PCBBOT face puts into (pin upwards) among carrier
PCB is put into the carrier of Reflow, and ensure correct the entering in edge PTH hole of pin of the plug-in unit part in PCBBOT face.
The plug-in unit part storage in PCBTOP face is on PCB.
Reflow completes welding, visual examination effect.
Further,
A., shown in paste solder printing, by suitable steel mesh perforate and suitable printing parameter, print solder paste onto on PCB.
B. PCBBOT plug-in unit part is placed on Reflowcarrier; Put into by PCA on corresponding carrier, the designing requirement of this operation to carrier is higher, is especially embodied in accurate aspect.
C. can according to respective working condition, the mode mounted by board by the plug-in unit part in TOP face or manually put puts into corresponding part position (because of position, the hole print solder paste that part is corresponding, should be noted when manually putting good position, avoid tin cream short circuit), and guarantee that part plug-in unit puts in place.
D. complete Reflow welding, key is now welding temperature, and welding directly will affect welding effect;
The temperature setting of Reflow is the key parameter of impact welding, and its parameters directly will determine welding effect, therefore needs before manufacture carefully to confirm each temperature parameter and measures relevant temperature, thus ensureing completing smoothly of welding.
E., after having welded, outward appearance and the welding effect of microscope and X-Ray equipment inspection part need be used.After the equal OK of above-mentioned inspection, PCBA can normally flow into next stop flow process, and now whole two-sided PIP processing procedure completes.
The invention has the beneficial effects as follows:
1, two-sided PIP processing procedure can cancel wave-soldering process really, thus the FLUX avoiding wave-soldering uses, thus avoids the potential pollution problem that FLUX brings;
2, decrease the thermal shock number of times of PCBA, reduce PCB/ part because of repeatedly thermal shock and bring negative damage problem;
3, decrease the problems such as the short circuit that wave-soldering brings, substantially increase product yield, reduce manufacturing cost.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly, will do the present invention below and describing in detail further:
1, according to paste solder printing, by suitable steel mesh perforate and suitable printing parameter, print solder paste onto on PCB;
steel mesh perforate factor of influence: steel plate thickness, area ratio (>0.67), Thickness Ratio (>1.5) etc.;
printing parameter: squeegee pressure, print speed printing speed, demoulding distance/speed etc.
2, PCBBOT plug-in unit part is placed on Reflowcarrier.Put into by PCA on corresponding carrier, the designing requirement of this operation to carrier is higher, is especially embodied in accurate aspect:
the quality of fit of Carrier and part is wanted accurately, and the situation rolled can not appear in material;
the quality of fit of PCA and Carrier is wanted accurately, and when guaranteeing that PCA is placed on carrier, the pin of part can aim at the insert hole on PCA, enables part pin enter into PTH smoothly;
after PCA puts into Carrier, the laminating of part and PCA is also accurate, thus avoids part floating high.
After part pin enters edge PTH hole smoothly, what check part from above goes out feet state, and the feet state that goes out of part is consistent substantially.
3, can according to respective working condition, the mode mounted by board by the plug-in unit part in TOP face or manually put puts into corresponding part position (because of position, the hole print solder paste that part is corresponding, should be noted when manually putting good position, avoid tin cream short circuit), and guarantee that part plug-in unit puts in place.
4, complete Reflow welding, key is now welding temperature, and welding directly will affect welding effect.
In order to ensure welding temperature, carrier, when designing, need ensure that part and PCA have sufficient heating surface area, therefore carrier is when designing, and need carry out process of windowing, avoid temperature not enough on carrying position.
Simultaneous temperature is when measuring, and corresponding temperature is surveyed in above-mentioned position also requirement, guarantees welding effect.
The temperature setting of Reflow is the key parameter of impact welding, and its parameters directly will determine welding effect, therefore needs before manufacture carefully to confirm each temperature parameter and measures relevant temperature, thus ensureing completing smoothly of welding.
5, after having welded, outward appearance and the welding effect of microscope and X-Ray equipment inspection part need be used, therefore when selecting part, the part that can meet Reflow processing procedure need be selected, avoid part because the high temperature of Reflow cannot be born, and occur fusing/distortion, the bad problem such as bubble.The terminal of part and the junction of part noumenon need encapsulation process simultaneously, avoid flux to flow into the contact-making surface of part, avoid loose contact.
When X-Ray checks, loading and the bubble of PTH need be confirmed, guarantee that the filling of PTH meets the requirement of relevant criterion, ensure soldering reliability.
After the equal OK of above-mentioned inspection, PCBA can normally flow into next stop flow process, and now whole two-sided PIP processing procedure completes.

Claims (3)

1. effectively reduce a manufacture method for PCBA manufacturing cost, it is characterized in that
1) make corresponding paste solder printing steel plate, the upper surface of all PTH elements is carried out paste solder printing;
2) with the carrier of reflow, the reeve part in PCBBOT face and PCB need be positioned,
First the plug-in unit part in PCBBOT face is put among carrier;
PCB is put into the carrier of Reflow, and ensure the pin of the plug-in unit part in PCBBOT face correct enter in edge PTH hole;
The plug-in unit part storage in PCBTOP face is on PCB;
Reflow completes welding, visual examination effect.
2. method according to claim 1, is characterized in that,
1), shown in paste solder printing, by suitable steel mesh perforate and suitable printing parameter, print solder paste onto on PCB;
2), PCBBOT plug-in unit part is placed on Reflowcarrier;
3), can according to working condition, the mode being mounted by board by the plug-in unit part in TOP face or manually put puts into corresponding part position, and guarantees that part plug-in unit puts in place;
4) Reflow welding, is completed;
5), welded after, need with the outward appearance of microscope and X-Ray equipment inspection part and welding effect; After the equal OK of above-mentioned inspection, PCBA can normally flow into next stop flow process, and now whole two-sided PIP processing procedure completes.
3. method according to claim 2, needs before manufacture to confirm each temperature parameter and measures relevant temperature.
CN201510568503.3A 2015-09-09 2015-09-09 Manufacturing method for effectively reducing manufacturing cost of PCBA Pending CN105307419A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510568503.3A CN105307419A (en) 2015-09-09 2015-09-09 Manufacturing method for effectively reducing manufacturing cost of PCBA

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510568503.3A CN105307419A (en) 2015-09-09 2015-09-09 Manufacturing method for effectively reducing manufacturing cost of PCBA

Publications (1)

Publication Number Publication Date
CN105307419A true CN105307419A (en) 2016-02-03

Family

ID=55204016

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510568503.3A Pending CN105307419A (en) 2015-09-09 2015-09-09 Manufacturing method for effectively reducing manufacturing cost of PCBA

Country Status (1)

Country Link
CN (1) CN105307419A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106852020A (en) * 2017-02-21 2017-06-13 郑州云海信息技术有限公司 A kind of manufacture method of raising PCBA production efficiencys
CN109451663A (en) * 2018-10-16 2019-03-08 上海望友信息科技有限公司 The parameters analysis method and analysis system connect applied to Through-hole reflow
CN110290651A (en) * 2019-07-22 2019-09-27 珠海格力电器股份有限公司 The assemble method of pcb board and spring, pcb board component and remote controler

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006088709A (en) * 2005-12-05 2006-04-06 Matsushita Electric Ind Co Ltd The screen printing method and screen printing apparatus
CN101730394A (en) * 2008-10-17 2010-06-09 海洋王照明科技股份有限公司 Process method for plug-in mounting connector on circuit board
CN101827501A (en) * 2010-03-31 2010-09-08 伟创力电子科技(上海)有限公司 Through-hole backflow welding technology and relevant template and jig
CN102215638A (en) * 2010-04-09 2011-10-12 昌硕科技(上海)有限公司 Method for welding pin through-hole element in surface mounting technology process
CN104159414A (en) * 2014-09-10 2014-11-19 深圳市九八八电子有限公司 Circuit board assembly method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006088709A (en) * 2005-12-05 2006-04-06 Matsushita Electric Ind Co Ltd The screen printing method and screen printing apparatus
CN101730394A (en) * 2008-10-17 2010-06-09 海洋王照明科技股份有限公司 Process method for plug-in mounting connector on circuit board
CN101827501A (en) * 2010-03-31 2010-09-08 伟创力电子科技(上海)有限公司 Through-hole backflow welding technology and relevant template and jig
CN102215638A (en) * 2010-04-09 2011-10-12 昌硕科技(上海)有限公司 Method for welding pin through-hole element in surface mounting technology process
CN104159414A (en) * 2014-09-10 2014-11-19 深圳市九八八电子有限公司 Circuit board assembly method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106852020A (en) * 2017-02-21 2017-06-13 郑州云海信息技术有限公司 A kind of manufacture method of raising PCBA production efficiencys
CN109451663A (en) * 2018-10-16 2019-03-08 上海望友信息科技有限公司 The parameters analysis method and analysis system connect applied to Through-hole reflow
CN110290651A (en) * 2019-07-22 2019-09-27 珠海格力电器股份有限公司 The assemble method of pcb board and spring, pcb board component and remote controler

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Application publication date: 20160203

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