CN105899001A - Design method for canceling PCBA wave soldering process - Google Patents
Design method for canceling PCBA wave soldering process Download PDFInfo
- Publication number
- CN105899001A CN105899001A CN201610466251.8A CN201610466251A CN105899001A CN 105899001 A CN105899001 A CN 105899001A CN 201610466251 A CN201610466251 A CN 201610466251A CN 105899001 A CN105899001 A CN 105899001A
- Authority
- CN
- China
- Prior art keywords
- pin
- hole
- pcba
- processing procedure
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 64
- 238000005476 soldering Methods 0.000 title claims abstract description 24
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 238000013461 design Methods 0.000 title abstract description 4
- 238000005516 engineering process Methods 0.000 claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 5
- 239000010959 steel Substances 0.000 claims abstract description 5
- 238000012545 processing Methods 0.000 claims description 25
- 238000003466 welding Methods 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 3
- 230000009977 dual effect Effects 0.000 abstract description 2
- 230000004907 flux Effects 0.000 abstract description 2
- 238000007639 printing Methods 0.000 abstract description 2
- 238000007598 dipping method Methods 0.000 abstract 1
- 230000008030 elimination Effects 0.000 abstract 1
- 238000003379 elimination reaction Methods 0.000 abstract 1
- 239000006071 cream Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000742 single-metal deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The invention discloses a design method for canceling a PCBA wave soldering process, which is characterized by comprising the following specific steps: 1. selecting a single pin connector; 2. adopting a pin solder paste dipping through hole process, forming a hole on the steel mesh corresponding to the through hole, printing solder paste, and attaching the single-pin connector to the through hole to finish reflow soldering; 3. after the printed circuit board is processed by the surface mounting technology, the parts are inserted into the single-pin connector in the process of the dual in-line package plug-in. Compared with the prior art, the invention realizes the elimination of the PCBA wave soldering process, thereby avoiding the pollution of the liquid soldering flux, increasing the reliability of the printed circuit board and improving the quality and market competitiveness of the product.
Description
Technical field
The present invention relates to a kind of PCBA solder wave process field, setting of a kind of PCBA of cancellation wave-soldering process
Meter method.
Background technology
Modern society, almost every kind of electronic equipment, little to accutron, computer, arrive greatly computer, communication electronics sets
Standby, military issue weapons system, as long as there being the electronic devices and components such as integrated circuit, for the electric interconnection between them, print will be used
Making sheet.In relatively large electronic product research process, the design of printed board and workmanship directly influence whole product
Quality and cost, even result in the success or failure of commercial competition.And optimize production procedure and the technique of PCBA, reduce printed circuit board
Quality risk, reduces cost, will become eternal topic.
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed substrate, is weight
The electronic unit wanted, is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection.Owing to it is to use electronics
Typography makes, therefore is referred to as " printing " circuit board.
PCBA=Printed Circuit Board Assembly, say, that PCB hollow plate is through surface mounting technology system
Journey) part on (abbreviation of Surface Mount Technology) surface mounting technology, the more whole processing procedure through DIP plug-in unit,
It is called for short PCBA processing procedure.
The PCBA of industry produces, and there is also wave-soldering production technology, main or part, such as electrochemical capacitor, connects
Devices etc. cannot cross the part of Reflow Soldering processing procedure.How much and printed circuit board is after wave-soldering process, there is liquid in the surface of PCBA
The pollution of state scaling powder (Flux), this pollution is to have serious impact to the reliability of product, and the many warps of printed circuit board
Go through and once heat, add the security risk of printed circuit board.
Summary of the invention
The technical assignment of the present invention is to provide a kind of method for designing cancelling PCBA wave-soldering process.
The technical assignment of the present invention realizes in the following manner, a kind of method for designing cancelling PCBA wave-soldering process,
Specifically comprise the following steps that
1, a kind of single needle adapter is selected；
2, using pin-in-paste through hole processing procedure, steel mesh correspondence vias, and print solder paste, single needle adapter mounts logical
Hole, completes reflow soldering；
3, printed circuit board is after surface mounting technology processing procedure processing procedure, during dual-inline package plug-in unit, by part
Insert in single needle adapter.
Preferably, described single needle adapter, one end is pin pin, for welding with printed circuit board through hole, adopts
With pin-in-paste through hole making technology；The other end is pin hole, carries out machinery for the pin with dual-inline package part
Connect.
Preferably, during dual-inline package plug-in unit, the mode using automatization's inserter or artificial plug-in unit will
The part of non-refractory, inserts single needle adapter.
Compared to the prior art a kind of of the present invention cancel the method for designing of PCBA wave-soldering process, it is achieved that cancels PCBA
Wave-soldering process, thus stopped the pollution of liquid scaling powder, add the reliability of printed circuit board, improve the product of product
Matter and the market competitiveness.
Detailed description of the invention
PIP(Pin In Paste), pin-in-paste through hole processing procedure, pin-in-paste through hole processing procedure is i.e. to use surface patch
Packing technique processing procedure web plate, prints solder paste onto the welding position that the DIP encapsulating parts pin above printed circuit board is corresponding, makes afterwards
With chip mounter, DIP part is mounted above the welding position that printed circuit board is corresponding, the most again by reflow soldering by tin cream, weldering
Connect a layers of copper and flow process that DIP part pin welds together and technique.
SMT(Surface Mount Technolegy) surface mounting technology processing procedure refers on the surface of appropriate material
On, weld the mounting technology into number much more extremely surface adhered with electronic parts (SMDs).
PTH (Plated Through Hole) plated-through-hole (i.e. plated through-hole), PTH is that circuit board plant is two-sided above
The one procedure that circuit board must do, popular is electroless copper plating.
DIP encapsulates (dual inline-pin package), dual-inline package technology, double enter line encapsulation, DRAM's
A kind of component encapsulation form.Refer to use the IC chip of dual-in-line form encapsulation, most integrated electricity of middle and small scale
Road all uses this packing forms, and its number of pins is usually no more than 100.
A kind of method for designing cancelling PCBA wave-soldering process, specifically comprises the following steps that
1, a kind of single needle adapter is selected；
2, using pin-in-paste through hole processing procedure, steel mesh correspondence vias, and print solder paste, single needle adapter mounts logical
Hole, completes reflow soldering；
3, printed circuit board is after surface mounting technology processing procedure processing procedure, during dual-inline package plug-in unit, by part
Insert in single needle adapter.
Described single needle adapter, one end is pin pin, for welding with printed circuit board through hole, uses pin leaching
Tin cream through hole making technology；The other end is pin hole, is mechanically connected for the pin with dual-inline package part.
During dual-inline package plug-in unit, use the mode of automatization's inserter or artificial plug-in unit by non-refractory
Part, insert single needle adapter.
Described single needle adapter material is the engineering plastics that heatproof is higher than 280 degree.
Embodiment 1:
The present invention proposes a kind of method for designing cancelling PCBA wave-soldering process.The main thought of the method is: use material resistance to
Temperature is higher than 280 degree, can be through the single needle adapter of Reflow Soldering processing procedure, and in surface mounting technology processing procedure processing procedure, employing is drawn
Foot wicking cream through hole processing procedure (Pin in Paste) is first welded to above printed circuit board, then uses the mode of plug-in unit, will not
Resistant to elevated temperatures part, inserts these single needle adapters.
Concrete design:
Single needle adapter:
Selecting a kind of single needle adapter, one end is Pin pin, for welding with printed circuit board through hole, uses Pin In
Paste technique；The other end is pin hole, is mechanically connected for the Pin foot with DIP part.
Surface mounting technology processing procedure PIP processing procedure:
According to pin-in-paste through hole processing procedure, the through hole that steel mesh is corresponding is all left, and print solder paste, mounts single needle adapter.
Afterwards, Reflow welding has been crossed.
Automatic insertion or artificial plug-in unit:
After pcb board has crossed surface mounting technology processing procedure, in plug-in unit section, DIP part being inserted single needle adapter, mode can use
Automation equipment or artificial.
By detailed description of the invention above, described those skilled in the art can readily realize the present invention.But should
Working as understanding, the present invention is not limited to above-mentioned several detailed description of the invention.On the basis of disclosed embodiment, described technology
The technical staff in field can the different technical characteristic of combination in any, thus realize different technical schemes.
Claims (3)
1. the method for designing cancelling PCBA wave-soldering process, it is characterised in that specifically comprise the following steps that
Select a kind of single needle adapter；
Using pin-in-paste through hole processing procedure, steel mesh correspondence vias, and print solder paste, single needle adapter mounts through hole,
Complete reflow soldering；
Part, after surface mounting technology processing procedure processing procedure, during dual-inline package plug-in unit, is inserted by printed circuit board
Enter in single needle adapter.
A kind of method for designing cancelling PCBA wave-soldering process the most according to claim 1, it is characterised in that described list
Needle connector, one end is pin pin, for welding with printed circuit board through hole, uses pin-in-paste through hole processing procedure work
Skill；The other end is pin hole, is mechanically connected for the pin with dual-inline package part.
A kind of method for designing cancelling PCBA wave-soldering process the most according to claim 1, it is characterised in that straight in biserial
During the formula of inserting encapsulation plug-in unit, use the mode of automatization's inserter or artificial plug-in unit by the part of non-refractory, insert single needle
Adapter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610466251.8A CN105899001A (en) | 2016-06-24 | 2016-06-24 | Design method for canceling PCBA wave soldering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610466251.8A CN105899001A (en) | 2016-06-24 | 2016-06-24 | Design method for canceling PCBA wave soldering process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105899001A true CN105899001A (en) | 2016-08-24 |
Family
ID=56718037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610466251.8A Pending CN105899001A (en) | 2016-06-24 | 2016-06-24 | Design method for canceling PCBA wave soldering process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105899001A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270885A (en) * | 2016-09-21 | 2017-01-04 | 郑州云海信息技术有限公司 | A kind of first procedure of two-sided PIP welding |
| CN106604565A (en) * | 2016-12-22 | 2017-04-26 | 深圳市宇顺电子股份有限公司 | Method of coating PCB with solder paste |
| CN106852020A (en) * | 2017-02-21 | 2017-06-13 | 郑州云海信息技术有限公司 | A kind of manufacture method of raising PCBA production efficiencys |
| CN111246956A (en) * | 2017-10-20 | 2020-06-05 | 艾锐势有限责任公司 | Connector structure with discrete regions for improved soldering and method of making same |
| CN111654981A (en) * | 2020-07-02 | 2020-09-11 | 四川耀讯电子科技有限公司 | SMT reflow soldering process of PCBA flexible circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0999730A2 (en) * | 1998-11-02 | 2000-05-10 | Lucent Technologies Inc. | Lead-free solder process for printed wiring boards |
| CN1967945A (en) * | 2005-11-15 | 2007-05-23 | 日本压着端子制造株式会社 | Biserial straight inserting type connector |
| CN101111130A (en) * | 2007-08-21 | 2008-01-23 | 无锡荣志电子有限公司 | Technique for placing connectors on printing circuit board |
-
2016
- 2016-06-24 CN CN201610466251.8A patent/CN105899001A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0999730A2 (en) * | 1998-11-02 | 2000-05-10 | Lucent Technologies Inc. | Lead-free solder process for printed wiring boards |
| CN1967945A (en) * | 2005-11-15 | 2007-05-23 | 日本压着端子制造株式会社 | Biserial straight inserting type connector |
| CN101111130A (en) * | 2007-08-21 | 2008-01-23 | 无锡荣志电子有限公司 | Technique for placing connectors on printing circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270885A (en) * | 2016-09-21 | 2017-01-04 | 郑州云海信息技术有限公司 | A kind of first procedure of two-sided PIP welding |
| CN106604565A (en) * | 2016-12-22 | 2017-04-26 | 深圳市宇顺电子股份有限公司 | Method of coating PCB with solder paste |
| CN106852020A (en) * | 2017-02-21 | 2017-06-13 | 郑州云海信息技术有限公司 | A kind of manufacture method of raising PCBA production efficiencys |
| CN111246956A (en) * | 2017-10-20 | 2020-06-05 | 艾锐势有限责任公司 | Connector structure with discrete regions for improved soldering and method of making same |
| CN111246956B (en) * | 2017-10-20 | 2022-08-30 | 艾锐势有限责任公司 | Connector structure with discrete regions for improved soldering and method of making same |
| CN111654981A (en) * | 2020-07-02 | 2020-09-11 | 四川耀讯电子科技有限公司 | SMT reflow soldering process of PCBA flexible circuit board |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160824 |