CN110351962A - A kind of secondary via hole reflow method - Google Patents
A kind of secondary via hole reflow method Download PDFInfo
- Publication number
- CN110351962A CN110351962A CN201910763028.3A CN201910763028A CN110351962A CN 110351962 A CN110351962 A CN 110351962A CN 201910763028 A CN201910763028 A CN 201910763028A CN 110351962 A CN110351962 A CN 110351962A
- Authority
- CN
- China
- Prior art keywords
- scolding tin
- via hole
- hole
- reflow method
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of secondary via hole reflow method, technical solution are as follows: is needing the scolding tin hole surface welded to carry out applying copper, it is good to realize that copper is applied in scolding tin hole；It is printed in scolding tin hole site using solder(ing) paste；The aperture of aluminium alloy net is carried out on PCB, scolding tin hole is completely covered in realization；Scraper rate is adjusted, realizes that solder(ing) paste applies and is fully welded tin hole；Component is inserted；It is welded using secondary via hole Reflow Soldering, progress SMD Reflow Soldering first, then carries out DIP Reflow Soldering.Using via hole reflow method of the invention, the deficiency of solder wave process is effectively improved, improves PCB yield, avoids the fraction defectives such as rosin joint, solder skip, the problems such as reducing environmental pollution.
Description
Technical field
The present invention relates to the welding technology field of electronic product, in particular to the secondary via hole reflux welder of a kind of circuit board
Process.
Background technique
In traditional Electronic Assemblies technique, for being equipped with the PCB(PCBA of via hole inserting element, Printed
Circuit Board, printed circuit board) welding generally use Wave soldering, but there are many shortcomings for wave soldering:
1, be not suitable for miniaturization, the welding of multi-functional, high density, thin space element, welding precision is unable to satisfy wanting for precise electronic product
It asks；2, bridge joint, solder skip are more；3, spraying scaling powder is needed in welding process, there are volatile substances, such as wine in scaling powder
Essence pollutes the environment；4, printed board is by larger thermal shock buckling deformation.Therefore wave soldering cannot be fitted in all various aspects
Answer the development of electronics assembly technology.
In order to improve the deficiency of wave soldering techniques, it is necessary to propose new improvement technique, adapt to electronic component precise treatment,
Miniaturization, highdensity process requirements, meanwhile, the fraction defectives such as rosin joint, solder skip are avoided, the problems such as reducing environmental pollution.
Summary of the invention
The present invention proposes a kind of secondary via hole reflow method, PIHR via hole reflow solder technique (Pin-In-Hole
Reflow, abbreviation PIHR), the deficiency of solder wave process is effectively improved, PCB yield is improved, avoids rosin joint, solder skip etc.
Fraction defective, the problems such as reducing environmental pollution.
The technical scheme is that a kind of secondary via hole reflow method, comprising the following steps:
It is needing the scolding tin hole surface welded to carry out applying copper, it is good to realize that copper is applied in scolding tin hole；
It is printed in scolding tin hole site using solder(ing) paste；
The aperture of aluminium alloy net is carried out on PCB, scolding tin hole is completely covered in realization；
Scraper rate is adjusted, realizes that solder(ing) paste applies and is fully welded tin hole；
Component is inserted；
Carry out SMD Reflow Soldering；
Carry out DIP Reflow Soldering.
Further, the area in the scolding tin hole is 1.41mm2。
Further, the area of the aluminium alloy steel mesh aperture is 3.04-5.87 mm2, reach scolding tin hole area
2.15-4.16 again.
Further, the scraper rate is set as 25mm/ seconds.
Further, the recirculating zone temperature of the secondary via hole reflow method is less than or equal to 220 ° Celsius, cooling zone
Temperature is less than or equal to 100 ° Celsius.
Using secondary via hole reflow method of the invention, at least have the advantages that
1, reduce production process, omit wave-soldering process, process flow simplifies；
2, equipment, material and the personnel that production process needs are greatly reduced；
3, production cost is reduced, the production cycle is shortened；
4, high ratio of defects caused by due to wave-soldering is significantly reduced, the high first-pass yield of Reflow Soldering is reached；
5, the heat treatment step of at least more than one is omitted, the reliability of PCB solderability and electronic component is improved.
Detailed description of the invention
Fig. 1: via hole reflow method flow chart of the invention.
Specific embodiment
Below with reference to examples and drawings, the present invention is described in further detail, but embodiments of the present invention are not
It is limited to this.
Currently, and some components pin is hollow sets since part PCB is in via hole reflow soldering process with a thickness of 1.6T
Meter, after being handled by solder reflow process, PBA not element face shows as tin amount deficiency, actually internal welded, existing skill
Art thickeies aluminium alloy steel mesh (Mental Mask) using part and solves.
For via hole solder reflow process, the welded condition of solder joint depends in scolding tin hole being formed after soldering tin amount reflux
Alloy volume, due to tin cream welding after reduction in bulk be tin amount 50% or so, for thicker PCB through hole due to scolding tin
The attachment carrier of cream is reduced, and is easier to the insufficient performance of postwelding scolding tin occur, in via hole reflow soldering process, thickeies aluminium using part
The treatment effect of alloy-steel network is not obvious, and in printing process, reinforcement causes scraper pressure to increase, and causes scolding tin
Soldering tin amount is reduced in hole, and then is reduced since step effect causes entry into the comparison leveling halftone of the tin amount in hole, in addition aluminium alloy
Steel mesh thickening causes demoulding difficulty to increase, and easily forms the hollow state of scolding tin after demoulding in scolding tin hole, and external manifestation is PCB printing surface
Tin amount is especially full, and lower part scolding tin is taken out of by pin again when original part is inserted into, and causes to print bad, causes customer complaint.
Since electronic product increasingly payes attention to miniaturization, multi-functional, keep density of components on circuit board higher and higher, it is many
All based on element pasted on surface (SMC/SMD), via hole reflow method scheme use of the invention is scraped for single side and dual platen
Knife directly bites aluminium alloy online tin cream on the stitch hole site of PCB, then installs inserting after PCB completes attachment
Element, last inserting element and surface mount elements are completed to weld by Reflow Soldering simultaneously.
Please referring to Fig. 1 is via hole reflow method flow chart of the present invention, step 101 the scolding tin hole surface that welds of needs into
The deposited copper of row, it is ensured that the deposited copper in whole scolding tin holes is good, realizes good relay contacts；Step 102 uses scolding tin in scolding tin hole site
Cream printing, step 103 carry out aluminium alloy net aperture on PCB, increase the tin cream amount in scolding tin hole, perforated area in practice
It should amplify as far as possible, scolding tin hole is completely covered in realization, such as the area in single scolding tin hole is 1.41 mm2, practical aluminium alloy steel mesh
Perforated area is 3.04-5.87 mm2, reach 2.15-4.16 times of scolding tin hole area；Step 104 adjusts scraper rate
It is whole, such as speed is set as 25mm/ seconds in practice, preferably to make the deposited interior surface for being fully welded tin hole of solder(ing) paste, it is ensured that weldering
Connect effect；Step 105 inserts some components, and inserting herein can be Machine automated inserting, this is to belong to industry
The well-known technique on boundary, the present invention repeat no more；Step 106 is welded using SMD Reflow Soldering, and step 107 carries out DIP reflux
The processing of via hole reflow soldering process is completed in weldering.Via hole reflow method described in this specification is to carry out via hole Reflow Soldering twice,
SMD(Surface Mounted Devices, surface mount device are carried out first) Reflow Soldering, DIP(Dual is then carried out again
In-line Package, dual-inline package technology) Reflow Soldering.
In the present invention, the temperature of the recirculating zone of via hole reflow method is less than or equal to 220 ° Celsius, the temperature of cooling zone
Less than or equal to 100 ° Celsius.
It should be noted that aluminium alloy steel mesh in the present invention program with a thickness of 4mm to 5mm, the common aluminium of industry closes
The thickness of golden steel mesh is generally several Mil units, and Mil is English unit, 1mil=1/1000 inch=0.0254mm.
The endpoint of disclosed range and any value are not limited to the accurate range or value herein, these ranges or
Value should be understood as comprising the value close to these ranges or value.For numberical range, between the endpoint value of each range, respectively
It can be combined with each other between the endpoint value of a range and individual point value, and individually between point value and obtain one or more
New numberical range, these numberical ranges should be considered as specific open herein.
The above is only the embodiment of the present invention, is not intended to limit the invention in any way, all skills according to the present invention
Art any simple modification substantially to the above embodiments, still falls within the technology of the present invention at change and equivalent structural changes
In the protection scope of scheme.
Claims (6)
1. a kind of secondary via hole reflow method characterized by comprising
It is needing the scolding tin hole surface welded to carry out applying copper, it is good to realize that copper is applied in scolding tin hole；
It is printed in scolding tin hole site using solder(ing) paste；
The aperture of aluminium alloy net is carried out on PCB, scolding tin hole is completely covered in realization；
Scraper rate is adjusted, realizes that solder(ing) paste applies and is fully welded tin hole；
Component is inserted；
Carry out SMD Reflow Soldering；
Carry out DIP Reflow Soldering.
2. secondary via hole reflow method as described in claim 1, which is characterized in that the area in the scolding tin hole is
1.41mm2。
3. secondary via hole reflow method as described in claim 1, which is characterized in that the face of the aluminium alloy steel mesh aperture
Product is 3.04-5.87 mm2, reach 2.15-4.16 times of scolding tin hole area.
4. secondary via hole reflow method as described in claim 1, which is characterized in that the scraper rate is set as
25mm/ seconds.
5. secondary via hole reflow method as described in claim 1, which is characterized in that the aluminium alloy steel mesh with a thickness of
4mm to 5mm.
6. secondary via hole reflow method as described in claim 1, which is characterized in that the reflux of secondary via hole reflow method
The temperature in area is less than or equal to 220 ° Celsius, and the temperature of cooling zone is less than or equal to 100 ° Celsius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910763028.3A CN110351962A (en) | 2019-08-19 | 2019-08-19 | A kind of secondary via hole reflow method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910763028.3A CN110351962A (en) | 2019-08-19 | 2019-08-19 | A kind of secondary via hole reflow method |
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| Publication Number | Publication Date |
|---|---|
| CN110351962A true CN110351962A (en) | 2019-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910763028.3A Pending CN110351962A (en) | 2019-08-19 | 2019-08-19 | A kind of secondary via hole reflow method |
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| CN (1) | CN110351962A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111654981A (en) * | 2020-07-02 | 2020-09-11 | 四川耀讯电子科技有限公司 | SMT reflow soldering process of PCBA flexible circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104159414A (en) * | 2014-09-10 | 2014-11-19 | 深圳市九八八电子有限公司 | Circuit board assembly method |
| CN106852020A (en) * | 2017-02-21 | 2017-06-13 | 郑州云海信息技术有限公司 | A kind of manufacture method of raising PCBA production efficiencys |
-
2019
- 2019-08-19 CN CN201910763028.3A patent/CN110351962A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104159414A (en) * | 2014-09-10 | 2014-11-19 | 深圳市九八八电子有限公司 | Circuit board assembly method |
| CN106852020A (en) * | 2017-02-21 | 2017-06-13 | 郑州云海信息技术有限公司 | A kind of manufacture method of raising PCBA production efficiencys |
Non-Patent Citations (1)
| Title |
|---|
| DAFUPZB: "过孔回流焊接工艺点滴见解", 《百度文库》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111654981A (en) * | 2020-07-02 | 2020-09-11 | 四川耀讯电子科技有限公司 | SMT reflow soldering process of PCBA flexible circuit board |
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Application publication date: 20191018 |