CN111654981A - SMT reflow soldering process of PCBA flexible circuit board - Google Patents
SMT reflow soldering process of PCBA flexible circuit board Download PDFInfo
- Publication number
- CN111654981A CN111654981A CN202010634646.0A CN202010634646A CN111654981A CN 111654981 A CN111654981 A CN 111654981A CN 202010634646 A CN202010634646 A CN 202010634646A CN 111654981 A CN111654981 A CN 111654981A
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- smt
- pcba
- circuit board
- flexible circuit
- reflow soldering
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- 238000005476 soldering Methods 0.000 title claims abstract description 42
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 34
- 238000003466 welding Methods 0.000 claims abstract description 17
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 15
- 239000010959 steel Substances 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims abstract description 14
- 238000001035 drying Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 18
- 238000002844 melting Methods 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 15
- 230000000694 effects Effects 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- OZJAIRCFCMQFIF-UHFFFAOYSA-N 1-phenylcyclobutan-1-amine Chemical compound C=1C=CC=CC=1C1(N)CCC1 OZJAIRCFCMQFIF-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an SMT reflow soldering process of a PCBA flexible circuit board, which comprises the following steps: s1, preparing an SMT steel mesh and mounting an SMT patch; s2, pre-tinning the SMT steel mesh; s3, inserting the SMT patch pin into the jack of the PCBA flexible circuit board; s4, sending the PCBA flexible circuit board provided with the SMT patch into a reflow soldering furnace for reflow soldering; s5, placing the welded PCBA flexible circuit board on a cleaning line for cleaning; s6, conveying the PCBA into a drying box for drying, and the invention relates to the technical field of PCBA flexible circuit board processing. The invention solves the problem that the common PCBA has concave or curved appearance in the SMT position, four sides of the SMT are welded preferentially in the SMT welding process, the solder balls in the middle parts are welded only after the four sides are welded, and the solder paste and the SMT solder balls can not be completely melted and welded due to furnace temperature difference, so that the phenomenon of insufficient welding or cold welding is generated.
Description
Technical Field
The invention relates to the technical field of PCBA flexible circuit board processing, in particular to an SMT reflow soldering process of a PCBA flexible circuit board.
Background
PCBA is short for English Printed Circuit Board Assembly, that is to say PCB blank Board through SMT upper part, or through the whole process of DIP plug-in components, short PCBA, this is a writing commonly used in China, and in Europe and America the standard writing is PCB 'A, added with "', this is called official custom.
In the prior art, the SMT position on a common PCBA can have concave or curved phenomenon, four sides of the SMT are welded preferentially in the SMT welding process, the solder balls at the middle parts can be welded after the four sides are welded, at this time, the solder paste and the SMT solder balls can not be completely melted and welded due to the difference of furnace temperature, and therefore the phenomenon of insufficient soldering or cold soldering is generated.
Disclosure of Invention
The invention aims to solve the problem that the SMT reflow soldering process of a PCBA flexible circuit board is insufficient in soldering or cold soldering phenomenon because four edges of the SMT are welded preferentially and solder balls in the middle part are welded only after the four edges are welded, and the solder paste and the SMT solder balls cannot be completely melted and soldered due to furnace temperature difference.
In order to achieve the purpose, the invention adopts the following technical scheme: an SMT reflow soldering process of a PCBA flexible circuit board comprises the following steps:
s1, preparing an SMT steel mesh and mounting an SMT patch;
s2, pre-tinning the SMT steel mesh;
s3, inserting the SMT patch pin into the jack of the PCBA flexible circuit board;
s4, sending the PCBA flexible circuit board provided with the SMT patch into a reflow soldering furnace for reflow soldering;
s5, placing the welded PCBA flexible circuit board on a cleaning line for cleaning;
and S6, conveying the PCBA into a drying box for drying.
Preferably, in S1, the SMT steel mesh is a solder paste mesh, and the SMT pad pins are inserted into the solder paste mesh.
Preferably, in S2, solder paste is printed at the SMT pad pins on both sides of the SMT steel mesh, and the thickness of the solder paste is 3-5 mm.
Preferably, in S3, the SMT patch is accurately positioned in the pad.
Preferably, in S4, the step of soldering in the reflow oven is:
the method comprises the following steps: preheating, namely preheating the PCBA flexible circuit board and the SMT patch to ensure that the welded material reaches thermal equilibrium;
step two: keeping the temperature constant, removing surface oxides, starting evaporation and welding by air flow, and keeping the temperature to reach the melting point of the solder paste, wherein the solder paste is in a state of being dissolved and undissolved, and the heating effect of a fifth heating interval, a sixth heating interval and a seventh heating interval is realized for the reflow oven;
step three: reflow, namely, the melting point of the soldering paste is reduced to the peak value and then is reduced to the melting point, and in the process of melting and dissolving the soldering paste, the soldering pad and the soldering paste are soldered, so that the heating effect of the eighth, ninth, tenth and third heating sections on the reflow soldering furnace is achieved;
step four: cooling, and cooling to 45-55 deg.C from the melting point of solder paste.
Preferably, in S5, the cleaning line passes through the water tank and is submerged in the cleaning solution.
Preferably, in the step S6, the drying box is provided with a fan, and the temperature is 45-55 ℃.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, the SMT paster and the solder paste can be completely fused and welded by mounting the SMT steel mesh and adopting the pre-welding step, so that the welding quality and effect are greatly improved; according to the invention, the steps of preheating, constant temperature, reflow and cooling are carried out by adopting reflow furnace welding, the temperature is convenient to control during welding, the operation is convenient, and the welding efficiency is high.
Drawings
The invention is described in further detail below with reference to the following figures and detailed description:
FIG. 1 is a schematic diagram of the overall process of the present invention;
fig. 2 is a schematic view of a solder reflow oven of the present invention.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
Please refer to fig. 1-2. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention.
Example 1: an SMT reflow soldering process of a PCBA flexible circuit board comprises the following steps:
s1, preparing an SMT steel mesh and mounting an SMT patch;
s2, pre-tinning the SMT steel mesh;
s3, inserting the SMT patch pin into the jack of the PCBA flexible circuit board;
s4, sending the PCBA flexible circuit board provided with the SMT patch into a reflow soldering furnace for reflow soldering;
s5, placing the welded PCBA flexible circuit board on a cleaning line for cleaning;
and S6, conveying the PCBA into a drying box for drying.
And in the S1, the SMT steel mesh is a solder paste screen, and the SMT patch pins are inserted into the solder paste screen.
And in the S2, solder paste is printed at the SMT patch pins on two sides of the SMT steel mesh, and the thickness of the solder paste is 3-5 mm.
In S3, the SMT patch is accurately positioned in the pad.
In S4, the reflow oven includes:
the method comprises the following steps: preheating, namely preheating the PCBA flexible circuit board and the SMT patch to ensure that the welded material reaches thermal equilibrium;
step two: keeping the temperature constant, removing surface oxides, starting evaporation and welding by air flow, and keeping the temperature to reach the melting point of the solder paste, wherein the solder paste is in a state of being dissolved and undissolved, and the heating effect of a fifth heating interval, a sixth heating interval and a seventh heating interval is realized for the reflow oven;
step three: reflow, namely, the melting point of the soldering paste is reduced to the peak value and then is reduced to the melting point, and in the process of melting and dissolving the soldering paste, the soldering pad and the soldering paste are soldered, so that the heating effect of the eighth, ninth, tenth and third heating sections on the reflow soldering furnace is achieved;
step four: cooling, and cooling to 45-55 deg.C from the melting point of solder paste.
In S5, the cleaning line passes through the water tank and is immersed in the cleaning solution.
In S6, the drying box is provided with a fan, and the temperature is 45-55 ℃.
Embodiment 2, use traditional welding process to weld, and detect the welding position, detect the welding of PCBA flexible circuit board in embodiment 1 simultaneously and be detecting:
the welding detection result of the traditional process is as follows: a large number of cold and cold solder joints appear.
Embodiment 1PCBA flexible circuit board welding detection result: no cold or cold solder joint was observed.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (7)
1. An SMT reflow soldering process of a PCBA flexible circuit board is characterized by comprising the following steps:
s1, preparing an SMT steel mesh and mounting an SMT patch;
s2, pre-tinning the SMT steel mesh;
s3, inserting the SMT patch pin into the jack of the PCBA flexible circuit board;
s4, sending the PCBA flexible circuit board provided with the SMT patch into a reflow soldering furnace for reflow soldering;
s5, placing the welded PCBA flexible circuit board on a cleaning line for cleaning;
and S6, conveying the PCBA into a drying box for drying.
2. An SMT reflow soldering process for a PCBA flexible circuit board according to claim 1, wherein: and in the S1, the SMT steel mesh is a solder paste screen, and the SMT patch pins are inserted into the solder paste screen.
3. An SMT reflow soldering process for a PCBA flexible circuit board according to claim 1, wherein: and in the S2, solder paste is printed at the SMT patch pins on two sides of the SMT steel mesh, and the thickness of the solder paste is 3-5 mm.
4. An SMT reflow soldering process for a PCBA flexible circuit board according to claim 1, wherein: in S3, the SMT patch is accurately positioned in the pad.
5. An SMT reflow soldering process for a PCBA flexible circuit board according to claim 1, wherein: in S4, the reflow oven includes:
the method comprises the following steps: preheating, namely preheating the PCBA flexible circuit board and the SMT patch to ensure that the welded material reaches thermal equilibrium;
step two: keeping the temperature constant, removing surface oxides, starting evaporation and welding by air flow, and keeping the temperature to reach the melting point of the solder paste, wherein the solder paste is in a state of being dissolved and undissolved, and the heating effect of a fifth heating interval, a sixth heating interval and a seventh heating interval is realized for the reflow oven;
step three: reflow, namely, the melting point of the soldering paste is reduced to the peak value and then is reduced to the melting point, and in the process of melting and dissolving the soldering paste, the soldering pad and the soldering paste are soldered, so that the heating effect of the eighth, ninth, tenth and third heating sections on the reflow soldering furnace is achieved;
step four: cooling, and cooling to 45-55 deg.C from the melting point of solder paste.
6. An SMT reflow soldering process for a PCBA flexible circuit board according to claim 1, wherein: in S5, the cleaning line passes through the water tank and is immersed in the cleaning solution.
7. An SMT reflow soldering process for a PCBA flexible circuit board according to claim 1, wherein: in S6, the drying box is provided with a fan, and the temperature is 45-55 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010634646.0A CN111654981A (en) | 2020-07-02 | 2020-07-02 | SMT reflow soldering process of PCBA flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010634646.0A CN111654981A (en) | 2020-07-02 | 2020-07-02 | SMT reflow soldering process of PCBA flexible circuit board |
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| Publication Number | Publication Date |
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| CN111654981A true CN111654981A (en) | 2020-09-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010634646.0A Pending CN111654981A (en) | 2020-07-02 | 2020-07-02 | SMT reflow soldering process of PCBA flexible circuit board |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112531099A (en) * | 2020-11-13 | 2021-03-19 | 深圳热电新能源科技有限公司 | High-performance inorganic block flexible thermoelectric device and preparation method thereof |
| CN112601386A (en) * | 2020-12-29 | 2021-04-02 | 重庆市名赫电子科技有限公司 | SMT surface mounting technology for PCBA mainboard processing |
| CN117583684A (en) * | 2024-01-16 | 2024-02-23 | 无锡市古德电子有限公司 | SMT welding method |
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2020
- 2020-07-02 CN CN202010634646.0A patent/CN111654981A/en active Pending
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| CN112601386A (en) * | 2020-12-29 | 2021-04-02 | 重庆市名赫电子科技有限公司 | SMT surface mounting technology for PCBA mainboard processing |
| CN117583684A (en) * | 2024-01-16 | 2024-02-23 | 无锡市古德电子有限公司 | SMT welding method |
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Application publication date: 20200911 |
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