KR100647880B1 - Method of installing injection connectors to a pcb - Google Patents

Abstract

A method for installing an injection connector in a PCB(Printed Circuit Board) is provided to promptly perform the soldering process for fixing the injection connector to the PCB through an automatic production line, thereby achieving the improvement of productivity. A cream solder(20) is coated on an upper surface and a lower surface of a PCB(10) using a metal mask. An injection connector(30) is inserted into the PCB while pins(35) of the injection connector(30) are disposed correspondingly to the cream solder(20) coated on the PCB(10). The pins(35) of the injection connector(30) are fixed to the cream solder(20) of the PCB(10) by applying heat to the PCB(10), into which the injection connecter(30) is inserted, in a heating furnace(40).

Description

Method of installing injection connectors to a PC}

1 is a schematic working flowchart showing a method of mounting an injection connector on a PCB according to a first embodiment of the present invention.

2 is a schematic working flowchart showing a method of mounting an injection connector on a PCB according to a second embodiment of the present invention.

<Description of Major Symbols Used in Drawings>

10: PCB 20: cream solder

30: injection connector 35: pin

40: heating furnace 45: chamber

46: conveyor

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of welding various electronic components on a PCB, and more particularly, to a technique of applying a cream solder to both upper and lower sides of a PCB using a metal mask and applying heat to weld the pins of the electronic component simultaneously. .

Applying the cream solder using a metal mask is a well known technique and will be described schematically. The cream solder means that the flux is mixed with the solder powder to an appropriate viscosity and then used as a solder.

There are several known methods of fabricating metal masks, which use perforation or laser processing to form perforated openings in the same location as the PCB.

When the cream solder is applied to the PCB using the metal mask, the PCB is placed under the metal mask, and the cream solder is supplied on the metal mask to be uniformly applied using a squeegee.

When the cream solder is applied onto the metal mask using a squeegee, the cream solder may be applied to the PCB through an opening provided in the metal mask.

Such a soldering process is a technique that is generally performed, and the present invention relates to the application of the cream solder to the PCB and to welding the pins of various electronic components to the cream solder.

Until now, as a method of welding the pins of the electronic components to the cream solder applied to the PCB, the worker manually performed welding. In the case of welding by hand, there were many variations in quality according to the skill of the operator and the incidence of defective products was also very high. In addition, productivity was low, and it was difficult to secure price competitiveness.

And since the electronic components coupled to the PCB are often coupled to the pins on both the upper and lower surfaces of the PCB, manual soldering presents many more problems.

The present invention for solving the conventional problems as described above is to provide a method for allowing the welding of the pins of a plurality of electronic components through the automatic line at the same time after applying the cream solder on the upper and lower surfaces of the PCB.

Another object of the present invention is to provide a method of preventing deformation of a product or position of a pin formed on an electronic component that may be involved in automatic welding.

Method for mounting the injection connector on the PCB of the present invention for achieving the above object, in the method for mounting the injection connector using a cream solder on the PCB, by applying a cream solder on the upper and lower surfaces of the PCB using a metal mask. A printing step; An injection connector insertion step of coupling the pins of the injection connector to the cream solder on the PCB to which the cream solder is applied; And a soldering step of applying the heat in the heating furnace to the PCB to which the injection connector is coupled, so that the pins are fixed to the cream solder.

In addition, the method of mounting the injection connector on the PCB of the present invention, the printing step is a first step of applying a cream solder to the upper surface of the PCB using the upper metal mask; A second step of placing the upper surface of the PCB on the metal mask jig so as to prevent the damage of the cream solder applied to the upper surface of the PCB so that the rear surface of the PCB is positioned at the upper side; The third step of applying a cream solder to the back of the PCB by using a lower metal mask; it is another feature.

In addition, the method of mounting the injection connector on the PCB of the present invention, after the injection connector insertion step, characterized in that it further comprises a protective cap coupling step of preventing deformation by covering adjacent injection connectors with a protective cap.

And in the method of mounting the injection connector on the PCB of the present invention, the heating furnace is characterized in that the conveyor is provided with a crawler movement to be continuously soldered.

On the other hand, in the method of mounting the injection connector on the PCB of the present invention, the heating furnace is characterized by having a multi-stage heating structure in which the temperature is set differently.

BEST MODE Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings, and the accompanying drawings are provided to help understanding of the present invention, and it is to be understood that one embodiment embodies the technical idea of the present invention. .

Therefore, within the technical scope of the present invention, easy design changes and simple replacement of components by those skilled in the art will also be included in the scope of the present invention.

The method for mounting an injection connector on a PCB according to the present invention includes a printing step, an injection connector insertion step and a soldering step. Here, the printing step is to apply the cream solder on the upper and lower surfaces of the PCB using a metal mask.

And the injection connector insertion step is to combine the injection connector prepared on the PCB with the cream solder is inserted so that the injection connector pin is placed on top of the cream solder. The injection connector is coupled to a plurality of pins and has an upper pin and a lower pin. When the prepared injection connector is inserted with the pin portion facing the cream solder applied to the PCB, the pin is aligned on the cream solder. At this stage, the injection connector pins are not yet fully secured to the cream solder.

Therefore, as a later step, the pin and the cream solder must be integrally welded. In particular, since the number of pins can reach several to several tens, the present invention includes a soldering step in which the cream solder and the pins are automatically welded by applying appropriate heat.

The injection connector mentioned is generally named because these small electronic parts are often molded by injection, and its shape and type can be changed in various ways.

More specific embodiments of the present invention are as described below.

First Embodiment

In this embodiment, the PCBs, which are independent components, are continuously connected to each other so that soldering can be performed at the same time. The work process is basically a printing step (I), an injection connector insertion step (II), and a soldering step. (III).

1 is a schematic work flow diagram showing a method of mounting an injection connector on a PCB according to a first embodiment of the present invention.

It shows the case where the pins of the injection connector are connected at one place on the upper surface of the PCB and the pins of the injection connector are connected at the three places on the bottom. Accordingly, in the printing step (I), the cream solder 20 is applied to the upper and lower specific positions of the PCB 10 using a metal mask.

A more specific working process of the printing step (I) is as follows.

In other words, the printing step may be further divided into three steps. To this end, the upper metal mask, the lower metal mask and the metal mask jig should be manufactured in advance. Fabrication of the metal mask is a general technique, so a detailed description thereof will be omitted.

The first step in the printing step is to apply the cream solder to the upper surface of the PCB using the prepared upper metal mask. In the application of the cream solder, the cream solder is injected into the opening provided in the metal mask by uniformly rubbing the cream solder supplied using the squeegee, and the cream solder is applied only to a specific portion of the upper surface of the PCB.

As a first step, after applying the cream solder to the upper surface of the PCB, the cream solder should be applied to the lower surface. To this end, as the second step, the upper surface of the PCB is coated with a cream solder and placed on the metal mask jig so that the lower surface of the PCB is positioned on the upper side. At this time, in the present invention, a metal mask jig is used to protect a portion where the cream solder is applied on the upper surface of the PCB. The metal mask jig has a position corresponding to the area where the cream solder is applied, and thus the cream solder is applied. Do not damage it.

The final process of the printing step is a third step of applying the cream solder to the lower surface of the PCB using a lower metal mask. Since the lower metal mask is also prepared in advance, rubbing the cream solder using the squeegee as in the first step, the cream solder is passed through the opening of the metal mask to complete the application of the cream solder to the lower surface of the PCB.

When the printing step (I) is completed, then the injection connector insertion step (II) is performed.

In the injection connector insertion step (II), as shown in FIG. 1, the prepared injection connector 30 is coupled to a cream solder-coated PCB. A plurality of pins 35 are coupled to the injection connector 30, and the pins are inserted into contact with the upper surface of the cream solder 20 formed on the PCB.

After inserting the injection connectors into the PCB, the soldering step (III) is performed. In this embodiment, the heating furnace 40 is prepared for the soldering step (III), and when the heating is applied, the pins of the injection connector are welded to the cream solder.

In the construction of the heating furnace 40, a heating means (not shown) is disposed inside the elongated chamber 45, and a conveyor 46 for automatic transfer of the PCB to which the injection connector is coupled to the lower portion of the heating means is provided. Put it there. The PCB on the conveyor moves slowly and heats up, so that the cream solder reaches its melting point and the injection connector pins are welded.

On the other hand, in the configuration of the heating furnace is more preferably divided into several sections it is suitable to be able to individually perform the temperature control for each section. Therefore, the temperature of each section is adjusted differently so that soldering can be performed under the most optimal conditions.

The temperature setting made in the heating furnace can be largely classified into two sections. That is, it is classified into preheat and main heating, and gradually raises the temperature from room temperature in the preheat section. Approximately 60-120 seconds is appropriate for the preheat section. If insufficient preheat is caused, large solder balls are easily generated, and if excessive, excessive wetting and unmelting may occur. Therefore, the end temperature of the preheat is suitably 150-200 ° C.

After preheating, the main heating is carried out. The rapid rise in temperature deteriorates the spreading of the solder cream, so the temperature should be gradually increased even in the main heating. The maximum temperature in this heating is suitable to be 230 ~ 240 ℃.

As such, after soldering in the furnace, cool down to an appropriate speed.

Second Embodiment

Next, a second embodiment of the present invention will be described.

The second embodiment is based on the first embodiment, characterized in that it further comprises a protective cap coupling step after the injection connector insertion step.

That is, the overall process consists of a printing step (I), an injection connector insertion step (II), a protective cap coupling step (II-1) and a soldering step (III). 2 shows a working flowchart of the second embodiment.

The printing step (I) is to apply the cream solder using a metal mask on the upper and lower surfaces of the PCB as mentioned. Then, the prepared injection connector is inserted into the PCB so that the injection connector pins come into contact with the applied cream solder (II).

Protective cap coupling step (II-1) is to cover and secure a plurality of injection connectors 30 arranged in succession with one protective cap (C). In this embodiment, the aluminum cap is used as the protective cap (C), and one side is opened to insert the injection connector.

After the protective cap coupling step (II-1), the heating is applied to the furnace 40 to perform soldering, as mentioned above.

If the above-mentioned protective cap is coupled to the injection connector and soldered, the pins of the injection connector can be prevented from being out of position when the cream solder is melted by heat, and the deformation of the injection connector can be prevented. Will be. This can reduce product defects. In addition, the use of the protective cap has a characteristic that can prevent color discoloration of the injection connector by heat.

When the PCB is passed through the heating furnace and the product is completed, it is desirable for the worker to perform an external inspection of the product (eg, unpaid, overpaid, short, foreign matter, inclination of the injection connector pin, etc.) by using a magnifying glass. If there are any defects, they are sorted by manual welding.

According to the method of the present invention as described above, it is possible to quickly perform the conventional manual soldering operation through the automatic line has the effect that it is possible to achieve productivity improvement.

In addition, mass production by automation and uniform product quality can reduce the occurrence of defective products, and can provide an effect of ensuring high reliability in terms of quality as well as price competitiveness.

In addition, the present invention also has the effect that it is possible to solve a number of problems due to the change in the position of the injection connector pin that can be caused during soldering because the use of a protective cap.

And by using the protective cap has the effect of being able to prevent color discoloration of the injection connector by heating.

Claims (5)

In the method of mounting the injection connector using a cream solder on the PCB, A printing step of applying a cream solder on the upper and lower surfaces of the PCB using a metal mask; An injection connector insertion step of coupling the pins of the injection connector to the cream solder on the PCB to which the cream solder is applied; And a soldering step in which the pin is fixed to the cream solder by applying heat to the PCB to which the injection connector is coupled, in a heating furnace. The method of claim 1, The printing step, Applying a cream solder to the upper surface of the PCB using the upper metal mask; A second step of placing the upper surface of the PCB on the metal mask jig so as to prevent the damage of the cream solder applied to the upper surface of the PCB so that the rear surface of the PCB is positioned at the upper side; The third step of applying a cream solder to the back of the PCB using a lower metal mask; Method for mounting the injection connector on the PCB, characterized in that consisting of. The method of claim 1, Mounting the injection connector on the PCB, After the injection connector insertion step, And a protective cap coupling step of preventing deformation by covering adjacent injection connectors with a protective cap. The method according to any one of claims 1 to 3, The heating furnace, Method for mounting the injection connector on the PCB, characterized in that the conveyor is provided with a crawler movement so that the soldering is made continuously. The method of claim 4, wherein The heating furnace, A method of mounting an injection connector on a PCB, characterized in that it has a multi-stage heating structure with different temperatures.

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