CN109604754A - A kind of reflow soldering method improving device thermal expansion deformation - Google Patents
A kind of reflow soldering method improving device thermal expansion deformation Download PDFInfo
- Publication number
- CN109604754A CN109604754A CN201811516686.4A CN201811516686A CN109604754A CN 109604754 A CN109604754 A CN 109604754A CN 201811516686 A CN201811516686 A CN 201811516686A CN 109604754 A CN109604754 A CN 109604754A
- Authority
- CN
- China
- Prior art keywords
- reflow soldering
- pcb board
- thermal expansion
- improving device
- expansion deformation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of reflow soldering method for improving device thermal expansion deformation, include the following steps: to prepare SMT steel mesh, by SMT steel mesh to pcb board print solder paste, the pcb board for being printed on tin cream is sent into chip mounter and carries out SMT patch；The good pcb board of patch is put into reflow soldering, the nitrogen after heating is passed through into reflow soldering；Once heated up, heating rate≤2 DEG C/s；Heat preservation, and the rotation speed of the fan of uptake is increased, keep leeward mouth rotation speed of the fan constant；Carry out secondary temperature elevation, heating rate≤2 DEG C/s；Reflow soldering；Cooling down completes welding；Subsequent detection.The present invention can reduce the peak temperature of Reflow Soldering, to widen PWI(process window index), preferable welding hot melt effect is generated, and reduce the temperature difference of component and pcb board, avoids rosin joint and problem on deformation caused by excessive temperature differentials.
Description
Technical field
The present invention relates to circuit board mount technologies, in particular to a kind of Reflow Soldering for improving device thermal expansion deformation
Connect method.
Background technique
Since electronic product pcb board is increasingly miniaturized, traditional welding method cannot be met the needs of.Reflow Soldering is to pass through
The cream solder on printed board pad is allocated in refuse in advance, realizes surface-assembled component welding end or pin and printed board
Pad room machine and electrical connection.With the continuous mature and development of technology, the application of reflow soldering process technology and equipment is increasingly
Extensively, it has almost all been applied in all electronics fields.
In actual production, since the material of component and pcb board is various, and specific heat capacity and thermal expansion between unlike material
Coefficient is different, in the welding process, often can be excessive because of component and pcb board rate of rise in temperature difference, leads to component or PCB
Plate deforms, and component is made to be detached from pad, forms rosin joint, or even destroy pad because of deformation, PCB is caused to scrap.
Summary of the invention
The purpose of the present invention is to provide it is a kind of improve device thermal expansion deformation reflow soldering method, can effectively reduce because
Welding Problems caused by device thermal expansion.
Above-mentioned technical purpose of the invention is realized by technical solution once:
A kind of reflow soldering method improving device thermal expansion deformation, which comprises the steps of:
A. prepare SMT steel mesh, by SMT steel mesh to pcb board print solder paste, will be printed on tin cream pcb board be sent into chip mounter into
Row SMT patch；
B. the good pcb board of patch is put into reflow soldering, the nitrogen after heating is passed through into reflow soldering；
C. it is once heated up, heating rate≤2 DEG C/s；
D. it keeps the temperature, and increases the rotation speed of the fan of uptake, while keeping leeward mouth rotation speed of the fan constant, the time of heat preservation is 70s-
90s, holding temperature are 150 DEG C -180 DEG C；
E. secondary temperature elevation, heating rate≤2 DEG C/s are carried out；
F. reflow soldering；
G. cooling down completes welding；
H. subsequent detection.
Further, in the step B, nitrogen gas concn is 3000PPM or less.
Further, in the step D, temperature difference≤8 DEG C.
Further, in the step F, the peak temperature of Reflow Soldering is 230 DEG C, weld interval 60s-90s.
Further, in the step G, cooling rate k is 2 DEG C/s≤k≤4 DEG C/s.
Compared with the existing technology, it is welded the invention has the following advantages: being heated by using nitrogen, reflux can be reduced
The peak temperature of weldering, to widen PWI(process window index), generate preferable welding hot melt effect.In insulating process, lead to
The revolving speed for increasing uptake fan is crossed, the air on reflow soldering top is made to accelerate flowing, is located at pcb board upper surface to reduce
The temperature of component reduces the temperature difference of component and pcb board, avoids rosin joint and problem on deformation caused by excessive temperature differentials.
Specific embodiment
Below in conjunction with specific embodiment, present invention is further described in detail.
This specific embodiment is only explanation of the invention, is not limitation of the present invention, those skilled in the art
Member can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but as long as at this
All by the protection of Patent Law in the protection scope of invention.
In one preferred embodiment, a kind of reflow soldering method of improvement device thermal expansion deformation of the invention, including it is following
Step:
A. prepare SMT steel mesh, by SMT steel mesh to pcb board print solder paste, will be printed on tin cream pcb board be sent into chip mounter into
Row SMT patch；
B. the good pcb board of patch is put into reflow soldering, the nitrogen after heating is passed through into reflow soldering, nitrogen gas concn is
3000PPM can reduce the peak temperature of Reflow Soldering using nitrogen heating, to widen PWI(process window hereinafter, in this stage
Index), generate preferable welding hot melt effect；
C. it is once heated up, controls heating rate≤2 DEG C/s, avoiding heating up too fast causes to damage component and pcb board；
D. it is kept the temperature, the time of heat preservation is 70s-90s, and holding temperature is 150 DEG C -180 DEG C；The fan of uptake is increased at this time
Revolving speed keeps leeward mouth rotation speed of the fan constant, to reduce the temperature difference between device and pcb board, controls temperature difference≤8 DEG C,
Avoid rosin joint and problem on deformation caused by excessive temperature differentials；
E. secondary temperature elevation, heating rate≤2 DEG C/s are carried out；
F. reflow soldering, the peak temperature of Reflow Soldering are 230 DEG C, weld interval 60s-90s；
G. cooling down, in the process, cooling rate k remain 2 DEG C/s≤k≤4 DEG C/s, if cooling rate is too fast, heat is answered
Power is likely to result in circuit board deformation.If cooling rate is too slow, solder joint crystallization time is long, and nucleation rate is low, and enough energy can make
Intermetallic compound grain grows excessively coarse, it is difficult to which the intermetallic compound connector for forming small grains becomes Joint Strength
Difference.Welding is completed after cooling；
H. subsequent detection.
Although description of this invention combination embodiments above carries out, those skilled in the art
Member can carry out many replacements based on the above contents, modifications and variations, be obvious.Therefore, all such substitutions,
Improvements and changes are included in the spirit and scope of appended claims.
Claims (5)
1. a kind of reflow soldering method for improving device thermal expansion deformation, which comprises the steps of:
A. prepare SMT steel mesh, by SMT steel mesh to pcb board print solder paste, will be printed on tin cream pcb board be sent into chip mounter into
Row SMT patch；
B. the good pcb board of patch is put into reflow soldering, the nitrogen after heating is passed through into reflow soldering；
C. it is once heated up, heating rate≤2 DEG C/s；
D. it keeps the temperature, and increases the rotation speed of the fan of uptake, while keeping leeward mouth rotation speed of the fan constant, the time of heat preservation is 70s-
90s, holding temperature are 150 DEG C -180 DEG C；
E. secondary temperature elevation, heating rate≤2 DEG C/s are carried out；
F. reflow soldering；
G. cooling down completes welding；
H. subsequent detection.
2. the reflow soldering method according to claim 1 for improving device thermal expansion deformation, which is characterized in that the step
In B, nitrogen gas concn is 3000PPM or less.
3. the reflow soldering method according to claim 1 for improving device thermal expansion deformation, which is characterized in that the step
In D, temperature difference≤8 DEG C.
4. the reflow soldering method according to claim 1 for improving device thermal expansion deformation, which is characterized in that the step
In F, the peak temperature of Reflow Soldering is 230 DEG C, weld interval 60s-90s.
5. the reflow soldering method according to claim 1 for improving device thermal expansion deformation, which is characterized in that the step
In G, cooling rate k is 2 DEG C/s≤k≤4 DEG C/s.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811516686.4A CN109604754B (en) | 2018-12-12 | 2018-12-12 | Reflow soldering method for improving thermal expansion deformation of device |
| PCT/CN2019/123054 WO2020119555A1 (en) | 2018-12-12 | 2019-12-04 | Reflow soldering method for ameliorating thermal expansive deformation of device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811516686.4A CN109604754B (en) | 2018-12-12 | 2018-12-12 | Reflow soldering method for improving thermal expansion deformation of device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109604754A true CN109604754A (en) | 2019-04-12 |
| CN109604754B CN109604754B (en) | 2021-10-22 |
Family
ID=66008105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811516686.4A Active CN109604754B (en) | 2018-12-12 | 2018-12-12 | Reflow soldering method for improving thermal expansion deformation of device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109604754B (en) |
| WO (1) | WO2020119555A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020119555A1 (en) * | 2018-12-12 | 2020-06-18 | 惠州光弘科技股份有限公司 | Reflow soldering method for ameliorating thermal expansive deformation of device |
| CN112149331A (en) * | 2020-09-25 | 2020-12-29 | 湖北三江航天红峰控制有限公司 | Method for establishing virtual model of hot air reflow oven based on finite element simulation |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115832124B (en) * | 2022-11-21 | 2024-01-05 | 江苏宜美照明科技股份有限公司 | Full-automatic COB patch welding method and system |
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|---|---|---|---|---|
| WO2020119555A1 (en) * | 2018-12-12 | 2020-06-18 | 惠州光弘科技股份有限公司 | Reflow soldering method for ameliorating thermal expansive deformation of device |
| CN112149331A (en) * | 2020-09-25 | 2020-12-29 | 湖北三江航天红峰控制有限公司 | Method for establishing virtual model of hot air reflow oven based on finite element simulation |
| CN112149331B (en) * | 2020-09-25 | 2022-08-19 | 湖北三江航天红峰控制有限公司 | Method for establishing virtual model of hot air reflow oven based on finite element simulation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109604754B (en) | 2021-10-22 |
| WO2020119555A1 (en) | 2020-06-18 |
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