US20130148320A1 - Method for producing an electronic module by sequential fixation of the components - Google Patents

Method for producing an electronic module by sequential fixation of the components Download PDF

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Publication number
US20130148320A1
US20130148320A1 US13/742,922 US201313742922A US2013148320A1 US 20130148320 A1 US20130148320 A1 US 20130148320A1 US 201313742922 A US201313742922 A US 201313742922A US 2013148320 A1 US2013148320 A1 US 2013148320A1
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Prior art keywords
components
component
type
board
solder
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Abandoned
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US13/742,922
Inventor
Bruno Lefevre
Jean-Yves Moreno
Christian Schwartz
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Valeo Systemes de Controle Moteur SAS
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Valeo Systemes de Controle Moteur SAS
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Priority to US13/742,922 priority Critical patent/US20130148320A1/en
Assigned to VALEO SYSTEMES DE CONTROLE MOTEUR reassignment VALEO SYSTEMES DE CONTROLE MOTEUR ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MORENO, JEAN-YVES, LEFEVRE, BRUNO, SCHWARTZ, CHRISTIAN
Publication of US20130148320A1 publication Critical patent/US20130148320A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10848—Thinned leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Definitions

  • the present invention relates to a method for producing an electronic module that can be used for example in the motor vehicle field, and a corresponding production line.
  • An electronic module usually comprises a printed circuit board onto which electronic components are soldered.
  • the current production methods include the steps of placing solder on the board, usually in the form of a paste, positioning the components on the latter and melting the solder by having the board run through a reflow oven. This step of melting the solder is normally called soldering the components.
  • This step of melting the solder is normally called soldering the components.
  • the presence of components of large size on the board or of concentrations of components in certain zones of the board cause temperature gradients in the board, that is to say that the various zones of the board do not reach the set point temperature of the reflow oven at the same time.
  • These temperature gradients cause heat stresses both on the board and on the components that have sustained the greatest heating. The heat stresses may cause a degradation of the performance and premature aging of the components.
  • the largest components also limit the heat exchanges that ensure an optimal melting of the solder by masking the smaller components or parts of the latter.
  • these larger components mask other components and prevent a visual inspection of these masked components.
  • the run in the reflow oven limits the maximal height that the components may have.
  • An object of the invention is to provide a means making it possible to limit the heat stresses during the manufacture of an electronic module.
  • provision is made for a method for producing an electronic module comprising a board with a printed circuit, at least one component of a first type and a component of a second type, the method comprising the steps of:
  • the component of the first type is soldered before the component of the second type is put in place.
  • the component of the second type therefore hampers neither the soldering of the component of the first type nor the operations of quality control of this soldering.
  • the bulky components will be positioned after the first soldering step.
  • the component of the second type may protect the component of the first type, particularly by forming a screen facing the component of the second type. This is particularly valuable when the component of the second type has a space requirement that is greater than the space requirement of the component of the first type. It is also possible to prevent concentrations of components by spreading the soldering of close components over the two soldering operations.
  • the component of the second type is soldered by applying two electrodes to each pad of the component and by running an electrical current between the electrodes to heat each pad of the component.
  • a further subject of the invention is a production line for applying this method.
  • the production line comprises a unit for putting in place components of the first type, a first heating unit for melting a solder placed between the components of the first type and the circuit, a unit for putting in place components of the second type and a second heating unit for melting a solder placed between the components of the second type and the circuit.
  • FIG. 1 is a schematic view of a production line of electronic modules according to the invention
  • FIG. 2 is a partial schematic view in perspective of such a module during the soldering of a component
  • FIG. 3 is a view similar to that of FIG. 2 of this module after the soldering of the component.
  • the production method according to the invention is used on a production line, generally identified as 1 , for producing electronic modules generally identified as 2 .
  • An electronic module 2 comprises a board 3 on which a conductive circuit 4 has been formed in order to constitute, in a manner known per se, a printed circuit board.
  • the board 3 is of the IMS (insulated metal substrate) type.
  • the circuit 4 may be formed of a conductive ink spread by screen printing over the board 3 .
  • the circuit may also consist of metal tracks attached to the board 3 .
  • the module 2 also comprises components of a first type 5 and a component of a second type 6 comprising connection pads 7 of which only one is shown in FIGS. 2 and 3 .
  • the components 5 such as control components, are of smaller size than the component 6 which is for example a power component.
  • the component 6 in this instance extends above one of the components 5 .
  • the connection pads, or more generally the connection members, of the components 5 and 6 are attached to the circuit 4 by melted solder 8 .
  • the solder 8 is in this instance solder paste made up of a mixture of tin and lead.
  • the production line 1 comprises a unit 10 for depositing the solder 8 on the circuit 4 of the boards 3 , a unit 20 for placing the components 5 , a heating unit 30 consisting in this instance of a reflow oven, a unit 40 for placing the components 6 and a unit 50 for soldering the components 6 .
  • the units 10 , 20 , 30 and 40 are known in themselves.
  • the soldering unit 50 comprises pairs of electrodes 51 connected to a source of electric power 52 in this instance delivering a current of the order of 3000 amperes at a minimum frequency of 1000 hertz.
  • the electrodes are in this instance made of cuprotungsten (25% copper and 75% tungsten).
  • the various units are connected together in conventional manner by a conveyor 60 transporting the boards 3 .
  • the circuit 4 is already printed on the boards 3 when the latter reach the production line 1 .
  • the solder 8 is deposited by screen printing on the lands for connecting the circuit 4 to the components 5 and 6 .
  • the components 5 are then placed by the unit 20 on the circuit 4 so that the members for connecting the components 5 rest on the solder 8 deposited on the corresponding connection lands of the circuit 4 .
  • the board 3 thus fitted with the components 5 then passes into the heating unit 30 which melts the solder 8 and allows the soldering of the components 5 .
  • the board 3 then travels into the unit 40 in which the component 6 is positioned on the circuit 4 so that the pads 7 of the component 6 rest on the solder 8 deposited on the corresponding connection lands of the circuit 4 .
  • the components 6 are then soldered by applying to each pad 7 of the components 6 a pair of electrodes 51 in order to run an electrical current between said electrodes via the corresponding pad 7 and heat each pad 7 of the component 6 sufficiently to cause the solder 8 to melt.
  • the pressure of the electrodes on the part to be soldered ensures that the part to be soldered is properly pressed onto the circuit.
  • the electrodes may exert a force of 12 daN on the part to be soldered.
  • Melting the solder by means of the electrodes has the advantage of being extremely fast (less than a second) while a run through the reflow oven lasts approximately one minute.
  • soldering profile and particularly the current intensity curve according to the time, the mechanical pressure of the electrodes on the component pads), the geometry of the electrodes (in order in particular to allow a better dispersal of the calories), the force exerted on the part (in order to maintain contact between the electrode and the part and prevent the formation of a spark), the spacing and positioning of the electrodes on the pads (particularly in order to modify the route taken by the current in the pads).
  • the temperature of the electrodes is kept substantially constant and relatively low, of the order of 40° C., in order to maintain the same soldering conditions for all the parts, hence the value of providing means for making it easier to disperse the calories at the electrodes, such as an appropriate geometry.
  • solder used for soldering the components 6 after soldering the components 5 by a screen printing operation.
  • the solder may also be deposited directly on the pads of the components before they are put in place on the circuit.
  • the heating unit 50 may be a reflow oven.
  • the electrodes may be made from different metals, particularly from copper, tungsten, molybdenum, etc.
  • the electrodes may therefore be made of cuprotungsten (25% copper and 75% tungsten) as in the embodiment described or be made of copper and comprise a tungsten tip for serving as the point of contact with the part to be soldered.
  • the parts to be soldered may be made of copper, brass, an alloy or a metal that may or may not be tinned, etc.
  • the board may be of the IMS type as described or be another type and for example comprise a glass and epoxy resin screen circuit like the boards of the FR4 type.
  • Solder may also be deposited in the form of a metal strip either on the circuit or on the members for connection of the components.
  • the modules may of course have a structure different from that of the above embodiment which has been specified only to explain the invention and is absolutely not limiting.
  • the components 6 placed after the boards have run through the reflow oven 30 may be bulky components or components that could be damaged by the heat prevailing in the oven.
  • the components 6 may be identical to the components 5 but soldered subsequently in order to prevent too great concentrations of components during the first soldering.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

An electronic module includes a board with a printed circuit, at least one component of a first type soldered to the board, and at least one component of a second type. The component of the second type extends above the at least one component of the first type. The at least one component of the first type is placed at least partially between the at least one component of the second type and the board and the at least one component of the second type includes a plurality of pads soldered to the board.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • The present application claims benefit under 35 U.S.C. §120 as a continuation of U.S. patent application Ser. No. 12/279,486 filed on Aug. 14, 2008, which is the National Stage of International Application No. PCT/FR2007/000270 filed on Feb. 15, 2007. Further, the present application claims benefit under 35 U.S.C. §119(a) to French Patent Application No. 0601356, filed Feb. 16, 2006. The priority applications are hereby incorporated by reference in their entirety.
    • FIELD OF THE DISCLOSURE
  • The present invention relates to a method for producing an electronic module that can be used for example in the motor vehicle field, and a corresponding production line.
    • BACKGROUND OF THE INVENTION
  • An electronic module usually comprises a printed circuit board onto which electronic components are soldered.
  • The current production methods include the steps of placing solder on the board, usually in the form of a paste, positioning the components on the latter and melting the solder by having the board run through a reflow oven. This step of melting the solder is normally called soldering the components. The presence of components of large size on the board or of concentrations of components in certain zones of the board cause temperature gradients in the board, that is to say that the various zones of the board do not reach the set point temperature of the reflow oven at the same time. These temperature gradients cause heat stresses both on the board and on the components that have sustained the greatest heating. The heat stresses may cause a degradation of the performance and premature aging of the components. To prevent or limit these temperature gradients, it is necessary to generate, according to each type of module, specific heat profiles of the reflow oven that are awkward to control.
  • The largest components also limit the heat exchanges that ensure an optimal melting of the solder by masking the smaller components or parts of the latter.
  • In addition, these larger components mask other components and prevent a visual inspection of these masked components.
  • Furthermore, with the known methods using a reflow oven, the run in the reflow oven limits the maximal height that the components may have.
  • In addition, the emergence of new standards relating to the composition of the solder risk causing a rise in the solder melting temperature. This temperature rise risks increasing the heat stresses sustained by the components. It will then be necessary to use, in order to produce the bodies of the components, technically enhanced plastics in order to withstand this temperature without damage. Certain components whose performance may be affected by an excess of heat will also have to be improved.
    • OBJECT OF THE INVENTION
  • An object of the invention is to provide a means making it possible to limit the heat stresses during the manufacture of an electronic module.
    • SUMMARY OF THE INVENTION
  • For this purpose, according to the invention, provision is made for a method for producing an electronic module comprising a board with a printed circuit, at least one component of a first type and a component of a second type, the method comprising the steps of:
      • placing solder on the board,
      • positioning the component of the first type,
      • melting the solder in order to solder the component of the first type,
      • positioning the component of the second type such that the latter extends above the component of the first type and has pads supported on the board by the solder,
      • melting the solder to solder the component of the second type.
  • Therefore, the component of the first type is soldered before the component of the second type is put in place. The component of the second type therefore hampers neither the soldering of the component of the first type nor the operations of quality control of this soldering. For example therefore the bulky components will be positioned after the first soldering step. The component of the second type may protect the component of the first type, particularly by forming a screen facing the component of the second type. This is particularly valuable when the component of the second type has a space requirement that is greater than the space requirement of the component of the first type. It is also possible to prevent concentrations of components by spreading the soldering of close components over the two soldering operations.
  • Advantageously, the component of the second type is soldered by applying two electrodes to each pad of the component and by running an electrical current between the electrodes to heat each pad of the component.
  • With this soldering method, only the pads of the component are heated, so that the component itself and the surrounding components sustain little or no temperature rise. It is therefore possible to use components having relatively average temperature-resistance properties.
  • A further subject of the invention is a production line for applying this method. The production line comprises a unit for putting in place components of the first type, a first heating unit for melting a solder placed between the components of the first type and the circuit, a unit for putting in place components of the second type and a second heating unit for melting a solder placed between the components of the second type and the circuit.
  • Other features and advantages of the invention will emerge on reading the following description of a particular, nonlimiting embodiment of the invention.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Reference will be made to the appended drawings, amongst which:
  • FIG. 1 is a schematic view of a production line of electronic modules according to the invention,
  • FIG. 2 is a partial schematic view in perspective of such a module during the soldering of a component,
  • FIG. 3 is a view similar to that of FIG. 2 of this module after the soldering of the component.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • With reference to the figures, the production method according to the invention is used on a production line, generally identified as 1, for producing electronic modules generally identified as 2.
  • An electronic module 2 comprises a board 3 on which a conductive circuit 4 has been formed in order to constitute, in a manner known per se, a printed circuit board. The board 3 is of the IMS (insulated metal substrate) type. The circuit 4 may be formed of a conductive ink spread by screen printing over the board 3. The circuit may also consist of metal tracks attached to the board 3.
  • The module 2 also comprises components of a first type 5 and a component of a second type 6 comprising connection pads 7 of which only one is shown in FIGS. 2 and 3. The components 5, such as control components, are of smaller size than the component 6 which is for example a power component. The component 6 in this instance extends above one of the components 5. The connection pads, or more generally the connection members, of the components 5 and 6 are attached to the circuit 4 by melted solder 8. The solder 8 is in this instance solder paste made up of a mixture of tin and lead.
  • The production line 1 comprises a unit 10 for depositing the solder 8 on the circuit 4 of the boards 3, a unit 20 for placing the components 5, a heating unit 30 consisting in this instance of a reflow oven, a unit 40 for placing the components 6 and a unit 50 for soldering the components 6.
  • The units 10, 20, 30 and 40 are known in themselves.
  • The soldering unit 50 comprises pairs of electrodes 51 connected to a source of electric power 52 in this instance delivering a current of the order of 3000 amperes at a minimum frequency of 1000 hertz. The electrodes are in this instance made of cuprotungsten (25% copper and 75% tungsten).
  • The various units are connected together in conventional manner by a conveyor 60 transporting the boards 3.
  • The circuit 4 is already printed on the boards 3 when the latter reach the production line 1.
  • In the unit 10, the solder 8 is deposited by screen printing on the lands for connecting the circuit 4 to the components 5 and 6.
  • The components 5 are then placed by the unit 20 on the circuit 4 so that the members for connecting the components 5 rest on the solder 8 deposited on the corresponding connection lands of the circuit 4.
  • The board 3 thus fitted with the components 5 then passes into the heating unit 30 which melts the solder 8 and allows the soldering of the components 5.
  • It is possible to carry out a visual inspection of the soldering of the components 5 at the exit of the reflow oven 30. Since the component 6 was not on the board during the run in the reflow oven 30, the weight to be heated during this run is relatively small, which makes it possible to use smaller capacity ovens or to run more boards through the oven simultaneously.
  • The board 3 then travels into the unit 40 in which the component 6 is positioned on the circuit 4 so that the pads 7 of the component 6 rest on the solder 8 deposited on the corresponding connection lands of the circuit 4.
  • The components 6 are then soldered by applying to each pad 7 of the components 6 a pair of electrodes 51 in order to run an electrical current between said electrodes via the corresponding pad 7 and heat each pad 7 of the component 6 sufficiently to cause the solder 8 to melt. It will be noted that the pressure of the electrodes on the part to be soldered ensures that the part to be soldered is properly pressed onto the circuit. As an example, the electrodes may exert a force of 12 daN on the part to be soldered.
  • Melting the solder by means of the electrodes has the advantage of being extremely fast (less than a second) while a run through the reflow oven lasts approximately one minute.
  • It is possible to influence the quality of the soldering or to adapt the soldering to the materials or the components to be soldered by modifying the soldering profile (and particularly the current intensity curve according to the time, the mechanical pressure of the electrodes on the component pads), the geometry of the electrodes (in order in particular to allow a better dispersal of the calories), the force exerted on the part (in order to maintain contact between the electrode and the part and prevent the formation of a spark), the spacing and positioning of the electrodes on the pads (particularly in order to modify the route taken by the current in the pads). The temperature of the electrodes is kept substantially constant and relatively low, of the order of 40° C., in order to maintain the same soldering conditions for all the parts, hence the value of providing means for making it easier to disperse the calories at the electrodes, such as an appropriate geometry.
  • Naturally, the invention is not limited to the embodiment described and it is possible to apply variant embodiments thereto without departing from the context of the invention as defined by the claims.
  • In particular, it is possible to deposit the solder used for soldering the components 6 after soldering the components 5 by a screen printing operation. The solder may also be deposited directly on the pads of the components before they are put in place on the circuit.
  • It is possible to heat the paste of the components in a different manner, for example by applying a soldering iron to each pad of the components 6 or of the components 5. The heating unit 50 may be a reflow oven.
  • The electrodes may be made from different metals, particularly from copper, tungsten, molybdenum, etc. The electrodes may therefore be made of cuprotungsten (25% copper and 75% tungsten) as in the embodiment described or be made of copper and comprise a tungsten tip for serving as the point of contact with the part to be soldered.
  • The parts to be soldered may be made of copper, brass, an alloy or a metal that may or may not be tinned, etc. The board may be of the IMS type as described or be another type and for example comprise a glass and epoxy resin screen circuit like the boards of the FR4 type.
  • It is possible to use other solders, tin-based, silver-based, leadless etc. Solder may also be deposited in the form of a metal strip either on the circuit or on the members for connection of the components.
  • The modules may of course have a structure different from that of the above embodiment which has been specified only to explain the invention and is absolutely not limiting. The components 6 placed after the boards have run through the reflow oven 30 may be bulky components or components that could be damaged by the heat prevailing in the oven. The components 6 may be identical to the components 5 but soldered subsequently in order to prevent too great concentrations of components during the first soldering.

Claims (3)

1.-8. (canceled)
9. An electronic module comprising:
a board with a printed circuit,
at least one component of a first type soldered to the board, and
at least one component of a second type extending above the at least one component of the first type, the at least one component of the first type being placed at least partially between the at least one component of the second type and the board, and the at least one component of the second type having a plurality of pads soldered to the board.
10. The electronic module as claimed in claim 9, wherein the at least one component of the second type is soldered by applying two electrodes to each of the plurality of pads and by running an electrical current between the electrodes to heat each of the plurality of pads of the at least one component of the second type.
US13/742,922 2006-02-16 2013-01-16 Method for producing an electronic module by sequential fixation of the components Abandoned US20130148320A1 (en)

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FR0601356A FR2897503B1 (en) 2006-02-16 2006-02-16 METHOD FOR MANUFACTURING AN ELECTRONIC MODULE BY SEQUENTIALLY FIXING COMPONENTS AND CORRESPONDING PRODUCTION LINE
FR0601356 2006-02-16
PCT/FR2007/000270 WO2007093709A1 (en) 2006-02-16 2007-02-15 Method for producing an electronic module by sequential fixation of the components
US27948608A 2008-11-18 2008-11-18
US13/742,922 US20130148320A1 (en) 2006-02-16 2013-01-16 Method for producing an electronic module by sequential fixation of the components

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US13/742,922 Abandoned US20130148320A1 (en) 2006-02-16 2013-01-16 Method for producing an electronic module by sequential fixation of the components
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US20090166339A1 (en) 2009-07-02
WO2007093710A3 (en) 2007-10-04
JP2009527116A (en) 2009-07-23
US20130301231A1 (en) 2013-11-14
FR2897503B1 (en) 2014-06-06
US20090217519A1 (en) 2009-09-03
FR2897503A1 (en) 2007-08-17
JP2009527115A (en) 2009-07-23
EP1985165A2 (en) 2008-10-29
US8468691B2 (en) 2013-06-25
PL1985165T3 (en) 2014-10-31
JP5185831B2 (en) 2013-04-17
EP1985164B1 (en) 2014-06-11
WO2007093709A1 (en) 2007-08-23
PL1985164T3 (en) 2014-11-28
WO2007093710A2 (en) 2007-08-23
EP1985165B1 (en) 2014-06-11
EP2787797A1 (en) 2014-10-08
EP1985164A1 (en) 2008-10-29
JP4890568B2 (en) 2012-03-07
US9706694B2 (en) 2017-07-11

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