CN104507271A - Plug-in component technology and surface mount technology combination based PCBA (printed circuit board assembly) machining method and PCBA - Google Patents

Plug-in component technology and surface mount technology combination based PCBA (printed circuit board assembly) machining method and PCBA Download PDF

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Publication number
CN104507271A
CN104507271A CN201410842874.1A CN201410842874A CN104507271A CN 104507271 A CN104507271 A CN 104507271A CN 201410842874 A CN201410842874 A CN 201410842874A CN 104507271 A CN104507271 A CN 104507271A
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China
Prior art keywords
plug
technique
components
pcba
parts
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Application number
CN201410842874.1A
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CN104507271B (en
Inventor
李荣尧
秦波
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K&JAD TECHNOLOGY Co Ltd
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K&JAD TECHNOLOGY Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding

Abstract

The invention discloses a plug-in component technology and surface mount technology combination based PCBA (printed circuit board assembly) machining method and a PCBA. The method includes the steps: S1, attaching a plug-in component on a PCB with a surface mount bonding pad, and fixing the component which is packaged in a plug-in manner; S2, subjecting the PCB mounted with the component to automatic spot heating welding, and welding pins of the component in plug-in package on the surface mount bonding pad of the PCB. The PCB is provided with the plug-in packaged component and the surface mount bonding pad, and the pins of the plug-in packaged component are welded on the surface mount bonding pad. The advantages of plug-in technology and the surface mount technology are fused, the plug-in packaged component and the PCB with the surface mount ponding pad are utilized, and the automatic spot heating welding technology is combined, so that labor cost and material cost of PCBA machining are saved, the requirement on temperature resistance of the component is lowered, production efficiency and product percent of pass of the PCB are increased, and good social and economic benefits are gained. The method can be widely applied to various PCBA machining technologies.

Description

The PCBA processing method combined based on plug-in element technique and paster technique and PCBA board
Technical field
The present invention relates to circuit board manufacture field, particularly relate to a kind of PCBA method for processing semi-finished product, the invention still further relates to a kind of PCBA board.
Background technology
Printed circuit board, also known as printed circuit board (PCB), printed substrate, normal use english abbreviation PCB(Printed circuit board) or write PWB(Printed wire board), take insulation board as base material, be cut into certain size, at least with a conductive pattern on it, and cloth porose (as component hole, fastener hole, plated-through hole etc.), be used for replacing the chassis of device electronic devices and components in the past, and realize being interconnected between electronic devices and components.Because this plate adopts electron printing to make, therefore be called as " printing " circuit board.
PCBA is the abbreviation of English Printed Circuit Board+Assembly, that is PCB hollow plate part on SMT, then through the whole processing procedure of DIP plug-in unit, is called for short PCBA.
PCBA processing method of the prior art has two kinds: plug-in unit technique and paster technique.
1. plug-in unit technique.
The step of plug-in unit technique is: on PCB, fix components and parts (as: rubberizing paper or use bonded adhesives etc. simply can fix the mode of components and parts), more artificial plug-in unit (components and parts and PCB are plug-in type), then wave-soldering.The inferior position of plug-in unit technique is that the cost of labor cost of plug-in unit process or pin Forging Process is higher, efficiency is low; Advantage is plug-in unit technique paster technique on year-on-year basis, and lower to the temperature requirement of components and parts, product cost is low.
2. paster technique.
The step of paster technique is: first manually or machine on PCB, add tin cream (or similar method simply can fixing components and parts), then machine paste components and parts (components and parts are bonded on tin cream, simply fixing; Components and parts and PCB are SMD), then Reflow Soldering.
The inferior position of paster technique is to require higher to the temperature tolerance of components and parts, as used plug-in element, causes fraction defective high, thus the corresponding raising of defective cost caused (if use SMD components, the cost of its components and parts own will be high); Advantage is paster technique plug-in unit technique on year-on-year basis, has saved the cost that artificial plug-in unit spends.
Summary of the invention
In order to solve the problems of the technologies described above, the object of this invention is to provide one and can save artificial and components and parts cost, the PCBA board processed with PCBA processing method and this processing method of conforming product rate of simultaneously enhancing productivity again.
The technical solution adopted in the present invention is:
Based on the PCBA processing method that plug-in element technique and paster technique combine, it comprises step: S1, and the pcb board with paster pad sticks plug-in components, and fixing components and parts, described components and parts are plug-in unit encapsulation; S2, carries out point automatically to the pcb board posting components and parts and adds thermal weld, the pin of the components and parts of plug-in unit encapsulation is welded on the paster pad of pcb board.
Preferably, described step S1 specifically comprises sub-step: S11, first rubberizing paper on pcb board; S12, is simply fixed on the components and parts of plug-in unit encapsulation on pcb board through automatic pasting technique.
Preferably, described step S2 is specially sub-step: S21, automatic tack weld; S22, tin on solder joint also adds thermal weld.
Preferably, before described step S1, also comprise step: S0, cutting process is carried out to the components and parts of plug-in unit encapsulation.
Preferably, described components and parts are infrared tube.
Based on the PCBA board that plug-in element technique combines based on plug-in element technique and paster technique, it has components and parts and the paster pad of plug-in unit encapsulation, and the pin of the components and parts of described plug-in unit encapsulation is welded on paster pad.
Preferably, described components and parts are infrared tube.
The invention has the beneficial effects as follows:
A kind of PCBA processing method combined based on plug-in element technique and paster technique of the present invention has merged the advantage of plug-in unit technique and paster technique, the components and parts utilizing plug-in unit to encapsulate and the pcb board with paster pad, in conjunction with automatically putting heating solder technology, save cost of labor and the Material Cost of PCBA processing, reduce the requirement of components and parts heatproof, improve production efficiency and the conforming product rate of pcb board, there is good economic and social benefit.
The present invention can be widely used in various PCBA processing technology.
Another beneficial effect of the present invention is:
A kind of PCBA board combined based on plug-in element technique and paster technique based on plug-in element technique of the present invention, its course of processing has merged the advantage of plug-in unit technique and paster technique, the components and parts utilizing plug-in unit to encapsulate and the pcb board with paster pad, in conjunction with automatically putting heating solder technology, save cost of labor and the Material Cost of PCBA processing, reduce the requirement of components and parts heatproof, improve production efficiency and the conforming product rate of pcb board, there is good economic and social benefit.
The present invention can be widely used in various pcb board.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further:
Fig. 1 is the method flow diagram of a kind of a kind of embodiment of PCBA processing method combined based on plug-in element technique and paster technique of the present invention;
Fig. 2 is the structural upright schematic diagram of a kind of a kind of embodiment of PCBA board combined based on plug-in element technique and paster technique of the present invention;
Fig. 3 is the structure schematic side view of a kind of a kind of embodiment of PCBA board combined based on plug-in element technique and paster technique of the present invention;
Fig. 4 is the structure schematic top plan view of a kind of a kind of embodiment of PCBA board combined based on plug-in element technique and paster technique of the present invention.
Embodiment
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.
As shown in Figure 1, a kind of PCBA processing method combined based on plug-in element technique and paster technique, it is characterized in that, it comprises step: S1, and the pcb board with paster pad sticks plug-in components, and fixing components and parts, described components and parts are plug-in unit encapsulation; S2, carries out point automatically to the pcb board posting components and parts and adds thermal weld, the pin of the components and parts of plug-in unit encapsulation is welded on the paster pad of pcb board.Described Automatic-heating is welded as non-reflow Welding, such as utilizes automatic positioning welding to heat separately the pin of the components and parts that plug-in unit encapsulates and welds.
As shown in Figures 2 to 4, described step S1 specifically comprises sub-step: S11, first rubberizing paper on pcb board 1; S12, components and parts 2PCB plate 1 is simply fixed on the components and parts 2 that plug-in unit encapsulates on pcb board 1 through automatic pasting technique.Described paster technique, refers to and uses chip mounter that plug-in components 2 is attached on pcb board 1, can use bonded adhesives, gummed paper or other can the mode of simple fixing pluge components and parts 2, plug-in components 2 elder generation is simply fixed on pcb board 1.
Preferably, described step S2 is specially sub-step: S21, automatic tack weld; S22, tin on solder joint also adds thermal weld.Wherein, gather pcb board 1 image by vision sensor, utilize graphical analysis to find out solder joint (position that the pin 21 of the components and parts 2 of plug-in unit encapsulation and the paster pad 11 of pcb board 1 join), then command manipulator tin add thermal weld on solder joint.
Preferably, before described step S1, also comprise step: S0, cutting process is carried out to the components and parts 2 of plug-in unit encapsulation.First can carry out cutting process to the components and parts 2 of plug-in unit encapsulation, the pin 21 of components and parts 2 is switched to unified and suitable height.
Preferably, described components and parts 2 are infrared tube.For infrared tube, the infrared tube that the infrared tube due to plug-in unit encapsulation compares paster encapsulation has low, the resistant to elevated temperatures advantage of cost, and if the infrared tube requiring paster to encapsulate high temperature resistant, so cost can corresponding increasing, therefore selects the infrared tube that plug-in unit encapsulates.
A kind of PCBA processing method combined based on plug-in components 2 technique and paster technique of the present invention has merged the advantage of plug-in unit technique and paster technique, the components and parts 2 utilizing plug-in unit to encapsulate and the pcb board 1 with paster pad 11, in conjunction with automatically putting heating solder technology, save cost of labor and the Material Cost of PCBA processing, reduce the requirement of components and parts 2 heatproof, improve production efficiency and the conforming product rate of pcb board 1, there is good economic and social benefit.
The present invention can be widely used in various PCBA processing technology.
As shown in Figures 2 to 4, a kind of PCBA board combined based on plug-in element technique and paster technique, it has components and parts 2 and the paster pad 11 of plug-in unit encapsulation, and the pin 21 of the components and parts 2 of described plug-in unit encapsulation is welded on paster pad 11.
Preferably, described components and parts 2 are infrared tube.For infrared tube, the infrared tube that the infrared tube due to plug-in unit encapsulation compares paster encapsulation has low, the resistant to elevated temperatures advantage of cost, and if the infrared tube requiring paster to encapsulate high temperature resistant, so cost can corresponding increasing, therefore selects the infrared tube that plug-in unit encapsulates.
A kind of PCBA board combined based on plug-in element technique and paster technique of the present invention, its course of processing has merged the advantage of plug-in unit technique and paster technique, the components and parts 2 utilizing plug-in unit to encapsulate and the pcb board 1 with paster pad 11, in conjunction with automatically putting heating solder technology, save cost of labor and the Material Cost of PCBA processing, reduce the requirement of components and parts 2 heatproof, improve production efficiency and the conforming product rate of pcb board 1, there is good economic and social benefit.
The present invention can be widely used in various pcb board 1.
More than that better enforcement of the present invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to spirit of the present invention, and these equivalent distortion or replacement are all included in the application's claim limited range.

Claims (7)

1., based on the PCBA processing method that plug-in element technique and paster technique combine, it is characterized in that, it comprises step:
S1, the pcb board with paster pad sticks plug-in components, and fixing components and parts, described components and parts are plug-in unit encapsulation;
S2, carries out point automatically to the pcb board posting components and parts and adds thermal weld, the pin of the components and parts of plug-in unit encapsulation is welded on the paster pad of pcb board.
2. a kind of PCBA processing method combined based on plug-in element technique and paster technique according to claim 1, it is characterized in that, described step S1 specifically comprises sub-step:
S11, first rubberizing paper on pcb board;
S12, is simply fixed on the components and parts of plug-in unit encapsulation on pcb board through automatic pasting technique.
3. a kind of PCBA processing method combined based on plug-in element technique and paster technique according to claim 1, it is characterized in that, described step S2 is specially sub-step:
S21, automatic tack weld;
S22, tin on solder joint also adds thermal weld.
4. a kind of PCBA processing method combined based on plug-in element technique and paster technique according to any one of claims 1 to 3, is characterized in that, before described step S1, also comprise step:
S0, carries out cutting process to the components and parts of plug-in unit encapsulation.
5. a kind of PCBA processing method combined based on plug-in element technique and paster technique according to claim 4, it is characterized in that, described components and parts are infrared tube.
6. based on the PCBA board that plug-in element technique combines based on plug-in element technique and paster technique, it is characterized in that, it has components and parts and the paster pad of plug-in unit encapsulation, and the pin of the components and parts of described plug-in unit encapsulation is welded on paster pad.
7., based on the PCBA board that plug-in element technique combines based on plug-in element technique and paster technique, it is characterized in that, described components and parts are infrared tube.
CN201410842874.1A 2014-12-29 2014-12-29 The PCBA processing methods and PCBA board combined based on plug-in element technique and paster technique Active CN104507271B (en)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104968161A (en) * 2015-06-30 2015-10-07 深圳市志祥科技有限公司 LED lamp lighting device circuit board production process
CN105120602A (en) * 2015-07-30 2015-12-02 柳州市美源科技股份有限公司 Small and medium-sized PCB components mixed installing technology
CN105228345A (en) * 2015-11-05 2016-01-06 福建众益太阳能科技股份公司 Solar lamp, PCB and preparation method thereof for Solar lamp
CN106937482A (en) * 2017-03-31 2017-07-07 柳州译海网络科技有限公司 A kind of electronic product method for manufacturing of energy-saving and emission-reduction
CN108617108A (en) * 2018-06-28 2018-10-02 宁波高新区技领电源有限公司 A kind of patch welding procedure of horizontal patch capacitor
CN108668463A (en) * 2018-04-04 2018-10-16 深圳珈伟光伏照明股份有限公司 A kind of welding method of axial direction potted element
CN108990309A (en) * 2017-05-31 2018-12-11 罗伯特·博世有限公司 For assembling the attachment device and corresponding method of electronic component on circuit boards
CN110121238A (en) * 2019-05-06 2019-08-13 深圳市华星光电技术有限公司 A kind of package assembly and its method of the printed circuit board with plug-in type electrolytic capacitor
CN112996272A (en) * 2021-02-02 2021-06-18 广州市爱浦电子科技有限公司 Manufacturing method of novel power supply structure

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JPH10247697A (en) * 1997-03-04 1998-09-14 Sony Corp Surface mounting type semiconductor plastic package and its manufacture
CN101575488A (en) * 2008-05-08 2009-11-11 松下电器产业株式会社 Surface mount adhesive, mounting structure including the same, and method for producing mounting structure
CN101977484A (en) * 2010-11-23 2011-02-16 南京熊猫电子制造有限公司 PCB (Printed Circuit Board) production line combining manual in process processing and paster processing
CN202121094U (en) * 2011-06-15 2012-01-18 杭州富阳恒泰汽车电器有限公司 Surface-mount type connector assembly

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH04314354A (en) * 1991-04-12 1992-11-05 Nippon Avionics Co Ltd Surface mounting parts
JPH10247697A (en) * 1997-03-04 1998-09-14 Sony Corp Surface mounting type semiconductor plastic package and its manufacture
CN101575488A (en) * 2008-05-08 2009-11-11 松下电器产业株式会社 Surface mount adhesive, mounting structure including the same, and method for producing mounting structure
CN101977484A (en) * 2010-11-23 2011-02-16 南京熊猫电子制造有限公司 PCB (Printed Circuit Board) production line combining manual in process processing and paster processing
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104968161A (en) * 2015-06-30 2015-10-07 深圳市志祥科技有限公司 LED lamp lighting device circuit board production process
CN105120602A (en) * 2015-07-30 2015-12-02 柳州市美源科技股份有限公司 Small and medium-sized PCB components mixed installing technology
CN105228345A (en) * 2015-11-05 2016-01-06 福建众益太阳能科技股份公司 Solar lamp, PCB and preparation method thereof for Solar lamp
CN106937482A (en) * 2017-03-31 2017-07-07 柳州译海网络科技有限公司 A kind of electronic product method for manufacturing of energy-saving and emission-reduction
CN108990309A (en) * 2017-05-31 2018-12-11 罗伯特·博世有限公司 For assembling the attachment device and corresponding method of electronic component on circuit boards
CN108990309B (en) * 2017-05-31 2021-02-12 罗伯特·博世有限公司 Connecting device for mounting electronic components on a circuit board and corresponding method
CN108668463A (en) * 2018-04-04 2018-10-16 深圳珈伟光伏照明股份有限公司 A kind of welding method of axial direction potted element
CN108617108A (en) * 2018-06-28 2018-10-02 宁波高新区技领电源有限公司 A kind of patch welding procedure of horizontal patch capacitor
CN110121238A (en) * 2019-05-06 2019-08-13 深圳市华星光电技术有限公司 A kind of package assembly and its method of the printed circuit board with plug-in type electrolytic capacitor
CN112996272A (en) * 2021-02-02 2021-06-18 广州市爱浦电子科技有限公司 Manufacturing method of novel power supply structure

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