CN108594902A - A kind of ideal warm stove curve creation method of Reflow Soldering and its application process - Google Patents
A kind of ideal warm stove curve creation method of Reflow Soldering and its application process Download PDFInfo
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- CN108594902A CN108594902A CN201810349756.5A CN201810349756A CN108594902A CN 108594902 A CN108594902 A CN 108594902A CN 201810349756 A CN201810349756 A CN 201810349756A CN 108594902 A CN108594902 A CN 108594902A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- Automation & Control Theory (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention discloses a kind of ideal warm stove curve creation method of Reflow Soldering, including determines tin cream parameter；Judge the size of PCBA board, including big plate, middle plate and platelet；Draw tin cream characteristic curve；Reflow soldering is adjusted according to tin cream characteristic curve, PCBA productions furnace temperature is made to meet tin cream characteristic curve；According to identical oven temperature profile and tolerance value, it is created that each upper limit curve of furnace temperature and lower limit curve, then Intermediate Gray is then ideal curve.The parameters that a kind of ideal warm stove curve creation method of Reflow Soldering of the present invention passes through combination tin cream, and each section of curve is determined according to the size of the PCBA board of welding, allow reflow soldering oven temperature profile independent of the subjective experience value of process engineer, objectively show the requirement of reflow soldering furnace temperature, it is accurate to provide reflow soldering temperature scale, improve reflow soldering quality, can be simple and quick find suitable reflux furnace temperature, improve production efficiency.
Description
Technical field
The present invention relates to the ideal warm stove curve creation method in the field of being welded more particularly to a kind of Reflow Soldering and its application sides
Method.
Background technology
Reflow Soldering is one kind in three kinds of main techniques in SMT attachment process.Reflow Soldering is primarily used to welding and has pasted
The wiring board for installing element makes surface mount elements be merged with circuit pads tin cream thawing and welds together, then again by heating
Tin cream is cooled down by the cooling of Reflow Soldering, element and pad are solidified togather.
In entire welding process, the oven temperature profile of Reflow Soldering has vital effect to the welding of electronic component,
Temperature is too low to lead to failure welding, and temperature is excessively high and component can be caused to damage, and heating slope can make very much component drawing crack soon,
Qualitative change can occur for the too slow tin cream of heating, influence quality of welding spot.Therefore, a good process curve is shown in entire production process
It obtains particularly important.
All it is each factory process engineer of oneself, according to tin cream currently, without relevant standardized process curve
Data and the PCBA produced artificially assess oven temperature profile.
Invention content
The purpose of the present invention is that solve the above-mentioned problems and provides a kind of ideal warm stove curve establishment side of Reflow Soldering
Method and its application process.
The present invention is achieved through the following technical solutions above-mentioned purpose：
A kind of ideal warm stove curve creation method of Reflow Soldering, includes the following steps：
S1, tin cream parameter is determined, including：
Preheating zone, initial temperature, heating slope range；
Heat preservation zone, temperature range, time range；
Recirculating zone, peak temperature range, liquid phase state duration range, tin cream fusing point, tin cream solidification point；
Cooling zone, descending temperature ramp back down range, cooling end temp；
S2, the size for judging PCBA board, including big plate, middle plate and platelet；
When it is big plate, the equal capping value of tin cream parameter, when being middle plate and platelet, tin cream parameter takes in bound
Between be worth；
S3, tin cream characteristic curve is drawn；
S4, reflow soldering is adjusted according to tin cream characteristic curve, PCBA productions furnace temperature is made to meet tin cream characteristic curve；
S5, basis identical oven temperature profile and tolerance value, are created that each upper limit curve of furnace temperature and lower limit curve, then
Intermediate Gray is then ideal curve.
Specifically, the tin cream characteristic curve includes preheating zone, heat preservation zone, recirculating zone and cooling zone, above-mentioned steps S3 packets
Include following steps：
A1, Drawing of Curve coordinate system is created, using temperature value as ordinate, time value is abscissa；
A2, preheating zone Drawing of Curve set the starting point of preheating zone curve as A points, and terminal is B points；
Using initial temperature, time value be 0 point be used as A points, with heat preservation zone temperature be B points ordinate, the abscissa of B points
For：(B ordinate-A ordinates)/heating slope
A points and B points are connected, preheating zone temperature curve is obtained；
A3, heat preservation zone Drawing of Curve set the terminal of heat preservation zone curve as C points, and are risen using B points as heat preservation zone curve
Point；
The ordinate of C points is the holding temperature in tin cream parameter, and the abscissa of C points is B point abscissas and heat preservation zone time
The sum of, B points and C points are connected, heat preservation zone temperature curve is obtained；
Reflux is divided into the first rising area, the second rising area and descending area by A4, recirculating zone Drawing of Curve, and first rises
The starting point in area is C points, and the terminal of the first rising area is D points, and the starting point of the second rising area is D points, and the terminal of the second rising area is E
The starting point of point, descending area is E points, and the terminal of descending area is F points；
D point ordinates are the fusing point of tin cream, set the heating slope of C points and D points as 2 DEG C/S, the abscissa of D points is：(tin
Cream fusing point-C points ordinate)/2；
F point ordinates are tin cream solidification point, and the abscissa of F points is：D points abscissa+liquid phase state duration；
E point ordinates are peak temperature, and the abscissa of E points is：D points abscissa+liquid phase state duration/2；
It is sequentially connected C points and D points, D points and E points, E points and F points, obtains recirculating zone temperature curve；
A5, cooling zone Drawing of Curve set the terminal of cooling zone curve as G points, and starting point is F points；
The ordinate of G points is cooling end temp, and the abscissa of G is：(tin cream fusing point-G points ordinate)/descending temperature ramp back down；
F points and G points are connected, cooling zone temperature curve is obtained.
Specifically, the adjusting of reflow soldering includes that preheating zone is adjusted, heat preservation zone is adjusted, recirculating zone adjusts and cooling zone tune
Section；
The method that the preheating zone is adjusted includes：If reaching B point overlong times, shorten preheating time, if reaching B
The point time is too short, then lengthens preheating time；
The method that the heat preservation zone is adjusted includes：If shortening soaking time to C point overlong times by B points, if by
B points are too short to the C point times, then lengthen soaking time；
The method that the recirculating zone is adjusted includes：If shortening heat preservation zone with peak value temperature to D point overlong times by C points
If the time of degree lengthens time of the heat preservation zone with peak temperature too short to the D point times by C points；If E point temperature is excessively high,
Peak temperature temperature is then reduced, if E point temperature is too low, increases peak temperature temperature；If D points and F point overlong times,
The reduction recirculating zone time lengthens the recirculating zone time if D points and F point times are too short；
The method that the cooling zone is adjusted includes：If by the overlong time of F points to G points, increases cooling area wind speed, carry
Height cooling efficiency reduces cooling area wind speed if too short by the time of F points to G points, reduces cooling efficiency.
The beneficial effects of the present invention are：
A kind of ideal warm stove curve creation method of Reflow Soldering of the present invention is by combining the parameters of tin cream, and according to welding
The size of PCBA board determine each section of curve, allow reflow soldering oven temperature profile independent of the subjective experience value of process engineer,
The requirement of reflow soldering furnace temperature is objectively showed, reflow soldering temperature scale standard is provided, improves reflow soldering quality, it can be simple and quick
Find suitable reflux furnace temperature, improve production efficiency.
Description of the drawings
Fig. 1 is the temperature curve that a kind of ideal warm stove curve creation method of Reflow Soldering of the present invention creates.
Specific implementation mode
The invention will be further described below in conjunction with the accompanying drawings：
As shown in Figure 1, a kind of ideal warm stove curve creation method of Reflow Soldering of the present invention, includes the following steps：
1) tin cream parameter is determined, including：
Preheating zone, initial temperature, heating slope range；
Heat preservation zone, temperature range, time range；
Recirculating zone, peak temperature range, liquid phase state duration range, tin cream fusing point, tin cream solidification point；
Cooling zone, descending temperature ramp back down range, cooling end temp；
The above parameter is exactly tin cream characterisitic parameter, can be obtained from the data of tin cream, is the prior art, need not do and have
The explanation of body；Furnace temperature has to meet tin cream characteristic, within tin cream communication window.
2) judge the size of PCBA board, including big plate, middle plate and platelet；
3) Drawing of Curve coordinate system is created, using temperature value as ordinate, time value is abscissa；
Tin cream characteristic curve includes preheating zone, heat preservation zone, recirculating zone and cooling zone；
4) preheating zone Drawing of Curve sets the starting point of preheating zone curve as A points, and terminal is B points；
Using initial temperature, time value be 0 point be used as A points, with heat preservation zone temperature be B points ordinate, the abscissa of B points
For：(B ordinate-A ordinates)/heating slope, connects A points and B points, obtains preheating zone temperature curve；
The selection of heating slope at this time is selected according to the size of PCBA board, if PCBA board is big plate, heat up slope
The upper limit value of heating slope range is taken, if PCBA board is middle plate, platelet, heating slope takes the upper limit value of heating slope range under
Median between limit value.
5) heat preservation zone Drawing of Curve sets the terminal of heat preservation zone curve as C points, and using B points as the heat preservation zone origin of curve；
The ordinate of C points is the holding temperature in tin cream parameter, and the abscissa of C points is B point abscissas and heat preservation zone time
The sum of, B points and C points are connected, heat preservation zone temperature curve is obtained；
The selection of holding temperature at this time is selected according to the size of PCBA board, if PCBA board is big plate, holding temperature
The maximum value of heat-preserving range is taken, if PCBA board is middle plate, platelet, holding temperature takes between the maximum value of heat-preserving range and minimum value
Median.
6) reflux is divided into the first rising area, the second rising area and descending area, the first rising area by recirculating zone Drawing of Curve
Starting point be C points, the terminal of the first rising area is D points, and the starting point of the second rising area is D points, and the terminal of the second rising area is E
The starting point of point, descending area is E points, and the terminal of descending area is F points；
D point ordinates are the fusing point of tin cream, set the heating slope of C points and D points as 2 DEG C/S, the abscissa of D points is：(tin
Cream fusing point-C points ordinate)/2；
F point ordinates are tin cream solidification point, and the abscissa of F points is：D points abscissa+liquid phase state duration；
E point ordinates are peak temperature, and the abscissa of E points is：D points abscissa+liquid phase state duration/2；
It is sequentially connected C points and D points, D points and E points, E points and F points, obtains recirculating zone temperature curve；
The selection of peak temperature at this time is selected according to the size of PCBA board, if PCBA board is big plate, peak temperature
The maximum value of peak temperature range is taken, if PCBA board is middle plate, platelet, peak temperature takes the maximum value and most of peak temperature range
Median between small value.
The selection of liquid phase state duration at this time is selected according to the size of PCBA board, if PCBA board is big plate, liquid phase state
Duration takes the maximum value of liquid phase state duration range, if PCBA board is middle plate, platelet, liquid phase state duration takes liquid phase state duration range
Median between maximum value and minimum value.
7) cooling zone Drawing of Curve sets the terminal of cooling zone curve as G points, and starting point is F points；
The ordinate of G points is cooling end temp, and the abscissa of G is：(tin cream fusing point-G points ordinate)/descending temperature ramp back down；
F points and G points are connected, cooling zone temperature curve is obtained.
The selection of cooling end temp at this time is selected according to the size of PCBA board, cooling if PCBA board is big plate
End temp takes the maximum value of cooling end temp range, if PCBA board is middle plate, platelet, cooling end temp takes cooling to terminate
Median between the maximum value and minimum value of temperature range.
8) after obtaining above-mentioned characteristic curve, by adjusting reflow soldering, keep the characteristic that PCBA productions furnace temperature meets tin cream bent
Line.
Preheating zone is adjusted：If reaching B point overlong times, shorten preheating time, it is on the contrary then lengthen preheating time
Heat preservation zone is adjusted：If by B points to C point overlong times, shorten soaking time, it is on the contrary then lengthen soaking time.
Recirculating zone is adjusted：If shortening time of the heat preservation zone with peak temperature to D point overlong times by C points, it is on the contrary then
It lengthens.If E point temperature is excessively high, peak temperature temperature is reduced, it is on the contrary then increase peak value warm area temperature；If when D points and F points
Between it is long, then reduce the recirculating zone time, it is on the contrary then lengthen the recirculating zone time
Cooling zone is adjusted：If by the overlong time of F points to G points, increase cooling area wind speed, improves cooling efficiency, instead
Then reduce cooling area wind speed.
9) according to identical oven temperature profile and tolerance value, each upper limit curve of furnace temperature and lower limit curve are created that, then
Intermediate Gray is then ideal curve.
Technical scheme of the present invention is not limited to the limitation of above-mentioned specific embodiment, every to do according to the technique and scheme of the present invention
The technology deformation gone out, each falls within protection scope of the present invention.
Claims (3)
1. a kind of ideal warm stove curve creation method of Reflow Soldering, it is characterised in that：Include the following steps：
S1, tin cream parameter is determined, including：
Preheating zone, initial temperature, heating slope range；
Heat preservation zone, temperature range, time range；
Recirculating zone, peak temperature range, liquid phase state duration range, tin cream fusing point, tin cream solidification point；
Cooling zone, descending temperature ramp back down range, cooling end temp；
S2, the size for judging PCBA board, including big plate, middle plate and platelet；
When it is big plate, the equal capping value of tin cream parameter, when being middle plate and platelet, tin cream parameter takes the centre of bound
Value；
S3, tin cream characteristic curve is drawn；
S4, reflow soldering is adjusted according to tin cream characteristic curve, PCBA productions furnace temperature is made to meet tin cream characteristic curve；
S5, basis identical oven temperature profile and tolerance value, are created that each upper limit curve of furnace temperature and lower limit curve, then intermediate
Band is then ideal curve.
2. the ideal warm stove curve creation method of a kind of Reflow Soldering according to claim 1, which is characterized in that the tin cream is special
Linearity curve includes preheating zone, heat preservation zone, recirculating zone and cooling zone, and above-mentioned steps S3 includes the following steps：
A1, Drawing of Curve coordinate system is created, using temperature value as ordinate, time value is abscissa；
A2, preheating zone Drawing of Curve set the starting point of preheating zone curve as A points, and terminal is B points；
A points are used as using initial temperature, the point that time value is 0, with the ordinate that heat preservation zone temperature is B points, the abscissa of B points is：
(B ordinate-A ordinates)/heating slope
A points and B points are connected, preheating zone temperature curve is obtained；
A3, heat preservation zone Drawing of Curve set the terminal of heat preservation zone curve as C points, and using B points as the heat preservation zone origin of curve；
The ordinate of C points is the holding temperature in tin cream parameter, and the abscissas of C points is the sum of B point abscissas and heat preservation zone time,
B points and C points are connected, heat preservation zone temperature curve is obtained；
Reflux is divided into the first rising area, the second rising area and descending area by A4, recirculating zone Drawing of Curve, the first rising area
Starting point is C points, and the terminal of the first rising area is D points, and the starting point of the second rising area is D points, and the terminal of the second rising area is E points,
The starting point of descending area is E points, and the terminal of descending area is F points；
D point ordinates are the fusing point of tin cream, set the heating slope of C points and D points as 2 DEG C/S, the abscissa of D points is：(tin cream is molten
Point-C points ordinate)/2；
F point ordinates are tin cream solidification point, and the abscissa of F points is：D points abscissa+liquid phase state duration；
E point ordinates are peak temperature, and the abscissa of E points is：D points abscissa+liquid phase state duration/2；
It is sequentially connected C points and D points, D points and E points, E points and F points, obtains recirculating zone temperature curve；
A5, cooling zone Drawing of Curve set the terminal of cooling zone curve as G points, and starting point is F points；
The ordinate of G points is cooling end temp, and the abscissa of G is：(tin cream fusing point-G points ordinate)/descending temperature ramp back down；
F points and G points are connected, cooling zone temperature curve is obtained.
3. the ideal warm stove curve creation method of a kind of Reflow Soldering according to claim 2, which is characterized in that reflow soldering
Adjusting includes that preheating zone is adjusted, heat preservation zone is adjusted, recirculating zone is adjusted and cooling zone is adjusted；
The method that the preheating zone is adjusted includes：If reaching B point overlong times, shorten preheating time, if reach B points
Between it is too short, then lengthen preheating time；
The method that the heat preservation zone is adjusted includes：If shortening soaking time to C point overlong times by B points, if by B points
It is too short to the C point times, then lengthen soaking time；
The method that the recirculating zone is adjusted includes：If shortening heat preservation zone with peak temperature to D point overlong times by C points
If time lengthens time of the heat preservation zone with peak temperature too short to the D point times by C points；If E point temperature is excessively high, drop
Lower peak temperatures temperature increases peak temperature temperature if E point temperature is too low；If D points and F point overlong times, reduce
The recirculating zone time lengthens the recirculating zone time if D points and F point times are too short；
The method that the cooling zone is adjusted includes：If by the overlong time of F points to G points, increase cooling area wind speed, improves drop
Warm efficiency reduces cooling area wind speed if too short by the time of F points to G points, reduces cooling efficiency.
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Cited By (11)
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|---|---|---|---|---|
| CN109332841A (en) * | 2018-12-20 | 2019-02-15 | 安徽华东光电技术研究所有限公司 | The method for establishing ROGERS plate Yu case weld thermal reflow profile |
| CN109688727A (en) * | 2018-12-26 | 2019-04-26 | 无锡市同步电子制造有限公司 | One kind having lead pb-free solder method |
| CN110248495A (en) * | 2019-05-31 | 2019-09-17 | 深圳市英创立电子有限公司 | Tin cream Reflow Soldering and glue technique for fixing |
| CN111459210A (en) * | 2020-04-15 | 2020-07-28 | 苏州市杰煜电子有限公司 | PCB reflow temperature control method |
| CN112091347A (en) * | 2020-08-31 | 2020-12-18 | 浙江双宇电子科技有限公司 | Novel tin-dispensing and reflow soldering process method for solar photovoltaic junction box |
| CN112257280A (en) * | 2020-10-29 | 2021-01-22 | 桂林电子科技大学 | Liquid-solid phase continuous form prediction method for reflow soldering BGA group soldering points |
| CN112632856A (en) * | 2020-12-21 | 2021-04-09 | 江苏警官学院 | Conveyor belt speed and temperature control method of reflow furnace |
| CN112756728A (en) * | 2021-01-25 | 2021-05-07 | 北京遥测技术研究所 | Method for determining reflow soldering process parameters |
| CN113011031A (en) * | 2021-03-24 | 2021-06-22 | 西南石油大学 | Optimal design method based on reflow furnace temperature curve |
| CN114083073A (en) * | 2021-10-21 | 2022-02-25 | 杭州电子科技大学 | Improved reflow furnace temperature optimization method |
| CN117226331A (en) * | 2023-11-13 | 2023-12-15 | 深圳市捷汇多科技有限公司 | Welding process monitoring and analyzing method, device and system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109332841A (en) * | 2018-12-20 | 2019-02-15 | 安徽华东光电技术研究所有限公司 | The method for establishing ROGERS plate Yu case weld thermal reflow profile |
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| CN110248495A (en) * | 2019-05-31 | 2019-09-17 | 深圳市英创立电子有限公司 | Tin cream Reflow Soldering and glue technique for fixing |
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| CN112091347A (en) * | 2020-08-31 | 2020-12-18 | 浙江双宇电子科技有限公司 | Novel tin-dispensing and reflow soldering process method for solar photovoltaic junction box |
| CN112257280A (en) * | 2020-10-29 | 2021-01-22 | 桂林电子科技大学 | Liquid-solid phase continuous form prediction method for reflow soldering BGA group soldering points |
| CN112632856B (en) * | 2020-12-21 | 2023-09-19 | 江苏警官学院 | Method for controlling speed and temperature of conveyor belt of reflow oven |
| CN112632856A (en) * | 2020-12-21 | 2021-04-09 | 江苏警官学院 | Conveyor belt speed and temperature control method of reflow furnace |
| CN112756728A (en) * | 2021-01-25 | 2021-05-07 | 北京遥测技术研究所 | Method for determining reflow soldering process parameters |
| CN113011031A (en) * | 2021-03-24 | 2021-06-22 | 西南石油大学 | Optimal design method based on reflow furnace temperature curve |
| CN113011031B (en) * | 2021-03-24 | 2022-03-25 | 西南石油大学 | Optimal design method based on reflow furnace temperature curve |
| CN114083073B (en) * | 2021-10-21 | 2022-11-29 | 杭州电子科技大学 | Improved reflow furnace temperature optimization method |
| CN114083073A (en) * | 2021-10-21 | 2022-02-25 | 杭州电子科技大学 | Improved reflow furnace temperature optimization method |
| CN117226331A (en) * | 2023-11-13 | 2023-12-15 | 深圳市捷汇多科技有限公司 | Welding process monitoring and analyzing method, device and system |
| CN117226331B (en) * | 2023-11-13 | 2024-01-26 | 深圳市捷汇多科技有限公司 | Welding process monitoring and analyzing method, device and system |
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