CN103071876B - A kind of welded encapsulation method and apparatus - Google Patents
A kind of welded encapsulation method and apparatus Download PDFInfo
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- CN103071876B CN103071876B CN201310002521.6A CN201310002521A CN103071876B CN 103071876 B CN103071876 B CN 103071876B CN 201310002521 A CN201310002521 A CN 201310002521A CN 103071876 B CN103071876 B CN 103071876B
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Abstract
The present invention relates to a kind of welded encapsulation method and apparatus, described welded encapsulation device comprises lower heating plate metal electrode, lower heating plate and insulation spacer, lower heating plate is fixed on two lower heating plate metal electrodes placed side by side, lower heating plate metal electrode has insulation spacer, the outside of two lower heating plate metal electrodes is provided with two upper heating plate metal electrodes placed side by side with lower heating plate metal electrode, upper heating plate metal electrode does not contact with lower heating plate metal electrode, upper heating plate metal electrode is fixed with conducting block, upper heating plate is fixed on the conducting block on two upper heating plate metal electrodes, upper heating plate metal electrode and lower heating plate metal electrode are connected to independently heating and temperature controlling device.The mode that the present invention adopts upper and lower heating plate jointly to heat, heats from bottom and top the device needing to weld multiple assembly simultaneously jointly, solves each temperature at weld difference caused due to each assembly thermal resistance comparatively large, affects the problem of welding efficiency.
Description
Technical field
The present invention relates to field of semiconductor package, particularly relate to a kind of welded encapsulation method and apparatus.
Background technology
Chips welding, cover plate welding and window welding is related in semiconductor product packaging technology.Its welding manner is generally in nitrogen protection environment or vacuum environment, and heat fused solder or soldering paste make chip and substrate, between cover plate with shell or other together with assembling components.The more than parts of a usual product need welding, and such as a kind of MEMS encapsulation, adopts solder cover plate, substrate and shell to be welded, form an air-tight packaging device.
This device be packaged with two solders side, namely cover plate welds with shell and shell welds with substrate, mainly contain two kinds of methods at present to weld: 1) adopt same solder, the heating plate each assembly being put into together soldering furnace heats, make solder fusing, then cool the welding of device; 2) adopt the solder of two kinds of different melting points, first cover plate and shell are welded together, and then with the lower solder of another kind of fusing point, the assembly welded is welded (also can first weld shell and substrate, then welded cover plate) with substrate above.
Current welding manner is having the following disadvantages for this welding manner of welding two assemblies that needs: cover plate, substrate weld by (1) method 1 together with shell, because heat is mainly from the substrate heat conduction directly contacted with heating plate, then shell is delivered to by cover plate solder, be delivered to cover plate solder and cover plate again, the assembly welding of test device.Adopt the stove welding device of current flow heats, this welding manner can cause cover plate and shell weld temperature than shell and substrate weld temperature low, especially weld in vacuum environment, there will be along with heating plate heats up, when making the solder fusing between substrate and shell, the still unfused phenomenon of cover plate place solder, if the welding completing cover plate just must improve technological temperature, substrate and shell weld may be caused like this to superfuse, the phenomenon of not prison welding, if air-tight packaging, often cause device sealing poor.(2) method 2 is welded at twice, first welds shell and cover plate, then welds (conversely also can) together with substrate.Which decrease production efficiency, and add process complexity, for avoiding second time welding to occur melting, cause the phenomenon of superfusing, the fusing point of usual substrate solder will exceed more than 50 DEG C than cover plate solder again; In addition along with current international market is to the requirement of lead-free product, the trend that lead-free solder necessarily develops, and a lot of electronic product can not bear temperature when high-temperature solder welds, two fusing point is selected to differ by more than 50 DEG C, physical property is good, and the solder that price is low, be also a difficult problem of encapsulation.
Summary of the invention
Technical problem to be solved by this invention is that the thermograde that in solution prior art, individual event heating mode causes is comparatively large, and what twice welding caused not easily finds suitable solder, inefficient shortcoming, provides the welded encapsulation apparatus and method that a kind of production efficiency is high.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of welded encapsulation device, comprise lower heating plate metal electrode, lower heating plate and insulation spacer, lower heating plate is fixed on two lower heating plate metal electrodes placed side by side, lower heating plate metal electrode has insulation spacer, the outside of described two lower heating plate metal electrodes is provided with two upper heating plate metal electrodes placed side by side with lower heating plate metal electrode, described upper heating plate metal electrode does not contact with lower heating plate metal electrode, described upper heating plate metal electrode is fixed with conducting block, described upper heating plate is fixed on the conducting block on two upper heating plate metal electrodes, described upper heating plate is parallel up and down with lower heating plate, described upper heating plate metal electrode and lower heating plate metal electrode are connected to independently heating and temperature controlling device.
The invention has the beneficial effects as follows: heating plate and lower heating plate are set, achieve the top of device to be packaged and bottom according to the needs of solder independent heating simultaneously.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described upper heating plate metal electrode is provided with alignment pin, described conducting block is provided with conducting block locating hole, and described upper heating plate is provided with heating plate locating hole, and described conducting block and upper heating plate are located by upper heating plate metal electrode alignment pin.
The beneficial effect of above-mentioned further scheme is adopted to be: to utilize locating hole and alignment pin location, conducting block can be changed as required easily, also make the easier for installation of device.
Further, described upper heating plate is provided with heating plate thermocouple locating hole.
The beneficial effect of above-mentioned further scheme is adopted to be: upper heating plate is provided with heating plate thermocouple locating hole, in use can monitor the temperature of heating plate the moment, guarantee that upper heating plate is in most suitable heating-up temperature.
Further, described lower heating plate is provided with lower heating plate thermocouple locating hole.
The beneficial effect of above-mentioned further scheme is adopted to be: lower heating plate is provided with lower heating plate thermocouple locating hole, in use can monitor the temperature of lower heating plate the moment, guarantees that lower heating plate is in most suitable heating-up temperature.
Further, described lower heating plate is provided with locating slot.
The beneficial effect of above-mentioned further scheme is adopted to be: locating slot makes device to be packaged can conveniently be placed on lower heating plate.
A method for welded encapsulation, adopts above-mentioned welded encapsulation device to realize treating packaging and carries out welded encapsulation, comprise the following steps:
Step one, is positioned over device to be packaged on the lower heating plate of soldering furnace;
Step 2, by upper heating plate metal electrode and the fixing upper heating plate of conducting block, makes heating plate put
In the upper end of device to be packaged;
Step 3, in control, the heating-up temperature of heating plate and lower heating plate, treats packaging and welds.
The invention has the beneficial effects as follows: adopt the mode that upper and lower heating plate heats jointly, jointly heat from bottom and top needing the device welding multiple assembly simultaneously, solve each temperature at weld difference caused due to device to be packaged each assembly thermal resistance larger, affect the problem of welding efficiency, improve welding efficiency.
On the basis of technique scheme, the present invention can also do following improvement.
Further, the device to be packaged in described step one comprises substrate, shell and cover plate, and shell is placed between substrate and cover plate, is provided with substrate solder between described substrate and shell, is all provided with cover plate solder between described shell and cover plate.
Adopt the beneficial effect of above-mentioned further scheme to be: semiconductor devices to be packaged, between substrate and shell, is equipped with solder between shell and cover plate, adopt and heat simultaneously, improve welding efficiency.
Further, in described step 3, when substrate solder and housing are identical with cover plate solder varieties, control lower heating plate and the heating curve that the temperature of upper heating plate is consistent (heating curve refers to that temperature conversion is in time identical) simultaneously, substrate and the cover plate for the treatment of packaging heat simultaneously, realize the welding of device to be packaged.
Adopt the beneficial effect of above-mentioned further scheme to be: to identical solder, to heat from bottom and top simultaneously, avoid each temperature at weld difference comparatively large, affect the problem of welding effect.
Further, in described step 3, when substrate solder is different with cover plate solder varieties, control the temperature of upper heating plate and lower heating plate respectively, substrate and the cover plate for the treatment of packaging heat respectively, and (heating refers to respectively, in control, heating plate heats cover plate, control lower heating plate to base plate heating), substrate solder and housing and cover plate solder is made to there is certain thermograde (so-called thermograde, refer to that temperature is different because substrate solder is different with the position of cover plate solder), realize the welding respectively to substrate and cover plate, reach the effect of the disposable welding of different solder.
The beneficial effect of above-mentioned further scheme is adopted to be: the welding temperature at control device substrate and cover plate place respectively, can be used for different solder and weld simultaneously, reduces the difficulty of product heating.
Further, in described step 2, described conducting block is located between heating plate metal electrode and upper heating plate, by the spacing regulating the thickness of conducting block to regulate upper heating plate and device to be packaged.
The beneficial effect of above-mentioned further scheme is adopted to be: by the spacing regulating the thickness of conducting block to regulate upper heating plate and device to be packaged, can regulate the spacing of heating plate and device to be packaged as required, thus the heating making heating plate treat packaging is heating distance most effectively.
Further, between described upper heating plate and device to be packaged, tool is at regular intervals, and described spacing meets enables heating plate contact device to be packaged and upper heating plate does not extrude device to be packaged.
Adopt the beneficial effect of above-mentioned further scheme to be: in guarantee, the spacing of heating plate and device to be packaged is enough little, but does not extrude device to be packaged, under the prerequisite ensureing good heating effect, can not damage device to be packaged.
Accompanying drawing explanation
Fig. 1 is the structure chart of apparatus of the present invention;
Fig. 2 is the schematic diagram of each components apart of welding procedure of the present invention;
Fig. 3 is the present invention device figure to be packaged;
Fig. 4 is metal electrode structure figure of the present invention;
Fig. 5 is heating board structure figure under the present invention;
Fig. 6 is conducting block structure chart of the present invention;
Fig. 7 is heating board structure figure in the present invention.
In accompanying drawing, the list of parts representated by each label is as follows:
1, shell, 2, lower heating plate, 3, conducting block, 4, upper heating plate, 5, device to be packaged, 6, insulation spacer, 7, lower heating plate metal electrode, 8, lower heating plate metal electrode alignment pin, 9, upper heating plate metal electrode, 10, upper heating plate metal electrode alignment pin, 11, lower heating plate locating hole, 12, lower heating plate thermocouple locating hole, 13, locating slot, 14, conducting block locating hole, 15, upper heating plate locating hole, 16, upper heating plate thermocouple locating hole, 17, substrate, 18, cover plate, 19, cover plate solder, 20, substrate solder.
Detailed description of the invention
Be described principle of the present invention and feature below in conjunction with accompanying drawing, example, only for explaining the present invention, is not intended to limit scope of the present invention.
The present invention adopts two pairs of electrodes to control the mode of upper and lower heating plate respectively, substrate 17 and the cover plate 18 (as Fig. 3) for the treatment of packaging 5 heat simultaneously, cover plate solder 19 and substrate solder 20 are melted, completes the welding of cover plate 18, substrate 17 and shell 1.Fig. 3 is the separation graph of primary clustering of the present invention, mainly includes heating plate metal electrode 9, lower heating plate metal electrode 7, lower heating plate 2, conducting block 3, upper heating plate 4 and device to be packaged 5 and forms.
Metal electrode as shown in Figure 4, has two pairs of electrode structures, and wherein insulation spacer 6 ensures that electrode conducts with the cavity welding stove; Lower heating plate metal electrode 7 connects lower heating plate 2, and heat lower heating plate 2 energising, lower heating plate metal electrode alignment pin 8 is fixed lower heating plate 2; Upper heating plate metal electrode 9 connects conducting block 3, then connects upper heating plate 4 by conducting block 3, and to upper heating plate 4 electrified regulation, upper heating plate metal electrode alignment pin 10 pairs of conducting blocks 3 and upper heating plate 4 position.Fig. 5 is lower heating plate 2, and its lower heating plate locating hole 11 is corresponding with lower heating plate metal electrode alignment pin 8, the position of fixing lower heating plate 2; Lower heating plate thermocouple locating hole 12 inserts the temperature of the lower heating plate 2 of thermocouple detection, and feeds back to temperature control system, and the temperature realizing lower heating plate 2 controls; Locating slot 13 is treated packaging 5 and is fixed.Then conducting block locating hole 14 is inserted upper heating plate metal electrode alignment pin 10 and fix conducting block 3 (as Fig. 7), the upper heating plate locating hole 15 of Fig. 7 is inserted upper heating plate metal electrode alignment pin 10, in guarantee, heating plate 4 is connected with conducting block 3 good electrical, upper heating plate thermocouple locating hole 16 is inserted the temperature of the upper heating plate 4 of thermocouple detection, and feed back to temperature control system, realize controlling the temperature of upper heating plate 4.
Fig. 2 is the model assembled, by the spacing regulating the thickness of conducting block 3 to control upper heating plate 4 and device 5 to be packaged, ensure spacing enough little (<100 μm) as far as possible, to ensure that upper heating plate 4 is treated packaging 5 and had good heating effect, but avoid heating plate 4 to contact with device 5 to be packaged, damage device 5 to be packaged by pressure.Control the temperature of upper heating plate 2 and lower heating plate 4 respectively, the substrate 17 and the cover plate 18 that realize treating packaging 5 heat separately, realize the welding of device 5 to be packaged.If the cover plate solder 19 that device 5 to be packaged adopts and substrate solder 20 are solders of the same race, the temperature of lower heating plate 2 and upper heating plate 4 can be controlled, the heating curve be consistent, substrate 17 and the cover plate 18 for the treatment of packaging 5 heat simultaneously, realize the welding of device 5 to be packaged; If cover plate solder 19 and substrate solder 20 are not solders of the same race, there is certain gradient in its welding temperature, heating plate 4 and lower heating plate 2 can be controlled respectively, substrate 17 and the cover plate 18 for the treatment of packaging 5 respectively heat, make cover plate solder 19 and substrate solder 20 there is certain temperature difference, realize the welding of different solder.
As shown in Figure 1, a kind of welded encapsulation device of the present invention, comprise lower heating plate metal electrode 7, lower heating plate 2 and insulation spacer 6, lower heating plate 2 is fixed on two lower heating plate metal electrodes 7 placed side by side, lower heating plate metal electrode 7 has insulation spacer 6, the outside of two lower heating plate metal electrodes 7 is provided with two upper heating plate metal electrodes 9 placed side by side with lower heating plate metal electrode 7, upper heating plate metal electrode 9 does not contact with lower heating plate metal electrode 7, upper heating plate metal electrode 9 is fixed with conducting block 3, upper heating plate 4 is fixed on the conducting block 3 on two upper heating plate metal electrodes 9, upper heating plate 4 is parallel with lower heating plate about 2, upper heating plate metal electrode 9 and lower heating plate metal electrode 7 are connected separately independently heating and temperature controlling device respectively.Upper heating plate metal electrode 9 is provided with heating plate metal electrode alignment pin 10, conducting block 3 and upper heating plate 4 are equipped with locating hole, conducting block 3 and upper heating plate 4 are located by upper hot plate metal electrode alignment pin 10, upper heating plate 4 is provided with heating plate thermocouple locating hole 16, lower heating plate is provided with lower heating plate thermocouple locating hole 15, and lower heating plate is provided with locating slot 13.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (11)
1. a welded encapsulation device, comprise lower heating plate metal electrode, lower heating plate and insulation spacer, lower heating plate is fixed on two lower heating plate metal electrodes placed side by side, lower heating plate metal electrode has insulation spacer, it is characterized in that: the outside of described two lower heating plate metal electrodes is provided with two upper heating plate metal electrodes placed side by side with lower heating plate metal electrode, described upper heating plate metal electrode does not contact with lower heating plate metal electrode, described upper heating plate metal electrode is fixed with conducting block, described upper heating plate is fixed on the conducting block on two upper heating plate metal electrodes, described upper heating plate is parallel up and down with lower heating plate, described upper heating plate metal electrode and lower heating plate metal electrode are connected to independently heating and temperature controlling device.
2. a kind of welded encapsulation device according to claim 1, it is characterized in that: described upper heating plate metal electrode is provided with alignment pin, described conducting block is provided with conducting block locating hole, described upper heating plate is provided with heating plate locating hole, and described conducting block and upper heating plate are located by upper heating plate metal electrode alignment pin.
3. a kind of welded encapsulation device according to claim 1, is characterized in that: described upper heating plate is provided with heating plate thermocouple locating hole.
4. a kind of welded encapsulation device according to claim 1, is characterized in that: described lower heating plate is provided with lower heating plate thermocouple locating hole.
5. a kind of welded encapsulation device according to claim 1, is characterized in that: described lower heating plate is provided with locating slot.
6. a method for welded encapsulation, is characterized in that, the method carries out welded encapsulation by using the welded encapsulation device according to any one of claim 1-5 to realize treating packaging, comprises the following steps:
Step one, is positioned over device to be packaged on the lower heating plate of soldering furnace;
Step 2, by upper heating plate metal electrode and the fixing upper heating plate of conducting block, makes heating plate be placed in the upper end of device to be packaged;
Step 3, in control, the heating-up temperature of heating plate and lower heating plate, treats packaging and welds.
7. the method for a kind of welded encapsulation according to claim 6, it is characterized in that: the device to be packaged in described step one comprises substrate, shell and cover plate, shell is placed between substrate and cover plate, be provided with substrate solder between described substrate and shell, between described shell and cover plate, be provided with cover plate solder.
8. the method for a kind of welded encapsulation according to claim 7, it is characterized in that: in described step 3, when substrate solder is identical with cover plate solder varieties, the heating curve that the temperature simultaneously controlling lower heating plate and upper heating plate is consistent, substrate and the cover plate for the treatment of packaging heat simultaneously, realize the welding of device.
9. the method for a kind of welded encapsulation according to claim 7, it is characterized in that: in described step 3, when substrate solder is different with cover plate solder varieties, control the temperature of upper heating plate and lower heating plate respectively, substrate and the cover plate for the treatment of packaging heat respectively, make substrate solder and cover plate solder there is certain thermograde, realize the welding respectively to substrate and cover plate.
10. the method for a kind of welded encapsulation according to any one of claim 6 to 9, it is characterized in that: in described step 2, described conducting block is located between heating plate metal electrode and upper heating plate, by the spacing regulating the thickness of conducting block to regulate upper heating plate and device to be packaged.
The method of 11. a kind of welded encapsulation according to claims 10, it is characterized in that: between described upper heating plate and device to be packaged, tool is at regular intervals, described spacing meets enables heating plate contact device to be packaged and upper heating plate does not extrude device to be packaged.
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| CN201310002521.6A CN103071876B (en) | 2013-01-05 | 2013-01-05 | A kind of welded encapsulation method and apparatus |
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| CN104308315B (en) * | 2014-06-24 | 2016-05-18 | 北京时代民芯科技有限公司 | A kind of device and method of ceramic component reflow soldering process |
| CN107656562B (en) * | 2016-07-26 | 2020-06-30 | 中国航空工业集团公司西安飞行自动控制研究所 | Temperature control system for MEMS device |
| CN109332960A (en) * | 2018-11-29 | 2019-02-15 | 江苏美凯奥纺织科技有限公司 | A kind of welder for Teflon mesh belt |
| CN113681107B (en) * | 2021-09-10 | 2023-07-04 | 上海无线电设备研究所 | Microstrip board and substrate welding device and use method |
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| JPH084933B2 (en) * | 1987-07-22 | 1996-01-24 | 松下電器産業株式会社 | Substrate heating device |
| JP4092258B2 (en) * | 2003-06-06 | 2008-05-28 | トヨタ自動車株式会社 | Reflow furnace and temperature control method for reflow furnace |
| CN1277739C (en) * | 2005-01-28 | 2006-10-04 | 华中科技大学 | Vacuum package device for micro system |
| CN201023165Y (en) * | 2006-08-21 | 2008-02-20 | 李功明 | Automatic temperature-control infrared ray repair table |
| JP2012104557A (en) * | 2010-11-08 | 2012-05-31 | Ngk Spark Plug Co Ltd | Wiring board with electronic component and manufacturing method of the same |
| CN202123298U (en) * | 2010-12-23 | 2012-01-25 | 何光宁 | Tin remover of chip |
| CN102151980B (en) * | 2011-03-11 | 2013-03-27 | 宋洪海 | Ti-Al complex metal cooking pot manufacture method |
| CN202045876U (en) * | 2011-04-03 | 2011-11-23 | 兰州交通大学 | Hot welding device for PE (polyethylene) partition plate |
| JP2012243955A (en) * | 2011-05-19 | 2012-12-10 | Panasonic Corp | Batch-type local heating device |
| CN102259827B (en) * | 2011-06-25 | 2014-06-25 | 中北大学 | Method for encapsulating MEMS (micro electro mechanical system) high-range acceleration sensor |
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Address after: 264006 Yantai economic and Technological Development Zone, Guiyang, No. 11 main street, Shandong Patentee after: Yantai Rui micro nano technology Limited by Share Ltd Address before: 264006 Yantai economic and Technological Development Zone, Guiyang, No. 11 main street, Shandong Patentee before: Yantai Raytron Technology Co., Ltd. |