CN117226331A - Welding process monitoring and analyzing method, device and system - Google Patents
Welding process monitoring and analyzing method, device and system Download PDFInfo
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- CN117226331A CN117226331A CN202311502116.0A CN202311502116A CN117226331A CN 117226331 A CN117226331 A CN 117226331A CN 202311502116 A CN202311502116 A CN 202311502116A CN 117226331 A CN117226331 A CN 117226331A
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- 238000000034 method Methods 0.000 title claims abstract description 75
- 238000012544 monitoring process Methods 0.000 title claims abstract description 61
- 230000008569 process Effects 0.000 title claims abstract description 49
- 238000003466 welding Methods 0.000 title claims abstract description 34
- 238000005476 soldering Methods 0.000 claims abstract description 249
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 198
- 229910000679 solder Inorganic materials 0.000 claims description 61
- 238000012545 processing Methods 0.000 claims description 30
- 238000009413 insulation Methods 0.000 claims description 18
- 238000004458 analytical method Methods 0.000 claims description 17
- 230000007547 defect Effects 0.000 claims description 13
- 238000012163 sequencing technique Methods 0.000 claims description 4
- 230000002159 abnormal effect Effects 0.000 abstract description 10
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000012216 screening Methods 0.000 abstract 1
- 238000004590 computer program Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000002955 isolation Methods 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 2
- WEJZHZJJXPXXMU-UHFFFAOYSA-N 2,4-dichloro-1-phenylbenzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC=C1 WEJZHZJJXPXXMU-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The invention relates to the field of computers, in particular to a method, a device and a system for monitoring and analyzing a welding process, wherein the method comprises the steps of monitoring the temperature near a PCB in real time during the movement of a reflow soldering machine, comparing the temperature with a standard temperature in real time, identifying the abnormal temperature, comparing the state of soldering tin on the PCB at the temperature with the similarity of the standard state, further determining the influence degree of the temperature on the soldering tin, screening out the temperature with larger influence, determining temperature-regulating equipment associated with the position corresponding to the temperature, and generating relevant overhaul information; the invention can screen out the region with temperature control problem accurately in the huge reflow motor, so that the related devices in the region can be overhauled by later staff in a targeted way, and the waste of manpower and time cost caused by comprehensive overhaul of the whole machine is avoided.
Description
Technical Field
The present invention relates to the field of computers, and in particular, to a method, apparatus, and system for monitoring and analyzing a welding process.
Background
Reflow soldering is an apparatus for Surface Mount (SMT) electronic components for mounting the electronic components on a PCB (Printed Circuit Board) board. The reflow soldering machine mainly comprises a preheating zone, a heating zone and a cooling zone, and the solder at the soldering feet of the element is dissolved under the action of different degrees of temperature in the soldering process by controlling the temperatures of different zones, so that the element and the PCB can achieve certain firmness and reliability of soldering connection.
However, if the temperature setting of each area in the reflow soldering machine is unreasonable, or the abnormal temperature of the local area caused by the abnormal temperature in the furnace can cause abnormal dissolution of soldering tin, and further, the soldering product is unqualified; for the furnace temperature of the reflow soldering machine, the existing mode mainly comprises the steps of putting a product to be soldered into the reflow soldering machine, enabling the product to be soldered to be output in the furnace after the whole process is carried out, checking the soldering condition of the product, judging whether the furnace temperature of the reflow soldering machine is problematic according to the soldering condition, judging whether the reflow soldering machine is problematic or not only in the mode, and not knowing which parts of the reflow soldering machine are particularly problematic in the furnace temperature, so that a worker is difficult to determine a problem area, and the related temperature control device of the problem area cannot be checked in a targeted manner, and the whole machine needs to be checked and maintained every time, so that the workload of checking is greatly increased.
Therefore, the prior art has the problem that the furnace temperature and the soldering tin state in the whole welding process are difficult to monitor and analyze so as to determine the occurrence position of the abnormal furnace temperature in the reflow soldering machine.
Disclosure of Invention
Based on this, it is necessary to provide a welding process monitoring and analyzing method, device and system for the above-mentioned problems.
The embodiment of the invention is realized in such a way that a welding process monitoring and analyzing method comprises the following steps:
s1: when the PCB enters the reflow soldering machine, starting timing;
s2: monitoring the furnace temperature and acquiring a real-time video picture of soldering tin;
s3: establishing a time and furnace temperature coordinate system, and drawing a first curve on the time and furnace temperature coordinate system according to each time point and the corresponding furnace temperature;
s4: a pre-stored standard curve is introduced into a time and furnace temperature coordinate system, wherein the standard curve is a relation curve of time and furnace temperature corresponding to the temperature at which soldering tin can be dissolved according to a preset dissolving process;
s5: monitoring whether the difference between the temperature on the first curve corresponding to each time point and the temperature on the standard curve is larger than a first set value;
s6: when the difference value between the temperature on the first curve corresponding to a certain time point and the temperature on the standard curve is larger than a first set value, acquiring a real-time soldering tin form of soldering tin at the time point on a real-time video picture, acquiring a standard soldering tin form corresponding to the standard curve at the time point, and further calculating the similarity of the real-time soldering tin form and the standard soldering tin form;
S7: if the similarity between the real-time soldering tin form and the standard soldering tin form is lower than a second set value, distinguishing features between the real-time soldering tin form and the standard soldering tin form are identified, distinguishing feature names are determined, and the distinguishing feature names are marked at positions, corresponding to the time points, of the first curve;
s8: calculating the position of the PCB in the reflow soldering machine at the time point, further determining an associated device capable of influencing the furnace temperature at the position as a device to be overhauled, and generating overhauling information;
s9: and repeatedly executing the steps S6 to S8 until the PCB moves out of the reflow soldering machine.
In one embodiment, the present invention provides a welding process monitoring and analysis device comprising:
the first processing module is used for starting timing when the PCB enters the reflow soldering machine;
the first monitoring module is used for starting to monitor the furnace temperature and acquiring a real-time video picture of soldering tin;
the second processing module is used for establishing a time and furnace temperature coordinate system, and drawing a first curve on the time and furnace temperature coordinate system according to each time point and the corresponding furnace temperature;
the third processing module is used for introducing a pre-stored standard curve into the time and furnace temperature coordinate system, wherein the standard curve is a relation curve of time and furnace temperature corresponding to the temperature at which soldering tin can be dissolved according to a preset dissolving process;
The second monitoring module is used for monitoring whether the difference value between the temperature on the first curve corresponding to each time point and the temperature on the standard curve is larger than a first set value or not;
the fourth processing module is used for acquiring a real-time soldering tin form of soldering tin at a certain time point on a real-time video picture when the difference value between the temperature on the first curve corresponding to the certain time point and the temperature on the standard curve is larger than a first set value, acquiring a standard soldering tin form corresponding to the standard curve at the time point, and further calculating the similarity of the real-time soldering tin form and the standard soldering tin form;
the fifth processing module is used for identifying distinguishing features between the real-time soldering tin form and the standard soldering tin form if the similarity between the real-time soldering tin form and the standard soldering tin form is lower than a second set value, determining distinguishing feature names, and marking the distinguishing feature names at positions of the first curve corresponding to the time points;
the sixth processing module is used for calculating the position of the PCB in the reflow soldering machine at the time point, further determining that the associated device capable of influencing the furnace temperature at the position is a device to be overhauled, and generating overhauling information;
and the repeated execution module is used for repeatedly executing the steps S6 to S8 until the PCB moves out of the reflow soldering machine.
In one embodiment, the present invention provides a welding process monitoring analysis system comprising:
the camera is used for acquiring real-time video pictures of soldering tin;
the temperature sensor is arranged on the PCB and used for acquiring real-time temperature;
the camera is installed in the heat insulation carrier, and is isolated from the outside by the heat insulation carrier so as to be prevented from being damaged by high temperature, a perspective window is formed in the heat insulation carrier, and the camera can shoot soldering tin on the PCB through the perspective window;
and the computer equipment is connected with the camera and the temperature sensor and is used for executing the welding process monitoring and analyzing method.
The invention provides a welding process monitoring and analyzing method, a device and a system, wherein the method comprises the steps of starting timing when a PCB enters a reflow soldering machine; monitoring the furnace temperature and acquiring a real-time video picture of soldering tin; establishing a time and furnace temperature coordinate system, and drawing a first curve on the time and furnace temperature coordinate system according to each time point and the corresponding furnace temperature; introducing a pre-stored standard curve into a time and furnace temperature coordinate system; monitoring whether the difference between the temperature on the first curve corresponding to each time point and the temperature on the standard curve is larger than a first set value; when the difference value between the temperature on the first curve corresponding to a certain time point and the temperature on the standard curve is larger than a first set value, acquiring a real-time soldering tin form of soldering tin at the time point on a real-time video picture, acquiring a standard soldering tin form corresponding to the standard curve at the time point, and further calculating the similarity of the real-time soldering tin form and the standard soldering tin form; if the similarity between the real-time soldering tin form and the standard soldering tin form is lower than a second set value, distinguishing features between the real-time soldering tin form and the standard soldering tin form are identified, names of the distinguishing features are determined, and the distinguishing feature names are marked at positions, corresponding to the time points, of the first curve; calculating a first position of the PCB at the reflow soldering machine at the time point, further determining an associated device capable of influencing the furnace temperature at the first position as a device to be overhauled, and generating overhauling information; repeating the steps until the PCB moves out of the reflow soldering machine; the invention can monitor the temperature near the PCB in real time in the moving process of the reflow soldering machine, can identify the abnormal temperature by comparing the temperature with the standard temperature in real time, can further determine the influence degree of the temperature on the soldering tin by comparing the state of the soldering tin on the PCB at the temperature with the similarity of the standard state, and can screen out the region which has temperature control problem more accurately in the huge reflow motor, thereby facilitating the targeted overhaul of related devices of the region by later staff and avoiding the waste of manpower and time cost caused by the comprehensive overhaul of the whole machine.
Drawings
FIG. 1 is a flow chart of a welding process monitoring analysis method provided in one embodiment;
FIG. 2 is a block diagram of a welding process monitoring and analyzing device in one embodiment;
FIG. 3 is a composition diagram of a welding process monitoring analysis system in one embodiment;
FIG. 4 is a perspective view of a thermal isolation carrier in a welding process monitoring analysis system according to one embodiment;
FIG. 5 is a side view of a thermal isolation carrier in a welding process monitoring analysis system in accordance with one embodiment;
FIG. 6 is an interior view of a thermal isolation carrier in a welding process monitoring analysis system in accordance with one embodiment;
FIG. 7 is a partial view of a thermal isolation carrier in a welding process monitoring analysis system according to one embodiment;
FIG. 8 is a block diagram of the internal architecture of a computer device in one embodiment.
In the accompanying drawings: 1. a thermal insulation carrier; 2. a light pipe; 3. a light emitter; 4. a first bracket; 5. polishing lens; 6. a reflective mirror; 7. a PCB board; 8. a camera is provided.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that the terms "first," "second," and the like, as used herein, may be used to describe various elements, but these elements are not limited by these terms unless otherwise specified. These terms are only used to distinguish one element from another element. For example, a first xx script may be referred to as a second xx script, and similarly, a second xx script may be referred to as a first xx script, without departing from the scope of this disclosure.
As shown in fig. 1, in one embodiment, a welding process monitoring analysis method is provided, the method comprising:
s1: when the PCB enters the reflow soldering machine, starting timing;
s2: monitoring the furnace temperature and acquiring a real-time video picture of soldering tin;
s3: establishing a time and furnace temperature coordinate system, and drawing a first curve on the time and furnace temperature coordinate system according to each time point and the corresponding furnace temperature;
s4: a pre-stored standard curve is introduced into a time and furnace temperature coordinate system, wherein the standard curve is a relation curve of time and furnace temperature corresponding to the temperature at which soldering tin can be dissolved according to a preset dissolving process;
s5: monitoring whether the difference between the temperature on the first curve corresponding to each time point and the temperature on the standard curve is larger than a first set value;
S6: when the difference value between the temperature on the first curve corresponding to a certain time point and the temperature on the standard curve is larger than a first set value, acquiring a real-time soldering tin form of soldering tin at the time point on a real-time video picture, acquiring a standard soldering tin form corresponding to the standard curve at the time point, and further calculating the similarity of the real-time soldering tin form and the standard soldering tin form;
s7: if the similarity between the real-time soldering tin form and the standard soldering tin form is lower than a second set value, distinguishing features between the real-time soldering tin form and the standard soldering tin form are identified, distinguishing feature names are determined, and the distinguishing feature names are marked at positions, corresponding to the time points, of the first curve;
s8: calculating the position of the PCB in the reflow soldering machine at the time point, further determining an associated device capable of influencing the furnace temperature at the position as a device to be overhauled, and generating overhauling information;
s9: and repeatedly executing the steps S6 to S8 until the PCB moves out of the reflow soldering machine.
In this embodiment, the method is executed in a computer device, where the computer device may be an independent physical server or terminal, or may be a server cluster formed by multiple physical servers, or may be a cloud server that provides basic cloud computing services such as a cloud server, a cloud database, a cloud storage, a CDN, and the like; the real-time soldering tin picture is obtained through a camera, the camera is arranged at a position on the reflow motor conveyor belt, which is close to the PCB, and the camera lens is aligned to the position where the soldering tin is positioned through pre-adjustment, and the camera can be an industrial high-definition camera or other types of cameras; the temperature near the PCB is monitored by a temperature sensor arranged on the PCB, and the temperature sensor can adopt a high-temperature-resistant temperature sensor so as to adapt to the requirement of monitoring the temperature in a high-temperature environment; the first set point may be 2 degrees, 3 degrees, or other values, and the second set point may be 0.8, 0.9, or other values, without limitation; the real-time solder form refers to a solder form in a video picture image acquired by a camera at a certain real-time point, the standard solder form refers to a solder form in a picture image corresponding to the point in time of a standard video picture stored in computer equipment, the standard video picture refers to a solder form picture acquired at a standard temperature, and the view angles of the real-time acquired picture and the standard video picture are the same.
In the application, the inlet and the outlet of the reflow motor are respectively provided with a marking line, when the front end of the PCB is conveyed to the marking line at the inlet by the conveyor belt, timing is started, real-time temperature is monitored, and a first curve can be drawn along with the movement of the PCB in the reflow welder; then, introducing a standard curve on the same coordinate system, wherein the acquisition mode of the standard curve is the same as that of the first curve, comparing the time sequence of the standard curve with that of the first curve, then monitoring the difference value between the temperature of the standard curve corresponding to each time point and the temperature of the first curve in real time, wherein each time the temperature is monitored to be normal, the slight floating does not cause obvious influence on solder, so that a first set value is introduced as a redundancy, and when the absolute value of the temperature difference value is larger than the first set value, the real-time temperature is considered to be abnormal; however, even if the temperature is abnormal, the solder is not necessarily affected, under the condition of limited manpower and time, the areas can be temporarily not overhauled, the application judges whether the solder is affected by comparing the similarity between the solder at the temperature and the solder in a standard state, when the similarity is lower than a second set value, the solder can be judged to be affected, further, the distinguishing characteristics of the solder are identified and marked on a first curve to show the problem reason to a worker, furthermore, the temperature of the area in each reflow soldering machine is provided with a corresponding temperature control device (namely a related device) or a local position of a large temperature control device, after the temperature which is abnormal and can affect the solder is locked, the position corresponding to the temperature can be obtained according to the timing time and the conveying speed of a conveying belt, and further, a temperature control device corresponding to the position can be determined, so that the temperature control device can be overhauled in a targeted manner; in addition, if the temperatures monitored by a plurality of continuous adjacent time points in the first curve are lower than the first set value and can have the same influence on the solder, combining the distinguishing features marked at each time point, namely marking only once; if the distinguishing characteristic marked at a certain time point has the distinguishing characteristic appearing for the first time, the associated equipment corresponding to the temperature at the time point is taken as key maintenance equipment, and the maintenance priority of the key maintenance equipment is highest; the application can screen out the region with temperature control problem accurately in the huge reflow motor, so that the related devices in the region can be overhauled by later staff in a targeted way, and the waste of manpower and time cost caused by comprehensive overhaul of the whole machine is avoided.
As a preferred embodiment, the calculating the similarity between the real-time solder shape and the standard solder shape includes:
s61: determining the outline similarity of the real-time soldering tin form and the standard soldering tin form according to the first soldering tin outline corresponding to the real-time soldering tin form and the second soldering tin outline corresponding to the standard soldering tin form;
s62: determining the color similarity between the real-time soldering tin form and the standard soldering tin form according to the first soldering tin color corresponding to the real-time soldering tin form and the second soldering tin color corresponding to the standard soldering tin form;
s63: and determining the overall similarity of the real-time soldering tin form and the standard soldering tin form according to the contour similarity and the color similarity.
In this embodiment, the outline of the solder may represent the overall shape of the solder, so that the similarity of the real-time solder and the standard solder in the external shape can be determined by comparing the similarity of the first outline and the second outline; furthermore, the surface of the soldering tin presents different colors along with different smoothness degrees and different temperatures, and the similarity of the soldering tin surface can be judged through the similarity of the color of the real-time soldering tin surface and the standard soldering tin surface; further, the overall similarity calculated according to the contour similarity and the color similarity, namely the similarity of the contour similarity and the color similarity is determined from the overall external form of the soldering tin and the two dimensions of the condition of the surface of the soldering tin, and various forms of the soldering tin affected by temperature are fully considered, so that the similarity of the contour similarity and the color similarity can be fully represented, and whether the soldering tin is affected can be accurately judged through the value.
Further, determining the profile similarity between the real-time solder shape and the standard solder shape according to the first solder profile corresponding to the real-time solder shape and the second solder profile corresponding to the standard solder shape includes:
s611: identifying a first soldering tin contour, and taking a set number of first contour points on the first soldering tin contour; identifying a second soldering tin contour, and taking a set number of second contour points on the second soldering tin contour;
s612: moving the second soldering tin outline to the position of the first soldering tin outline on the real-time video picture;
s613: selecting a first contour point and sequencing each first contour point in a clockwise direction by taking the first contour point as a starting point; selecting a second contour point and sequencing each second contour point in a clockwise direction by taking the second contour point as a starting point;
s614: calculating the contour point distance between each first contour point and the second contour point of the corresponding sequence number, and further calculating the average distance of the contour point distances;
s615: selecting another second contour point, using the second contour point as a starting point to sequence each second contour point clockwise, executing step S614, and repeatedly executing the step until each second contour point is sequence-numbered by the starting point clockwise to each second contour point, obtaining corresponding average distances, and further obtaining a plurality of average distances;
S616: taking the minimum average distance as a first average distance, and calculating the contour similarity by the following formula:
wherein,for contour similarity, ++>For a first average distance, +.>Is the first adjustment coefficient.
In this embodiment, since the difference between the real-time solder form and the standard solder form may be large, it may be difficult to find the position on the real-time solder form and the position on the standard solder form, by using the contour calculation method of the present application, the average distance of each corresponding form of the first contour point and the second contour point may be calculated, and the maximum average distance may be taken for calculation, so that the calculation result has a certain redundancy, and further the accuracy of the judgment result is ensured.
The determining the color similarity between the real-time soldering tin shape and the standard soldering tin shape according to the first soldering tin color corresponding to the real-time soldering tin shape and the second soldering tin color corresponding to the standard soldering tin shape comprises the following steps:
s621: identifying a first soldering tin contour, and acquiring a first pixel value of each pixel point in the first soldering tin contour;
s622: identifying a second soldering tin contour, and acquiring a second pixel value of each pixel point in the second soldering tin contour;
s623: calculating the average pixel value of each second pixel value, taking the pixel value larger than the third set value of the average pixel value as an upper limit pixel value, taking the pixel value smaller than the fourth set value of the average pixel value as a lower limit pixel value, and taking the pixel value range between the lower limit pixel value and the upper limit pixel value as a standard pixel value range;
S624: determining whether each first pixel value is in a standard pixel value range one by one;
s625: taking a pixel point corresponding to a first pixel value in the standard pixel value range as a standard pixel point, and calculating the color similarity according to the following formula:
wherein,for color similarity, ++>For the total number of pixels in the first solder profile, < >>For reaching the standard, the number of pixels is +.>Is the second adjustment coefficient.
The overall similarity of the real-time solder morphology and the standard solder morphology is calculated by the following formula:
wherein,for the overall similarity, add>Is a preset weight coefficient.
In this embodiment, for example, the RGB average pixel value of each second pixel value is (100, 100, 100), and the third setting value and the fourth setting value are both 10, and the standard pixel value range is (90-110 ), and for the first pixel value, the pixel value of any one of the RGB pixels is not within the corresponding range of the standard pixel value range, and does not reach the standard.
As a preferred embodiment, the identifying the distinguishing feature between the real-time solder form and the standard solder form, and determining the name of the distinguishing feature includes:
selecting a partial image which exists only in the first soldering tin outline and does not exist in the second soldering tin outline in the first soldering tin outline;
And cutting out each partial image, and comparing each partial image with the images in the soldering tin defect database to further determine the name of each soldering tin defect, wherein the soldering tin defect database comprises images of various soldering tin defects and corresponding soldering tin defect names.
The calculating that the PCB is positioned at the first position of the reflow soldering machine at the time point comprises:
subtracting the starting timing time point from the time point to obtain the moving time of the PCB;
multiplying the conveying speed of the PCB by the moving time length by a reflow soldering machine to obtain the moving length;
and taking the position which is away from the starting point of the PCB by the moving length as a first position.
In this embodiment, only the partial image existing in the first solder contour but not in the second solder contour is a solder defect having a difference from the standard form, the partial image is identified by using the existing scanning identification technology, the identification basis is a solder defect database, and the name of the solder defect in the partial image, namely the distinguishing feature name, can be obtained after the identification is completed; further, since the speeds of the conveyor belts are consistent, the conveying time length can be obtained according to the time point at that time, and then the conveying distance can be calculated, so that the real-time position of the PCB can be determined, the corresponding temperature control device or the local temperature of the area of the temperature control equipment can be determined, and overhaul information can be generated on the basis of the temperature control device or the local temperature of the area, and can be displayed through a display screen of the computer equipment or sent to a terminal of a worker for the worker to carry out targeted overhaul.
As shown in fig. 2, in one embodiment, a welding process monitoring and analyzing apparatus is provided, the apparatus comprising:
the first processing module is used for starting timing when the PCB enters the reflow soldering machine;
the first monitoring module is used for starting to monitor the furnace temperature and acquiring a real-time video picture of soldering tin;
the second processing module is used for establishing a time and furnace temperature coordinate system, and drawing a first curve on the time and furnace temperature coordinate system according to each time point and the corresponding furnace temperature;
the third processing module is used for introducing a pre-stored standard curve into the time and furnace temperature coordinate system, wherein the standard curve is a relation curve of time and furnace temperature corresponding to the temperature at which soldering tin can be dissolved according to a preset dissolving process;
the second monitoring module is used for monitoring whether the difference value between the temperature on the first curve corresponding to each time point and the temperature on the standard curve is larger than a first set value or not;
the fourth processing module is used for acquiring a real-time soldering tin form of soldering tin at a certain time point on a real-time video picture when the difference value between the temperature on the first curve corresponding to the certain time point and the temperature on the standard curve is larger than a first set value, acquiring a standard soldering tin form corresponding to the standard curve at the time point, and further calculating the similarity of the real-time soldering tin form and the standard soldering tin form;
The fifth processing module is used for identifying distinguishing features between the real-time soldering tin form and the standard soldering tin form if the similarity between the real-time soldering tin form and the standard soldering tin form is lower than a second set value, determining distinguishing feature names, and marking the distinguishing feature names at positions of the first curve corresponding to the time points;
the sixth processing module is used for calculating the position of the PCB in the reflow soldering machine at the time point, further determining that the associated device capable of influencing the furnace temperature at the position is a device to be overhauled, and generating overhauling information;
and the repeated execution module is used for repeatedly executing the steps S6 to S8 until the PCB moves out of the reflow soldering machine.
The process of implementing respective functions by each module in the welding process monitoring and analyzing device provided in the embodiment of the present application may refer to the description of the embodiment shown in fig. 1, and will not be repeated here.
As shown in fig. 3, in one embodiment, a welding process monitoring analysis system is provided, the system comprising:
the camera is used for acquiring real-time video pictures of soldering tin;
the temperature sensor is arranged on the PCB and used for acquiring real-time temperature;
the camera is installed in the heat insulation carrier, and is isolated from the outside by the heat insulation carrier so as to be prevented from being damaged by high temperature, a perspective window is formed in the heat insulation carrier, and the camera can shoot soldering tin on the PCB through the perspective window;
And the computer equipment is connected with the camera and the temperature sensor and is used for executing the welding process monitoring and analyzing method.
In the embodiment, the heat insulation carrier is placed on the conveyor belt beside the PCB and can move along with the PCB, and the camera is arranged in the heat insulation carrier and can be prevented from being damaged by high temperature in the soldering furnace; according to the method, the computer equipment, the camera and the temperature sensor are matched with each other to execute the welding process monitoring analysis method, the temperature near the PCB is monitored in real time in the moving process of the reflow soldering machine, abnormal temperature can be identified by comparing the temperature with the standard temperature in real time, the influence degree of the temperature on the soldering tin can be further determined by comparing the similarity of the soldering tin state on the PCB at the temperature and the standard state, and the temperature with larger influence is screened out to determine the temperature regulating equipment associated with the position corresponding to the temperature, and related overhaul information is generated; the application can screen out the region with temperature control problem accurately in the huge reflow motor, so that the related devices in the region can be overhauled by later staff in a targeted way, and the waste of manpower and time cost caused by comprehensive overhaul of the whole machine is avoided.
Further, as shown in fig. 4 to 7, as a preferred embodiment, the heat insulation carrier 1 is a box body, at least one through hole is formed in a box wall of the heat insulation carrier 1, a light guide 2 is further arranged on the box wall, an opening at one end of the light guide 2 is connected with an opening at one end of the through hole facing the outside of the box, and a light emitter 3 is arranged at an opening at one end of the through hole facing the inside of the box;
the heat insulation carrier 1 is also provided with a first bracket 4, the first bracket 4 is provided with a lighting mirror 5, the lighting mirror 5 is positioned at the opening of the other end and is used for lighting the light of the light emitter 3 to soldering tin on the PCB 7; the first bracket 4 is also provided with a reflector 6 for emitting solder light to the lens of the camera 8.
In the present embodiment, the heat insulating carrier 1 is made of a heat insulating material; light emitted by the light emitter 3 is transmitted to the light-emitting lens 5 through the light pipe 2, light is reflected to soldering tin through the light-emitting lens 5, and the lightened soldering tin image is reflected to the lens of the camera 8 through the reflecting mirror 6, so that the definition of the obtained soldering tin image is improved, and analysis is facilitated.
FIG. 8 illustrates an internal block diagram of a computer device in one embodiment. As shown in fig. 8, the computer device includes a processor, a memory, a network interface, an input device, and a display screen connected by a system bus. The memory includes a nonvolatile storage medium and an internal memory. The non-volatile storage medium of the computer device stores an operating system and may also store a computer program, which when executed by a processor, causes the processor to implement the welding process monitoring and analyzing method provided by the embodiment of the invention. The internal memory may also store a computer program, which when executed by the processor, causes the processor to execute the welding process monitoring and analyzing method provided by the embodiment of the invention. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, the input device of the computer equipment can be a touch layer covered on the display screen, can also be keys, a track ball or a touch pad arranged on the shell of the computer equipment, and can also be an external keyboard, a touch pad or a mouse and the like.
It will be appreciated by those skilled in the art that the structure shown in FIG. 8 is merely a block diagram of some of the structures associated with the present inventive arrangements and is not limiting of the computer device to which the present inventive arrangements may be applied, and that a particular computer device may include more or fewer components than shown, or may combine some of the components, or have a different arrangement of components.
In one embodiment, the welding process monitoring and analyzing apparatus provided by the embodiments of the present invention may be implemented in the form of a computer program that is executable on a computer device as shown in fig. 8. The memory of the computer device may store various program modules constituting the welding process monitoring and analyzing apparatus, such as a first processing module, a first monitoring module, a second processing module, a third processing module, a second monitoring module, a fourth processing module, a fifth processing module, a sixth processing module, and a repetitive execution module shown in fig. 2. The computer program of each program module causes the processor to carry out the steps of the welding process monitoring analysis method of each embodiment of the invention described in the specification.
For example, the computer apparatus shown in fig. 8 may perform step S1 through the first processing module in the welding process monitoring and analyzing device shown in fig. 2; the computer equipment can execute the step S2 through the first monitoring module; the computer equipment can execute the step S3 through the second processing module; the computer equipment can execute the step S4 through the third processing module; the computer equipment can execute the step S5 through the second monitoring module; the computer equipment can execute the step S6 through a fourth processing module; the computer equipment can execute the step S7 through a fifth processing module; the computer equipment can execute the step S8 through a sixth processing module; the computer device may execute step S9 by repeating the execution module.
In one embodiment, a computer device is presented, the computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the following steps when executing the computer program:
s1: when the PCB enters the reflow soldering machine, starting timing;
s2: monitoring the furnace temperature and acquiring a real-time video picture of soldering tin;
s3: establishing a time and furnace temperature coordinate system, and drawing a first curve on the time and furnace temperature coordinate system according to each time point and the corresponding furnace temperature;
s4: a pre-stored standard curve is introduced into a time and furnace temperature coordinate system, wherein the standard curve is a relation curve of time and furnace temperature corresponding to the temperature at which soldering tin can be dissolved according to a preset dissolving process;
s5: monitoring whether the difference between the temperature on the first curve corresponding to each time point and the temperature on the standard curve is larger than a first set value;
s6: when the difference value between the temperature on the first curve corresponding to a certain time point and the temperature on the standard curve is larger than a first set value, acquiring a real-time soldering tin form of soldering tin at the time point on a real-time video picture, acquiring a standard soldering tin form corresponding to the standard curve at the time point, and further calculating the similarity of the real-time soldering tin form and the standard soldering tin form;
S7: if the similarity between the real-time soldering tin form and the standard soldering tin form is lower than a second set value, distinguishing features between the real-time soldering tin form and the standard soldering tin form are identified, distinguishing feature names are determined, and the distinguishing feature names are marked at positions, corresponding to the time points, of the first curve;
s8: calculating the position of the PCB in the reflow soldering machine at the time point, further determining an associated device capable of influencing the furnace temperature at the position as a device to be overhauled, and generating overhauling information;
s9: and repeatedly executing the steps S6 to S8 until the PCB moves out of the reflow soldering machine.
In one embodiment, a computer readable storage medium is provided, having a computer program stored thereon, which when executed by a processor causes the processor to perform the steps of:
s1: when the PCB enters the reflow soldering machine, starting timing;
s2: monitoring the furnace temperature and acquiring a real-time video picture of soldering tin;
s3: establishing a time and furnace temperature coordinate system, and drawing a first curve on the time and furnace temperature coordinate system according to each time point and the corresponding furnace temperature;
s4: a pre-stored standard curve is introduced into a time and furnace temperature coordinate system, wherein the standard curve is a relation curve of time and furnace temperature corresponding to the temperature at which soldering tin can be dissolved according to a preset dissolving process;
S5: monitoring whether the difference between the temperature on the first curve corresponding to each time point and the temperature on the standard curve is larger than a first set value;
s6: when the difference value between the temperature on the first curve corresponding to a certain time point and the temperature on the standard curve is larger than a first set value, acquiring a real-time soldering tin form of soldering tin at the time point on a real-time video picture, acquiring a standard soldering tin form corresponding to the standard curve at the time point, and further calculating the similarity of the real-time soldering tin form and the standard soldering tin form;
s7: if the similarity between the real-time soldering tin form and the standard soldering tin form is lower than a second set value, distinguishing features between the real-time soldering tin form and the standard soldering tin form are identified, distinguishing feature names are determined, and the distinguishing feature names are marked at positions, corresponding to the time points, of the first curve;
s8: calculating the position of the PCB in the reflow soldering machine at the time point, further determining an associated device capable of influencing the furnace temperature at the position as a device to be overhauled, and generating overhauling information;
s9: and repeatedly executing the steps S6 to S8 until the PCB moves out of the reflow soldering machine.
It should be understood that, although the steps in the flowcharts of the embodiments of the present invention are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in various embodiments may include multiple sub-steps or stages that are not necessarily performed at the same time, but may be performed at different times, nor do the order in which the sub-steps or stages are performed necessarily performed in sequence, but may be performed alternately or alternately with at least a portion of the sub-steps or stages of other steps or other steps.
Those skilled in the art will appreciate that all or part of the processes in the methods of the above embodiments may be implemented by a computer program for instructing relevant hardware, where the program may be stored in a non-volatile computer readable storage medium, and where the program, when executed, may include processes in the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in embodiments provided herein may include non-volatile and/or volatile memory. The nonvolatile memory can include Read Only Memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous Link DRAM (SLDRAM), memory bus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), among others.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. A method of welding process monitoring analysis, the method comprising:
s1: when the PCB enters the reflow soldering machine, starting timing;
s2: monitoring the furnace temperature and acquiring a real-time video picture of soldering tin;
s3: establishing a time and furnace temperature coordinate system, and drawing a first curve on the time and furnace temperature coordinate system according to each time point and the corresponding furnace temperature;
S4: a pre-stored standard curve is introduced into a time and furnace temperature coordinate system, wherein the standard curve is a relation curve of time and furnace temperature corresponding to the temperature at which soldering tin can be dissolved according to a preset dissolving process;
s5: monitoring whether the difference between the temperature on the first curve corresponding to each time point and the temperature on the standard curve is larger than a first set value;
s6: when the difference value between the temperature on the first curve corresponding to a certain time point and the temperature on the standard curve is larger than a first set value, acquiring a real-time soldering tin form of soldering tin at the time point on a real-time video picture, acquiring a standard soldering tin form corresponding to the standard curve at the time point, and further calculating the similarity of the real-time soldering tin form and the standard soldering tin form;
s7: if the similarity between the real-time soldering tin form and the standard soldering tin form is lower than a second set value, distinguishing features between the real-time soldering tin form and the standard soldering tin form are identified, distinguishing feature names are determined, and the distinguishing feature names are marked at positions, corresponding to the time points, of the first curve;
s8: calculating the position of the PCB in the reflow soldering machine at the time point, further determining an associated device capable of influencing the furnace temperature at the position as a device to be overhauled, and generating overhauling information;
S9: and repeatedly executing the steps S6 to S8 until the PCB moves out of the reflow soldering machine.
2. The method of claim 1, wherein calculating the similarity of the real-time solder morphology and the standard solder morphology comprises:
s61: determining the outline similarity of the real-time soldering tin form and the standard soldering tin form according to the first soldering tin outline corresponding to the real-time soldering tin form and the second soldering tin outline corresponding to the standard soldering tin form;
s62: determining the color similarity between the real-time soldering tin form and the standard soldering tin form according to the first soldering tin color corresponding to the real-time soldering tin form and the second soldering tin color corresponding to the standard soldering tin form;
s63: and determining the overall similarity of the real-time soldering tin form and the standard soldering tin form according to the contour similarity and the color similarity.
3. The method of claim 2, wherein determining the profile similarity of the real-time solder shape to the standard solder shape based on the first solder profile corresponding to the real-time solder shape and the second solder profile corresponding to the standard solder shape comprises:
s611: identifying a first soldering tin contour, and taking a set number of first contour points on the first soldering tin contour; identifying a second soldering tin contour, and taking a set number of second contour points on the second soldering tin contour;
S612: moving the second soldering tin outline to the position of the first soldering tin outline on the real-time video picture;
s613: selecting a first contour point and sequencing each first contour point in a clockwise direction by taking the first contour point as a starting point; selecting a second contour point and sequencing each second contour point in a clockwise direction by taking the second contour point as a starting point;
s614: calculating the contour point distance between each first contour point and the second contour point of the corresponding sequence number, and further calculating the average distance of the contour point distances;
s615: selecting another second contour point, using the second contour point as a starting point to sequence each second contour point clockwise, executing step S614, and repeatedly executing the step until each second contour point is sequence-numbered by the starting point clockwise to each second contour point, obtaining corresponding average distances, and further obtaining a plurality of average distances;
s616: taking the minimum average distance as a first average distance, and calculating the contour similarity by the following formula:
wherein,for contour similarity, ++>For a first average distance, +.>Is the first adjustment coefficient.
4. The method of claim 2, wherein determining the color similarity of the real-time solder morphology and the standard solder morphology based on the first solder color corresponding to the real-time solder morphology and the second solder color corresponding to the standard solder morphology comprises:
S621: identifying a first soldering tin contour, and acquiring a first pixel value of each pixel point in the first soldering tin contour;
s622: identifying a second soldering tin contour, and acquiring a second pixel value of each pixel point in the second soldering tin contour;
s623: calculating the average pixel value of each second pixel value, taking the pixel value larger than the third set value of the average pixel value as an upper limit pixel value, taking the pixel value smaller than the fourth set value of the average pixel value as a lower limit pixel value, and taking the pixel value range between the lower limit pixel value and the upper limit pixel value as a standard pixel value range;
s624: determining whether each first pixel value is in a standard pixel value range one by one;
s625: taking a pixel point corresponding to a first pixel value in the standard pixel value range as a standard pixel point, and calculating the color similarity according to the following formula:
wherein,for color similarity, ++>For the total number of pixels in the first solder profile, < >>For reaching the standard, the number of pixels is +.>Is the second adjustment coefficient.
5. The method of claim 2, wherein the overall similarity of the real-time solder morphology and the standard solder morphology is calculated by the formula:
wherein,for the overall similarity, add >Is a preset weight coefficient.
6. The method of claim 2, wherein identifying distinguishing features between the real-time solder morphology and the standard solder morphology, determining names of the distinguishing features, comprises:
selecting a partial image which exists only in the first soldering tin outline and does not exist in the second soldering tin outline in the first soldering tin outline;
and cutting out each partial image, and comparing each partial image with the images in the soldering tin defect database to further determine the name of each soldering tin defect, wherein the soldering tin defect database comprises images of various soldering tin defects and corresponding soldering tin defect names.
7. The method of claim 6, wherein calculating the point in time that the PCB board is in the first position of the reflow soldering machine comprises:
subtracting the starting timing time point from the time point to obtain the moving time of the PCB;
multiplying the conveying speed of the PCB by the moving time length by a reflow soldering machine to obtain the moving length;
and taking the position which is away from the starting point of the PCB by the moving length as a first position.
8. A welding process monitoring and analysis device, the device comprising:
the first processing module is used for starting timing when the PCB enters the reflow soldering machine;
The first monitoring module is used for starting to monitor the furnace temperature and acquiring a real-time video picture of soldering tin;
the second processing module is used for establishing a time and furnace temperature coordinate system, and drawing a first curve on the time and furnace temperature coordinate system according to each time point and the corresponding furnace temperature;
the third processing module is used for introducing a pre-stored standard curve into the time and furnace temperature coordinate system, wherein the standard curve is a relation curve of time and furnace temperature corresponding to the temperature at which soldering tin can be dissolved according to a preset dissolving process;
the second monitoring module is used for monitoring whether the difference value between the temperature on the first curve corresponding to each time point and the temperature on the standard curve is larger than a first set value or not;
the fourth processing module is used for acquiring a real-time soldering tin form of soldering tin at a certain time point on a real-time video picture when the difference value between the temperature on the first curve corresponding to the certain time point and the temperature on the standard curve is larger than a first set value, acquiring a standard soldering tin form corresponding to the standard curve at the time point, and further calculating the similarity of the real-time soldering tin form and the standard soldering tin form;
the fifth processing module is used for identifying distinguishing features between the real-time soldering tin form and the standard soldering tin form if the similarity between the real-time soldering tin form and the standard soldering tin form is lower than a second set value, determining distinguishing feature names, and marking the distinguishing feature names at positions of the first curve corresponding to the time points;
The sixth processing module is used for calculating the position of the PCB in the reflow soldering machine at the time point, further determining that the associated device capable of influencing the furnace temperature at the position is a device to be overhauled, and generating overhauling information;
and the repeated execution module is used for repeatedly executing the steps S6 to S8 until the PCB moves out of the reflow soldering machine.
9. A welding process monitoring analysis system, the system comprising:
the camera is used for acquiring real-time video pictures of soldering tin;
the temperature sensor is arranged on the PCB and used for acquiring real-time temperature;
the camera is installed in the heat insulation carrier, and is isolated from the outside by the heat insulation carrier so as to be prevented from being damaged by high temperature, a perspective window is formed in the heat insulation carrier, and the camera can shoot soldering tin on the PCB through the perspective window;
computer device, connected to the camera and to the temperature sensor, for performing the welding process monitoring analysis method according to any of claims 1-7.
10. The system of claim 9, wherein the thermal insulation carrier is a box body, at least one through hole is formed in a box wall of the thermal insulation carrier, a light guide pipe is further arranged on the box wall, an opening of one end of the light guide pipe is connected with an opening of one end of the through hole facing the outside of the box, and a light emitter is arranged at an opening of one end of the through hole facing the inside of the box;
The heat insulation carrier is also provided with a first bracket, the first bracket is provided with a lighting mirror, and the lighting mirror is positioned at the opening at the other end and is used for lighting the light of the light emitter to soldering tin on the PCB; and the first bracket is also provided with a reflector for emitting the light of the soldering tin to the lens of the camera.
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0878837A (en) * | 1994-09-06 | 1996-03-22 | Matsushita Electric Ind Co Ltd | Mounting soldering technique and mounting soldered printed board |
| EP0862962A2 (en) * | 1997-02-24 | 1998-09-09 | Quad Systems Corporation | Method and apparatus for controlling a time/temperature profile inside a reflow oven |
| CN103028802A (en) * | 2012-12-31 | 2013-04-10 | 北京中科同志科技有限公司 | Temperature control method for reflow welding machine |
| CN207900409U (en) * | 2017-12-28 | 2018-09-25 | 山东欣立得光电科技有限公司 | A kind of reflow machine of processing LED display cell board |
| CN108594902A (en) * | 2018-04-18 | 2018-09-28 | 成都迅生电子科技有限公司 | A kind of ideal warm stove curve creation method of Reflow Soldering and its application process |
| CN110587050A (en) * | 2019-09-24 | 2019-12-20 | 贵州永红航空机械有限责任公司 | Brazing method for controlling ablation and cracks of titanium and titanium alloy plate fin radiator |
| CN111307812A (en) * | 2019-03-05 | 2020-06-19 | 南昌工程学院 | Welding spot appearance detection method based on machine vision |
| CN114700575A (en) * | 2022-04-19 | 2022-07-05 | 江西兆驰半导体有限公司 | Method for optimizing reflux curve of back-brushed tin product |
-
2023
- 2023-11-13 CN CN202311502116.0A patent/CN117226331B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0878837A (en) * | 1994-09-06 | 1996-03-22 | Matsushita Electric Ind Co Ltd | Mounting soldering technique and mounting soldered printed board |
| EP0862962A2 (en) * | 1997-02-24 | 1998-09-09 | Quad Systems Corporation | Method and apparatus for controlling a time/temperature profile inside a reflow oven |
| CN103028802A (en) * | 2012-12-31 | 2013-04-10 | 北京中科同志科技有限公司 | Temperature control method for reflow welding machine |
| CN207900409U (en) * | 2017-12-28 | 2018-09-25 | 山东欣立得光电科技有限公司 | A kind of reflow machine of processing LED display cell board |
| CN108594902A (en) * | 2018-04-18 | 2018-09-28 | 成都迅生电子科技有限公司 | A kind of ideal warm stove curve creation method of Reflow Soldering and its application process |
| CN111307812A (en) * | 2019-03-05 | 2020-06-19 | 南昌工程学院 | Welding spot appearance detection method based on machine vision |
| CN110587050A (en) * | 2019-09-24 | 2019-12-20 | 贵州永红航空机械有限责任公司 | Brazing method for controlling ablation and cracks of titanium and titanium alloy plate fin radiator |
| CN114700575A (en) * | 2022-04-19 | 2022-07-05 | 江西兆驰半导体有限公司 | Method for optimizing reflux curve of back-brushed tin product |
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