CN101600304B - Process method for manufacturing radio frequency power amplifier mainboard - Google Patents
Process method for manufacturing radio frequency power amplifier mainboard Download PDFInfo
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- CN101600304B CN101600304B CN2009101082900A CN200910108290A CN101600304B CN 101600304 B CN101600304 B CN 101600304B CN 2009101082900 A CN2009101082900 A CN 2009101082900A CN 200910108290 A CN200910108290 A CN 200910108290A CN 101600304 B CN101600304 B CN 101600304B
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- power amplifier
- radio frequency
- frequency power
- reflow ovens
- circuit board
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Abstract
The invention discloses a process method for manufacturing a radio frequency power amplifier mainboard, which comprises the following steps: performing printing solder paste processing on a radio frequency power amplifier circuit board, a power amplifier tube and a heat radiating copper plate thereof which are processed by baking; adhering a chip element, the power amplifier tube and the copper plate to the radio frequency power amplifier circuit board; placing the radio frequency power amplifier circuit board in an adaptive fixture for fixing; and adjusting the temperature and/or time parameters of a reflow oven, and welding the chip element, the power amplifier tube and the copper plate on the radio frequency power amplifier circuit board through the reflow oven. Because the components of the power amplifier tube, the radio frequency power amplifier mainboard, the copper plate and the like are baked in advance, the adaptive fixing fixture is adopted and the technological parameters of time, temperature and the like during the welding by the reflow oven are adjusted, the chip element and the power amplifier tube are ensured to be reflowed and welded on the radio frequency power amplifier circuit board, the process flow of manufacturing the radio frequency power amplifier mainboard is simplified, and the defective product debugging caused by passing through the reflow oven for a plurality of times is eliminated.
Description
Technical field
The present invention relates to the processing method field of radio frequency power amplifier mainboard, in particular, what improvement related to is a kind of process of making radio frequency power amplifier mainboard.
Background technology
Radio frequency power amplifier mainboard, belong to a kind of power amplifier mainboard with radio-frequency enabled, owing to have power tube, be difficult to weld simultaneously with surface mount elements, make this radio frequency power amplifier mainboard need divide the processing of at least twice reflow ovens, cause the surface mount elements on it to damage easily because of secondary welding produces high temperature, thereby, cause production debugging bad.The technological process of prior art making radio frequency power amplifier mainboard as shown in Figure 1.
Therefore, prior art still haves much room for improvement and develops.
Summary of the invention
The objective of the invention is, be to provide a kind of process of making radio frequency power amplifier mainboard, surface mount elements and the power tube on the Reflow Soldering radio frequency power amplifier circuit board simultaneously avoids the production debugging that causes because of mistake reflow ovens repeatedly bad.
Technical scheme of the present invention is as follows:
A kind of process of making radio frequency power amplifier mainboard may further comprise the steps:
The copper coin of A, baking processing radio frequency power amplifier circuit board, power tube and heat transmission thereof;
B, described radio frequency power amplifier circuit board, power tube and copper coin thereof that baking processing is crossed carry out the print solder paste processing;
C, described power tube and copper coin thereof that tin cream is gone up in surface mount elements and printing are mounted on the described radio frequency power amplifier circuit board;
D, the radio frequency power amplifier circuit board that will be pasted with described surface mount elements, power tube and copper coin thereof are placed in the adaptive fixture and fix;
The temperature and/or the time parameter of E, adjustment reflow ovens are welded on described surface mount elements, power tube and copper coin thereof on the described radio frequency power amplifier circuit board by described reflow ovens.
Described process, wherein, the described power tube of the baking processing in the described steps A comprises:
Described power tube is placed under 140 ℃ ± 10 ℃ the environment and toasted 24 hours.
Described process, wherein, the described radio frequency power amplifier mainboard of the baking processing in the described steps A comprises:
The time of packing was carried out baking processing at 3 months with interior radio frequency power amplifier circuit board.
Described process wherein, adopts pair principle when mounting described power tube among the described step C, described power tube adopts following a kind of matching method to match at least:
Every grade of 500mA divides pairing by current parameters;
Between 2.6V to 3.0V, every grade of 0.1V divides pairing by voltage parameter;
Every grade of 0.2dB divides pairing by gain parameter.
Described process, wherein, the operation of adjusting the temperature parameter of described reflow ovens in the described step e comprises:
The first preheating warm area temperature of described reflow ovens is adjusted to 330 ℃;
And, the second preheating warm area temperature of described reflow ovens is adjusted to 320 ℃.
Described process, wherein, the operation of adjusting the temperature parameter of described reflow ovens in the described step e comprises:
The flat-temperature zone temperature of described reflow ovens is adjusted to 280 ℃.
Described process, wherein, the operation of adjusting the temperature parameter of described reflow ovens in the described step e comprises:
The welding warm area temperature of described reflow ovens is adjusted to 240 ℃.
Described process, wherein, the operation of adjusting the time parameter of described reflow ovens in the described step e comprises:
To be adjusted at by the constant temperature time of described reflow ovens between 80 seconds to 100 seconds.
Described process, wherein, the operation of adjusting the time parameter of described reflow ovens in the described step e comprises:
To be adjusted at by the weld time of described reflow ovens between 30 seconds to 60 seconds.
A kind of process of making radio frequency power amplifier mainboard provided by the present invention, owing to taked components and parts such as baking power tube, radio frequency power amplifier mainboard and copper coin thereof in advance, and adopted adaptive fixed jig, and technological parameters such as time when having adjusted the reflow ovens welding and temperature, guaranteed that the Reflow Soldering simultaneously of surface mount elements and power tube is on radio frequency power amplifier circuit board, simplified the technological process of making radio frequency power amplifier mainboard, it is bad to have eliminated the production debugging that causes because of mistake reflow ovens repeatedly.
Description of drawings
Fig. 1 is a process flow diagram of making radio frequency power amplifier mainboard in the prior art;
Fig. 2 is for making the process flow diagram of radio frequency power amplifier mainboard among the present invention;
Fig. 3 is a temperature curve of crossing reflow ovens in the prior art;
Fig. 4 is for crossing the temperature curve of reflow ovens among the present invention.
Embodiment
Below with reference to accompanying drawing, the embodiment and the embodiment of method of the present invention and system thereof described in detail.
A kind of process of making radio frequency power amplifier mainboard of the present invention is fit to have the batch process of the wiring board of power tube and paster components and parts, and its processing step is described as follows as shown in Figure 2:
Preparation before step S210, the production comprises that the copper coin to radio frequency power amplifier circuit board, power tube and heat transmission thereof carries out baking processing;
Tin cream on step S220, the radio frequency power amplifier circuit board that will toast, power tube and the copperplate thereof;
Step S230, power tube and copper coin thereof that tin cream is gone up in surface mount elements and printing are mounted on the radio frequency power amplifier circuit board that is printed with tin cream equally; Comprise step S230a that mounts surface mount elements and the step S230b that mounts power tube and copper coin thereof, the order of described step S230a and step S230b can be exchanged;
Step S240, the radio frequency power amplifier circuit board that will be pasted with surface mount elements, power tube and copper coin thereof and copper coin thereof are placed in the adaptive fixture to be fixed;
Step S250, adjustment temperature and time parameter are welded on surface mount elements, power tube and copper coin thereof on the radio frequency power amplifier circuit board by reflow ovens.
Above-mentioned technological process is compared with the technological process (as shown in Figure 1) of before making radio frequency power amplifier mainboard, merging or saving be the operation of totally 11 steps, especially cross reflow ovens with twice and changed once reflow ovens into, simplified technological process greatly, improved production efficiency:
A) three operations with step S102 copper coin seal tin cream, step S106 power tube seal tin cream and step S107 radio frequency power amplifier circuit board seal tin cream are merged into step S220;
B) step S103 being installed copper coin and radio frequency power amplifier circuit board and step S110 installed the reflow ovens tool and was merged into step S240;
C) step S118 product quality check and step S119 are finished the product warehousing merging and be step S270;
D) having saved step S104 crosses reflow ovens and step S105 for the first time with copper coin and radio frequency power amplifier circuit board and crosses three operations that check and step S111 after the reflow ovens are checked before the mistake reflow ovens for the second time for the first time;
E) four operations that step S114 manual welding components and parts, step S115 check welding quality, step S116 maintenance trouble product, step S117 carry out stress test have more been saved.
F) the S101 preparation step before step S210 is equivalent to, step S109 before step S230a is equivalent to mounts the components and parts paster, step S108 before step S230b is equivalent to mounts power tube and load elements, after crossing stove, S113 before step S112 before step S250 is equivalent to, step S260 are equivalent to checks.
In the process of practice, can improve the technology of baking power tube, specifically, promptly in step S210, adjust the baking parameter of power tube, 12 hours stoving times are before extended to present 24 hours, also 150 ℃ ± 10 ℃ baking temperatures before are reduced to present 140 ℃ ± 10 ℃ simultaneously.Because power tube is damp quick components and parts, make moist easily, prolong time to its baking, can fully solve the factor of making moist, improve baking quality; Simultaneously, satisfying under the situation of baking quality, reducing temperature, can reduce the quantity that high temperature damages its baking.Secondly, can improve the technology of baking radio frequency power amplifier circuit board, way before is just to toast packing in the radio frequency power amplifier circuit board more than 3 months, for guaranteeing the welding quality of reflow ovens, now change into all radio frequency power amplifier circuit board all toasted, comprise the time of packing at 3 months with interior radio frequency power amplifier circuit board.Facts have proved that the quality first-pass yield that brings thus is than having improved more than 25% before.
Secondly, in step S230, also can adjust the pairing parameter of power tube when mounting power tube, concrete pair principle comprises: can divide pairing according to its current parameters, every grade of 500mA; And/or between 2.6V to 3.0V, every grade of 0.1V divides pairing according to its voltage parameter; And/or divide pairing by every grade of 0.2dB of its gain parameter.So, can further improve the quality first-pass yield of radio frequency power amplifier mainboard.
Also be the most key in addition, be that the temperature and time parameter of adjusting described reflow ovens among the step S250 seems extremely important, as shown in Figure 4, can adjust the temperature of described reflow ovens separately, also can adjust the time of described reflow ovens separately, the temperature and time of the described reflow ovens of adjustment also capable of being combined, concrete improvement comprises:
1) temperature of the first preheating warm area is brought up to 330 ℃ ± 5 ℃ by before 320 ℃ ± 5 ℃; And, the temperature of the second preheating warm area is brought up to 320 ℃ ± 5 ℃ by before 300 ℃ ± 5 ℃;
2) temperature of flat-temperature zone is brought up to 280 ℃ ± 5 ℃ by before 270 ℃ ± 5 ℃;
3) temperature that will weld warm area is reduced to 240 ℃ ± 5 ℃ by before 250 ℃ ± 5 ℃;
4) constant temperature time was shortened between 80 seconds to 100 seconds by before 100 seconds to 120 seconds;
5) shortened 30 second to 60 second between by before 60 seconds to 90 seconds weld time;
6) 183 ℃ of above times of refluxing are expanded between 50 seconds to 100 by before 100 seconds to 120 seconds;
Above-mentioned adjusted temperature curve is compared with the temperature curve (as shown in Figure 3) of crossing reflow ovens before, and segmentation has improved the intensification temperature of 10 ℃ (first preheating warm area) and 20 ℃ (second preheating warm areas), has correspondingly just reduced about 20 seconds of warm-up time; Improved 10 ℃ thermostat temperature and reduced by 20 seconds constant temperature time; Having reduced by 10 ℃ welding temperature and reduced by 30 seconds weld time, eliminated because of secondary and crossed the high temperature damage that reflow ovens welding power tube causes surface mount elements, is that the high temperature loss percentage of surface mount elements reduces to zero, significantly reduces the production debugging fraction defective.
Should be understood that; for those of ordinary skills; above-mentioned making radio frequency power amplifier mainboard is once crossed the optimisation technique of reflow ovens and can be improved according to the above description or conversion; the for example slight change of temperature and time number range etc., and all these improve and conversion all should belong to the protection range of claims of the present invention.
Claims (9)
1. process of making radio frequency power amplifier mainboard may further comprise the steps:
The copper coin of A, baking processing radio frequency power amplifier circuit board, power tube and heat transmission thereof;
B, described radio frequency power amplifier circuit board, power tube and copper coin thereof that baking processing is crossed carry out the print solder paste processing;
C, described power tube and copper coin thereof that tin cream is gone up in surface mount elements and printing are mounted on the described radio frequency power amplifier circuit board;
D, the radio frequency power amplifier circuit board that will be pasted with described surface mount elements, power tube and copper coin thereof are placed in the adaptive fixture and fix;
The temperature and/or the time parameter of E, adjustment reflow ovens are welded on described surface mount elements, power tube and copper coin thereof on the described radio frequency power amplifier circuit board by described reflow ovens.
2. process according to claim 1 is characterized in that, the described power tube of the baking processing in the described steps A comprises:
Described power tube is placed under 140 ℃ ± 10 ℃ the environment and toasted 24 hours.
3. process according to claim 1 is characterized in that, the described radio frequency power amplifier mainboard of the baking processing in the described steps A comprises:
The time of packing was carried out baking processing at 3 months with interior radio frequency power amplifier circuit board.
4. process according to claim 1 is characterized in that, adopts pair principle when mounting described power tube among the described step C, and described power tube adopts following a kind of matching method to match at least:
Every grade of 500mA divides pairing by current parameters;
Between 2.6V to 3.0V, every grade of 0.1V divides pairing by voltage parameter;
Every grade of 0.2dB divides pairing by gain parameter.
5. process according to claim 1 is characterized in that, the operation of adjusting the temperature parameter of described reflow ovens in the described step e comprises:
The first preheating warm area temperature of described reflow ovens is adjusted to 330 ℃;
And, the second preheating warm area temperature of described reflow ovens is adjusted to 320 ℃.
6. process according to claim 1 is characterized in that, the operation of adjusting the temperature parameter of described reflow ovens in the described step e comprises:
The flat-temperature zone temperature of described reflow ovens is adjusted to 280 ℃.
7. process according to claim 1 is characterized in that, the operation of adjusting the temperature parameter of described reflow ovens in the described step e comprises:
The welding warm area temperature of described reflow ovens is adjusted to 240 ℃.
8. process according to claim 1 is characterized in that, the operation of adjusting the time parameter of described reflow ovens in the described step e comprises:
To be adjusted at by the constant temperature time of described reflow ovens between 80 seconds to 100 seconds.
9. process according to claim 1 is characterized in that, the operation of adjusting the time parameter of described reflow ovens in the described step e comprises:
To be adjusted at by the weld time of described reflow ovens between 30 seconds to 60 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101082900A CN101600304B (en) | 2009-06-26 | 2009-06-26 | Process method for manufacturing radio frequency power amplifier mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101082900A CN101600304B (en) | 2009-06-26 | 2009-06-26 | Process method for manufacturing radio frequency power amplifier mainboard |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101600304A CN101600304A (en) | 2009-12-09 |
| CN101600304B true CN101600304B (en) | 2011-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101082900A Expired - Fee Related CN101600304B (en) | 2009-06-26 | 2009-06-26 | Process method for manufacturing radio frequency power amplifier mainboard |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102288846B (en) * | 2011-06-15 | 2013-09-04 | 博威科技(深圳)有限公司 | Testing method of radio frequency power tubes |
| CN105960108A (en) * | 2014-10-24 | 2016-09-21 | 周杰 | Reflow soldering method for patch LED lamp capable of lowering damage rate |
| CN112055478B (en) * | 2020-07-22 | 2021-07-27 | 厦门市铂联科技股份有限公司 | FPC product processing method |
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| CN101600304A (en) | 2009-12-09 |
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